An etching apparatus

Abstract

The utility model discloses an etching device, including support mechanism and a plurality of etching carrier, etching carrier includes: bottom plate, the conductive plate is located on the bottom plate, is equipped with the conductive part on the conductive plate, the positioning plate is located on the side of the conductive plate away from the bottom plate, when the product is installed in the positioning plate, and the product is contacted with the conductive part, the cover plate is located on the side of the positioning plate away from the conductive plate, is equipped with the vacancy on the cover plate, and the vacancy is set up with the site of the product needing etching correspondingly. The utility model discloses etching carrier, through the positioning plate fixed etching's product, product fixed can be contacted with the conductive part on the conductive plate, then utilizes the bottom plate to cover the conductive plate, and the cover plate covers the positioning plate, and the vacancy set up on the cover plate makes the site of the product needing etching exposed, when etching carrier is immersed in etching solution, only the exposed part of the product can be affected by the current and etching solution and realizes etching, improves etching efficiency, and enhances the corrosion resistance of etching carrier.

Description

Technical Field

[0001] This utility model relates to the field of electrochemical etching technology, and in particular to an etching device. Background Technology

[0002] In existing technologies, etching carriers used for electrochemical etching are mainly made of titanium metal coated with PVC modified resin. After the product is mounted on the etching carrier, it is placed in the etching tank along with the product and immersed in the etching solution. This causes micropores to form on the surface of the product in localized areas, thus achieving etching. When the coating layer peels off, the etching carrier has poor corrosion resistance at the peeled-off location, thereby shortening the service life of the etching carrier. Utility Model Content

[0003] The purpose of this invention is to provide an etching apparatus to solve the problems in the prior art, improve etching efficiency and the corrosion resistance of the etching carrier.

[0004] This utility model provides an etching apparatus, including a support mechanism and multiple etching carriers, wherein the multiple etching carriers are mounted on the support mechanism, and the etching carriers include:

[0005] Base plate;

[0006] A conductive plate is disposed on the base plate, and a conductive part is provided on the conductive plate;

[0007] A positioning plate is provided on the side of the conductive plate opposite to the base plate. The positioning plate is used to install the product. When the product is installed on the positioning plate, the product is in contact with the conductive part.

[0008] A cover plate is provided on the side of the positioning plate opposite to the conductive plate. The cover plate has a gap, which corresponds to the part of the product that needs to be etched.

[0009] In the etching apparatus described above, preferably, the conductive portion comprises a plurality of graphite blocks arranged along the extension direction of the conductive plate.

[0010] In the etching apparatus described above, preferably, the positioning plate has a plurality of positioning grooves, the plurality of positioning grooves are arranged parallel to each other along the extension direction of the positioning plate, the product is installed in the positioning groove, the bottom wall of the positioning groove is provided with at least one first through hole, and the graphite block extends into the first through hole to contact the product.

[0011] In the etching apparatus described above, preferably, the cover plate is a composite of titanium and EPDM material, and the positioning plate and the base plate are both composites of PPS and glass fiber composite materials.

[0012] In the etching apparatus described above, preferably, a drainage section is provided on the side of the base plate opposite to the conductive plate.

[0013] In the etching apparatus described above, preferably, the cover plate has an anti-sticking portion on the side facing the product.

[0014] In the etching apparatus described above, preferably, the support mechanism is provided with a plurality of mounting positions, the mounting positions being used to mount the etching carrier, the mounting positions being provided with a first positioning part, and the etching carrier being provided with a first positioning engagement part, the first positioning part being able to form a positioning engagement with the first positioning engagement part, so that one end of the etching carrier is fixed to the mounting position.

[0015] In the etching apparatus described above, preferably, the mounting position is provided with a second positioning part, and the etching carrier is provided with a second positioning mating part. The second positioning part and the second positioning mating part can form a positioning mating, so that the other end of the etching carrier is fixed to the mounting position.

[0016] In the etching apparatus described above, preferably, the positioning plate, the conductive plate, and the base plate are connected by fastening bolts; a protective nut is provided corresponding to the fastening bolt, the protective nut has a first engagement portion, and the positioning plate has a second engagement portion that cooperates with the first engagement portion.

