An infrared receiving tube of the type which concentrates the light

Abstract

The utility model discloses an environmental light interference's infrared receiving tube of gathering light line type, including package shell, condenser lens, infrared photosensitive chip, connecting wire and conducting strip, the package shell includes base plate and cover shell, is equipped with the welding tin tray on the conducting strip, and infrared photosensitive chip is connected with the welding tin tray through the connecting wire, and the condenser lens is located on the cover shell, and the four around of condenser lens is equipped with plane part, and the plane part has coated extinction coating, and the rest part of condenser lens except plane part has coated anti -reflection coating. The utility model discloses the electric connection structure of setting infrared photosensitive chip, conducting strip and welding tin tray in package shell, can realize the stable output of infrared signal, and the plane part of condenser lens has coated extinction coating, and the rest part has coated anti -reflection coating, and extinction coating can absorb the interference visible light and stray infrared light of side, reduce the influence of environmental light interference, and anti -reflection coating can reduce interface reflectivity, improve the transmittance of target direction incident infrared light.

Description

Technical Field

[0001] This utility model relates to the field of infrared receiver tubes, and in particular to a light-focusing infrared receiver tube that resists ambient light interference. Background Technology

[0002] An infrared receiver tube is an optoelectronic component used to receive and convert infrared light signals. It is widely used in remote control systems, infrared sensing control equipment, and optical communication terminals. Its function is to focus infrared light from the target direction onto the surface of a photosensitive chip to achieve signal recognition response.

[0003] In the prior art, to expand the receiving angle, infrared receiver tubes usually use hemispherical or spherical focusing lenses to expand the receiving space range of infrared signals. However, infrared receiver tubes are often in complex lighting environments, such as direct sunlight, ambient diffuse reflection, and background light sources such as flashing lights. When interfering incident light from the edge of the lens or the side of the plane enters the lens area, it is easily deflected to the surface of the photosensitive chip through refraction or reflection, thereby causing false signal triggering and affecting the signal receiving accuracy of the infrared receiver tube.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an infrared receiver tube with accurate signal reception, compact structure, and focused light type that resists ambient light interference.

[0006] To achieve this objective, the present invention adopts the following technical solution: an infrared receiver tube with focusing light type and resistance to ambient light interference, comprising a package housing, a focusing lens, an infrared photosensitive chip, a connecting wire, a conductive sheet, and metal pins;

[0007] The packaging housing includes a substrate and a cover. The cover is disposed above the substrate. The conductive sheet is disposed on the substrate and has a solder pad on it. The infrared photosensitive chip is disposed on the conductive sheet and is connected to the solder pad via the connecting line.

[0008] The three metal pins extend into the interior of the substrate and are electrically connected to the conductive sheet.

[0009] The condensing lens is disposed on the cover shell, and the condensing lens has a flat portion around its perimeter. The flat portion is coated with a matte coating, and the remaining portion of the condensing lens, except for the flat portion, is coated with an anti-reflective coating.

[0010] An encapsulation space is formed between the cover and the substrate, and the encapsulation space is filled with an epoxy resin layer, which is used to encapsulate and fix the infrared photosensitive chip.

[0011] In the above-mentioned infrared receiver tube with focused light type and resistance to ambient light interference, the infrared photosensitive chip is disposed in the middle of the substrate and located at the center of the optical axis of the focusing lens.

[0012] In the above technical solution, the focusing lens in the infrared receiver tube that is designed to resist ambient light interference is a Fresnel lens.

[0013] In the above-mentioned infrared receiver tube with focused light and resistance to ambient light interference, the substrate is made of BT flexible resin glass fiber board.

[0014] In the above-described infrared receiver tube with focused light and resistance to ambient light interference, the connecting wire is a gold wire.

[0015] In the above technical solution, the substrate and the cover are fixedly connected by a hot melt adhesive layer in the infrared receiver tube that focuses light and resists ambient light interference.

[0016] In the above technical solution, the metal pins in the beam-focusing, ambient light interference-resistant infrared receiver tube are surface-mount pins.

