Vacuum chucking device and semiconductor apparatus
By introducing a filling layer and a flexible covering layer into the vacuum adsorption device, the problems of deformation and damage of thin wafers during the adsorption process are solved, achieving stable adsorption of both thin and thick wafers, reducing modification costs and breakage risks, and improving wafer yield.
CN224556263UActive Publication Date: 2026-07-24SEMICON MFG ELECTRONICS (SHAOXING) CORP
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SEMICON MFG ELECTRONICS (SHAOXING) CORP
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-24
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Figure CN224556263U_ABST
Abstract
The utility model relates to the technical field of semiconductor manufacturing, provide a kind of vacuum adsorption device and semiconductor equipment, vacuum adsorption device includes matrix, filling layer and flexible cover layer;The matrix has an adsorption surface, the adsorption surface is provided with adsorption groove, the matrix is provided with the adsorption channel that is communicated with the adsorption groove in;The filling layer is filled in the adsorption groove, the filling layer is provided with flow channel, the flow channel is communicated with the adsorption channel, the surface of the filling layer close to the adsorption groove opening side is provided with first adsorption hole, the first adsorption hole is communicated with the flow channel, the flexible cover layer covers the adsorption surface and filling layer, and the flexible cover layer is provided with second adsorption hole, and second adsorption hole is communicated with first adsorption hole.This vacuum adsorption device can form support to wafer by filling layer, and form flexible contact with wafer by flexible cover layer, reduce the deformation of wafer, reduce the damage risk in wafer adsorption process.
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