[0017] In the etching apparatus described above, preferably, the first joint is a snap fastener, the positioning plate is provided with a first mounting hole, and the second joint is a slot provided in the first mounting hole.

[0018] Compared with the prior art, the etching carrier of this utility model fixes the product to be etched by a positioning plate. After the product is fixed, it can contact the conductive part on the conductive plate. Then, the conductive plate is covered by a base plate, and the positioning plate is covered by a cover plate. The gaps in the cover plate expose the parts of the product that need to be etched. When the etching carrier is immersed in the etching solution, only the exposed part of the product will be etched by the current and the etching solution. This improves the etching efficiency, enhances the corrosion resistance of the etching carrier, and can effectively extend the service life of the etching carrier. Attached Figure Description

[0019] Figure 1 This is a perspective view of the etching apparatus provided in an embodiment of the present invention;

[0020] Figure 2 This is a front view of the etching apparatus provided in an embodiment of the present invention;

[0021] Figure 3This is a perspective view of the product to be etched provided in an embodiment of this utility model;

[0022] Figure 4 This is a front view of the product to be etched provided in an embodiment of this utility model;

[0023] Figure 5 This is a first-view perspective perspective view of the etching carrier provided in an embodiment of the present invention;

[0024] Figure 6 This is a second-view perspective perspective view of the etching carrier provided in an embodiment of the present invention;

[0025] Figure 7 This is a top view of the etching carrier provided in an embodiment of the present invention;

[0026] Figure 8 yes Figure 7 Cross-sectional view along the AA direction;

[0027] Figure 9 yes Figure 7 Cross-sectional view along the BB direction;

[0028] Figure 10 yes Figure 7 Cross-sectional view along the CC direction;

[0029] Figure 11 This is a perspective view of the conductive plate provided in an embodiment of this utility model;

[0030] Figure 12 This is a perspective view of the positioning plate provided in an embodiment of this utility model;

[0031] Figure 13 This is a perspective view of the base plate provided in an embodiment of this utility model;

[0032] Figure 14 This is a first-view perspective perspective view of the cover plate provided in an embodiment of this utility model;

[0033] Figure 15 This is a second-view perspective perspective view of the cover plate provided in an embodiment of this utility model;

[0034] Figure 16 This is a perspective view of the support mechanism provided in an embodiment of this utility model;

[0035] Figure 17 This is a top view of the support mechanism provided in an embodiment of this utility model.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100 - Product, 110 - Masking part, 111 - Second through hole, 120 - Etched part;

[0038] 10-Support mechanism, 11-Bracket, 12-Mounting position, 121-First positioning part, 1211-Mounting groove, 122-Second positioning part, 1221-Second mounting hole, 13-Locking bolt;

[0039] 20-Etching carrier, 21-Base plate, 211-Drainage part, 2111-Drainage groove, 2112-Drainage slope, 22-Conductive plate, 221-Conductive part, 2211-Graphite block, 23-Positioning plate, 231-Positioning groove, 232-First through hole, 233-First mounting hole, 234-Second joint, 2341-Slot, 24-Cover plate, 241-Gap, 242-Anti-sticking part, 25-First positioning mating part, 251-Hook, 26-Second positioning mating part, 261-Positioning post;

[0040] 30-Fixing stud, 31-Locking nut, 32-Locking nut, 33-Limiting ring, 34-Protective cover;

[0041] 40 - Fastening bolt;

[0042] 50 - Protective nut, 51 - First joint, 511 - Snap fastener. Detailed Implementation

[0043] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] Reference Figure 1 and Figure 2 As shown, this utility model provides an etching apparatus, including a support mechanism 10 and a plurality of etching carriers 20. The plurality of etching carriers 20 are installed on the support mechanism 10, which can realize the etching of a large number of products 100.

[0045] Reference Figure 5 , Figure 6 as well as Figure 8 As shown, the etching carrier 20 includes a base plate 21, a conductive plate 22, a positioning plate 23, and a cover plate 24, wherein:

[0046] The conductive plate 22 is disposed on the base plate 21. The conductive plate 22 is provided with a conductive part 221. The conductive plate 22 is connected to the external current and the current is connected through the conductive part 221.

