heat sink
By introducing a first fluid medium from the steam chamber and a second fluid medium from the cold plate into the radiator, and combining the structure of the heat spreader and heat pipe, multi-path heat transfer is achieved, solving the problem of low heat dissipation efficiency of existing heat spreaders and improving heat dissipation efficiency and effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG ENVICOOL TECH CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-24
Smart Images
Figure CN224556078U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of heat dissipation technology, and in particular relates to a heat sink. Background Technology
[0002] With the continuous advancement of technology, the power consumption of electronic devices is gradually increasing, and the requirements for heat dissipation of the heat source inside these devices are also gradually increasing. As an efficient heat dissipation method, heat exchange plates are used to remove heat through a second fluid medium, which can achieve relatively efficient heat exchange and has been widely used in many fields in recent years.
[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:
[0004] A vapor chamber uses a phase change process to transfer heat from the heat source to the outside. However, although this single-path heat transfer method can disperse heat, there is still a lot of room for improvement in terms of heat dissipation efficiency. Utility Model Content
[0005] This application aims to address the technical problem that there is significant room for improvement in the heat dissipation efficiency of heat exchange plates in the prior art.
[0006] This application provides a heat sink, including: a first heat dissipation part, a second heat dissipation part, and a heat pipe;
[0007] A vapor chamber is formed between the first heat dissipation part and the second heat dissipation part, and a first fluid medium is provided in the vapor chamber;
[0008] The first heat dissipation part includes a heat spreader plate, the evaporation zone of the heat spreader plate is used to contact the heat source, and the condensation zone of the heat spreader plate faces into the steam chamber;
[0009] The second heat dissipation section includes a cold plate, the heat-conducting surface of which faces the inside of the steam chamber; the evaporation end of the heat pipe is connected to the steam chamber.
[0010] According to one embodiment of this application, the condensing end of the heat pipe extends to the heat dissipation surface of the cold plate and is in contact with the heat dissipation surface.
[0011] According to one embodiment of this application, a recessed groove is formed at the location corresponding to the heat source in the first heat dissipation part, and the bottom surface of the groove is the heat spreader plate.
[0012] According to one embodiment of this application, the cold plate is provided with a medium flow cavity, and a plurality of heat dissipation fins spaced apart from each other are provided in the medium flow cavity. A flow gap for the flow of a second fluid medium is formed between two adjacent heat dissipation fins, and the two ends of the flow gap are connected.
[0013] According to one embodiment of this application, the portion of the condenser end of the heat pipe located on the heat dissipation surface is perpendicular to the flow gap, and its projection in the vertical direction passes through at least two of the flow gaps.
[0014] According to one embodiment of this application, multiple heat pipes are spaced apart along the flow direction of the second fluid medium in the flow gap.
[0015] According to one embodiment of this application, the condensing end of the heat pipe is welded to the heat dissipation surface of the cold plate.
[0016] According to one embodiment of this application, the cold plate has a first flow port and a second flow port communicating with the medium flow cavity, wherein the first flow port is used for the inflow of the flowing medium and the second flow port is used for the outflow of the flowing medium.
[0017] According to one embodiment of this application, the cold plate includes an upper cover and a lower cover;
[0018] The upper cover and the lower cover together form the medium flow cavity, and the first flow port and the second flow port are located on the upper cover.
[0019] According to one embodiment of this application, the first flow port and the second flow port are respectively equipped with pipe connectors.
[0020] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects:
[0021] In the radiator of this application, a first fluid medium is disposed in the steam chamber. When the first heat dissipation part is heated by a heat source, the first fluid medium in the steam chamber absorbs heat to form steam. Part of the steam contacts the heat-conducting surface of the cold plate, and another part of the steam moves from the evaporation end of the heat pipe to the condensation end of the heat pipe. The second fluid medium flows in the medium flow chamber of the second heat dissipation part to exchange heat and carry away the heat, thereby achieving the heat dissipation effect. Compared with the use of a heat spreader or heat pipe alone in related technologies, this application utilizes the first fluid medium in the steam chamber to achieve multi-path heat transfer, which makes the heat transfer efficiency higher and the heat dissipation effect better.
