Wafer automatic centering device integrated on wafer transfer robot arm

Abstract

The utility model provides a kind of wafer automatic centering device integrated on wafer handling mechanical arm, belong to wafer handling technical field;Including: wafer handling mechanical arm pedestal, the top of wafer handling mechanical arm pedestal is fixedly installed with mounting disc, the top of mounting disc is separately installed with handling mechanical arm lower arm, handling mechanical arm upper arm and centering detection frame;A group of first point sensor, a group of second point sensor, a group of third point sensor and a group of fourth point sensor are respectively installed in the centering detection frame.This wafer automatic centering device integrated on wafer handling mechanical arm can replace independent wafer centering equipment, thereby the productivity of mechanical arm is improved, the movement time of separate wafer centering unit is reduced, and the productivity of mechanical arm is improved;Meanwhile, it can also eliminate the interference of wafer flat edge and gap, and truly realize wafer automatic centering integrated on wafer handling robot without other unit assistance.

Description

Technical Field

[0001] This utility model belongs to the field of wafer handling technology, specifically relating to an automatic wafer alignment device integrated on a wafer handling robotic arm. Background Technology

[0002] Wafers are the core material in semiconductor manufacturing, and their background technologies involve multiple fields such as materials, processes, and equipment. In the early days, wafers were mainly made of silicon and manufactured through processes such as crystal pulling and slicing. With the development of process technology, the introduction of photolithography in the 1970s propelled wafer manufacturing into the micron era. In the 1990s, copper interconnects and CMOS technology became widespread, improving chip performance. In recent years, advanced processes have driven the transistor structure from FinFET to GAAFET, while specialty processes have flourished due to the demand from the Internet of Things and automotive electronics. In addition, wafer manufacturing is developing towards intelligence and greening, and domestically produced equipment is gradually breaking the foreign monopoly, enhancing the autonomy of the industrial chain. Wafer alignment is a crucial step in the wafer handling process. The purpose of wafer alignment is to adjust the center of the wafer to the rotation center position to prevent the wafer from rotating off-center. The above functions are usually implemented on a dedicated device. In this way, the wafer handling robot arm will specifically transfer the wafer to the wafer alignment unit, and then take it out after the wafer alignment is completed, which occupies the robot arm's capacity. At the same time, alignment correction cannot be performed before each process unit. Utility Model Content

[0003] To address the issue of reduced robotic arm productivity in existing technologies, this invention provides an automatic wafer alignment device integrated into a wafer handling robotic arm. This device combines an alignment detection frame with the handling robotic arm to reduce the movement time of individual wafer alignment units, thereby improving the robotic arm's productivity. The specific technical solution is as follows: An automatic wafer alignment device integrated into a wafer handling robotic arm includes: a wafer handling robotic arm base; a mounting plate is fixedly installed on the top of the base; a lower arm, an upper arm, and an alignment detection frame are respectively mounted on the top of the mounting plate; a set of first point sensors, a set of second point sensors, a set of third point sensors, and a set of fourth point sensors are respectively installed within the alignment detection frame.

[0004] Preferably, the lower arm of the handling robotic arm includes: a lower robotic arm upper arm, a lower robotic arm lower arm, and a lower robotic arm connecting arm. The lower robotic arm upper arm is rotatably connected to the top of the mounting plate, the lower robotic arm lower arm is rotatably connected to the top of the lower robotic arm upper arm, and the lower robotic arm connecting arm is rotatably connected to the top of the lower robotic arm lower arm.

[0005] Preferably, a lower robotic arm finger is fixedly mounted on the top of the lower robotic arm connecting arm, and a lower suction cup is mounted on the top of the lower robotic arm finger, with the lower suction cup located on the side away from the lower robotic arm connecting arm.