[0047] The positioning plate 23 is located on the side of the conductive plate 22 away from the base plate 21. The positioning plate 23 is used to install the product 100. When the product 100 is installed on the positioning plate 23, the product 100 is in contact with the conductive part 221. When the conductive plate 22 is energized, the current can flow to the product 100 through the conductive part 221, thereby realizing the current conduction of the product 100.

[0048] Cover plate 24 is located on the side of positioning plate 23 opposite to conductive plate 22, see reference. Figure 14 As shown, the cover plate 24 is provided with a gap 241, which corresponds to the part of the product 100 that needs to be etched. Thus, the cover plate 24 can cover the part of the product 100 that does not need to be etched, while the part that needs to be etched is exposed.

[0049] After the product 100 to be etched is fixed on the positioning plate 23, one side of the product 100 is connected to the conductive plate 22 to facilitate the conduction of current in the product 100. The part of the product 100 that does not need to be etched is covered by the cover plate 24, and the part that needs to be etched is exposed through the gap 241 on the cover plate 24. The side of the conductive plate 22 away from the product 100 is covered by the base plate 21. Thus, only the part of the product 100 that needs to be etched is exposed, preventing the part that does not need to be etched from affecting the etching, thereby improving the etching efficiency and enhancing the corrosion resistance of the etching carrier 20, which can effectively extend the service life of the etching carrier 20.

[0050] In the embodiments provided in this application, reference is made to Figure 3 as well as Figure 4 As shown, the product 100 to be etched is a composite material. The part to be etched is on the surface of the etching part 120. The etching part 120 can be made of titanium metal. The masking part 110 needs to be anodized before etching. The masking part 110 can be made of aluminum alloy to avoid the masking part 110 being corroded during the etching process.

[0051] Reference Figure 8 As shown, when fixing product 100, after placing product 100 on positioning plate 23, product 100 contacts conductive part 221. After fixing cover plate 24 and base plate 21 respectively, the part to be etched on the surface of etching part 120 is exposed through gap 241. When etching carrier 20 is immersed in etching solution, etching carrier 20 is energized. The current flows through conductive plate 22 and then through conductive part 221 to etching part 120, so that etching part 120 is in an energized state. Only the exposed part of etching part 120 can contact etching solution. Under the combined action of current and etching solution, micropores can be etched at the corresponding position on the surface of etching part 120, thereby completing the etching of composite material.

[0052] Reference Figure 11As shown, the conductive part 221 includes a plurality of graphite blocks 2211, which are uniformly arranged along the extension direction of the conductive plate 22. Multiple products 100 can be mounted on the positioning plate 23; therefore, the conductive plate 22 is provided with a plurality of graphite blocks 2211, each corresponding to a product 100. When the conductive plate 22 is energized, current can flow simultaneously through the plurality of graphite blocks 2211 to the plurality of products 100, thereby enabling each product 100 to conduct current.

[0053] In the embodiments provided in this application, the conductive plate 22 can be made of titanium metal. Since the part of the product 100 to be etched is titanium metal 120, the conductive plate 22 needs to be isolated from the etching solution during the etching process to prevent the conductive plate 22 from being corroded and affecting the etching effect of the product 100. Therefore, a base plate 21 is provided on the side of the conductive plate 22 away from the product 100, and the opposite sides of the conductive plate 22 are shielded by the positioning plate 23 and the base plate 21 respectively, thereby cutting off the possibility of the conductive plate 22 contacting the etching solution.

[0054] Since graphite block 2211 has excellent electrical conductivity and corrosion resistance, it is used as conductive part 221. On the one hand, it can realize the conduction of current from conductive plate 22 to product 100. On the other hand, when etching carrier 20 is immersed in etching solution, graphite block 2211 will not be etched even if it comes into contact with etching solution, thereby ensuring the stability of etching effect of product 100 and improving etching efficiency.

[0055] Preferably, there are two conductive plates 22, which are symmetrically arranged along the width direction of the base plate 21. Each conductive plate 22 is provided with multiple graphite blocks 2211. The graphite blocks 2211 on the two conductive plates 22 are symmetrically arranged. When the product 100 is installed on the positioning plate 23, both ends of the product 100 are in contact with the two symmetrical graphite blocks 2211 respectively, which further ensures the current conduction effect of the product 100.

