A strip line circuit board film laminating and heat shrinking device

By designing a specific structure for the belt conveyor mechanism and hot air box, the problem of wire loss during the heat shrinking process of wired circuit boards is prevented from entering the high-temperature area. This achieves efficient and safe circuit board protection, and is suitable for fields such as smart homes, industrial control, and automotive electronics.

CN224555887UActive Publication Date: 2026-07-24SHENGANNUO TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENGANNUO TECHNOLOGY CO LTD
Filing Date
2025-08-25
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

During the heat shrinking process of wired circuit boards, the insulation layer of the connecting wires is prone to aging and embrittlement, and the conductors are prone to oxidation, resulting in a decline in insulation and conductivity performance, which increases product defect rate and maintenance costs, and limits its application in high-reliability fields.

Method used

Design a heat shrinking device for coated circuit boards with wires. The device adopts a belt conveyor mechanism with the sides wider than the sides of the hot air box, so that the connecting wires avoid the high-temperature area. Combined with the design of the hot air box being suspended and the opening facing downwards, it ensures that the hot air is accurately focused on the circuit board, forming a stable high-temperature environment and achieving uniform shrinkage of the heat shrink film.

Benefits of technology

It effectively protects the insulation and conductivity of the connecting wires, reduces product defect rate and maintenance costs, improves the efficiency and quality of heat shrink coating, is suitable for mass production, and enhances operational convenience and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to circuit board processing technical field especially is involved in a kind of tape line circuit board film laminating heat shrink device, including the workbench of strip, belt conveying mechanism is provided on the workbench, the rear position of workbench is fixedly installed with support at belt conveying mechanism, the hot-air box above belt conveying mechanism is hung on the support, hot-air box is installed with hot blast engine, and hot-air box opening faces downward, to make the hot blast provided by hot blast engine downward to belt conveying mechanism on;By belt conveying mechanism is designed as the two sides wider than the two sides of hot-air box, make belt conveying mechanism form the part that protrudes outside hot-air box, when actual operation can let the connecting wire of tape line circuit board always be in the hot blast range outside hot-air box, can avoid the aging of insulating layer, conductor oxidation and other loss problems caused by connecting wire with circuit board into high temperature area in traditional heat shrink mode to a large extent, effectively guarantee the insulation performance and conductive performance of connecting wire.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a heat shrinking device for coating circuit boards with wires. Background Technology

[0002] In the field of electronic control, wired circuit boards are components that control the load connected to the wires by setting up control circuit boards on the wires. Their core working principle is that when the wires are connected to the load, the circuit board can regulate the load's operating status and parameters according to preset programs or real-time signals. They are widely used in smart homes, industrial control, automotive electronics, medical instruments, and many other fields.

[0003] Current assembly techniques for these types of wired circuit boards primarily involve using a housing that fits the circuit board to secure it to the connecting wires. The housing is designed to provide physical protection, reducing damage from external mechanical impacts, and also serves to integrate the structure and facilitate installation. However, this housing protection method has certain drawbacks in practical use. Because it's difficult to achieve a complete seal at the connection point between the housing and the connecting wires, moisture can easily seep into the housing and onto the circuit board surface in humid environments, when water vapor condenses, or when liquids splash. This can lead to oxidation of the circuit components, affecting their electrical performance, and in severe cases, cause short circuits, open circuits, and other faults, significantly shortening the lifespan of the wired circuit board and even damaging the load equipment.

[0004] To better protect circuit boards from moisture, dust, and other harmful substances, the industry is increasingly adopting a supplementary protection method: applying heat-shrink film to the circuit board surface. The specific procedure is as follows: first, the heat-shrink film is tightly fitted onto the circuit board surface; then, the entire circuit board with the film is placed in a heat-shrink oven for heat shrinking. Under the high temperature environment of the oven, the heat-shrink film rapidly shrinks and adheres tightly to the circuit board surface, forming a continuous, sealed protective film. This heat-shrink film effectively blocks the intrusion of moisture and dust, significantly improving the circuit board's moisture and dirt resistance. When used in conjunction with a casing, it further enhances the overall protection of the circuit board.