[0006] Preferably, the upper arm of the handling robotic arm includes: an upper robotic arm main arm, an upper robotic arm secondary arm, and an upper robotic arm connecting arm. The upper robotic arm main arm is rotatably connected to the top of the mounting plate, the upper robotic arm secondary arm is rotatably connected to the top of the upper robotic arm main arm, and the upper robotic arm connecting arm is rotatably connected to the top of the upper robotic arm secondary arm.

[0007] Preferably, a robotic arm finger is fixedly mounted on the top of the upper robotic arm connecting arm, and an upper suction cup is mounted on the top of the robotic arm finger, the upper suction cup being located on the side away from the upper robotic arm connecting arm.

[0008] Preferably, the centering detection frame includes: a frame base, a frame top cover plate, and frame columns. The frame base is fixedly installed on the top of the mounting plate, and two frame columns are symmetrically installed on the top of the frame base. The frame top cover plate is fixedly installed on the top of the two frame columns.

[0009] Preferably, there are two first point sensors, which are respectively installed on the opposite surfaces of the frame base and the frame top cover, and are vertically aligned. There are also two second point sensors, which are respectively installed on the opposite surfaces of the frame base and the frame top cover, and are vertically aligned. The first and second point sensors are arranged on one side of the wafer centerline.

[0010] Preferably, there are two third point sensors, which are respectively installed on the opposite surfaces of the frame base and the frame top cover, and are vertically aligned. There are also two fourth point sensors, which are respectively installed on the opposite surfaces of the frame base and the frame top cover, and are vertically aligned. The third and fourth point sensors are arranged on the other side of the wafer centerline.

[0011] Preferably, a fifth point sensor is installed on the opposite surface of the frame base and the frame cover plate, the two fifth point sensors are vertically aligned, and the fifth point sensors are located on the center line of the wafer.

[0012] In addition, the automatic wafer alignment device integrated on the wafer handling robot arm in the above-mentioned technical solution provided by this utility model may also have the following features: a connector component is provided on one side of the base of the wafer handling robot arm.

[0013] The present invention discloses an automatic wafer alignment device integrated into a wafer handling robotic arm. Compared with the prior art, the advantages of this device are as follows: This automatic wafer alignment device integrated into the wafer handling robot arm can replace a separate wafer alignment device, which is equivalent to saving one step of the robot arm's process, thereby increasing the robot arm's productivity, reducing the movement time of a separate wafer alignment unit, and improving the robot arm's productivity; at the same time, it can also eliminate the interference of wafer flat edges and notches, truly realizing automatic wafer alignment integrated into the wafer handling robot without the assistance of other units. This automatic wafer alignment device, integrated into the wafer handling robot arm, uses two sets of four sensors to collect the positions of four points on the circumference of the wafer without the robot arm extending beyond its safe turning radius. Therefore, wafer offset detection can be performed simultaneously with the robot arm's rotation without adding extra robot arm movement. Without affecting the robot arm's production capacity, wafer alignment correction can be performed once each wafer is transferred, improving the stability of wafer transfer. This automated wafer alignment device, integrated into the wafer handling robotic arm, can replace a separate wafer alignment device. Compared to traditional wafer handling robotic arms, its increased material cost is only 1 / 5 of that of a separate wafer alignment device; it can save on the manufacturing cost of semiconductor manufacturing equipment. Attached Figure Description

[0014] Figure 1 A three-dimensional structural schematic diagram of the automatic wafer alignment device integrated on the wafer handling robotic arm provided by this utility model; Figure 2 for Figure 1 Enlarged view of point A; Figure 3 A top view of the automatic wafer alignment device integrated on a wafer handling robotic arm provided by this utility model; Figure 4 A first side view of the automatic wafer alignment device integrated on a wafer handling robotic arm provided by this utility model; Figure 5 A second side view of the automatic wafer alignment device integrated on a wafer handling robotic arm provided by this utility model; in, Figures 1 to 5The reference numerals and component names in the attached drawings are as follows: 1. Wafer handling robot arm base, 2. Mounting plate, 3. Lower arm of handling robot arm, 4. Upper arm of handling robot arm, 5. Alignment detection frame, 6. Lower finger of robot arm, 7. Upper finger of robot arm, 8. Lower suction cup, 9. Upper suction cup, 10. Connector component, 11. First point sensor, 12. Second point sensor, 13. Third point sensor, 14. Fourth point sensor, 15. Fifth point sensor, 31. Lower robot arm upper arm, 32. Lower robot arm lower arm, 33. Lower robot arm connecting arm, 41. Upper robot arm upper arm, 42. Upper robot arm lower arm, 43. Upper robot arm connecting arm, 51. Frame base, 52. Frame top cover plate, 53. Frame column. Detailed Implementation

