Wafer centering and edge finding device

Abstract

The utility model provides a kind of wafer centering edge inspection device, belong to wafer handling technical field;Including:bottom plate, the top of the bottom plate is slidably connected with sliding plate, the top of the sliding plate is fixedly installed with fixed plate, the top of the fixed plate is fixedly installed with double-shaft motor, the output of the double-shaft motor is connected with rotating shaft, the top of the rotating shaft is fixedly installed with rotating wafer chuck, the rotating wafer chuck is used to fix wafer, the top of the bottom plate is provided with moving part, the moving part is used to drive the sliding plate to move.Top rod and rotating wafer chuck both have vacuum channel structure, avoid the slip in wafer centering adjustment process, improve the precision of wafer centering;8 points to 32 points test, production capacity is faster than original thousand point sampling test, shorten the production capacity of single wafer centering edge inspection;Utilize moving part cooperation grating ruler, record grating ruler position when wafer triggers point sensor, replace the strip sensor of traditional equipment.

Description

Technical Field

[0001] This utility model belongs to the field of wafer handling technology, specifically relating to a wafer centering and edge-tracking device. Background Technology

[0002] Wafers are the core material in semiconductor manufacturing, and their background technologies involve multiple fields such as materials, processes, and equipment. In the early days, wafers were mainly made of silicon and manufactured through processes such as crystal pulling and slicing. With the development of process technology, the introduction of photolithography in the 1970s propelled wafer manufacturing into the micron era. In the 1990s, copper interconnects and CMOS technology became widespread, improving chip performance. In recent years, advanced processes have driven the transistor structure from FinFET to GAAFET, while specialty processes have flourished due to the demand from the Internet of Things and automotive electronics. In addition, wafer manufacturing is developing towards intelligence and greening, and domestically produced equipment is gradually breaking the foreign monopoly, enhancing the autonomy of the industrial chain. Wafer alignment and edge tracing are crucial steps in wafer handling. Wafer alignment aims to align the wafer center with the rotation center, preventing eccentric rotation. Wafer edge tracing adjusts the wafer angle, ensuring the wafer's flat or notched surface faces the specified direction, guaranteeing correct processing. The two functions mentioned above are usually integrated into a dedicated device. Existing wafer alignment and edge-tracing machines have problems such as redundant test points, long single-wafer testing time, and expensive core components such as strip sensors. Therefore, it is necessary to design and develop a wafer alignment and edge-tracing device to shorten the single-wafer testing time, and at the same time reduce the device manufacturing cost by replacing the strip sensor with a point sensor. Utility Model Content

[0003] To address the issue of expensive core components in existing technologies, this invention provides a wafer alignment and edge-tracking device. This device utilizes a support component combined with point sensors to replace strip sensors, thereby reducing production costs. The specific technical solution is as follows: A wafer alignment and edge-tracking device includes: a base plate; a sliding plate slidably connected to the top of the base plate; a fixed plate fixedly mounted on the top of the sliding plate; a dual-axis motor fixedly mounted on the top of the fixed plate; a rotating shaft connected to the output end of the dual-axis motor; a rotating wafer chuck fixedly mounted on the top of the rotating shaft; the rotating wafer chuck for fixing the wafer; a moving component on the top of the base plate for moving the sliding plate; and a support component on the top of the base plate, comprising: a sensor support, a lower sensor support, point sensors, and an upper sensor support. The sensor support is fixedly mounted on the top of the base plate, and the upper and lower sensor supports are respectively mounted vertically on the sensor support. Multiple sets of point sensors are equidistantly mounted on opposite ends of the upper and lower sensor supports.

[0004] Preferably, a rotary shaft encoder is fixedly mounted on the top of the fixed plate, a first synchronous pulley is fixedly fitted on the output end of the rotary shaft encoder, the bottom of the rotary shaft extends rotatably through the fixed plate, a second synchronous pulley is fixedly fitted on the bottom of the rotary shaft, and a synchronous belt meshes between the first synchronous pulley and the second synchronous pulley.

[0005] Preferably, a sensor is fixedly installed on the inner wall of the fixing plate, and a sensor baffle is fixedly installed on the top edge of the second synchronous pulley, the sensor baffle being adapted to the sensor.

