Three-dimensional heat dissipation device and immersion cooling system

Abstract

The present application relates to a three-dimensional heat dissipation device and an immersion cooling system. The three-dimensional heat dissipation device comprises a base, a vapor chamber assembly and an evaporation structure layer. The vapor chamber assembly comprises a main vapor chamber and a plurality of fin vapor chambers. The main vapor chamber is disposed on the base and has a first internal space. The fin vapor chambers are disposed in parallel to each other and are connected to the main vapor chamber. The main vapor chamber and any two adjacent fin vapor chambers define a gap therebetween. Each of the fin vapor chambers has a second internal space which is in communication with the first internal space. The first internal space and the second internal spaces form an airtight chamber. The evaporation structure layer covers and is in thermal contact with the vapor chamber assembly. Through the above structure, the three-dimensional heat dissipation device and the immersion cooling system of the present application can effectively cool and dissipate heat from the component to be cooled, so as to maintain the working efficiency and service life of the component to be cooled.

Description

Technical Field

[0001] This invention relates to a three-dimensional heat dissipation device, and more particularly to a three-dimensional heat dissipation device with a heat spreader assembly and an immersion cooling system. Background Technology

[0002] In recent years, with the significant increase in processing power of electronic devices (such as computers or servers) used in cloud services, these devices generate a large amount of waste heat. Some manufacturers immerse the components of electronic devices that need to be cooled (such as CPUs and GPUs) in a closed tank of working fluid to remove the heat generated by these components.

[0003] However, if the current cooling system lacks effective heat dissipation methods, it will be unable to effectively cool and dissipate heat from the components to be cooled, which may affect the working performance and service life of the components to be cooled.

[0004] However, the aforementioned technologies still have inconveniences and shortcomings, requiring further improvement. Therefore, how to effectively solve these inconveniences and shortcomings is one of the important research and development topics at present, and has become a goal that urgently needs improvement in related fields. Utility Model Content

[0005] This invention proposes a three-dimensional heat dissipation device and an immersion cooling system to solve the problems of prior art.

[0006] According to one embodiment of the present invention, a three-dimensional heat dissipation device includes a base, a vapor chamber assembly, and at least one evaporation structure layer. The vapor chamber assembly includes a main vapor chamber and a plurality of finned vapor chambers. The main vapor chamber is located on the base and has a first internal space. The finned vapor chambers are arranged parallel to each other, respectively connected to the main vapor chamber, and a gap is defined between the main vapor chamber and any two adjacent finned vapor chambers. Each finned vapor chamber has a second internal space communicating with the first internal space, and the first internal space and the second internal spaces together constitute an airtight chamber. The evaporation structure layer covers and is thermally connected to the vapor chamber assembly.

[0007] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the main vapor chamber includes a top surface and a bottom surface opposite to each other, and the finned vapor chambers are spaced apart on the top surface of the main vapor chamber. The evaporation structure layer includes a plurality of first upper evaporation structure layers, which are spaced apart on the top surface of the main vapor chamber, and a portion of these first upper evaporation structure layers are located within the gaps.

[0008] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the main heat dissipation plate further includes a plurality of slots, which are linearly arranged on the top surface of the main heat dissipation plate and are respectively connected to the first internal space, and the fin heat dissipation plates are respectively inserted into these slots.

[0009] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, a top abutment protrudes outward from the bottom surface of the main heat spreader. The evaporation structure layer includes a plurality of first lower evaporation structure layers, which are spaced apart on the bottom surface of the main heat spreader, and the top abutment is located between these first lower evaporation structure layers.

[0010] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer includes a plurality of second evaporation structure layers, which are respectively located on the fin heat exchange plates.

[0011] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, these second evaporation structure layers are respectively located on two opposite sides of each fin heat spreader, and a portion of these second evaporation structure layers are located within these gaps.

[0012] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer has a plurality of filaments that interweave to form a plurality of gaps.

[0013] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is a single-layer or multi-layer structure.

[0014] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

[0015] According to one embodiment of the present invention, an immersion cooling system includes a liquid container, a heat source module, and the aforementioned three-dimensional heat dissipation device. The liquid container has an inner chamber for storing coolant. The heat source module is located inside the liquid container and is immersed in the coolant. The three-dimensional heat dissipation device is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container, the long axis of the gap, and the long axis of the heat spreader assembly are parallel to each other.

