A semiconductor laser chip clamping device

Abstract

The utility model provides a kind of semiconductor laser chip clamping device, belong to laser processing technical field, including conveying assembly, including support, fixedly connected in the support end portion's support table, rotationally installed in the support table center's main shaft, fixedly connected in the main shaft end portion's synchronous pulley, and the synchronous belt of adaptation installation in the synchronous pulley side wall;Clamping assembly includes the fixed seat of insertion in the support seat end portion, fixedly connected in the fixed seat side wall's limit rod.The utility model has the beneficial effects of: through the cooperation of conveying assembly and clamping assembly, ensure support seat moving precision, ensure the relative position error of chip and processing tool, satisfy semiconductor laser chip soldering precision requirement, through adjustable clamping force adaptation different size chip, avoid the edge burst caused by point contact, ensure that chip is attached without warping, while avoiding stress damage, can be adapted to special-shaped chip and different material chip, improve universality.

Description

Technical Field

[0001] This utility model belongs to the field of laser processing technology, specifically relating to a semiconductor laser chip clamping device. Background Technology

[0002] With the explosive development of fields such as optical communication, lidar, and quantum computing, the demand for semiconductor laser chips (such as VCSEL and DFB laser chips) is growing exponentially. As the core components of optoelectronic systems, these chips have stringent requirements for positioning accuracy, clamping stress, and automation efficiency in their processing (packaging, wire bonding, optical power detection, etc.).

[0003] The core specifications of semiconductor laser chips (such as threshold current, optical power, and wavelength) are extremely sensitive to processing positioning errors. Traditional pneumatic conveying devices rely on direct cylinder propulsion, resulting in poor conveying accuracy and being affected by air pressure fluctuations, leading to excessive deviations in the relative positions of the chip, welding head, and probe. Most equipment uses magnetic or friction positioning, which has low repeatability and existing fixing and clamping methods are prone to chip chipping and cracking. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor laser chip clamping device, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor laser chip clamping device, comprising,

[0007] The conveying assembly includes a bracket, a support platform fixedly connected to the end of the bracket, a main shaft rotatably mounted at the center of the support platform, a timing pulley fixedly connected to the end of the main shaft, and a timing belt adapted to be mounted on the side wall of the timing pulley. A support seat is slidably connected to the side wall of the support platform, and the side wall of the support seat is fixedly connected to the side wall of the timing belt.

[0008] The clamping assembly includes a fixed seat inserted into the end of the support base, a limiting rod fixedly connected to the side wall of the fixed seat, a propulsion cylinder fixedly connected to the end of the fixed seat, and a push rod fixedly connected to the end of the output shaft of the propulsion cylinder. The push rod is used in conjunction with the limiting rod, and a limiting groove is formed on the side wall of the limiting rod.

[0009] As a preferred embodiment of the present invention, the clamping assembly further includes a support rod fixedly connected to the end of the fixed base, and a pressure plate hinged to the end of the support rod, the end of the pressure plate extending above the limiting rod.

[0010] As a preferred embodiment of this utility model, a pressing cylinder is fixedly connected to the bottom of the fixed base, the end of the pressing cylinder is hinged to the middle side wall of the pressure plate, and the side wall of the fixed base is provided with a clearance hole for use in conjunction with the output shaft of the pressing cylinder.

[0011] In a preferred embodiment of this utility model, a rotating shaft is installed at the bottom of the fixed seat, and a bearing seat that cooperates with the rotating shaft of the fixed seat is installed on the side wall of the support seat.

[0012] As a preferred embodiment of the present invention, the conveying assembly further includes a guide rail fixedly connected to the side wall of the support platform, and a guide wheel rotatably mounted on the side wall of the support base. The side wall of the guide wheel rolls in contact with the side wall of the guide rail, and the middle side wall of the guide wheel is provided with a limiting groove that cooperates with the edge strip of the side wall of the guide rail.

[0013] In a preferred embodiment of this utility model, a mounting base is fixedly connected to the side wall of the support platform, a rotating rod is rotatably mounted on the side of the mounting base, a positioning rod is fixedly connected to the middle side wall of the rotating rod, a positioning block is fixedly connected to the side wall of the support base, and the end of the positioning rod is engaged in the middle of the positioning block.

