A heat dissipation device for an NPU chip

Abstract

The utility model provides a kind of NPU chip heat dissipation device, comprising: shell, inside shell is used to install circuit board and allow circuit board and external device connection;Heat dissipation mechanism, heat dissipation device is installed in shell, heat dissipation device is connected with circuit board, and circuit board drives heat dissipation mechanism to work;Heat dissipation mechanism is used to export the heat generated by chip on circuit board in shell outside shell;Protective structure, protective structure is arranged at the outside of shell, and protective structure is used to prevent the abrasion of the outer surface of shell, so that aluminum shell is as basic heat dissipation component, while, set up heat dissipation mechanism can actively enhance heat exchange capacity, effectively solve the heat dissipation bottleneck problem caused by the increase of high arithmetic power chip heat consumption, ensure that chip operating temperature is stably in safe range, secondly, protective structure not only protects the outer surface of shell from physical damage, improves heat dissipation efficiency and prolongs equipment service life.

Description

Technical Field

[0001] This utility model relates to the field of biotechnology, and more specifically, to a heat dissipation device for an NPU chip. Background Technology

[0002] Current high-performance chip cooling solutions typically use an aluminum casing as the primary heat dissipation component. The chip is directly attached to the aluminum casing using thermally conductive adhesive, relying on the high thermal conductivity of aluminum to conduct the heat generated by the chip to the casing surface, where it is then dissipated through natural convection. However, due to the limited thermal conductivity of aluminum and the constraint of casing surface area on device size, when the chip's computing power increases, leading to increased heat dissipation, relying solely on the aluminum casing for heat dissipation may not be sufficient to dissipate the heat in time, causing the chip temperature to rise and affecting performance and reliability.

[0003] Therefore, it is necessary to provide a device to overcome the above-mentioned problems. Utility Model Content

[0004] The main objective of this invention is to provide an NPU chip heat dissipation device to at least solve the problem of insufficient heat dissipation efficiency under high heat flux density caused by relying solely on aluminum casing for heat dissipation in the prior art.

[0005] To achieve the above objectives, this utility model provides an NPU chip heat dissipation device, comprising: a housing, wherein the housing contains an interface slot for mounting a circuit board and allowing the circuit board to connect to an external device; a heat dissipation mechanism, wherein the heat dissipation device is installed inside the housing and connected to the circuit board, and the circuit board drives the heat dissipation mechanism to operate; the heat dissipation mechanism is used to dissipate heat generated by the chip on the circuit board in the housing to the outside of the housing; and a protective structure, wherein the protective structure is disposed on the outside of the housing and is used to prevent wear on the outer surface of the housing.

[0006] Optionally, the housing includes: a main housing, which is a columnar shape with openings at both ends, and the circuit board is installed inside the main housing; and baffles, which are disposed at both ends of the main housing and have interface slots for enabling the external device to connect to the circuit board inside the main housing.

[0007] Optionally, the main housing includes: a first housing; a second housing, wherein the end faces of the first housing and the second housing extending along the length direction are engaged with each other, and the first housing is located above the second housing; wherein the inner surfaces of the first housing and the second housing are provided with a serrated structure, the serrated structure being used to increase the heat dissipation area.

[0008] Optionally, the protective structure includes: two sets of protective shells, which are symmetrically fitted onto the outside of both ends of the main shell; there is a height difference between the outer surface of the protective shell and the outer surface of the main shell.

[0009] Optionally, the second housing is provided with a plurality of studs, which are used to fix and support the circuit board.

[0010] Optionally, the first housing has a mesh opening, and the heat dissipation mechanism includes a fan, which is fixed on the circuit board and located at the mesh opening; the fan is connected to the circuit board, and the circuit board drives the fan to rotate.

[0011] Optionally, each set of protective shells has a plane extending towards the center, and the plane is provided with mounting holes. The baffle includes: a first baffle, which is screwed onto the plane of one set of protective shells to close the first end of the main shell; and a second baffle, which is screwed onto the plane of another set of protective shells to close the second end of the main shell; wherein the first baffle is provided with an interface groove.