[0016] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0017] The above description is only used to illustrate the problem that this creation aims to solve, the technical means to solve the problem, and the effects it produces. The specific details of this creation will be described in detail in the implementation methods and related diagrams below. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1This is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device.

[0021] Figure 3 for Figure 1 A cross-sectional view along line segment AA.

[0022] Figure 4 for Figure 1 A cross-sectional view along line segment BB.

[0023] Figure 5 This is a schematic diagram of an immersion cooling system according to an embodiment of the present invention.

[0024] The reference numerals in the attached figures are explained as follows:

[0025] 10: Three-dimensional heat dissipation device

[0026] 100: Base

[0027] 110: Framework

[0028] 120: Opening

[0029] 130: Elastic Clip

[0030] 200: Heat spreader assembly

[0031] 210: Main heat spreader

[0032] 211: First Internal Space

[0033] 212: Top surface

[0034] 213: Slot

[0035] 214: Bottom

[0036] 215: Top and back sections

[0037] 216: Capillary structure

[0038] 220: Finned Heat Exchanger

[0039] 221: Side view

[0040] 222: Second Interior Space

[0041] 223: Airtight Chamber

[0042] 300: First evaporation structure layer

[0043] 310: First upper evaporation structure layer

[0044] 320: First lower evaporation structure layer

[0045] 400: Second evaporation structure layer

[0046] 500: Immersion Cooling System

[0047] 510: Liquid containers

[0048] 511: Inner Chamber

[0049] 511A: Inner wall

[0050] 520: Coolant

[0051] 600: Heat source module

[0052] 610: Circuit board

[0053] 620: Electronic Components

[0054] AA, BB: line segments

[0055] G: Gap

[0056] X, Y, Z: Axes Detailed Implementation

[0057] The following diagrams disclose various embodiments of this invention. For clarity, many practical details will be described in the following description. However, those skilled in the art will understand that these practical details are not essential in some embodiments of this invention and should not be used to limit the invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in a simplified schematic manner. Additionally, for ease of viewing, the dimensions of the components in the diagrams are not drawn to scale.

[0058] Figure 1 A perspective view of a three-dimensional heat dissipation device 10 according to an embodiment of this invention. Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device 10. Figure 3 for Figure 1 A sectional view taken along line segment AA. (Example) Figures 1 to 3As shown, in this embodiment, the three-dimensional heat dissipation device 10 includes a base 100, a vapor chamber assembly 200, and multiple evaporation structure layers (such as a first evaporation structure layer 300 and a second evaporation structure layer 400). The vapor chamber assembly 200 includes a main vapor chamber 210 and multiple finned vapor chambers 220. The main vapor chamber 210 is located on the base 100 and is used to thermally connect to an element to be cooled (not shown in the figure). These finned vapor chambers 220 are arranged parallel to each other and are respectively connected to the main vapor chamber 210, and a gap G is defined between the main vapor chamber 210 and any two adjacent finned vapor chambers 220. The main vapor chamber 210 has a first internal space 211. Each finned vapor chamber 220 has a second internal space 222 communicating with the first internal space 211, and the first internal space 211 and these second internal spaces 222 together constitute an airtight chamber 223. The airtight chamber 223 is filled with working fluid (not shown in the figure). The evaporation structure layer covers and thermally connects to the vapor chamber assembly 200.

[0059] In this way, the heat energy of the component to be cooled can be distributed to these finned heat exchangers 220 through the working fluid (not shown in the figure) in the main heat exchanger 210, and then evenly dissipated to the outside through the finned heat exchangers 220.

[0060] More specifically, in this embodiment, the base 100 includes a frame 110 and a plurality of elastic clips 130. The frame 110 can be welded or locked to the main heat spreader 210. The elastic clips 130 are located on two opposite sides of the frame 110 for fixing the frame 110 to a stationary component (such as a housing or wiring board). The frame 110 has a plurality of openings 120. These openings 120 are arranged sequentially along the long axis (such as the Y-axis) of the frame 110 and are located between the elastic clips 130.