[0005] However, this heat-shrink protection process still faces unavoidable problems when applied to wired circuit boards. Due to the structural characteristics of wired circuit boards, their control circuit board and connecting wires are integrated into one design. During heat shrinking, the connecting wires inevitably enter the heat shrink oven along with the circuit board. Although the high temperature inside the heat shrink oven can meet the shrinkage requirements of the heat shrink film, it will cause a series of adverse effects on the connecting wires: the insulation layer of the connecting wires is prone to aging, embrittlement, and even cracking at high temperatures, leading to a sharp decline in insulation performance and increasing the safety hazards of leakage and short circuits; at the same time, the conductors inside the connecting wires may also undergo oxidation due to the high-temperature environment, resulting in a decrease in their conductivity and affecting the control accuracy and response speed of the wired circuit board to the load.

[0006] For a long time, the loss of these connecting wires during the heat-shrink process has been a key bottleneck restricting the upgrading of wired circuit board protection technology. This not only increases product defect rates and subsequent maintenance costs, but also limits the application of wired circuit boards in fields with high reliability requirements. Therefore, it is necessary to propose an improved technical solution to address these problems. Utility Model Content

[0007] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0008] A heat shrinking device for coating circuit boards with wires includes a long strip-shaped worktable, a belt conveyor mechanism is provided on the worktable, a bracket is fixedly installed on the worktable at the rear of the belt conveyor mechanism, a hot air box is suspended on the bracket above the belt conveyor mechanism, a hot air fan is installed on the hot air box, and the opening of the hot air box faces downward so that the hot air provided by the hot air fan blows downward onto the belt conveyor mechanism. The hot air box and the belt conveyor mechanism are spaced at the same height, and the two sides of the belt conveyor mechanism are wider than the two sides of the hot air box, so that the belt conveyor mechanism has a part that extends beyond the two sides of the hot air box.

[0009] Preferably, the belt conveyor mechanism includes rollers installed at both ends of the workbench, a belt body sleeved on the rollers and acting on the workbench, and a motor assembly fixedly connected to the workbench and poweredly connected to one of the rollers. The workbench has blocking edges on both sides to abut against the two sides of the belt body.

[0010] Preferably, the support includes two U-shaped fixed frames, with both ends of the fixed frames fixedly connected to two blocking edges, and the two fixed frames are distributed in front and behind at the rear of the workbench. Each fixed frame is connected to a hanging rod, and the fixed frames are used to lift the front and rear ends of the hot air box.

[0011] Preferably, the hot air box has an outer metal protective layer and an inner heat insulation layer, the hot air fan is fixedly installed on the top of the hot air box, and the air inlet and air outlet of the hot air fan are both located inside the hot air box.

[0012] Preferably, work plates extend from both sides of the front of the workbench.

[0013] Preferably, at least three hot air blowers are provided, and the three hot air blowers are evenly distributed inside the hot air box.

[0014] Compared with the prior art, the beneficial effects of this utility model are: By designing the belt conveyor mechanism to be wider on both sides than the hot air box, the belt conveyor mechanism extends beyond the hot air box. In actual operation, this ensures that the connecting wires of the circuit board are always outside the hot air's reach. This largely avoids the insulation aging and embrittlement, conductor oxidation, and other losses caused by the connecting wires entering the high-temperature area along with the circuit board in traditional heat shrinking methods. It effectively protects the insulation and conductivity of the connecting wires, reducing product defect rates and subsequent maintenance costs.

[0015] The hot air box is suspended by a bracket with its opening facing downwards. Combined with the downward-blowing design of the hot air blower, it can precisely focus the hot air onto the control circuit board on the belt conveyor mechanism. At the same time, the height difference between the hot air box and the belt conveyor mechanism can ensure that the hot air forms a stable high-temperature environment in the circuit board area. This ensures that the heat shrink film can shrink and adhere quickly and evenly, improving the efficiency and quality of heat shrinking and lamination, while avoiding energy waste caused by excessive heat diffusion.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a front structural diagram of the present invention.