[0056] In order to stably fix the product 100 on the positioning plate 23, in one feasible embodiment, refer to Figure 12 As shown, the positioning plate 23 has multiple positioning grooves 231, which are arranged parallel to each other along the extending direction of the positioning plate 23. The product 100 is installed in the positioning groove 231, and the shape of the positioning groove 231 is adapted to the shape of the product 100. The outer contour of the composite material of this application is rectangular, and the positioning groove 231 is a rectangular groove that can accommodate the composite material. After the composite material is installed in the positioning groove 231, the side of the etching part 120 that does not need to be etched is blocked by the bottom wall of the positioning groove 231. The shielding part 110 is provided on the side of the etching part 120 away from the bottom wall of the positioning groove 231. (Refer to...) Figure 3 as well as Figure 4As shown, the masking part 110 is provided with multiple second through holes 111. The positions of the second through holes 111 correspond to the parts of the etching part 120 that need to be etched. The rest of the parts are all covered by the masking part 110 that has been treated with Ano, so that only the parts of the etching part 120 that need to be etched are exposed.

[0057] After product 100 is fixed in positioning groove 231, it needs to be connected to conductive plate 22. Only after conductive plate 22 is energized can current be conducted to product 100. (Refer to...) Figure 12 As shown, the bottom wall of the positioning groove 231 is provided with at least one first through hole 232. The number of first through holes 232 corresponds to the number of graphite blocks 2211. The graphite blocks 2211 extend into the first through hole 232 and contact the product 100. That is, after the positioning plate 23 is installed on the conductive plate 22, the graphite blocks 2211 can extend into the first through hole 232. The top of the graphite blocks 2211 is at least flush with the bottom wall of the positioning groove 231. When the product 100 is installed on the positioning plate 23, it can contact the graphite blocks 2211, thereby enabling the current to be conducted on the product 100.

[0058] During the etching process, except for the part of the etching section 120 that needs to be etched, which needs to be exposed to contact the etching solution, the cover plate 24, the positioning plate 23, and the base plate 21 are all immersed in the etching solution. Since the etching solution is corrosive, in order to prevent the etching carrier 20 from being corroded and affecting the etching effect, and to prevent the etching carrier from having a short service life due to corrosion, in the embodiments provided in this application, the cover plate 24 is made of titanium metal and EPDM material composite molding, and the composite molding can be done by injection molding. The positioning plate 23 and the base plate 21 are both made of PPS and glass fiber composite materials.

[0059] The cover plate 24 has an internal titanium metal skeleton and is covered with EPDM material (ethylene propylene diene monomer rubber). The titanium metal provides support, and the EPDM material has excellent corrosion resistance and electrical insulation. Therefore, when the cover plate 24 is immersed in the etching solution, it can stably cover the surface of the product 100 and will not be affected by the current and the etching solution, effectively improving the corrosion resistance of the cover plate 24.

[0060] PPS (polyphenylene sulfide) is a special engineering plastic with outstanding corrosion resistance and electrical insulation. Glass fiber is an inorganic non-metallic material with excellent electrical insulation. The positioning plate 23 and the base plate 21 are made of PPS and glass fiber composite materials, which makes the positioning plate 23 and the base plate 21 have good corrosion resistance and electrical insulation. Therefore, when the etching carrier 20 is immersed in the etching solution, the positioning plate 23 and the base plate 21 will not be affected by the current and the etching solution, effectively improving the corrosion resistance of the positioning plate 23 and the base plate 21, thereby effectively improving the service life of the etching carrier 20 as a whole.

[0061] After product 100 is etched, the etching carrier 20 needs to be removed from the etching solution and baked. Since the etching solution is corrosive, to prevent residue from remaining on the etching carrier 20, it must be completely adhered to the etching carrier 20 after baking. In the embodiments provided in this application, refer to... Figure 6 As shown, the bottom plate 21 has a drainage section 211 on the side opposite to the conductive plate 22. The drainage section 211 can drain the etching solution as much as possible to reduce the amount of etching solution remaining on the etching carrier 20.