[0006] Preferably, two slide rails are symmetrically installed on the top of the base plate, and sliders are slidably connected to the top of the slide rails. The two sliders are fixedly installed on the bottom of the sliding plate. A grating ruler is fixedly installed on the top of the base plate for detecting the sliding plate.

[0007] Preferably, the moving component includes: a first motor, a first bearing housing, a first screw, a first threaded sleeve, and a first fixing block. The first motor and the first bearing housing are fixedly installed on the top of the base plate. The output end of the first motor is connected to the first screw. The first screw is rotatably fitted inside the first bearing housing. The first threaded sleeve is threaded onto the first screw. The first fixing block is fixedly installed on the first threaded sleeve. The end of the first fixing block away from the first threaded sleeve is fixedly connected to the sliding plate.

[0008] Preferably, a lifting component is provided on the top of the base plate, and a top rod mounting seat is installed at the output end of the lifting component. The top rod mounting seat is sleeved on the outside of the dual-axis motor, and three top rods are equidistantly installed on the top of the top rod mounting seat. A top rod suction cup is installed on the top of each top rod.

[0009] In addition, the wafer alignment and edge-searching device in the above-mentioned technical solution provided by this utility model may also have the following features: the lifting component includes: a mounting plate, a second motor, a second screw, a second bearing seat, a second threaded sleeve, and a second fixing block. The mounting plate is fixedly installed on the top of the base plate. The second bearing seat and the second motor are fixedly installed on the side wall of the mounting plate in the vertical direction. The output end of the second motor is connected to the second screw. The second screw is rotatably fitted in the second bearing seat. The second screw is threadedly fitted in the second threaded sleeve. The second fixing block is fixedly installed on the second threaded sleeve.

[0010] In the above technical solution, the end of the second fixing block away from the second threaded sleeve is fixedly connected to the top rod mounting seat.

[0011] The wafer alignment and edge-searching device of this utility model has the following advantages compared with the prior art: The wafer alignment and edge-following device has a vacuum channel structure in both the push rod and the rotating wafer chuck, which avoids slippage during the wafer alignment and adjustment process and improves the accuracy of wafer alignment. This wafer alignment and edge-checking device, by selecting 8 to 32 points for testing, has a faster throughput than the original thousand-point sampling test, and shortens the throughput of single-wafer alignment and edge-checking. This wafer alignment and edge-tracking device uses a moving component in conjunction with a grating ruler to record the position of the grating ruler when the wafer triggers a point sensor, replacing the strip sensor of traditional equipment. The price of a strip sensor is more than 10 times that of a point sensor. By using the above structure to replace the original expensive core component, the production and manufacturing cost of the device is reduced. Attached Figure Description

[0012] Figure 1 A first three-dimensional structural schematic diagram of the wafer alignment and edge-tracing device provided by this utility model; Figure 2 A second three-dimensional structural schematic diagram of the wafer alignment and edge-tracing device provided by this utility model; Figure 3 A front view schematic diagram of the wafer alignment and edge-tracing device provided by this utility model; Figure 4 A rear view schematic diagram of the wafer alignment and edge-tracing device provided by this utility model; Figure 5 A schematic diagram of the sensor provided by this utility model; in, Figures 1 to 5 The reference numerals and component names in the attached drawings are as follows: 1. Base plate, 2. Sliding plate, 3. Fixing plate, 4. Dual-axis motor, 5. Rotary wafer chuck, 6. Rotary shaft encoder, 7. Moving component, 8. Support component, 9. Lifting component, 10. Top rod mounting seat, 11. Top rod, 12. Top rod chuck, 13. Grating ruler, 14. First synchronous pulley, 15. Second synchronous pulley, 16. Synchronous belt, 17. Slide rail, 18. Slider, 19. Sensor baffle, 20. Sensor, 41. Rotating shaft, 71. First motor, 72. First bearing seat, 73. First screw, 74. First threaded sleeve, 75. First fixing block, 81. Sensor bracket, 82. Sensor lower support plate, 83. Point sensor, 84. Sensor upper bracket, 91. Mounting plate, 92. Second motor, 93. Second screw, 94. Second bearing seat, 95. Second threaded sleeve, 96. Second fixing block. Detailed Implementation