[0019] The reference numerals and names in the figure are as follows: Workbench 10, blocking edge 11, work plate 12, belt conveyor mechanism 20, roller 21, belt body 22, motor assembly 23, bracket 30, fixing frame 31, hanging rod 32, hot air box 40, metal protective layer 41, heat insulation layer 42, hot air blower 50. Detailed Implementation

[0020] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] Please see Figure 1-2 In this embodiment of the utility model, a heat shrinking device for coating a circuit board with wires includes a long strip-shaped workbench 10. A belt conveyor mechanism 20 is provided on the workbench 10. A bracket 30 is fixedly installed on the workbench 10 at the rear position of the belt conveyor mechanism 20. A hot air box 40 located above the belt conveyor mechanism 20 is suspended on the bracket 30. A hot air fan 50 is installed on the hot air box 40. At least three hot air fans 50 are provided. The three hot air fans 50 are evenly distributed in the hot air box 40, and the opening of the hot air box 40 faces downward so that the hot air provided by the hot air fan 50 blows downward toward the belt conveyor mechanism 20. The hot air box 40 and the belt conveyor mechanism 20 are spaced apart in height, and the two sides of the belt conveyor mechanism 20 are wider than the two sides of the hot air box 40, so that the belt conveyor mechanism 20 has a portion that extends beyond the two sides of the hot air box 40.

[0022] When the heat-shrinkable circuit board coating device is in operation, the heat-shrinkable circuit board is first placed on the belt conveyor mechanism 20 of the workbench 10. At this time, according to the structural characteristics of the circuit board, the control circuit board part covered with heat-shrinkable film should be aligned with the corresponding area of ​​the belt conveyor mechanism 20 and the hot air box 40, while the connecting wire part is naturally placed on the part of the belt conveyor mechanism 20 that extends beyond the sides of the hot air box 40. After the device is started, the belt conveyor mechanism 20 starts to operate, driving the circuit board forward along the long strip of the workbench 10. When the control circuit board part of the circuit board is conveyed to the bottom of the hot air box 40, the belt conveyor mechanism 20 temporarily stops or maintains a constant speed conveying state, and the hot air fan 50 installed on the hot air box 40 starts simultaneously. The generated hot air is blown precisely downwards through the downward opening of the hot air box 40 onto the control circuit board on the belt conveyor mechanism 20. Because the hot air box 40 and the belt conveyor mechanism 20 are spaced at a certain height, the hot air can form a stable high-temperature zone around the control circuit board, ensuring that the heat shrink film shrinks quickly and adheres tightly to the surface of the circuit board under the action of the hot air, achieving the heat shrink coating effect. During this process, because the two sides of the belt conveyor mechanism 20 are wider than the two sides of the hot air box 40, the connecting wires are always outside the two sides of the hot air box 40, thus avoiding the range of the hot air from the hot air box 40 and not coming into contact with the high-temperature hot air. After the heat shrink film on the control circuit board is shrunk, the belt conveyor mechanism 20 continues to operate, conveying the processed circuit board with wires out of the area of ​​the hot air box 40, completing the entire heat shrink coating operation.

[0023] Therefore, by designing the belt conveyor mechanism 20 to be wider on both sides than the hot air box 40, thus extending beyond the hot air box 40, the connecting wires of the circuit board are kept outside the hot air's effective range during actual operation. This largely avoids the insulation aging and embrittlement, conductor oxidation, and other losses caused by the connecting wires entering the high-temperature area along with the circuit board in traditional heat shrinking methods. This effectively ensures the insulation and conductivity of the connecting wires, reducing product defect rates and subsequent maintenance costs. Secondly, the hot air box 40 is suspended by the bracket 30 with its opening facing downwards. Combined with the downward-blowing design of the hot air blower 50, the hot air can be precisely focused on the control circuit board on the belt conveyor mechanism 20. At the same time, the height difference between the hot air box 40 and the belt conveyor mechanism 20 ensures a stable high-temperature environment in the circuit board area. This ensures that the heat shrink film can shrink and adhere quickly and evenly, improving the efficiency and quality of the lamination heat shrinking, while avoiding energy waste caused by excessive hot air diffusion. In addition, the design of the long strip workbench 10 with the belt conveyor mechanism 20 facilitates the continuous conveying and heat shrinking of the circuit board with wires, which is suitable for mass production needs. The structure of the belt conveyor mechanism 20 being wider on both sides than the hot air box 40 also provides ample space for operators to observe the status of the connecting wires and adjust the position of the circuit board during the conveying process, improving the convenience and safety of operation.

