Diode automatic glue filling and packaging device
By designing the clamping component, the displacement problem caused by unstable positioning of diodes during potting was solved, thereby improving packaging accuracy and consistency and increasing production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SOCAY ELECTRONICS
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-24
AI Technical Summary
Existing automatic diode potting and encapsulation devices suffer from simple limiting methods during the potting process, which makes the diodes prone to displacement, affecting the encapsulation quality and consistency.
The clamping assembly, including a fixing block, electric push rod, gear and rack drive, and guide rail, is used to achieve stable clamping and positioning of the diode, ensuring stable position during the potting process.
It effectively avoids potting deviations caused by external forces or vibrations, improves packaging accuracy and product consistency, and increases production efficiency.
Smart Images
Figure CN224556206U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of component packaging technology, and in particular to an automatic diode potting and packaging device. Background Technology
[0002] In the manufacturing process of electronic components, diodes, as crucial semiconductor devices, directly impact product performance, stability, and lifespan through their packaging quality. To meet the demands of large-scale production and improve packaging efficiency and quality, an automated diode potting and packaging device has emerged. This device primarily enables a series of continuous operations, including automated diode positioning, potting, and packaging. By replacing traditional manual packaging with automated operation, it reduces labor costs and minimizes human error, making it an indispensable key piece of equipment in diode mass production.
[0003] Existing automated diode encapsulation devices typically employ conveyor belts or rotary table mechanisms to transport the diodes. A simple stop structure at the encapsulation station provides initial positioning of the diode. The encapsulation principle involves a pumping mechanism delivering adhesive to the encapsulation head. A pre-set program controls the head's movement and adhesive output, completing the encapsulation process within the designated area of the diode. The adhesive is then treated by a drying or curing mechanism, ultimately completing the encapsulation process.
[0004] However, current diode positioning methods are relatively simple, only achieving preliminary positional limitation. During the potting process, the diode is prone to displacement due to factors such as the contact force of the potting head, the impact force generated by the flow of adhesive, and unavoidable vibrations during device operation. This displacement directly leads to deviations in the potting position, thus affecting the packaging quality and making it difficult to guarantee product consistency. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides an automatic diode potting and encapsulation device, which aims to improve the problem that diodes are prone to displacement due to external forces or vibrations during the potting process.
[0006] To achieve the above objectives, this utility model provides the following technical solution: an automatic diode potting and encapsulation device, comprising a worktable, universal wheels on the lower surface of the worktable, a control console on one side of the upper part of the worktable, a glue storage tank on the other side of the upper part of the control console, a conveying pipe fixedly connected to the inner wall of the glue storage tank, a support rod fixedly connected to the upper surface of the worktable, a transverse electric slide rail fixedly connected to the upper surface of the support rod, a moving platform fixedly connected to one end of the conveying pipe, a replacement component on the inner wall of the moving platform, and a clamping component on the upper surface of the worktable;
[0007] The clamping assembly includes a fixed block, the lower surface of which is slidably connected to the upper surface of the worktable. An electric push rod is fixedly connected to the lower side of the inner wall of the worktable. A connecting plate one is fixedly connected to the output end of the electric push rod. A moving block is fixedly connected to the upper surface of the connecting plate one. A connecting rod is fixedly connected to the upper surface of the moving block. A connecting plate two is fixedly connected to the lower surface of the moving block. A rack is fixedly connected to the outer wall of the connecting plate two. A rotating shaft is fixedly connected to the lower side of the inner wall of the worktable. A gear is rotatably connected to the outer wall of the rotating shaft. The gear teeth mesh with the rack teeth. A guide rail is fixedly connected to the upper side of the inner wall of the worktable.
[0008] Furthermore, the replacement component includes an L-shaped fixing rod two, which is disposed on the inner wall of the moving platform. A button is slidably connected to the inner wall of the moving platform, and a moving column is fixedly connected to the outer wall of the button. A spring is fixedly connected to the inner wall of the moving platform, and a sliding groove is provided on the lower side of the inner wall of the moving platform. A sliding rod is fixedly connected to the outer wall of the L-shaped fixing rod two, and an encapsulation head is provided on the lower surface of the moving platform. An L-shaped fixing rod one is fixedly connected to the upper surface of the encapsulation head.
[0009] Furthermore, the outer wall of the sliding rod is slidably connected to the inside of the groove, and one end of the spring is fixedly connected to the other end of the spring.
[0010] Furthermore, the outer wall of the movable column is fixedly connected to the inner wall of the L-shaped fixed rod II, and the movable column is used to drive the L-shaped fixed rod II to move.