[0015] The following are specific implementation cases and appendices. Figures 1-5 The present invention will be further described, but the present invention is not limited to these embodiments. The present invention provides a technical solution: an automatic wafer alignment device integrated on a wafer handling robot arm, comprising: a wafer handling robot arm base 1, a mounting plate 2 fixedly mounted on the top of the wafer handling robot arm base 1, a lower arm 3, an upper arm 4 and an alignment detection frame 5 respectively mounted on the top of the mounting plate 2, the lower arm 3, the upper arm 4 and the alignment detection frame 5 being arranged in a triangle, and the lower arm 3 and the upper arm 4 being driven by a motor; The centering detection frame 5 is equipped with a first point sensor 11, a second point sensor 12, a third point sensor 13 and a fourth point sensor 14, which are arranged in a rectangular shape.

[0016] As a preferred embodiment, the lower arm 3 of the handling robot includes: a lower robot arm upper arm 31, a lower robot arm lower arm 32, and a lower robot arm connecting arm 33. The lower robot arm upper arm 31 is rotatably connected to the top of the mounting plate 2, the lower robot arm lower arm 32 is rotatably connected to the top of the lower robot arm upper arm 31, and the lower robot arm connecting arm 33 is rotatably connected to the top of the lower robot arm lower arm 32. The wafer handling robot base 1 is equipped with a motor-driven lower robot arm upper arm 31, a motor-driven lower robot arm lower arm 32 is installed inside the lower robot arm upper arm 31, and a motor-driven lower robot arm connecting arm 33 is installed inside the lower robot arm lower arm lower arm 32. The motors mentioned above are stepper motors, DC servo motors, AC servo motors, etc., and are controlled by electrical signals to rotate or move, featuring fast response, high precision, and large driving force.

[0017] As a preferred option, the lower robotic arm connecting arm 33 is further fixedly mounted with a lower robotic arm finger 6, and a lower suction cup 8 is mounted on the top of the lower robotic arm finger 6. The lower suction cup 8 is located on the side away from the lower robotic arm connecting arm 33. Air is extracted from the lower suction cup 8 by a vacuum device to fix the lower suction cup 8 to the wafer. Air is then injected into the lower suction cup 8 by a vacuum device to restore the internal air pressure and release the adsorption.

[0018] As a preferred embodiment, the upper arm 4 of the handling robotic arm further comprises: an upper robotic arm main arm 41, an upper robotic arm secondary arm 42, and an upper robotic arm connecting arm 43. The upper robotic arm main arm 41 is rotatably connected to the top of the mounting plate 2, the upper robotic arm secondary arm 42 is rotatably connected to the top of the upper robotic arm main arm 41, and the upper robotic arm connecting arm 43 is rotatably connected to the top of the upper robotic arm secondary arm 42. The wafer handling robotic arm base 1 is equipped with a motor-driven upper robotic arm main arm 41, a motor-driven upper robotic arm secondary arm 42 is installed inside the upper robotic arm main arm 41, and a motor-driven upper robotic arm connecting arm 43 is installed inside the upper robotic arm secondary arm 42. The motors mentioned above are also stepper motors, DC servo motors, AC servo motors, etc., and are controlled by electrical signals to rotate or move.