[0024] Please see Figure 1-2 Based on the above technical solution, a further proposed belt conveyor mechanism 20 includes rollers 21 installed at both ends of the workbench 10, a belt body 22 sleeved on the rollers 21 and acting on the workbench 10, and a motor assembly 23 fixedly connected to the workbench 10 and poweredly connected to one of the rollers 21. The conveying structure, composed of the rollers 21 at both ends of the workbench 10, the sleeved belt body 22, and the powered motor assembly 23, can drive the belt body 22 to achieve uniform and stable operation by utilizing the stable driving force of the motor assembly 23 on the rollers 21. This avoids the conveying speed fluctuation problem that may occur in traditional conveying methods, ensuring... The control circuit board covered with heat-shrink film can pass under the hot air box 40 at a uniform speed, so that the hot air can continuously and evenly act on the heat-shrink film, effectively preventing problems such as inconsistent shrinkage of the heat-shrink film and poor local adhesion caused by uneven conveying speed, and further improving the quality of heat-shrink film coating; the two sides of the worktable 10 have blocking edges 11 to abut against the two sides of the belt body 22, which can accurately abut against the two sides of the belt body 22, effectively limiting the lateral displacement of the belt body 22 during operation, preventing the belt body 22 from running off track due to long-term use or uneven force, and ensuring that the circuit board on the belt body 22 always stays on the preset conveying path.

[0025] Please see Figure 1-2Based on the above technical solution, it is further proposed that the support 30 includes two U-shaped fixing frames 31, with both ends of the fixing frames 31 fixedly connected to two blocking edges 11. This connection method not only utilizes the existing structural strength of the blocking edges 11 to ensure the stability of the fixing frames 31 after installation, avoiding problems such as loosening or displacement of the fixing frames 31, but also allows the fixing frames 31 to form an integrated structure with the worktable 10, eliminating the need to open additional mounting holes or add fixing components on the surface of the worktable 10, reducing damage to the original structure of the worktable 10, and lowering the processing difficulty and cost. The two fixing frames 31 are distributed front and rear at the rear of the worktable 10, and each fixing frame 31 is connected to a hanging rod 32, which lifts the front and rear ends of the hot air box 40. Two fixed frames 31 are designed to be distributed front and back at the rear of the workbench 10, corresponding to the front and rear ends of the drying box. The front and rear ends of the drying box are then lifted by the hanging rods 32, which can keep the drying box in a horizontal and stable installation state above the belt conveyor mechanism 20. This effectively avoids the drying box tilting due to uneven force, ensures that the opening of the drying box is accurately aligned with the belt conveyor mechanism 20, and ensures that the hot air generated by the hot air blower 50 can be blown evenly and concentratedly to the lower wire circuit board control part, further improving the stability of the drying effect.