[0062] In one feasible implementation, refer to Figure 13 As shown, the drainage section 211 is a drainage trough 2111 provided on the base plate 21. The drainage trough 2111 includes a drainage slope 2112. The etching carrier 20 of this application is suspended on the support mechanism 10. The drainage slope 2112 is provided at the bottom of the drainage trough 2111. When the etching carrier 20 is removed from the etching solution, the etching solution remaining on the base plate 21 is drained away along the drainage slope 2112 under the action of gravity, thereby effectively reducing the residue of the etching solution.

[0063] After all products 100 are installed on the positioning plate 23, the cover plate 24 needs to be placed over all products 100. Since the cover plate 24 is made of EPDM material, and products 100 require baking after etching, the cover plate 24 may stick to the products 100 after baking. When the cover plate 24 sticks to the products 100, it is difficult to separate it from the products 100. Therefore, to prevent the cover plate 24 from sticking to the products 100, refer to... Figure 15 As shown, the cover plate 24 has an anti-stick part 242 on the side facing the product 100. The anti-stick part 242 is used to prevent the product 100 from sticking to the cover plate 24 after baking.

[0064] Preferably, the anti-sticking part 242 is a serrated part on the side of the cover plate 24 facing the product 100. The serrated side of the cover plate 24 covers the product 100. After the etching carrier 20 is baked, based on the characteristics of the serrated structure, there is still a certain gap between the cover plate 24 and the product 100, which can prevent the product 100 from sticking to the cover plate 24, thereby making it easy to separate the cover plate 24 from the product 100.

[0065] After multiple products 100 are installed on the positioning plate 23, the cover plate 24, positioning plate 23, conductive plate 22, and base plate 21 need to be connected and fixed in sequence to form the etching carrier 20, as shown in the figure. Figure 9 as well as Figure 10As shown, the cover plate 24, positioning plate 23, conductive plate 22 and base plate 21 are connected by multiple fixing studs 30. The multiple fixing studs 30 are arranged along the length direction of the etching carrier 20, and then the cover plate 24, positioning plate 23, conductive plate 22 and base plate 21 are connected in sequence through multiple points, so that the etching carrier 20 has a firm and stable structure.

[0066] When the cover plate 24, positioning plate 23, conductive plate 22 and base plate 21 are connected by the fixing stud 30, both ends of the fixing stud 30 pass through the cover plate 24 and the base plate 21 respectively. The end of the fixing stud 30 that passes through the cover plate 24 is provided with a locking nut 31, and the end of the fixing stud 30 that passes through the base plate 21 is provided with a locking nut 32, so as to lock and fix both ends of the fixing stud 30, thereby fixing the cover plate 24, positioning plate 23, conductive plate 22 and base plate 21.

[0067] Since the cover plate 24 faces and contacts the product 100, in order to prevent the cover plate 24 from excessively squeezing the product 100 and causing damage, a limiting ring 33 is fitted on the fixing stud 30. The limiting ring 33 is located between the cover plate 24 and the positioning plate 23. After the etching carrier 20 is assembled, the two ends of the limiting ring 33 abut against the cover plate 24 and the positioning plate 23 respectively to prevent the fixing stud 30 from being over-tightened and causing the cover plate 24 to excessively squeeze the product 100.

[0068] During the etching process, both the locking nut 31 and the locking nut 32 are immersed in the etching solution. In order to prevent the locking nut 31 and the locking nut 32 from being corroded and thus damaging the structure of the etching carrier 20, the locking nut 31 is injection molded from PPS and glass fiber composite material with excellent corrosion resistance, while the locking nut 32 is made of titanium metal. At the same time, a protective cover 34 is set on the outside of the locking nut 32. The protective cover 34 is also made of PPS and glass fiber composite material, thereby further improving the corrosion resistance of both ends of the fixing stud 30.

[0069] Since the limiting ring 33 is exposed, in order to prevent the limiting ring 33 from being corroded by the etching solution, the limiting ring 33 is injection molded from a composite material of PPS and glass fiber to improve the corrosion resistance of the limiting ring 33.

[0070] Multiple fixing studs 30 are used to sequentially connect the cover plate 24, positioning plate 23, conductive plate 22, and base plate 21 along the length of the etching carrier 20. They also need to be fixed along the width of the etching carrier 20 to improve its structural strength. Therefore, referring to... Figure 10As shown, a plurality of fastening bolts 40 are provided in the width direction of the etching carrier 20. The plurality of fastening bolts 40 connect the positioning plate 23, the conductive plate 22 and the base plate 21 in sequence in the width direction of the etching carrier 20. In the length direction of the etching carrier 20, a plurality of rows of fastening bolts 40 are provided, thereby making the positioning plate 23, the conductive plate 22 and the base plate 21 fastened together.