[0013] The following are specific implementation cases and appendices. Figures 1-5The present invention will be further described, but it is not limited to these embodiments. The present invention provides a technical solution: a wafer alignment and edge-tracking device, comprising: a base plate 1, a sliding plate 2 slidably connected to the top of the base plate 1, a fixed plate 3 fixedly installed on the top of the sliding plate 2 through a connecting column, a dual-axis motor 4 fixedly installed on the top of the fixed plate 3, a rotating shaft 41 connected to the output end of the dual-axis motor 4, the rotating shaft 41 passing through both sides of the dual-axis motor 4, and power distribution is achieved through mechanical structures such as gears and couplings; a rotating wafer chuck 5 fixedly installed on the top of the rotating shaft 41, the rotating wafer chuck 5 having a vacuum channel designed in the middle, the rotating wafer chuck 5 being used to fix the wafer, and a moving part 7 provided on the top of the base plate 1, the moving part 7 being used to drive the sliding plate 2 to move; The top of the base plate 1 is provided with a support component 8, which includes: a sensor support 81, a lower sensor support 82, point sensors 83, and an upper sensor support 84. The sensor support 81 is fixedly installed on the top of the base plate 1. The upper sensor support 84 and the lower sensor support 82 are respectively installed on the sensor support 81 along the vertical direction. Three sets of point sensors 83 are equidistantly installed at opposite ends of the upper sensor support 84 and the lower sensor support 82. Each set of point sensors 83 has two point sensors 83, which are respectively installed on the lower sensor support 82 and the upper sensor support 84. Each set of point sensors 83 corresponds to each other in the vertical direction. Different sets of point sensors 83 correspond to wafers of different sizes for inspection.

[0014] As a preferred embodiment, a rotary shaft encoder 6 is fixedly mounted on the top of the fixed plate 3. A first synchronous pulley 14 is fixedly fitted at the output end of the rotary shaft encoder 6. The bottom of the rotary shaft 41 extends through the fixed plate 3. A second synchronous pulley 15 is fixedly fitted at the bottom of the rotary shaft 41. A synchronous belt 16 meshes between the first synchronous pulley 14 and the second synchronous pulley 15. The position of the rotary shaft 41 is fed back in real time by the rotary shaft encoder 6. The rotary shaft encoder 6 converts the mechanical displacement of the rotary shaft 41 into an electrical signal through photoelectric, magnetic and other sensors, and feeds back information such as position and speed in the form of pulses or digital codes.

[0015] As a preferred embodiment, a sensor 20 is fixedly installed on the inner wall of the fixed plate 3, and a sensor baffle 19 is fixedly installed on the top edge of the second synchronous wheel 15. The sensor baffle 19 is adapted to the sensor 20. When the sensor baffle 19 moves with the rotating shaft 41, it triggers the sensor by blocking / transmitting light, magnetic induction or contact, and outputs a corresponding signal. The sensor 20 detects whether the rotating shaft 41 has reached the specified processing position.

[0016] As a preferred embodiment, two slide rails 17 are symmetrically installed on the top of the base plate 1. The two slide rails 17 are arranged in parallel, and sliders 18 are slidably connected to the top of the slide rails 17. The two sliders 18 are fixedly installed on the bottom of the sliding plate 2. A grating ruler 13 is fixedly installed on the top of the base plate 1. The grating ruler 13 is used to detect the sliding plate 2. The grating ruler consists of a scale grating and an indicator grating, both of which are engraved with parallel and equally spaced stripes. When the two gratings are placed opposite each other at a small angle, moiré fringes of alternating light and dark will be generated under the illumination of the light source. The light intensity change of the moiré fringes is converted into an electrical signal by a photoelectric element. The grating ruler 13 is used to detect and provide feedback on the movement position of the sliding plate 2.

[0017] As a preferred embodiment, the moving component 7 further includes: a first motor 71, a first bearing housing 72, a first screw 73, a first threaded sleeve 74, and a first fixing block 75. The first motor 71 and the first bearing housing 72 are fixedly installed on the top of the base plate 1. The output end of the first motor 71 is connected to the first screw 73. The first screw 73 is rotatably fitted inside the first bearing housing 72. The first threaded sleeve 74 is threadedly fitted on the first screw 73. The first threaded sleeve 74 is located between the first motor 71 and the first bearing housing 72. The first fixing block 75 is fixedly installed on the first threaded sleeve 74 by bolts. The end of the first fixing block 75 away from the first threaded sleeve 74 is fixedly connected to the sliding plate 2 by bolts.