[0026] Please see Figure 1-2Based on the above technical solution, it is further proposed that the hot air box 40 has an outer metal protective layer 41 and an inner heat insulation layer 42. This not only provides reliable physical protection for the internal structure, resisting damage to the hot air box 40 caused by external impacts and collisions, and extending the service life of the equipment, but also ensures that the hot air box 40 is not easily deformed under long-term high-temperature working environment due to the structural stability of the metal material, maintaining the precise downward orientation of the opening, and ensuring the concentrated effect of hot air on the circuit board. The inner heat insulation layer 42 can effectively block the transfer of high temperature inside the hot air box 40 to the outside. On the one hand, it can avoid the ambient temperature of the device being too high, preventing burns to operators when they approach the equipment, greatly improving the safety of use. On the other hand, it can reduce the heat loss inside the box, keeping the hot air box 40 in a stable high-temperature environment, reducing the energy consumption required by the hot air blower 50 to maintain the temperature, achieving energy saving, and preventing the workbench 10, belt conveyor mechanism 20 and other surrounding components from aging due to heat leakage, further protecting the operational stability of the entire device. The hot air blower 50 is fixedly installed on the top of the hot air box 40, and both the air inlet and outlet of the hot air blower 50 are located inside the hot air box 40, forming an internal heating circulation air duct. After the hot air blower 50 draws in air from the hot air box 40 and heats it, it directly delivers the hot air to the circuit board area below the hot air box 40. It does not need to frequently exchange with the outside cold air, which reduces heat loss during the transportation process, ensures that the temperature of the blown hot air is stable and sufficient, and avoids temperature fluctuations inside the box caused by the intake of cold air, which would affect the shrinkage effect of the heat shrink film. It also allows the hot air to form a certain circulation flow inside the hot air box 40, making the temperature distribution inside the box more uniform. This ensures that the heat shrink film in all parts of the circuit board is subjected to the same hot air action, further improving the uniformity and quality of the film drying. At the same time, this built-in installation method also reduces the exposed parts of the hot air blower 50, reduces the interference and damage of external factors to the hot air blower 50, and improves its working reliability and service life.

[0027] Please see Figure 1 Based on the above technical solution, it is further proposed that work boards 12 extend from both sides of the front of the workbench 10. Operators can complete the heat shrink film application work on the circuit board on the work board 12, which provides key auxiliary support space for the whole process of heat shrink film application on the circuit board with wires, and significantly improves the convenience of operation.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A heat shrinking device for coating circuit boards with wires, characterized in that, Includes a long strip-shaped workbench (10), on which a belt conveyor mechanism (20) is provided. A bracket (30) is fixedly installed at the rear of the workbench (10) and a hot air box (40) is suspended above the belt conveyor mechanism (20) on the bracket (30). A hot air fan (50) is installed on the hot air box (40) and the opening of the hot air box (40) faces downward so that the hot air provided by the hot air fan (50) blows downward toward the belt conveyor mechanism (20). The hot air box (40) and the belt conveyor mechanism (20) are spaced at a height, and the two sides of the belt conveyor mechanism (20) are wider than the two sides of the hot air box (40), so that the belt conveyor mechanism (20) has a portion that extends beyond the two sides of the hot air box (40).

2. The heat shrinking device for coating circuit boards with wires according to claim 1, characterized in that, The belt conveyor mechanism (20) includes rollers (21) installed at both ends of the workbench (10), a belt body (22) sleeved on the rollers (21) and acting on the workbench (10), and a motor assembly (23) fixedly connected to the workbench (10) and poweredly connected to one of the rollers (21). The workbench (10) has blocking edges (11) on both sides to abut against the sides of the belt body (22).

3. The heat shrinking device for coating circuit boards with wires according to claim 2, characterized in that, The support (30) includes two U-shaped fixed frames (31). The two ends of the fixed frames (31) are fixedly connected to two blocking edges (11) respectively. The two fixed frames (31) are distributed in front and behind at the rear of the workbench (10). Each fixed frame (31) is connected to a hanging rod (32). The fixed frames (31) lift the front and rear ends of the hot air box (40) through the hanging rods (32).

4. The heat shrinking device for coating circuit boards with wires according to claim 1, characterized in that, The hot air box (40) has an outer metal protective layer (41) and an inner heat insulation layer (42). The hot air blower (50) is fixedly installed on the top of the hot air box (40), and the air inlet and air outlet of the hot air blower (50) are both located inside the hot air box (40).

5. The heat shrinking device for coating wired circuit boards according to claim 1, characterized in that, Work plates (12) extend from both sides of the front of the workbench (10).

6. The heat shrinking device for coating a circuit board with wires according to claim 4, characterized in that, At least three hot air blowers (50) are provided, and the three hot air blowers (50) are evenly distributed inside the hot air box (40).