[0019] As a preferred embodiment, the upper robotic arm connecting arm 43 is further fixedly mounted on the top of the upper robotic arm finger 7, which is located above the lower robotic arm finger 6 and arranged in parallel. The upper robotic arm finger 7 is mounted on the top of the upper robotic arm finger 7, and the upper robotic arm finger 9 is located on the side away from the upper robotic arm connecting arm 43. Air is extracted from the upper robotic arm finger 9 by a vacuum device to fix the upper robotic arm finger 9 to the wafer. Air is then injected into the upper robotic arm finger 9 by a vacuum device to restore the internal air pressure and release the adsorption.

[0020] As a preferred embodiment, the centering detection frame 5 further includes: a frame base 51, a frame top cover plate 52, and frame columns 53. The frame base 51 is fixedly installed on the top of the mounting plate 2, and two frame columns 53 are symmetrically installed on the top of the frame base 51. The frame top cover plate 52 is fixedly installed on the top of the two frame columns 53.

[0021] As a preferred embodiment, the number of first point sensors 11 is further specified as two, with the two first point sensors 11 respectively mounted on the opposite surfaces of the frame base 51 and the frame top cover 52, and the two first point sensors 11 corresponding to each other in the vertical direction; the number of second point sensors 12 is also specified as two, with the two second point sensors 12 respectively mounted on the opposite surfaces of the frame base 51 and the frame top cover 52, and the two second point sensors 12 corresponding to each other in the vertical direction. The first point sensors 11 and the second point sensors 12 are arranged on one side of the wafer centerline and are at the same vertical distance from the wafer centerline; the length of the line connecting the first point sensors 11 and the second point sensors 12 is greater than the wafer chord length on the line, so the first point sensors 11 and the second point sensors 12 will not be simultaneously triggered by wafer obstruction.

[0022] As a preferred embodiment, there are two third point sensors 13, which are respectively mounted on the opposite surfaces of the frame base 51 and the frame top cover 52, and are vertically aligned. There are also two fourth point sensors 14, which are respectively mounted on the opposite surfaces of the frame base 51 and the frame top cover 52, and are vertically aligned. The third and fourth point sensors 13 are located on the other side of the wafer centerline and are at the same vertical distance from the wafer centerline. The length of the line connecting the third and fourth point sensors 13 is greater than the chord length of the wafer on that line, so the third and fourth point sensors 13 will not be simultaneously triggered by wafer obstruction.

[0023] As a preferred option, a fifth point sensor 15 is installed on the opposite surfaces of the frame base 51 and the frame top cover 52. The two fifth point sensors 15 correspond to each other in the vertical direction and are located on the center line of the wafer.

[0024] As a preferred embodiment, the wafer handling robotic arm base 1 is further provided with a connector component 10 on one side, which is used for electrical connection with the internal motor.

[0025] The lower arm, upper arm, and point sensor of the handling robot in this case are existing technologies, and any combination of the lower arm, upper arm, and point sensor that meets the requirements of this case is acceptable.

[0026] The specific types or circuit structures of the controllers for the electrical components mentioned in this application, as well as the circuit connection relationships between the electrical components and the accurate coordinated control of multiple power components, are all prior art. Therefore, the above content will not be elaborated upon in this application.

[0027] Working Principle: All electrical components in this application are externally connected to a power supply and control switch during use. After installation, first check the installation, fixation, and safety precautions before use. During use, by activating the lower arm 3 and upper arm 4 of the transport robotic arm, the lower finger 6 and upper finger 7 extend outwards to the bottom of the wafer. The wafer is then attracted by the lower suction cup 8 and upper suction cup 9. The wafer is then moved into the alignment detection frame 5 by the lower arm 3 and upper arm 4. The first point sensor 11, the second point sensor 12, the third point sensor 13, and the fourth point sensor 14 are used to collect the positions of four points on the circumference of the wafer. When the wafer has a flat edge or a notch, the value measured by the fifth point sensor 15 is added to the center calculation data to eliminate the influence of the flat edge or notch on the wafer center calculation. In this way, the wafer position deviation can be measured in each wafer transfer and the wafer can be corrected during the transfer process. The lower arm 3 and the upper arm 4 of the handling robot arm are used to adjust the wafer to the center position, which improves the stability of wafer transfer.