[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0024] Figure 1 This is a three-dimensional structural diagram of the heat sink provided in the embodiment of this application;
[0025] Figure 2 yes Figure 1 Exploded view;
[0026] Figure 3 This is a three-dimensional structural diagram of the heat sink provided in an embodiment of this application from another angle;
[0027] Figure 4 It is along Figure 3 A cross-sectional view along the AA direction;
[0028] Figure 5 yes Figure 1 Another angle of the exploded view;
[0029] Figure 6 yes Figure 5 A further exploded view;
[0030] Figure 7 yes Figure 5 A magnified view of a portion of point A in the middle.
[0031] Figure label:
[0032] 100. First heat dissipation section; 110. Groove; 111. Heat spreader; 1111. Evaporation zone; 1112. Condensation zone;
[0033] 200, Second heat dissipation section; 210, Cold plate; 21a, Heat-conducting surface; 21b, Heat dissipation surface;
[0034] 211. Top cover; 2111. Clearance opening; 2112. Connection hole; 212. Bottom cover; 213. Heat dissipation fins; 220. Pipe connector;
[0035] 300, heat pipe; 310, evaporator end; 320, condenser end;
[0036] a. Heat source; b. Steam chamber; c. Medium flow chamber; d. Flow gap. Detailed Implementation
[0037] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0038] The following is for reference. Figures 1-7 A heat sink according to an embodiment of this application is described.
[0039] Please see Figure 1 and Figure 2This radiator is used to dissipate heat from a heat source a within a limited installation space. The heat source a includes electronic equipment or other devices requiring heat dissipation. The radiator includes a first heat dissipation section 100, a second heat dissipation section 200, and a heat pipe 300. The first heat dissipation section 100 contacts the heat source a and absorbs heat, then transfers the heat to the second heat dissipation section 200 and the heat pipe 300 respectively through a first fluid medium within the vapor chamber b, thereby achieving heat dissipation from the heat source a.
[0040] The first heat dissipation section 100 includes a vapor chamber 111, the evaporation zone 1111 of which is used to contact the heat source a, and the condensation zone 1112 of which faces into the steam chamber; the second heat dissipation section 200 includes a cold plate 210, the heat-conducting surface 21a of which faces into the steam chamber b; the evaporation end 310 of the heat pipe 300 is connected to the steam chamber b, and the condensation end 320 of the heat pipe 300 extends to the heat dissipation surface 21b of the cold plate 210 and is in contact with the heat dissipation surface 21b.
[0041] The heat spreader 111 is a thin sheet made of metal, containing a capillary wick filled with working fluid. When heat from heat source a is conducted to the evaporation zone 1111 of the heat spreader 111, the working fluid absorbs heat and evaporates into steam. The steam diffuses from the high-pressure zone (high-temperature zone) to the low-pressure zone (low-temperature zone) under the action of pressure difference. When the steam comes into contact with the cooler inner wall in the condensation zone 1112, it condenses into liquid and releases heat. The condensed liquid flows back to the evaporation zone 1111 through the capillary action of the capillary wick, reabsorbs heat from heat source a, and evaporates.
[0042] The cold plate 210 includes a heat-conducting substrate made of a highly thermally conductive material (such as aluminum or copper), internal coolant channels, and inlets / outlets. The heat-conducting substrate conducts heat from the heat source to the coolant; the coolant flows in the coolant channels, absorbing and carrying away heat; the inlets / outlets connect to the coolant circulation system, ensuring the inflow and outflow of coolant. The cold plate 210 transfers heat from the heat source to the coolant through conduction and convection, thereby achieving heat dissipation. Specifically, the heat-conducting substrate (heat-conducting surface 21a) of the cold plate 210 contacts the heat source (i.e., the first fluid medium), absorbs heat, and then conducts the heat through the substrate to the internal coolant channels; the coolant flows through these channels, absorbs heat, is carried out of the cold plate 210, and releases heat in an external heat exchanger, thus completing a heat dissipation cycle.
[0043] The heat pipe 300 includes a shell made of a metal with high thermal conductivity, a sealed working fluid (i.e., a first fluid medium) inside the shell, and a capillary wick. When the evaporation end 310 of the heat pipe 300 is heated, the working fluid absorbs heat and evaporates into vapor. Due to the pressure difference between the evaporation end 310 and the condensation end 320, the vapor flows from the evaporation end 310 to the condensation end 320 inside the heat pipe 300. At the condensation end 320, the vapor encounters a cooler environment, releases heat, and condenses into liquid. The condensed liquid, under the action of capillary force, flows back to the evaporation end 310 along the capillary wick, forming a closed loop.