[0012] This utility model discloses an NPU chip heat dissipation device, comprising: a housing, the interior of which is used to mount a circuit board and allow the circuit board to connect to external devices; a heat dissipation mechanism, in which the heat dissipation device is installed inside the housing and connected to the circuit board, the circuit board driving the heat dissipation mechanism to operate; the heat dissipation mechanism is used to exhaust the heat generated by the chip on the circuit board inside the housing to the outside of the housing; and a protective structure, which is disposed outside the housing to prevent wear on the outer surface of the housing. Thus, while the aluminum housing serves as a basic heat dissipation component, the heat dissipation mechanism actively enhances heat exchange capacity, effectively solving the heat dissipation bottleneck problem caused by increased heat consumption of high-performance chips, ensuring that the chip's operating temperature remains stable within a safe range. Furthermore, the protective structure not only protects the outer surface of the housing from physical damage, improving heat dissipation efficiency, but also extends the device's service life. Attached Figure Description

[0013] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings: Figure 1 This is a top view schematic diagram of an optional chip heat dissipation device according to an embodiment of the present utility model; Figure 2 This is a side view schematic diagram of an optional chip heat dissipation device according to an embodiment of the present utility model; Figure 3 This is a schematic top view of an optional first housing according to an embodiment of the present utility model; Figure 4 This is optional according to the embodiments of the present utility model. Figure 3 Schematic diagram of section AA in the diagram; Figure 5 This is a top view schematic diagram of an optional second housing according to an embodiment of the present utility model; Figure 6 This is a side view of an optional second housing according to an embodiment of the present utility model; Figure 7 This is a schematic front view of an optional protective shell according to an embodiment of the present utility model; Figure 8 This is optional according to the embodiments of the present utility model. Figure 7 Schematic diagram of the BB section in the diagram; Figure 9 This is a schematic diagram of a first baffle, which is an optional embodiment of the present utility model; Figure 10 This is a schematic diagram of a second baffle, which is an optional embodiment of the present utility model.

[0014] Figure label: 10. Shell; 11. Main shell; 111. First shell; 112. Second shell; 113. Serrated structure; 114. Stud; 115. Mesh; 12. Baffle; 121. First baffle; 122. Second baffle; 13. Interface groove; 20. Protective structure; 21. Protective shell. Detailed Implementation

[0015] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0016] As Figure 1 , Figure 2 As shown, an NPU chip heat dissipation device includes: Housing 10, the interior of which is used to mount a circuit board and allow the circuit board to be connected to an external device; A heat dissipation mechanism is provided, wherein the heat dissipation device is installed inside the housing 10 and is connected to the circuit board, and the circuit board drives the heat dissipation mechanism to work; the heat dissipation mechanism is used to exhaust the heat generated by the chip on the circuit board in the housing 10 to the outside of the housing 10. A protective structure 20 is disposed outside the housing 10 and is used to prevent wear on the outer surface of the housing 10.

[0017] Specifically, an NPU (Neural Processing Unit) is a processor used for neural network calculations. Due to its powerful computing capabilities, an NPU chip generates a significant amount of heat during operation, thus requiring stricter heat dissipation. The chip heat dissipation device in this application uses a housing 10 to house a circuit board, on which the NPU chip is integrated. The housing 10 allows the circuit board to connect to external devices while retaining a traditional aluminum housing 10 as the basic heat dissipation component. The thermal conductivity of aluminum conducts heat from the chip to the surface of the housing 10, where natural convection dissipates the heat into the surrounding environment. A heat dissipation mechanism connected to the circuit board is added, positioned opposite the integrated NPU chip. Driven by the circuit board, the mechanism actively dissipates heat generated by the chip on the circuit board within the housing 10, compensating for the limitations of relying solely on the aluminum housing for natural heat dissipation. Furthermore, a protective structure 20 is provided on the outside of the housing 10. This structure prevents wear on the outer surface of the housing 10 caused by friction, impact, or drops, protecting the integrity of the housing 10 while maintaining stable heat dissipation performance.

[0018] This solution first retains the aluminum casing 10 as the basic heat dissipation component, while setting up a heat dissipation mechanism that can actively enhance heat exchange capacity, effectively solving the heat dissipation bottleneck problem caused by the increased heat consumption of high computing power chips, and ensuring that the chip's operating temperature remains stable within a safe range. Secondly, the protective structure 20 not only protects the outer surface of the casing from physical damage, but also improves heat dissipation efficiency and extends the service life of the equipment, making it particularly suitable for dealing with the continuously increasing heat consumption requirements of high computing power chips.

[0019] In one possible implementation, the housing 10 includes: The main housing 11 is a columnar structure with openings at both ends, and the circuit board is installed inside the main housing 11. A baffle 12 is provided at both ends of the main housing 11. An interface slot 13 is provided on the baffle 12, which is used to enable the external device to connect to the circuit board inside the main housing 11.

[0020] Specifically, such as Figure 1 , Figure 2As shown, the housing 10 consists of a main housing 11 and baffles 12. The main housing 11 is a columnar structure with openings at both ends, used to accommodate and fix the circuit board. The baffles 12 are respectively installed at both ends of the main housing 11, serving to close the ends. The interface slots 13 opened on the baffles 12 are through openings that penetrate the baffles 12. Their shape and position are designed according to actual connection requirements, allowing connection cables, pipes, or other components of external devices to pass through the baffles and connect to the internal circuit board, providing a channel for physical connection between devices. While ensuring the structural integrity of the housing 10, the necessary functional connections are achieved, enabling the equipment to be effectively protected while allowing necessary interaction with external systems.