[0018] As a preferred embodiment, the top of the base plate 1 is further provided with a lifting component 9, and the output end of the lifting component 9 is equipped with a push rod mounting seat 10. The push rod mounting seat 10 is sleeved on the outside of the dual-axis motor 4. Three push rods 11 are equidistantly installed on the top of the push rod mounting seat 10. A push rod suction cup 12 is installed on the top of the push rod 11. Vacuum channels are designed in the middle of the push rods 11 and the push rod suction cup 12. The three push rod suction cups 12 prevent the wafer from slipping during the handover process.

[0019] As a preferred embodiment, the lifting component 9 further includes: a mounting plate 91, a second motor 92, a second screw 93, a second bearing seat 94, a second threaded sleeve 95, and a second fixing block 96. The mounting plate 91 is fixedly installed on the top of the base plate 1. The second bearing seat 94 and the second motor 92 are fixedly installed vertically on the side wall of the mounting plate 91. The output end of the second motor 92 is connected to the second screw 93. The second screw 93 is arranged vertically and is rotatably fitted into the second bearing seat 94. The second screw 93 is threadedly fitted into the second threaded sleeve 95. The second threaded sleeve 95 is located between the second motor 92 and the second bearing seat 94. The second fixing block 96 is fixedly installed on the second threaded sleeve 95 by bolts. The end of the second fixing block 96 away from the second threaded sleeve 95 is fixedly connected to the top rod mounting seat 10 by bolts.

[0020] The dual-axis motor, rotary shaft encoder, grating ruler, sensor, first motor, point sensor and second motor in this case are existing technologies. The first motor and second motor are bidirectional AC motors, DC motors or stepper motors. As long as the dual-axis motor, rotary shaft encoder, grating ruler, sensor, first motor, point sensor and second motor meet the requirements of this case, they are all acceptable.

[0021] The specific types or circuit structures of the controllers for the electrical components mentioned in this application, as well as the circuit connection relationships between the electrical components and the accurate coordinated control of multiple power components, are all prior art. Therefore, the above content will not be elaborated upon in this application.

[0022] Working principle: All electrical components mentioned in this application are connected to an external power supply and control switch during use. After the utility model is installed, first check the installation, fixation, and safety protection of the utility model, and then it can be used. Before use, select the installation position of the point sensor 83 according to the size of the wafer to be tested. If the wafer size is large, install it on the outer mounting point of the lower support plate 82 and the upper support plate 84 of the sensor. During use, start the second motor 92 to drive the second screw 93 to rotate. The second screw 93 drives the second threaded sleeve 95 on the surface to move upward, and drives the top rod mounting seat 10 to move upward through the second fixing block 96, so that the top rod 11 and the top rod suction cup 12 move to a suitable height. Then, install the wafer on the rotating wafer suction cup 5. The top rod suction cup 12 prevents the wafer from slipping during the transfer process. When the device is working, the wafer is attracted and fixed by the rotating wafer suction cup 5. After the wafer is fixed, the second motor 92 drives the top rod 11 and the top rod suction cup 12 to descend and detach from the wafer.

[0023] Then, the first motor 71 drives the first screw 73 to rotate, causing the first screw 73 to move the first threaded sleeve 74 and the first fixing block 75 linearly. This causes the sliding plate 2 to move along the slide rail 17, moving the wafer between the lower support plate 82 and the upper support plate 84 of the sensor. The grating ruler 13 achieves precise displacement measurement through the interference / diffraction effect of the grating fringes, accurately measuring the displacement of the sliding plate 2, so that the edge of the wafer moves to the test point of the point sensor 83. Then, the dual-axis motor 4 drives the rotating shaft 41 to rotate, thereby driving the rotating wafer chuck 5 and the wafer to rotate. During the wafer rotation, the rotating shaft 41 carries... The second synchronous pulley 15 is rotated, causing the first synchronous pulley 14 to rotate via the synchronous belt 16. This allows the rotary shaft encoder 6 to detect the position, speed, and direction of the wafer rotation, followed by detection by the point sensor 83. Testing can be performed using 8-point to 32-point methods. The 8-point test involves the probe card contacting only 8 test points on the chip, typically used for basic electrical parameter testing. This method is faster and suitable for initial screening of defective chips. The 32-point test involves the probe card contacting all 32 test points on the chip, enabling more comprehensive testing and detection of more complex electrical characteristics to ensure that the chip performance meets design requirements.