[0061] The main vapor chamber 210 is generally plate-shaped, having a top surface 212 and a bottom surface 214 facing each other. Finned vapor chambers 220 are spaced apart on the top surface 212 of the main vapor chamber 210, and are linearly arranged along the X-axis on the top surface 212 of the main vapor chamber 210. A protruding abutment 215 protrudes outward from the bottom surface 214 of the main vapor chamber 210 from one of the openings 120 of the frame 110, abutting against the element to be cooled. Each finned vapor chamber 220 is generally plate-shaped and inserted along the Z-axis into the top surface 212 of the main vapor chamber 210. The major axis direction (e.g., Y-axis) of the finned vapor chamber 220 is parallel to the major axis direction (e.g., Y-axis) of the vapor chamber assembly 200; however, the invention is not limited thereto.

[0062] Figure 4 for Figure 1 A sectional view created along line segment BB. (Example) Figure 3 and Figure 4As shown, the first evaporation structure layer 300 includes a plurality of (e.g., 6) first upper evaporation structure layers 310 and a plurality of (e.g., 2) first lower evaporation structure layers 320. These first upper evaporation structure layers 310 are spaced apart on the top surface 212 of the main vapor chamber 210, and a portion (e.g., 4) of these first upper evaporation structure layers 310 are located within the gaps G. These first lower evaporation structure layers 320 are spaced apart on the bottom surface 214 of the main vapor chamber 210, and a top abutment 215 is located between these first lower evaporation structure layers 320. The first lower evaporation structure layers 320 located on the bottom surface 214 of the main vapor chamber 210 are exposed through another opening 120 of the frame 110.

[0063] More specifically, the main vapor chamber 210 further includes a plurality of slots 213. These slots 213 are linearly arranged along the X-axis on the top surface 212 of the main vapor chamber 210, and these slots 213 are respectively connected to the first internal space 211 so that the fin vapor chambers 220 are respectively inserted into the slots 213.

[0064] The first evaporation structure layer 300 is a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the main heat spreader 210; however, this invention is not limited to this.

[0065] In this embodiment, the first evaporation structure layer 300 is a mesh structure, hence also called the first mesh structure layer, which has many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0066] Furthermore, in this embodiment, the first evaporation structure layer 300 is a multi-layer structure with layers stacked sequentially on each other. However, this invention is not limited to this. In other embodiments, the first evaporation structure layer 300 may also be a single-layer structure.

[0067] In this embodiment, the evaporation structure layer comprises a plurality of (e.g., 10) second evaporation structure layers 400. These second evaporation structure layers 400 are respectively located on these finned heat spreaders 220. More specifically, each finned heat spreader 220 has two opposing sides 221. These second evaporation structure layers 400 are respectively fixedly covered on the opposing sides 221 of each finned heat spreader 220 and are thermally connected to the main heat spreader 210, that is, a portion of these second evaporation structure layers 400 are located within these gaps G.

[0068] The second evaporation structure layer 400 is a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the finned heat spreader 220; however, this invention is not limited to this.

[0069] The second evaporation structure layer 400 is a mesh structure, hence also called the second mesh structure layer. It has many filaments (not shown in the figure) that interweave to form multiple voids. Thus, these voids allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled. However, this invention is not limited to this.

[0070] Furthermore, in this embodiment, the second evaporation structure layer 400 is a multi-layer structure with layers stacked sequentially on top of each other. However, the invention is not limited to this, and in other embodiments, the second evaporation structure layer 400 may also be a single-layer structure.

[0071] Furthermore, the airtight chamber 223 of the heat spreader assembly 200 includes a capillary structure 216. The capillary structure 216 is disposed on the inner surface of the airtight chamber 223, allowing the working fluid (not shown) within the airtight chamber 223 to flow under the guidance of the capillary structure 216. The capillary structure 216, the first evaporation structure layer 300, and the second evaporation structure layer 400 can be similar components. For example, the capillary structure 216 can be made of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or any combination thereof, but this invention is not limited thereto.

[0072] It should be understood that this invention is not limited to the number of finned heat spreader 220, first evaporation structure layer 300 and second evaporation structure layer 400. In other embodiments, the finned heat spreader 220 and the first evaporation structure layer 300 and the second evaporation structure layer 400 may also be a single unit.

[0073] Figure 5 This is a schematic diagram of an immersion cooling system 500 according to an embodiment of the present invention. Figure 5 As shown, the immersion cooling system 500 includes a liquid container 510, a heat source module 600, and the aforementioned three-dimensional heat dissipation device 10. The liquid container 510 has an inner chamber 511 for storing coolant 520. The heat source module 600 is located inside the liquid container 510 and is immersed in the coolant 520. The three-dimensional heat dissipation device 10 is located inside the liquid container 510 and is thermally connected to the heat source module 600.