[0017] All three metal pins are located on the same side wall of the substrate, and a support pad is provided on the other side wall of the substrate. The support pad and the metal pins are on the same horizontal plane.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] This invention achieves stable infrared signal output by setting an infrared photosensitive chip, conductive sheet, and solder pad electrical connection structure within the encapsulation housing. A condenser lens is disposed on the cover, with a flat portion around its perimeter coated with a matte coating. The remaining portion of the condenser lens, excluding the flat portion, is coated with an anti-reflective coating. The matte coating absorbs lateral interference from visible light and stray infrared light, reducing the impact of ambient light interference and improving signal reception accuracy in the target direction. The anti-reflective coating reduces interface reflectivity and increases the transmittance of incident infrared light, thereby enhancing the infrared photosensitive chip's signal reception performance. In addition, the encapsulation space is filled with an epoxy resin layer, which provides a stable encapsulation of the infrared photosensitive chip, acting as a moisture-proof seal and enhancing the structural stability and service life of the infrared receiver. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the infrared photosensitive chip mounting structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the overall bottom structure of this utility model. Detailed Implementation

[0025] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0027] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] like Figures 1 to 3 As shown, this utility model embodiment provides a light-focusing infrared receiver tube that resists ambient light interference, including a package housing 1, a focusing lens 2, an infrared photosensitive chip 3, a connecting line 4, a conductive sheet 5, and metal pins 6. The package housing 1 includes a substrate 11 and a cover 12, with the cover 12 disposed above the substrate 11. The conductive sheet 5 is disposed on the substrate 11 and has a solder pad 51. The infrared photosensitive chip 3 is disposed on the conductive sheet 5 and is connected to the solder pad 51 via the connecting line 4. The three metal pins 6 extend into the substrate 11 and are electrically connected to the conductive sheet 5. When the focusing lens 2 focuses infrared light onto the surface of the infrared photosensitive chip 3, the photosensitive structure inside the infrared photosensitive chip 3 generates a photoelectric conversion signal. This signal can be transmitted to the solder pad 51 via the connecting line 4, and then transmitted to the external metal pins 6 via the conductive sheet 5, realizing the sensing output of the infrared signal.

[0029] The condenser lens 2 is disposed on the cover 12. The condenser lens 2 has a flat portion 20 around its perimeter, which is coated with a matte coating. The remaining portion of the condenser lens 2, excluding the flat portion 20, is coated with an anti-reflective coating. The condenser lens 2 can focus and guide infrared light from the target direction onto the infrared photosensitive chip 3 to improve receiving sensitivity. The flat portion 20 around the condenser lens 2 divides the focusing area into a focusing area and a non-focusing area. Since the flat portion 20 itself does not perform a focusing function, it can easily become an incident channel for oblique or lateral incident light. Therefore, a matte coating is applied to the flat portion 20 area. It can absorb visible light and stray infrared light, preventing these rays from entering the infrared photosensitive chip 3 through surface reflection or scattering, thereby reducing the influence of ambient light interference and improving the signal reception accuracy in the target direction. At the same time, in order to enable the infrared light of the target incident from the front to penetrate efficiently into the main focusing area of ​​the condenser lens 2 and reduce energy loss, an anti-reflective coating with matching infrared band is coated on the surface of the main focusing area of ​​the condenser lens 2, except for the planar part 20. The anti-reflective coating can reduce the interface reflectivity and increase the transmittance of incident infrared light, thereby enhancing the reception performance of the infrared photosensitive chip 3 for the target signal.

[0030] An encapsulation space is formed between the cover shell 12 and the substrate 11. The encapsulation space is filled with an epoxy resin layer (not shown). The epoxy resin layer is used to encapsulate and fix the infrared photosensitive chip 3. Injecting epoxy resin material into the encapsulation space and curing it to form an epoxy resin layer can form a dense coating layer around the infrared photosensitive chip 3. This not only provides structural fixation and electrical protection for the infrared photosensitive chip 3 and the connection area, but also has good sealing, moisture-proof and dust-proof properties to prevent the entry of external moisture and extend the service life of the infrared receiver tube.