[0071] To prevent the fastening bolt 40 from being corroded by the etching solution, a protective nut 50 is also connected to the positioning plate 23. The protective nut 50 is set accordingly to the fastening bolt 40, so that the fastening bolt 40 is isolated from the outside. The protective nut 50 is made of a material with excellent corrosion resistance.

[0072] Reference Figure 10 as well as Figure 12 As shown, the protective nut 50 is provided with a first joint 51, and the positioning plate 23 is provided with a second joint 234. The first joint 51 and the second joint 234 can be engaged to fix the position of the protective nut 50. The engagement of the first joint 51 and the second joint 234 is to prevent the protective nut 50 from falling off after the etching carrier 20 is baked.

[0073] Preferably, the first joint 51 is a buckle 511, the positioning plate 23 is provided with a first mounting hole 233, and the second joint 234 is a groove 2341 provided in the first mounting hole 233. After the protective nut 50 is installed in the first mounting hole 233, it is rotated at a certain angle so that the buckle 511 is embedded in the groove 2341, thereby fixing the position of the protective nut 50.

[0074] In other embodiments, the first joint 51 and the second joint 234 may use other structures or components to fix the protective nut 50, which is not limited here.

[0075] Reference Figure 1 and Figure 2 As shown, the etching apparatus of this application can perform etching of a large number of products 100. Multiple etching carriers 20 are installed through the support mechanism 10. During etching, the support mechanism 10 and the multiple etching carriers 20 are simultaneously immersed in the etching solution. Current is passed to the support mechanism 10. The current flows along the support mechanism 10 to the conductive plates 22 of the multiple etching carriers 20, and then the current is guided to the multiple products 100 through the multiple conductive parts 221 on the conductive plates 22, so that all products 100 are simultaneously connected to the current.

[0076] In the embodiments provided in this application, reference is made to Figure 16 and Figure 17As shown, the support mechanism 10 includes a bracket 11 with multiple mounting positions 12 for mounting etching carriers 20. During the etching process, in order to ensure that the etched surfaces of all products 100 are aligned with the cathode plates on both sides of the equipment, the support mechanism 10 needs to rotate 360° during the etching process. This ensures that all products 100 have a moment of alignment with the cathode plates within a specified time. Therefore, the multiple mounting positions 12 are arranged in a ring, and the multiple etching carriers 20 are respectively mounted on the multiple mounting positions 12 and distributed in a ring on the support mechanism 10, so that the rotation of the support mechanism 10 can drive the etching carriers 20 to rotate synchronously.

[0077] After the etching carrier 20 is mounted on the support mechanism 10, in order to ensure that the etching carrier 20 is stably mounted on the support mechanism 10, in one feasible embodiment, refer to Figure 1 As shown, the mounting position 12 is provided with a first positioning part 121, and the etching carrier 20 is provided with a first positioning mating part 25. The first positioning part 121 can form a positioning mating with the first positioning mating part 25, so that one end of the etching carrier 20 is fixed to the mounting position 12. The support mechanism 10 of this application is conductive. The first positioning mating part 25 is connected to the conductive plate 22. When the support mechanism 10 is energized, the current can be transmitted to the conductive plate 22 through the first positioning mating part 25, so as to realize the current conduction of the product 100.

[0078] Reference Figure 17 As shown, the first positioning part 121 is a mounting groove 1211 provided on the upper part of the mounting position 12, referring to... Figure 6 , Figure 7 and Figure 11 As shown, the first positioning and mating part 25 is a hook 251. The hook 251 is connected to the conductive plate 22. The hook 251 can be engaged with the mounting groove 1211 to fix one end of the etching carrier 20 to the mounting position 12. After the hook 251 is engaged with the mounting groove 1211, the locking bolt 13 is used to further fix the hook 251 to the mounting groove 1211 to ensure the stability of one end of the etching carrier 20 connected to the mounting position 12.