[0074] Thus, as Figure 3 and Figure 5 As shown, when the heat energy of the heat source module 600 is transferred to the three-dimensional heat dissipation device 10, since all surfaces of the first evaporation structure layer 300 and the second evaporation structure layer 400 are in contact with the coolant 520, part of the heat energy transferred to the first evaporation structure layer 300 and the second evaporation structure layer 400 can be quickly exchanged by the coolant 520, thereby effectively accelerating the heat dissipation of the heat source module 600.

[0075] Furthermore, in this embodiment, the three-dimensional heat dissipation device 10 is located upright in the inner cavity 511, and the long axis direction (e.g., Z-axis) of the liquid container 510, the long axis direction (e.g., Z-axis) of the gap G, and the long axis direction (e.g., Z-axis) of the heat spreader assembly 200 are parallel to each other.

[0076] Thus, as Figure 3 and Figure 5 As shown, the coolant 520 can enter the gap G defined between the main heat exchanger 210 and these fin heat exchangers 220, the first evaporation structure layer 300 and the second evaporation structure layer 400, so that the coolant 520 evaporates into bubbles due to heat and rises along the Z-axis to the surface of the coolant 520, thereby effectively removing the heat energy of the heat source module 600.

[0077] For example, the immersion cooling system 500 is a two-phase immersion liquid cooling system, and the liquid container 510 is a 1U server chassis; the heat source module 600 includes a circuit board 610 and several electronic components 620. The circuit board 610 is vertically fixed to the inner wall 511A of the liquid container 510. The electronic components 620 are distributed on the circuit board 610 and are in contact with the top portion 215 of the main heat spreader 210. In this embodiment, the electronic components 620 are conventional components such as CPUs, GPUs, or interface cards; however, this invention is not limited to these.

[0078] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0079] Finally, the embodiments disclosed above are not intended to limit this invention. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of this invention, and all such modifications and refinements shall be protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that, include: A base; A heat exchanger assembly includes a main heat exchanger and multiple finned heat exchangers. The main heat exchanger is located on a base and has a first internal space. The multiple finned heat exchangers are arranged parallel to each other and are respectively connected to the main heat exchanger. A gap is defined between the main heat exchanger and any two adjacent finned heat exchangers. Each of the multiple finned heat exchangers has a second internal space communicating with the first internal space. The first internal space and the second internal space together constitute an airtight chamber. At least one evaporation structure layer covers and thermally connects the vapor chamber assembly.

2. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The main heat exchanger includes a top surface and a bottom surface opposite to each other, and the plurality of finned heat exchangers are spaced apart on the top surface of the main heat exchanger; and The at least one evaporation structure layer includes a plurality of first upper evaporation structure layers, which are spaced apart on the top surface of the main heat spreader, and a portion of the plurality of first upper evaporation structure layers are located within the plurality of gaps.

3. The three-dimensional heat dissipation device as described in claim 2, characterized in that, The main heat spreader further includes multiple slots, which are linearly arranged on the top surface of the main heat spreader and are respectively connected to the first internal space, wherein the multiple fin heat spreaders are respectively inserted into the multiple slots.

4. The three-dimensional heat dissipation device as described in claim 2, characterized in that, The bottom surface of the main heat exchange plate protrudes outwards with a top support; and The at least one evaporation structure layer includes a plurality of first lower evaporation structure layers, the plurality of first lower evaporation structure layers are arranged at intervals on the bottom surface of the main heat spreader, and the top abutment is located between the plurality of first lower evaporation structure layers.

5. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer includes a plurality of second evaporation structure layers, which are respectively located on the plurality of fin heat spreaders.

6. The three-dimensional heat dissipation device as described in claim 5, characterized in that, The plurality of second evaporation structure layers are respectively located on two opposite sides of each of the plurality of finned heat spreaders, and a portion of the plurality of second evaporation structure layers are located within the plurality of gaps.

7. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer has a plurality of filaments that are interwoven to form a plurality of voids.

8. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is a single-layer or multi-layer structure.

9. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

10. An immersion cooling system, characterized in that, include: A liquid container having an internal chamber for storing coolant; A heat source module is located inside the liquid container and is used to be immersed in the coolant; as well as The three-dimensional heat dissipation device as described in any one of claims 1 to 9 is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container, the long axis of the gap, and the long axis of the heat spreader assembly are parallel to each other.

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