Heat dissipation fixing structure of metal substrate
By setting countersunk holes and elastic rod structures on the copper plate and the metal thermally conductive substrate, the problem of bolts loosening due to vibration is solved, ensuring the stability and heat dissipation effect of the copper plate, thermally conductive adhesive film and the metal thermally conductive substrate, making it suitable for vibration environments such as automotive headlights.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN CORNERSTONE NEW MATERIAL TECH CO LTD
- Filing Date
- 2025-06-05
- Publication Date
- 2026-07-24
AI Technical Summary
In the prior art, when power semiconductor modules are fixed to automotive lights with screws, the screws are prone to loosening or falling off due to vibration, causing the copper plate, thermal conductive film and metal thermal conductive substrate to delaminate, affecting the heat dissipation effect.
A high-temperature pressing process is used to bond a copper plate, a thermally conductive adhesive film, and a metal thermally conductive substrate into an integral structure. Countersunk holes are set on the copper plate and the metal thermally conductive substrate, and bolts are connected through the countersunk holes. The bolts have notches, and an elastic rod is installed in the countersunk hole of the copper plate. The elastic rod is made of metal and coated with insulating rubber to prevent the bolts from loosening.
It effectively prevents bolts from loosening or falling off due to vibration, ensuring the stability of the copper plate, thermally conductive adhesive film and metal thermally conductive substrate, maintaining the long-lasting heat dissipation effect, and is suitable for vibration environments such as automotive headlights.
Smart Images

Figure CN224556056U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of aluminum substrate fixing technology, and in particular to a heat dissipation fixing structure for a metal substrate. Background Technology
[0002] A power semiconductor module is a combination of components with specific functions and modes. It consists of high-power electronic power devices combined and encapsulated into a single unit. Different functions can be achieved depending on the packaged components. Our company's patent ZL 202304024413 describes a circuit board module with a heat dissipation structure, primarily composed of a copper plate, a thermally conductive adhesive film, and a metal thermally conductive substrate; these three components are heat-pressed together and then fixed to ensure stability.
[0003] The usual method of fixing is by screws. However, if the circuit board module with heat dissipation structure is used in automotive headlights, fixing it with screws has certain drawbacks. For example, vibration may cause the screws to fall off or the tightness to decrease. Over time, the copper plate, thermally conductive adhesive film and metal thermally conductive substrate may delaminate, resulting in a decrease in heat dissipation effect. Therefore, this application proposes a heat dissipation fixing structure for a metal substrate. Utility Model Content
[0004] In view of the shortcomings of the existing technology, the present invention provides a heat dissipation fixing structure for a metal substrate.
[0005] An embodiment of this utility model provides a heat dissipation fixing structure for a metal substrate, comprising: A copper plate, a thermally conductive adhesive film, and a metal thermally conductive substrate are bonded together by a high-temperature pressing process to form an integral structure. A fixing structure; the fixing structure includes a first countersunk hole on a copper plate, a second countersunk hole on a metal thermally conductive substrate, a bolt threadedly connected to the first countersunk hole in the second countersunk hole, a notch on the bolt, and an elastic rod located in the notch in the first countersunk hole.
[0006] Furthermore, the metal thermally conductive substrate is provided with heat dissipation teeth, each of which extends downward in a direction perpendicular to the lower surface of the metal thermally conductive substrate.
[0007] Furthermore, the two ends of the bolt are located in the first countersunk hole and the second countersunk hole, respectively, and the first countersunk hole and the second countersunk hole are the same size.
[0008] Furthermore, the elastic rod is a metal rod, and the outside of the metal rod is coated with insulating rubber.
[0009] Furthermore, the inner wall of the first countersunk hole is provided with internal threads, and the bolt engages with the internal threads.
[0010] Furthermore, the notch is perpendicular to the bolt axis, and the depth of the notch is less than the radius of the bolt.
[0011] Compared with the prior art, the present invention has the following beneficial effects: This invention effectively prevents bolts from loosening or falling off due to vibration by setting notches on the bolts and setting elastic rods in the countersunk holes of the copper plate. It also avoids delamination of the copper plate, thermally conductive adhesive film, and metal thermally conductive substrate, ensuring the durability of heat dissipation. At the same time, the elastic rods are made of metal and coated with insulating rubber, which ensures both structural stability and safety. It is particularly suitable for vibration environments such as automotive headlights. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the heat dissipation and fixing structure of a metal substrate described in an embodiment of the present invention.
[0013] Figure 2 This is a schematic diagram of the orientation of the metal heat-conducting substrate in a heat dissipation fixing structure for a metal substrate as described in an embodiment of this utility model.
[0014] Figure 3 This is a schematic diagram of the copper plate orientation in a heat dissipation fixing structure for a metal substrate as described in an embodiment of this utility model.
[0015] Figure 4 This is a schematic diagram of the bolts in the heat dissipation fixing structure of a metal substrate described in an embodiment of this utility model.