[0014] As a preferred embodiment of this utility model, a positioning cylinder is hinged to the lower side wall of the support platform, and a connecting plate is hinged to the end of the positioning cylinder, with the end of the connecting plate fixedly connected to the side wall of the rotating rod.

[0015] Compared with the prior art, the beneficial effects of this utility model are: by using the conveying component and the clamping component together, the moving accuracy of the support base is guaranteed, the relative position error between the chip and the processing tool is ensured, the precision requirements for bonding semiconductor laser chips are met, the adjustable clamping force is adapted to chips of different sizes, edge cracking caused by point contact is avoided, chip bonding is ensured without warping, stress damage is avoided, and it can be adapted to irregularly shaped chips and chips of different materials, thus improving versatility. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a front structural diagram of the present invention;

[0019] Figure 3This is a side view of the present invention.

[0020] Figure 4 This is a three-dimensional structural diagram of the clamping component of this utility model.

[0021] In the diagram: 100, conveying assembly; 101, bracket; 102, support platform; 103, main shaft; 104, synchronous pulley; 105, synchronous belt; 106, support seat; 107, guide rail; 108, guide wheel; 109, mounting seat; 110, rotating rod; 111, positioning rod; 112, positioning block; 113, positioning cylinder; 114, connecting plate; 200, clamping assembly; 201, fixed seat; 202, limit rod; 203, propulsion cylinder; 204, push rod; 205, support rod; 206, pressure plate; 207, pressing cylinder. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0025] Example

[0026] Reference Figure 1-4 This is the first embodiment of the present invention, which provides a semiconductor laser chip clamping device, including,

[0027] The conveying assembly 100 includes a bracket 101, a support platform 102 fixedly connected to the end of the bracket 101, a main shaft 103 rotatably mounted at the center of the support platform 102, a synchronous pulley 104 fixedly connected to the end of the main shaft 103, and a synchronous belt 105 adapted to be mounted on the side wall of the synchronous pulley 104. A support seat 106 is slidably connected to the side wall of the support platform 102, and the side wall of the support seat 106 is fixedly connected to the side wall of the synchronous belt 105.

[0028] The clamping assembly 200 includes a fixed base 201 inserted into the end of the support base 106, a limiting rod 202 fixedly connected to the side wall of the fixed base 201, a push cylinder 203 fixedly connected to the end of the fixed base 201, and a push rod 204 fixedly connected to the end of the output shaft of the push cylinder 203. The push rod 204 is used in conjunction with the limiting rod 202, and a limiting groove is provided on the side wall of the limiting rod 202.

[0029] The conveying component 100 is the core component for transferring chips between multiple stations (picking station → detection station → packaging station). Synchronous transmission and rigid positioning ensure transfer accuracy. The bracket 101 and support platform 102 provide a stable reference surface for the transmission components. The main shaft 103 is rotatably mounted at the center of the support platform 102, with a synchronous pulley 104 connected to its end. The synchronous belt 105 is a polyurethane steel wire synchronous belt, driven by a servo motor to rotate the main shaft 103, causing the synchronous belt 105 to circulate and thus enabling the cyclic transfer of the support base 106. The support base 106 slides along the side wall of the support platform 102 with the synchronous belt 105 to support the clamping assembly 200. The clamping assembly 200 achieves stable chip clamping through the synergistic effect of side limiting and top pressing. A precision rotating shaft is installed at the bottom of the fixed base 201 and inserted into the bearing seat on the side wall of the support base 106. It can rotate around the support base 106 and switch different positions for processing as the track on the upper surface of the support platform 102 moves. Its rotation angle is monitored in real time by an angle sensor to ensure consistent posture. The limiting rod 202 is fixed to the side wall of the fixed base 201 by bolts. The side wall has a limiting groove to fit the chip edge (avoiding stress concentration caused by point contact). The push cylinder 203 is fixed to the end of the fixed base 201 by a bracket. Its piston rod is connected to the push rod 204 through a floating joint. The push rod 204 is set parallel to the limiting rod 202. The distance between them can be adjusted by the cylinder stroke to accommodate chips of different widths.

[0030] Specifically, the clamping assembly 200 also includes a support rod 205 fixedly connected to the end of the fixed base 201, and a pressure plate 206 hinged to the end of the support rod 205, with the end of the pressure plate 206 extending above the limiting rod 202.