[0031] Furthermore, the infrared photosensitive chip 3 is disposed in the middle of the substrate 11 and located at the center of the optical axis of the condenser lens 2. By placing the infrared photosensitive chip 3 at the center point of the optical axis of the condenser lens 2, it can be ensured that the infrared light in the target direction directly acts on the photosensitive area of ​​the infrared photosensitive chip 3, so as to maximize the photoelectric conversion efficiency and enhance the response sensitivity to effective signals.

[0032] Furthermore, the focusing lens 2 is a Fresnel lens, which has a concentric ring-shaped stepped structure on its surface. This allows the infrared beam from the target direction to be focused along the optical axis onto the surface of the infrared photosensitive chip 3, thereby increasing the energy density of the effective infrared light and enhancing the photoelectric conversion efficiency.

[0033] Furthermore, the substrate 11 is made of BT flexible resin glass fiber board, which has good thermal stability. Compared with ordinary epoxy board 11, its coefficient of thermal expansion is lower and it is not easy to deform due to temperature rise or thermal stress, thereby improving the overall structural stability.

[0034] Furthermore, the connecting line 4 is a gold wire, which has extremely low resistivity and good ductility, and can be stably welded at the micrometer scale to ensure that the weak signal output by the infrared photosensitive chip 3 is not affected by impedance during transmission.

[0035] Furthermore, the substrate 11 and the cover 12 are fixedly connected by a hot melt adhesive layer.

[0036] like Figure 3 As shown, further, the metal pins 6 are surface mount pins, and all three metal pins 6 are located on the same side wall of the substrate 11. A support pad 110 is provided on the other side wall of the substrate 11. The support pad 110 and the metal pins 6 are on the same horizontal plane. Surface mount pins have the characteristics of compact structure and precise positioning, and can be directly matched with PCB pads to achieve efficient assembly. At the same time, in order to avoid the problem of the infrared receiver tube tilting during the mounting process due to the metal pins 6 being concentrated on one side, a support pad 110 is provided on the other side wall of the substrate 11, and the support pad 110 and the end of the metal pins 6 are on the same horizontal plane, thereby improving the mounting stability of the infrared receiver tube.

[0037] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A beam-focusing infrared receiver tube resistant to ambient light interference, characterized in that, It includes a package housing, a condenser lens, an infrared sensor chip, connecting wires, conductive sheets, and metal pins; The packaging housing includes a substrate and a cover. The cover is disposed above the substrate. The conductive sheet is disposed on the substrate and has a solder pad on it. The infrared photosensitive chip is disposed on the conductive sheet and is connected to the solder pad via the connecting line. The three metal pins extend into the interior of the substrate and are electrically connected to the conductive sheet. The condensing lens is disposed on the cover shell, and the condensing lens has a flat portion around its perimeter. The flat portion is coated with a matte coating, and the remaining portion of the condensing lens, except for the flat portion, is coated with an anti-reflective coating. An encapsulation space is formed between the cover and the substrate, and the encapsulation space is filled with an epoxy resin layer, which is used to encapsulate and fix the infrared photosensitive chip.

2. The infrared receiver tube with focused beam and resistance to ambient light interference according to claim 1, characterized in that, The infrared photosensitive chip is located in the middle of the substrate and at the center of the optical axis of the focusing lens.

3. The infrared receiver tube with focused beam and resistance to ambient light interference as described in claim 1, characterized in that, The focusing lens is a Fresnel lens.

4. The infrared receiver tube with focusing beam and resistance to ambient light interference according to claim 1, characterized in that, The substrate is made of BT flexible resin glass fiber board.

5. The infrared receiver tube with focused beam and resistance to ambient light interference according to claim 1, characterized in that, The connecting wire is gold wire.

6. The infrared receiver tube with focusing beam and resistance to ambient light interference according to claim 1, characterized in that, The substrate and the cover are fixedly connected by a hot melt adhesive layer.

7. The infrared receiver tube with focusing beam and resistance to ambient light interference according to claim 1, characterized in that, The metal pins are surface mount pins; All three metal pins are located on the same side wall of the substrate, and a support pad is provided on the other side wall of the substrate. The support pad and the metal pins are on the same horizontal plane.

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