[0044] Specifically, please see Figure 3 and Figure 4 A recessed groove 110 is formed in the middle of the first heat dissipation part 100 (corresponding to the heat source a), and the bottom surface of the groove 110 is a heat spreader 111. The heat spreader 111 can better transfer heat when in contact with the heat source a. The partial recessed design of the first heat dissipation part 100 diffuses heat to a larger plane for outward transfer with the same heat source contact area, which is suitable for situations where space is limited.
[0045] Specifically, the heat spreader 111 has a closed inner cavity (not shown) containing a heat transfer medium. The heat spreader 111 includes an evaporation zone 1111 at the bottom of the closed inner cavity and a condensation zone 1112 at the top of the closed inner cavity. When the heat spreader 111 contacts the heat source a, the heat transfer medium is heated and evaporated in the evaporation zone 1111, rises to the condensation zone 1112, condenses, and falls back to the evaporation zone 1111, thereby achieving the purpose of heat transfer to the steam chamber b.
[0046] More specifically, a first fluid medium, which can be water, is disposed within the steam chamber b. The heat pipe 300 includes an evaporation end 310 and a condensation end 320. The evaporation end 310 is fixedly connected to the first heat dissipation part 100 and communicates with the steam chamber 310. The outer wall of the condensation end 320 is in contact with the second heat dissipation part 200. That is, the steam chamber b, as an intermediate heat transfer medium, can realize heat transfer between different objects in different directions, including: heat transfer between the heat spreader 111 (condensation zone 1112) and the second heat dissipation part 200 (lower cover 212), and heat transfer between the first heat dissipation part 100 and the heat pipe 300.
[0047] During operation, heat source a transfers heat through contact with the evaporation zone 1111 of the heat spreader 111 and the condensation zone 1112. The condensation zone 1112 contacts the first fluid medium in the steam chamber b. The first fluid medium absorbs heat to form steam. Part of the steam is in the steam chamber b and transfers heat through contact with the lower surface of the second heat dissipation section 200. Another part of the steam moves from the evaporation end 310 of the heat pipe 300 to the condensation end 320 of the heat pipe 300 for heat transfer, and dissipates heat through contact with the upper surface of the second heat dissipation section 200 via the condensation end 320.
[0048] In actual implementation, the evaporation end 310 of the heat pipe 300 is located on the side of the first heat dissipation section 100, and the condensation end 320 of the heat pipe 300 extends to the upper surface of the second heat dissipation section 200. Multiple heat pipes 300 can be provided, spaced apart and distributed on opposite sides of the second heat dissipation section 200. Specifically, the outer wall of the condensation end 320 of the heat pipe 300 is welded to the upper surface of the second heat dissipation section 200.
[0049] The second heat dissipation section 200 has a medium flow cavity c inside the cold plate 210 to accommodate a second fluid medium, thereby improving heat exchange efficiency. This second fluid medium can be water or coolant. Specifically, the second heat dissipation section 200 has a first flow port and a second flow port. The first flow port allows the second fluid medium to flow in, while the second flow port allows it to flow out. The second fluid medium flows within the second heat dissipation section 200 to exchange heat, carrying away heat and thus achieving heat dissipation. Specifically, both the first and second flow ports are equipped with pipe connectors 220, which can be pagoda connectors.
[0050] In the above embodiments of this application, a first fluid medium is provided in the steam chamber b. When the heat spreader 111 of the first heat dissipation part 100 absorbs heat from the heat source a, the first fluid medium in the steam chamber b absorbs heat and evaporates to form steam. Part of the steam contacts the heat-conducting surface 21a of the cold plate 210 of the second heat dissipation part 200, and another part of the steam moves from the evaporation end 310 of the heat pipe 300 to the condensation end 320 of the heat pipe 300, and contacts the heat dissipation surface 21b of the cold plate 210 through the condensation end 320. During this process, the second fluid medium flows in the medium flow cavity c in the cold plate 210 to exchange heat and carry away the heat. Compared with the use of heat spreaders or heat pipes alone in related technologies, this application utilizes the first fluid medium in the steam chamber b to achieve multi-path heat transfer, resulting in higher heat transfer efficiency and better heat dissipation effect.
[0051] Please see Figures 5-7 In some embodiments, the second heat dissipation unit 200 includes: an upper cover 211 and a lower cover 212;
[0052] The upper cover 211 and the lower cover 212 enclose a medium flow cavity c, with a first flow port and a second flow port located on the upper cover 211; wherein the upper cover 211 is provided with a clearance opening 2111 through which the heat pipe 300 passes. This clearance opening 2111 facilitates the passage of the heat pipe 300 so that the heat pipe 300 can extend to the upper surface of the upper cover 211 that contacts the second heat dissipation part 200.
