Heat dissipation structure of vehicle-mounted device, vehicle-mounted device and vehicle

By combining heat-conducting components with air-cooling components, a heat dissipation layout with heat separation is formed, which solves the problem of insufficient heat dissipation of vehicle electronic equipment, realizes efficient heat dissipation and electromagnetic shielding, and meets the heat dissipation and electromagnetic shielding requirements of vehicle equipment.

CN224556067UActive Publication Date: 2026-07-24CHONGQING CHANGAN AUTOMOBILE CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHONGQING CHANGAN AUTOMOBILE CO LTD
Filing Date
2025-06-30
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing technologies for heat dissipation design of in-vehicle electronic devices are insufficient to cope with the heat generated by the continuous operation of high-power devices, failing to meet the ever-increasing heat dissipation demands and hindering the further development of autonomous driving technology.

Method used

The heat-conducting component is connected to the heat source part of the circuit board, and the air-cooling component is connected to the heat-conducting component to form a heat dissipation layout that separates hot and cold. The high thermal conductivity of the heat-conducting component is used to quickly conduct heat, and the airflow of the air-cooling component removes the heat. The airflow path is optimized to enhance the heat dissipation effect.

Benefits of technology

It achieves efficient heat dissipation, meets the heat dissipation requirements of electronic devices, reduces costs, and enhances electromagnetic shielding and sealing effects through shielding covers and elastic seals, ensuring stable chip performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224556067U_ABST
    Figure CN224556067U_ABST
Patent Text Reader

Abstract

The application relates to a heat dissipation structure of a vehicle-mounted device, the vehicle-mounted device and a vehicle, and belongs to the technical field of vehicles, to solve the technical problem of poor heat dissipation effect of a circuit board of a vehicle-mounted electronic device in the related art. The heat dissipation structure provided by the application comprises a circuit board, a heat conduction piece and an air cooling assembly. The circuit board comprises a substrate and a chip electrically connected to the substrate. The chip is arranged between the substrate and the heat conduction piece. A heat source part is formed on the side of the chip facing the heat conduction piece. The heat conduction piece is in heat conduction connection with the heat source part of the circuit board assembly. The air cooling assembly and the circuit board are arranged on the two sides of the heat conduction piece opposite in a first direction. The air cooling assembly is in heat conduction connection with the heat conduction piece. The air inlet direction of the air cooling assembly is consistent with the first direction.
Need to check novelty before this filing date? Find Prior Art