[0011] Furthermore, one end of the second L-shaped fixing rod engages with the other end of the first L-shaped fixing rod, and the second L-shaped fixing rod and the first L-shaped fixing rod are used to connect the moving stage and the packaging head. The outer wall of the first L-shaped fixing rod is slidably connected to the inner wall of the moving stage.
[0012] Furthermore, the inner wall of the moving platform is slidably connected to the outer wall of the transverse electric slide rail, and one end of the connecting rod is fixedly connected to the lower surface of the fixed block.
[0013] Furthermore, the inner wall of the moving block is slidably connected to the outer wall of the guide rail, and the upper surface of the connecting plate is fixedly connected to the lower surface of the moving block.
[0014] Furthermore, the movable block is disposed on the upper side of the inner wall of the worktable, and the gear is disposed on the lower side of the inner wall of the worktable.
[0015] This utility model has the following beneficial effects:
[0016] 1. In this utility model, after the control console is started, the electric push rod drives the connecting plate to move, which in turn drives the moving block to slide along the slide rail. The fixed block moves through the connecting rod, and at the same time, the fixed blocks on both sides move synchronously in opposite directions through the rack and pinion transmission, thereby clamping the diode. This solves the problem that the diode is prone to displacement due to external force or vibration during the potting process, and effectively avoids defects such as uneven potting and misalignment of the encapsulation caused by positioning deviation, thereby improving the potting accuracy and product consistency.
[0017] 2. In this utility model, when replacing, pressing the button moves the relevant components to disengage the fixing rod. After removing the old encapsulation head, the new one is installed. Releasing the button causes the spring to push the fixing rod back into place, completing the replacement. This achieves the effect of enhancing the adaptability of the device to various diode encapsulation requirements and improving production efficiency. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of an automatic diode potting and encapsulation device proposed in this utility model;
[0019] Figure 2 This is a schematic diagram of the support rod part of an automatic diode potting and encapsulation device proposed in this utility model;
[0020] Figure 3 This is a schematic diagram of the connecting plate of an automatic diode potting and encapsulation device proposed in this utility model;
[0021] Figure 4 This is a schematic diagram of a rack and pinion mechanism for an automatic diode potting and encapsulation device proposed in this utility model.
[0022] Figure 5 This is a schematic diagram of the button of an automatic diode potting and encapsulation device proposed in this utility model;
[0023] Figure 6 This is a schematic diagram of a spring in an automatic diode potting and encapsulation device proposed in this utility model.
[0024] Legend:
[0025] 1. Workbench; 2. Casters; 3. Control console; 4. Glue storage bin; 5. Conveying pipe; 6. Horizontal electric slide rail; 7. Support rod; 8. Moving platform; 9. Sealing head; 10. Fixing block; 11. Electric push rod; 12. Connecting plate one; 13. Connecting rod; 14. Moving block; 15. Guide slide rail; 16. Connecting plate two; 17. Rack; 18. Rotating shaft; 19. Gear; 20. L-shaped fixing rod one; 21. Button; 22. Moving column; 23. Sliding rod; 24. L-shaped fixing rod two; 25. Spring; 26. Slide groove. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Reference Figures 1-4 An embodiment of this utility model provides an automatic diode potting and encapsulation device, including a workbench 1, a caster wheel 2 on the lower surface of the workbench 1, a control console 3 on one side of the upper part of the workbench 1, a glue storage tank 4 on the other side of the upper part of the control console 3, a conveying pipe 5 fixedly connected to the inner wall of the glue storage tank 4, a support rod 7 fixedly connected to the upper surface of the workbench 1, a transverse electric slide rail 6 fixedly connected to the upper surface of the support rod 7, a moving platform 8 fixedly connected to one end of the conveying pipe 5, a replacement component on the inner wall of the moving platform 8, and a clamping component on the upper surface of the workbench 1.
[0028] The clamping assembly includes a fixed block 10, which forms a parallel clamping force when moving in opposite directions to ensure that the diode pins and the package shell are fixed in relative position. The lower surface of the fixed block 10 is slidably connected to the upper surface of the worktable 1. An electric push rod 11 is fixedly connected to the lower side of the inner wall of the worktable 1. A connecting plate 12 is fixedly connected to the output end of the electric push rod 11. A moving block 14 is fixedly connected to the upper surface of the connecting plate 12. A connecting rod 13 is fixedly connected to the upper surface of the moving block 14. A connecting plate 16 is fixedly connected to the lower surface of the moving block 14. A rack 17 is fixedly connected to the outer wall of the connecting plate 16. A rotating shaft 18 is fixedly connected to the lower side of the inner wall of the worktable 1. A gear 19 is rotatably connected to the outer wall of the rotating shaft 18. The tooth end of the gear 19 meshes with the tooth end of the rack 17. The synchronous opposite movement of the two fixed blocks 10 is achieved through the transmission of the gear 19 to ensure that the clamping force is balanced. A guide rail 15 is fixedly connected to the upper side of the inner wall of the worktable 1.