[0053] Furthermore, the medium flow cavity c is provided with a plurality of heat dissipation fins 213 spaced apart from each other. The heat dissipation fins 213 are fixedly connected to the upper cover 211 and / or the lower cover 212. A flow gap d is formed between each two adjacent heat dissipation fins 213, and the flow gap d between each two adjacent heat dissipation fins 213 is connected.
[0054] In this way, the second fluid medium comes into contact with multiple heat dissipation fins 213 in the medium flow cavity c during the flow process. Compared with flowing directly in the medium flow cavity c, the contact heat transfer area is larger and the heat dissipation effect is better.
[0055] Furthermore, as Figure 4 As shown, the flow direction of the second fluid medium in the flow gap d is perpendicular to the paper and flows inward or outward. The portion of the heat pipe 300 located on the heat dissipation surface 21b is perpendicular to the flow direction of the second fluid medium in the flow gap d and covers multiple flow gaps d. On the other hand, multiple heat pipes 300 are spaced apart in the flow direction of the second fluid medium in the flow gap, for example, three heat pipes 300 are arranged on each side in the illustrated embodiment.
[0056] In actual implementation, the upper cover 211 is provided with connecting holes 2112. The connecting holes 2112 are distributed near the edge of the upper cover 211 so that screws or other fasteners can fix the upper cover 211 to a fixed object. Specifically, there can be multiple connecting holes 2112, which are distributed on the edge of the upper cover 211.
[0057] In actual implementation, the first and second flow ports are each equipped with a pipe connector 220, which can be a pagoda connector or other types of connectors. This pipe connector 220 provides a standardized connection interface between the medium flow chamber c and the external pipeline, thereby simplifying and quickly installing and disassembling the external pipeline, reducing assembly complexity, and shortening maintenance and replacement time.
[0058] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0059] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0060] In the description of this application, "first feature" and "second feature" may include one or more of the features.
[0061] In the description of this application, "multiple" means two or more.
[0062] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.
[0063] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.
[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0065] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A radiator, characterized in that, include: First heat dissipation section, second heat dissipation section and heat pipe; A vapor chamber is formed between the first heat dissipation part and the second heat dissipation part, and a first fluid medium is provided in the vapor chamber; The first heat dissipation part includes a heat spreader plate, the evaporation zone of the heat spreader plate is used to contact the heat source, and the condensation zone of the heat spreader plate faces into the steam chamber; The second heat dissipation section includes a cold plate, the heat-conducting surface of which faces the inside of the steam chamber; The evaporation end of the heat pipe is connected to the vapor chamber.
2. The radiator according to claim 1, characterized in that, The condensing end of the heat pipe extends to the heat dissipation surface of the cold plate and is in contact with the heat dissipation surface.
3. The radiator according to claim 1 or 2, characterized in that, The first heat dissipation part forms a sunken groove at the location corresponding to the heat source, and the bottom surface of the groove is the heat spreader plate.
4. The radiator according to claim 2, characterized in that, The cold plate is provided with a medium flow cavity, and a plurality of heat dissipation fins are provided in the medium flow cavity. A flow gap is formed between two adjacent heat dissipation fins for the flow of a second fluid medium, and the two ends of the flow gap are connected.
5. The radiator according to claim 4, characterized in that, The portion of the condenser end of the heat pipe located on the heat dissipation surface is perpendicular to the flow gap, and its projection in the vertical direction passes through at least two of the flow gaps.
6. The radiator according to claim 5, characterized in that, Multiple heat pipes are spaced apart along the flow direction of the second fluid medium in the flow gap.
7. The radiator according to claim 2, characterized in that, The condensing end of the heat pipe is welded to the heat dissipation surface of the cold plate.
8. The radiator according to claim 2, characterized in that, The cold plate has a first flow port and a second flow port that are connected to the medium flow cavity. The first flow port is used for the inflow of the flowing medium, and the second flow port is used for the outflow of the flowing medium.
9. The radiator according to claim 8, characterized in that, The cold plate includes an upper cover and a lower cover; The upper cover and the lower cover together form the medium flow cavity, and the first flow port and the second flow port are located on the upper cover.
10. The radiator according to claim 8, characterized in that, Pipe connectors are installed at the first flow port and the second flow port respectively.