[0031] The pressure plate 206 is hinged to the end of the support rod 205, and its end extends above the limiting rod. A silicone pad is attached to the bottom surface to prevent the chip from sliding.

[0032] Furthermore, a pressing cylinder 207 is fixedly connected to the bottom of the fixed base 201. The end of the pressing cylinder 207 is hinged to the middle side wall of the pressure plate 206, and the side wall of the fixed base 201 is provided with a clearance hole for use with the output shaft of the pressing cylinder 207.

[0033] The bottom of the fixed base 201 is fixed with a bracket to press the cylinder 207, and its piston rod is hinged to the middle position of the pressure plate through a joint bearing. The side wall of the fixed base is provided with a clearance hole for the piston rod of the pressing cylinder 207 to extend and retract, drive the pressure plate to rotate around the support rod 205, realize flexible pressing of the top of the chip, and prevent the chip from warping due to side clamping.

[0034] Furthermore, a rotating shaft is installed at the bottom of the fixed base 201, and a bearing seat that mates with the rotating shaft of the fixed base 201 is installed on the side wall of the support base 106.

[0035] Preferably, the conveying assembly 100 also includes a guide rail 107 fixedly connected to the side wall of the support platform 102, and a guide wheel 108 rotatably mounted on the side wall of the support base 106. The side wall of the guide wheel 108 rolls in contact with the side wall of the guide rail 107, and a limiting groove is provided on the middle side wall of the guide wheel 108 to cooperate with the side strip of the side wall of the guide rail 107.

[0036] The side wall of the support platform 102 is fixed with guide rail 107 by bolts; the side wall of the support base 106 is fitted with guide wheel 108 by bearing, and the guide wheel 108 has a limiting groove in the middle to prevent the support base 106 from shifting.

[0037] It should be noted that a mounting base 109 is fixedly connected to the side wall of the support platform 102, a rotating rod 110 is rotatably mounted on the side of the mounting base 109, a positioning rod 111 is fixedly connected to the middle side wall of the rotating rod 110, and a positioning block 112 is fixedly connected to the side wall of the support base 106, with the end of the positioning rod 111 being engaged in the middle of the positioning block 112.

[0038] The positioning rod 111 is used to position the support base 106 in conjunction with the support platform 102 and the mounting base 109, so that the support base 106 can be stopped in a specific position, and to cooperate with the processing equipment to process the chip and maintain the chip processing accuracy.

[0039] Preferably, a positioning cylinder 113 is hinged to the lower side wall of the support platform 102, and a connecting plate 114 is hinged to the end of the positioning cylinder 113. The end of the connecting plate 114 is fixedly connected to the side wall of the rotating rod 110.

[0040] The positioning cylinder 113 is used in conjunction with the connecting plate 114 to drive the rotating rod 110 to rotate, thereby adjusting the connection state between the positioning rod 111 and the positioning block 112.

[0041] During use, the servo motor drives the synchronous belt 105 to move, moving the support 106 to the material picking position. The guide wheel slides along the guide rail 107 to ensure that the axis of the support 106 is aligned with the material box outlet. The positioning cylinder 113 is vented, and the piston rod extends to push the connecting plate, causing the rotating rod 110 to rotate, so that the positioning rod 111 is engaged in the center groove of the positioning block 112 of the support 106, locking the support 106. When the chip is placed in the middle of the fixed seat 201, the pushing cylinder 203 is vented, and the piston rod extends to push the push rod 204 to move towards the limiting rod 202, pushing the chip into the middle of the side wall groove of the limiting rod 202. The chip side is clamped by the synergistic action of the push rod 204 and the limiting rod 202. Then, the control equipment drives the pressing cylinder 207 to vent, and the piston rod extends to push the pressure plate 206 to rotate around the support rod 205, so that the silicone pad lightly presses the top center of the chip.

[0042] After the chip is stably clamped and positioned, processes such as packaging (e.g., gold wire ball bonding) and testing (e.g., optical power testing) are performed. During the process, the clamping component 200 remains in a clamping state to prevent chip displacement. After processing, the pressing cylinder 207 exhausts air, and the pressure plate 206 is lifted (detached from the chip surface). The pushing cylinder 204 exhausts air, and the push rod retracts (releasing the side clamping). The chip is placed on the carrier at the target station. The servo motor drives the support base 106 to return to the picking position, waiting for the next clamping cycle. The entire process is automated.