[0029] Specifically, after the console 3 is started, the electric push rod 11 drives the connecting plate 12 to move horizontally, causing the moving block 14 to slide along the guide rail 15. The connecting rod 13 causes the fixed block 10 to slide on the surface of the worktable 1. At the same time, the moving block 14 drives the rack 17 on the connecting plate 16 to mesh with the gear 19. The gear 19 rotates around the rotating shaft 18, causing the fixed block 10 on the other side to move in the opposite direction synchronously, thereby achieving the opposite clamping of the diode.
[0030] Reference Figures 1-6The replacement component includes an L-shaped fixing rod 24, which, when engaged, forms a fixed connection with an L-shaped fixing rod 20. The L-shaped fixing rod 24 is located on the inner wall of the moving platform 8. A button 21 is slidably connected to the inner wall of the moving platform 8. A moving column 22 is fixedly connected to the outer wall of the button 21. A spring 25 is fixedly connected to the inner wall of the moving platform 8. A groove 26 is provided on the lower side of the inner wall of the moving platform 8. A sliding rod 23 is fixedly connected to the outer wall of the L-shaped fixing rod 24. A sealing head 9 is provided on the lower surface of the moving platform 8. An L-shaped fixing rod 20 is fixedly connected to the upper surface of the sealing head 9. The outer wall of the sliding rod 23 is slidably connected inside the groove 26. One end of the spring 25 is fixedly connected to the other end of the spring 25. The outer wall of the moving column 22 is fixedly connected to the L-shaped fixing rod 24. The inner wall of rod 24 has a moving column 22 for driving the L-shaped fixed rod 24 to move. One end of the L-shaped fixed rod 24 is engaged with the other end of the L-shaped fixed rod 1 20. The L-shaped fixed rod 24 and the L-shaped fixed rod 1 20 are used to connect the moving platform 8 and the encapsulation head 9. The outer wall of the L-shaped fixed rod 1 20 is slidably connected to the inner wall of the moving platform 8. The inner wall of the moving platform 8 is slidably connected to the outer wall of the transverse electric slide rail 6. One end of the connecting rod 13 is fixedly connected to the lower surface of the fixed block 10. The inner wall of the moving block 14 is slidably connected to the outer wall of the guide slide rail 15. The upper surface of the connecting plate 12 is fixedly connected to the lower surface of the moving block 14. The moving block 14 is set on the upper side of the inner wall of the worktable 1. The gear 19 is set on the lower side of the inner wall of the worktable 1.
[0031] Specifically, when replacing the encapsulation head 9, press button 21 to move the moving column 22 and the second L-shaped fixing rod 24. The sliding rod 23 slides along the slide groove 26 and compresses the spring 25, causing the second L-shaped fixing rod 24 to disengage from the first L-shaped fixing rod 20. After removing the old encapsulation head 9, insert the first L-shaped fixing rod 20 of the new encapsulation head 9 into the corresponding position. Release button 21, and the spring 25 pushes the second L-shaped fixing rod 24 to reset and engage.
[0032] Working principle: When an automatic diode potting and encapsulation device is needed, after the control console 3 is started, the electric push rod 11 drives the connecting plate 12 to move horizontally. The connecting plate 12 drives the moving block 14 to slide along the guide rail 15. At the same time, the connecting rod 13 synchronously drives the fixed block 10 to slide on the surface of the worktable 1, realizing the lateral clamping and positioning of the diode. When the moving block 14 moves, the rack 17 on the connecting plate 16 meshes with the gear 19, causing the gear 19 to rotate around the rotating shaft 18, thereby driving the rack 17 on the other side and the fixed block 10 to move in opposite directions synchronously, forming a counter-clamping action to ensure that the diode remains stable during the potting process. The glue in the glue tank 4 is transported to the moving table 8 through the conveying pipe 5. The moving table 8 moves to above the diode encapsulation position under the drive of the horizontal electric slide rail 6, and the encapsulation head 9 performs the potting operation.