[0028] In the description of this utility model, the term "multiple" refers to two or more. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0029] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automated wafer alignment device integrated into a wafer handling robotic arm, comprising: The wafer handling robot arm base (1) is characterized in that a mounting plate (2) is fixedly installed on the top of the wafer handling robot arm base (1), and a lower arm (3), an upper arm (4) and an alignment detection frame (5) of the handling robot arm are respectively installed on the top of the mounting plate (2). The centering detection frame (5) is equipped with a first point sensor (11), a second point sensor (12), a third point sensor (13), and a fourth point sensor (14).

2. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 1, characterized in that, The lower arm (3) of the handling robot includes: a lower robot arm upper arm (31), a lower robot arm lower arm (32) and a lower robot arm connecting arm (33). The upper arm (31) of the lower robot arm is rotatably connected to the top of the mounting plate (2). The lower robot arm lower arm (32) is rotatably connected to the top of the upper arm (31). The lower robot arm connecting arm (33) is rotatably connected to the top of the lower robot arm lower arm (32).

3. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 2, characterized in that, The lower robotic arm connecting arm (33) is fixedly mounted with a lower robotic arm finger (6), and a lower suction cup (8) is mounted on the top of the lower robotic arm finger (6). The lower suction cup (8) is located on the side away from the lower robotic arm connecting arm (33).

4. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 1, characterized in that, The upper arm (4) of the handling robot includes: upper robot arm (41), upper robot arm (42) and upper robot arm connecting arm (43). The upper robot arm (41) is rotatably connected to the top of the mounting plate (2). The upper robot arm (42) is rotatably connected to the top of the upper robot arm (41). The upper robot arm connecting arm (43) is rotatably connected to the top of the upper robot arm (42).

5. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 4, characterized in that, The upper robotic arm connecting arm (43) is fixedly mounted with a robotic arm upper finger (7), and the upper robotic arm upper finger (7) is mounted with an upper suction cup (9), which is located on the side away from the upper robotic arm connecting arm (43).

6. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 1, characterized in that, The centering detection frame (5) includes: a frame base (51), a frame top cover plate (52) and a frame column (53). The frame base (51) is fixedly installed on the top of the mounting plate (2). Two frame columns (53) are symmetrically installed on the top of the frame base (51). The frame top cover plate (52) is fixedly installed on the top of the two frame columns (53).

7. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 6, characterized in that, There are two first point sensors (11), which are respectively installed on the opposite surfaces of the frame base (51) and the frame top cover (52), and the two first point sensors (11) are vertically aligned. There are two second point sensors (12), which are respectively installed on the opposite surfaces of the frame base (51) and the frame top cover (52), and the two second point sensors (12) are vertically aligned. The first point sensors (11) and the second point sensors (12) are arranged on one side of the wafer centerline.

8. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 7, characterized in that, There are two third point sensors (13), which are respectively installed on the opposite surfaces of the frame base (51) and the frame top cover (52), and are vertically aligned. There are also two fourth point sensors (14), which are respectively installed on the opposite surfaces of the frame base (51) and the frame top cover (52), and are vertically aligned. The third point sensors (13) and the fourth point sensors (14) are arranged on the other side of the wafer centerline.

9. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 8, characterized in that, A fifth point sensor (15) is installed on the opposite surface of the frame base (51) and the frame top cover plate (52). The two fifth point sensors (15) are corresponding in the vertical direction and are located on the center line of the wafer.

10. The automatic wafer alignment device integrated on a wafer handling robotic arm according to claim 1, characterized in that, A connector component (10) is provided on one side of the wafer handling robot arm base (1).

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