[0043] In summary, the coordinated transmission of the synchronous pulley and synchronous belt, combined with the guiding and limiting functions of the guide rail and guide wheel, ensures the movement accuracy of the support base. The rigid locking of the positioning rod ensures the relative positional error between the chip and the processing tool, meeting the stringent requirements of semiconductor laser chip bonding accuracy and probe inspection. Adjustable clamping force adapts to chips of different sizes, avoiding edge chipping caused by point contact. The top silicone pad ensures chip bonding without warping, while preventing stress damage. The fixed base can rotate synchronously around the support base, adapting to various scenarios such as material box picking, vertical packaging, and side inspection. By replacing different limiting rods and silicone pads of different hardness, it can adapt to irregularly shaped chips (strip, square) and chips of different materials (silicon-based, compound semiconductor), improving versatility.

[0044] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0045] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0046] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A semiconductor laser chip clamping device, characterized in that: include, The conveying assembly (100) includes a bracket (101), a support platform (102) fixedly connected to the end of the bracket (101), a main shaft (103) rotatably mounted at the center of the support platform (102), a synchronous pulley (104) fixedly connected to the end of the main shaft (103), and a synchronous belt (105) adapted to be mounted on the side wall of the synchronous pulley (104). A support seat (106) is slidably connected to the side wall of the support platform (102), and the side wall of the support seat (106) is fixedly connected to the side wall of the synchronous belt (105). The clamping assembly (200) includes a fixed seat (201) inserted into the end of the support base (106), a limiting rod (202) fixedly connected to the side wall of the fixed seat (201), a propulsion cylinder (203) fixedly connected to the end of the fixed seat (201), and a push rod (204) fixedly connected to the end of the output shaft of the propulsion cylinder (203). The push rod (204) is used in conjunction with the limiting rod (202), and a limiting groove is provided on the side wall of the limiting rod (202).

2. The semiconductor laser chip clamping device according to claim 1, characterized in that: The clamping assembly (200) further includes a support rod (205) fixedly connected to the end of the fixed base (201), and a pressure plate (206) hinged to the end of the support rod (205), the end of the pressure plate (206) extending above the limiting rod (202).

3. The semiconductor laser chip clamping device according to claim 2, characterized in that: The bottom of the fixed base (201) is fixedly connected to a pressing cylinder (207), the end of the pressing cylinder (207) is hinged to the middle side wall of the pressure plate (206), and the side wall of the fixed base (201) is provided with a clearance hole for use in conjunction with the output shaft of the pressing cylinder (207).

4. The semiconductor laser chip clamping device according to claim 3, characterized in that: The bottom of the fixed seat (201) is equipped with a rotating shaft, and the side wall of the support seat (106) is equipped with a bearing seat that cooperates with the rotating shaft of the fixed seat (201).

5. The semiconductor laser chip clamping device according to claim 4, characterized in that: The conveying assembly (100) further includes a guide rail (107) fixedly connected to the side wall of the support platform (102) and a guide wheel (108) rotatably mounted on the side wall of the support base (106). The side wall of the guide wheel (108) rolls in contact with the side wall of the guide rail (107), and the middle side wall of the guide wheel (108) is provided with a limiting groove that cooperates with the side strip of the side wall of the guide rail (107).

6. The semiconductor laser chip clamping device according to claim 5, characterized in that: The support platform (102) is fixedly connected to the side wall of the mounting base (109), and a rotating rod (110) is rotatably installed on the side of the mounting base (109). A positioning rod (111) is fixedly connected to the middle side wall of the rotating rod (110), and a positioning block (112) is fixedly connected to the side wall of the support base (106). The end of the positioning rod (111) is engaged in the middle of the positioning block (112).

7. A semiconductor laser chip clamping device according to claim 6, characterized in that: A positioning cylinder (113) is hinged to the lower side wall of the support platform (102), and a connecting plate (114) is hinged to the end of the positioning cylinder (113). The end of the connecting plate (114) is fixedly connected to the side wall of the rotating rod (110).

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