[0033] Furthermore, when it is necessary to replace the encapsulation head 9 with a different specification, press button 21. Button 21 drives the moving column 22 and the L-shaped fixing rod 24 to move synchronously. The sliding rod 23 of the L-shaped fixing rod 24 slides along the slide groove 26 and compresses the spring 25, so that the L-shaped fixing rod 24 disengages from the L-shaped fixing rod 20. At this time, the old encapsulation head 9 can be taken out from under the moving table 8, and the L-shaped fixing rod 20 of the new encapsulation head 9 can be inserted into the corresponding position inside the moving table 8. After releasing button 21, the spring 25 rebounds and pushes the L-shaped fixing rod 24 to reset, re-engaging with the L-shaped fixing rod 20, thus completing the quick replacement of the encapsulation head 9.
[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An automatic diode potting and encapsulation device, comprising a worktable (1), characterized in that: The workbench (1) is provided with casters (2) on its lower surface. A control console (3) is provided on one side of the upper part of the workbench (1). A glue storage tank (4) is provided on the other side of the upper part of the control console (3). A conveying pipe (5) is fixedly connected to the inner wall of the glue storage tank (4). A support rod (7) is fixedly connected to the upper surface of the workbench (1). A transverse electric slide rail (6) is fixedly connected to the upper surface of the support rod (7). A moving platform (8) is fixedly connected to one end of the conveying pipe (5). A replacement component is provided on the inner wall of the moving platform (8). A clamping component is provided on the upper surface of the workbench (1). The clamping assembly includes a fixed block (10), the lower surface of which is slidably connected to the upper surface of the workbench (1). An electric push rod (11) is fixedly connected to the lower side of the inner wall of the workbench (1). A connecting plate (12) is fixedly connected to the output end of the electric push rod (11). A moving block (14) is fixedly connected to the upper surface of the connecting plate (12). A connecting rod (13) is fixedly connected to the upper surface of the moving block (14). A connecting plate (16) is fixedly connected to the lower surface of the moving block (14). A rack (17) is fixedly connected to the outer wall of the connecting plate (16). A rotating shaft (18) is fixedly connected to the lower side of the inner wall of the workbench (1). A gear (19) is rotatably connected to the outer wall of the rotating shaft (18). The tooth end of the gear (19) meshes with the tooth end of the rack (17). A guide rail (15) is fixedly connected to the upper side of the inner wall of the workbench (1).
2. The diode automatic potting and encapsulation device according to claim 1, characterized in that: The replacement component includes an L-shaped fixing rod two (24), which is disposed on the inner wall of the moving platform (8). A button (21) is slidably connected to the inner wall of the moving platform (8). A moving column (22) is fixedly connected to the outer wall of the button (21). A spring (25) is fixedly connected to the inner wall of the moving platform (8). A sliding groove (26) is opened on the lower side of the inner wall of the moving platform (8). A sliding rod (23) is fixedly connected to the outer wall of the L-shaped fixing rod two (24). An encapsulation head (9) is provided on the lower surface of the moving platform (8). An L-shaped fixing rod one (20) is fixedly connected to the upper surface of the encapsulation head (9).
3. The diode automatic potting and encapsulation device according to claim 2, characterized in that: The outer wall of the sliding rod (23) is slidably connected to the inside of the groove (26), and one end of the spring (25) is fixedly connected to the other end of the spring (25).
4. The diode automatic potting and encapsulation device according to claim 2, characterized in that: The outer wall of the movable column (22) is fixedly connected to the inner wall of the L-shaped fixed rod (24), and the movable column (22) is used to drive the L-shaped fixed rod (24) to move.
5. The diode automatic potting and encapsulation device according to claim 2, characterized in that: One end of the second L-shaped fixing rod (24) is engaged with the other end of the first L-shaped fixing rod (20). The second L-shaped fixing rod (24) and the first L-shaped fixing rod (20) are used to connect the moving platform (8) and the encapsulation head (9). The outer wall of the first L-shaped fixing rod (20) is slidably connected to the inner wall of the moving platform (8).
6. The diode automatic potting and encapsulation device according to claim 1, characterized in that: The inner wall of the moving platform (8) is slidably connected to the outer wall of the transverse electric slide rail (6), and one end of the connecting rod (13) is fixedly connected to the lower surface of the fixing block (10).
7. The diode automatic potting and encapsulation device according to claim 1, characterized in that: The inner wall of the movable block (14) is slidably connected to the outer wall of the guide rail (15), and the upper surface of the connecting plate (12) is fixedly connected to the lower surface of the movable block (14).
8. The diode automatic potting and encapsulation device according to claim 1, characterized in that: The movable block (14) is located on the upper side of the inner wall of the workbench (1), and the gear (19) is located on the lower side of the inner wall of the workbench (1).