[0016] In the above figures: 1. Metal thermally conductive substrate, 2. Bolt, 3. Copper plate, 4. First countersunk hole, 5. Thermally conductive adhesive film, 6. Second countersunk hole, 7. Notch, 8. Elastic rod. Detailed Implementation
[0017] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.
[0018] like Figures 1-4 As shown in the figure, this utility model embodiment proposes a heat dissipation fixing structure for a metal substrate, including: The copper plate 3, the thermally conductive adhesive film 5, and the metal thermally conductive substrate 1 are bonded together by a high-temperature pressing process to form an integral structure. The metal thermally conductive substrate 1 is provided with heat dissipation teeth, each of which extends downward along a direction perpendicular to the lower surface of the metal thermally conductive substrate 1. The design of the heat dissipation teeth increases the heat dissipation area of the metal thermally conductive substrate 1 and improves the heat dissipation efficiency.
[0019] The fixing structure includes a first countersunk hole 4 on the copper plate 3 and a second countersunk hole 6 on the metal thermally conductive substrate 1. The two ends of the bolt 2 are located in the first countersunk hole 4 and the second countersunk hole 6, respectively. The first countersunk hole 4 and the second countersunk hole 6 are the same size to ensure that the bolt 2 can pass through smoothly and connect the two. The thermally conductive adhesive film 5 has a through hole opposite to the first countersunk hole 4 so that the bolt 2 can pass through, while ensuring the thermal conductivity of the thermally conductive adhesive film 5.
[0020] The second countersunk hole 6 is provided with a bolt 2 that is threadedly connected to the first countersunk hole 4. The inner wall of the first countersunk hole 4 is provided with an internal thread, and the bolt 2 is engaged with the internal thread. This threaded connection method is both strong and easy to disassemble and maintain. The bolt 2 is provided with a notch 7, which is set perpendicular to the axis of the bolt 2, and the depth of the notch 7 is less than the radius of the bolt 2 to ensure that the strength of the bolt 2 is not affected. At the same time, the design of the notch 7 provides positioning space for the elastic rod 8.
[0021] The first countersunk hole 4 is provided with an elastic rod 8 located in the notch 7. At this time, the spring rod 8 is in a bent shape, with both ends abutting against the inner wall of the first countersunk hole 4. This can limit the elastic rod 8 so that it will not move or fall out of the notch 7 due to vibration, and can better lock the bolt 2.
[0022] When bolt 2 abuts against the second countersunk hole 6, the notch 7 is close to the inner side of the second countersunk hole 6 and is opposite to the inner wall of the first countersunk hole 4. Thus, when the elastic rod 8 is located inside the notch 7, it also abuts against the inner wall of the first countersunk hole 4. This design can prevent bolt 2 from loosening under vibration or external force, thus improving the stability of the structure. The elastic rod 8 is a metal rod, which can be made of stainless steel or copper, etc., while the insulating rubber can prevent current from passing through, ensuring the safety of the structure.
[0023] After the bolt 2 is installed in place, press the two ends of the elastic rod 8 relative to each other to make it bend, then place it in the first countersunk hole 4 and opposite the notch 7, loosen the elastic rod 8 to reset it, and it can be locked in the notch 7; or insert one end of the elastic rod 8 into the notch 7 until the elastic rod 8 is located in the first countersunk hole 4.
[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A heat dissipation fixing structure for a metal substrate, characterized in that, include: The copper plate (3), the thermally conductive adhesive film (5), and the metal thermally conductive substrate (1) are bonded together by a high-temperature pressing process to form an integral structure. Fixed structure; the fixed structure includes a first countersunk hole (4) on the copper plate (3), a second countersunk hole (6) on the metal heat-conducting substrate (1), a bolt (2) threadedly connected to the first countersunk hole (4) in the second countersunk hole (6), a notch (7) on the bolt (2), and an elastic rod (8) located in the notch (7) in the first countersunk hole (4).
2. The heat dissipation and fixing structure for a metal substrate according to claim 1, characterized in that, in: The metal thermally conductive substrate (1) is provided with heat dissipation teeth, and each heat dissipation tooth extends downward along a direction perpendicular to the lower surface of the metal thermally conductive substrate (1).
3. The heat dissipation and fixing structure for a metal substrate according to claim 1, characterized in that, in: The two ends of the bolt (2) are located in the first countersunk hole (4) and the second countersunk hole (6) respectively, and the first countersunk hole (4) and the second countersunk hole (6) have the same size.
4. The heat dissipation and fixing structure for a metal substrate according to claim 1, characterized in that, in: The elastic rod (8) is a metal rod, and the outside of the metal rod is covered with insulating rubber.
5. The heat dissipation and fixing structure for a metal substrate according to claim 1, characterized in that, in: The inner wall of the first countersunk hole (4) is provided with internal threads, and the bolt (2) is engaged with the internal threads.
6. The heat dissipation and fixing structure for a metal substrate according to claim 1, characterized in that, in: The notch (7) is set perpendicular to the axis of the bolt (2), and the depth of the notch (7) is less than the radius of the bolt (2).