[0079] After one end of the etching carrier 20 is fixed, the other end also needs to be fixed in order to achieve overall fixation of the etching carrier 20. (Refer to...) Figure 16 As shown, a second positioning part 122 is provided on the mounting position 12, referring to... Figure 2 As shown, the etching carrier 20 is provided with a second positioning engagement part 26. The second positioning part 122 and the second positioning engagement part 26 can form a positioning engagement so that the other end of the etching carrier 20 is fixed to the mounting position 12.

[0080] Reference Figure 16 and Figure 17As shown, the second positioning part 122 is a second mounting hole 1221 provided at the lower part of the mounting position 12. Each mounting position 12 includes two second mounting holes 1221. (Refer to...) Figure 6 As shown, the second positioning mating part 26 is a positioning post 261 provided on the base plate 21. There are two positioning posts 261. The two positioning posts 261 are provided at the end of the base plate 21 away from the first positioning mating part 25. After one end of the etching carrier 20 is fixed to the upper part of the mounting position 12, the two positioning posts 261 can be inserted into the two second mounting holes 1221 respectively, thereby fixing the other end of the etching carrier 20 to the mounting position 12, thus completing the installation of an etching carrier 20.

[0081] The remaining etching carriers 20 are installed in the same way at the mounting position 12. After all the etching carriers 20 are installed, they are immersed in the etching solution together with the support mechanism 10. Then, the support mechanism 10 is powered on, so that the surfaces of the multiple products 100 that need to be etched are etched with micropores under the combined action of the current and the etching solution.

[0082] The above description, based on the embodiments shown in the drawings, details the structure, features, and effects of this utility model. The above description is only a preferred embodiment of this utility model, but the scope of implementation of this utility model is not limited to what is shown in the drawings. Any changes made in accordance with the concept of this utility model, or modifications to equivalent embodiments, that do not exceed the spirit covered by the specification and drawings, shall be within the protection scope of this utility model.

Claims

1. An etching apparatus, characterized in that, The system includes a support mechanism and multiple etching carriers, wherein the multiple etching carriers are mounted on the support mechanism, and the etching carriers include: Base plate; A conductive plate is disposed on the base plate, and a conductive portion is provided on the conductive plate; A positioning plate is provided on the side of the conductive plate opposite to the base plate. The positioning plate is used to install the product. When the product is installed on the positioning plate, the product is in contact with the conductive part. A cover plate is provided on the side of the positioning plate opposite to the conductive plate. The cover plate has a gap, which corresponds to the part of the product that needs to be etched.

2. The etching apparatus according to claim 1, characterized in that, The conductive part includes a plurality of graphite blocks, which are arranged along the extension direction of the conductive plate.

3. The etching apparatus according to claim 2, characterized in that, The positioning plate has multiple positioning grooves, which are arranged parallel to each other along the extension direction of the positioning plate. The product is installed in the positioning groove. The bottom wall of the positioning groove is provided with at least one first through hole, and the graphite block extends into the first through hole to contact the product.

4. The etching apparatus according to claim 1, characterized in that, The bottom plate has a drainage section on the side opposite to the conductive plate.

5. The etching apparatus according to claim 1, characterized in that, The cover plate has an anti-sticking part on the side facing the product.

6. The etching apparatus according to claim 1, characterized in that, The support mechanism is provided with multiple mounting positions, which are used to mount the etching carrier. Each mounting position is provided with a first positioning part, and the etching carrier is provided with a first positioning engagement part. The first positioning part can form a positioning engagement with the first positioning engagement part so that one end of the etching carrier is fixed to the mounting position.

7. The etching apparatus according to claim 6, characterized in that, The mounting position is provided with a second positioning part, and the etching carrier is provided with a second positioning mating part. The second positioning part and the second positioning mating part can form a positioning mating so that the other end of the etching carrier is fixed to the mounting position.

8. The etching apparatus according to claim 1, characterized in that, The positioning plate, conductive plate, and base plate are connected by fastening bolts; a protective nut is provided corresponding to the fastening bolt, the protective nut is provided with a first joint, and the positioning plate is provided with a second joint for use with the first joint.

9. The etching apparatus according to claim 8, characterized in that, The first joint is a snap fastener, the positioning plate is provided with a first mounting hole, and the second joint is a slot provided in the first mounting hole.

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