[0024] In the description of this utility model, the term "multiple" refers to two or more. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0025] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer alignment and edge-tracing device, comprising: The base plate (1) is characterized in that a sliding plate (2) is slidably connected to the top of the base plate (1), a fixed plate (3) is fixedly installed on the top of the sliding plate (2), a dual-axis motor (4) is fixedly installed on the top of the fixed plate (3), a rotating shaft (41) is connected to the output end of the dual-axis motor (4), a rotating wafer chuck (5) is fixedly installed on the top of the rotating shaft (41), the rotating wafer chuck (5) is used to fix the wafer, and a moving part (7) is provided on the top of the base plate (1), the moving part (7) is used to drive the sliding plate (2) to move; The top of the base plate (1) is provided with a support component (8), which includes: a sensor support (81), a lower sensor support (82), a point sensor (83), and an upper sensor support (84). The sensor support (81) is fixedly installed on the top of the base plate (1). The upper sensor support (84) and the lower sensor support (82) are respectively installed on the sensor support (81) along the vertical direction. Multiple sets of point sensors (83) are installed at equal intervals on the opposite ends of the upper sensor support (84) and the lower sensor support (82).

2. The wafer alignment and edge-searching device according to claim 1, characterized in that, A rotary shaft encoder (6) is fixedly installed on the top of the fixed plate (3). A first synchronous pulley (14) is fixedly fitted on the output end of the rotary shaft encoder (6). The bottom of the rotary shaft (41) extends through the fixed plate (3). A second synchronous pulley (15) is fixedly fitted on the bottom of the rotary shaft (41). A synchronous belt (16) meshes between the first synchronous pulley (14) and the second synchronous pulley (15).

3. The wafer alignment and edge-searching device according to claim 2, characterized in that, A sensor (20) is fixedly installed on the inner wall of the fixed plate (3), and a sensor baffle (19) is fixedly installed on the top edge of the second synchronous wheel (15). The sensor baffle (19) is adapted to the sensor (20).

4. The wafer alignment and edge-searching device according to claim 1, characterized in that, Two slide rails (17) are symmetrically installed on the top of the base plate (1), and sliders (18) are slidably connected to the top of the slide rails (17). The two sliders (18) are fixedly installed on the bottom of the sliding plate (2). A grating ruler (13) is fixedly installed on the top of the base plate (1). The grating ruler (13) is used to detect the sliding plate (2).

5. The wafer alignment and edge-searching device according to claim 4, characterized in that, The moving part (7) includes: a first motor (71), a first bearing seat (72), a first screw (73), a first threaded sleeve (74), and a first fixing block (75). The first motor (71) and the first bearing seat (72) are fixedly installed on the top of the base plate (1). The output end of the first motor (71) is connected to the first screw (73). The first screw (73) is rotatably fitted inside the first bearing seat (72). The first threaded sleeve (74) is threaded on the first screw (73). The first fixing block (75) is fixedly installed on the first threaded sleeve (74). The end of the first fixing block (75) away from the first threaded sleeve (74) is fixedly connected to the sliding plate (2).

6. The wafer alignment and edge-searching device according to claim 1, characterized in that, The top of the base plate (1) is provided with a lifting component (9), and the output end of the lifting component (9) is equipped with a top rod mounting seat (10). The top rod mounting seat (10) is sleeved on the outside of the dual-axis motor (4). Three top rods (11) are equidistantly installed on the top of the top rod mounting seat (10), and a top rod suction cup (12) is installed on the top of the top rod (11).

7. The wafer alignment and edge-searching device according to claim 6, characterized in that, The lifting component (9) includes: a mounting plate (91), a second motor (92), a second screw (93), a second bearing seat (94), a second threaded sleeve (95), and a second fixing block (96). The mounting plate (91) is fixedly installed on the top of the base plate (1). The second bearing seat (94) and the second motor (92) are fixedly installed on the side wall of the mounting plate (91) in the vertical direction. The output end of the second motor (92) is connected to the second screw (93). The second screw (93) is rotatably fitted in the second bearing seat (94). The second screw (93) is threadedly fitted in the second threaded sleeve (95). The second fixing block (96) is fixedly installed on the second threaded sleeve (95). The end of the second fixing block (96) away from the second threaded sleeve (95) is fixedly connected to the top rod mounting seat (10).

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