[0021] In one possible implementation, the main housing 11 includes: First shell 111; The second housing 112 is engaged with the end faces of the first housing 111 and the second housing 112 extending along the length direction, with the first housing 111 located above the second housing 112. The inner surfaces of the first housing 111 and the second housing 112 are provided with a serrated structure 113, which is used to increase the heat dissipation area.

[0022] Specifically, such as Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the main housing 11 consists of a first housing 111 and a second housing 112 that cooperate with each other. The first housing 111 is located on top, and the second housing 112 is located on the bottom. The two are connected by interlocking end faces extending along the length direction to form a complete cylindrical receiving space. The inner surfaces of both the first housing 111 and the second housing 112 are provided with serrated structures 113. These serrated structures 113, while maintaining the same external volume, significantly increase the internal heat dissipation surface area through their inward protrusion design. This allows the heat generated by the chip to be more fully conducted to the surface of the housing 10, thereby effectively improving heat dissipation performance without increasing the overall device size. By combining space utilization with optimized heat dissipation efficiency, a significant enhancement in heat dissipation capacity is achieved while ensuring ease of assembly.

[0023] In one possible implementation, the protective structure 20 includes: Two sets of protective shells 21 are symmetrically fitted onto the outside of both ends of the main shell 11; There is a height difference between the outer surface of the protective shell 21 and the outer surface of the main shell 11.

[0024] Specifically, such as Figure 1 , Figure 7 and Figure 8As shown, two sets of protective shells 21 are symmetrically fitted onto the outer ends of the main shell 11, forming comprehensive protection for the main shell 11. A specific height difference is designed between the outer surface of the protective shell 21 and the outer surface of the main shell 11. This structural feature provides multiple protective functions: firstly, the stepped structure formed by the height difference effectively buffers external impact forces, reducing the collision energy directly borne by the main shell; secondly, it enhances the protective effect, protecting the main shell 11 from damage caused by external friction, collisions, and drops.

[0025] In one possible implementation, a plurality of studs 114 are provided on the second housing 112 for fixing and supporting the circuit board.

[0026] Specifically, such as Figure 6 As shown, the second housing 112 is provided with a plurality of studs 114, which are vertically fixed to the inner surface of the second housing 112 and are evenly distributed around the mounting area of ​​the circuit board. The studs 114 firmly fix the circuit board to the second housing 112, providing stable mechanical support for the circuit board and ensuring accurate positioning of the circuit board within the housing 10, preventing positional displacement due to vibration or impact.

[0027] In one possible implementation, the first housing 111 has mesh holes 115, and the heat dissipation mechanism includes: A fan is fixed to the circuit board and located at the mesh 115; the fan is connected to the circuit board, and the circuit board drives the fan to rotate.

[0028] Specifically, such as Figure 1 and Figure 3 As shown, the mesh 115 is positioned at the corresponding location of the heat dissipation mechanism, forming an effective airflow channel. The core component of the heat dissipation mechanism is a fan fixed to the circuit board, whose position is precisely aligned with the mesh 115 of the first housing 111, allowing the fan to directly draw in external cool air or expel internal hot air through the mesh 115 during operation. The fan blades are mounted parallel to the circuit board, ensuring that the airflow direction is perpendicular to the circuit board surface, forming the most direct and effective air convection path, allowing the cooling airflow to evenly cover the heat-generating components on the circuit board. The fan is directly driven and controlled by the circuit board, automatically adjusting its speed according to the chip's operating temperature to achieve intelligent temperature-controlled heat dissipation. This design perfectly integrates the forced air cooling system with the housing structure: on the one hand, the mesh 115 serves as a ventilation window, ensuring unobstructed airflow.

[0029] In one possible implementation, each set of protective shells 21 has a plane extending towards the center, the plane having mounting holes, and the baffle 12 includes: The first baffle 121 is screwed onto the plane of a set of protective shells 21 to close the first end of the main shell 11; The second baffle 122 is screwed onto the plane of another set of the protective shells 21 to close the second end of the main shell 11; The first baffle 121 has an interface slot 13.

[0030] Specifically, such as Figure 9 and Figure 10 As shown, neither the first baffle 121 nor the second baffle 122 is a flat plate of a certain thickness. Each set of protective shells 21 has a plane extending towards the center, with mounting holes for detachable connection with the baffle 12. The first baffle 121 is screwed onto the plane of one set of protective shells 21, sealing the first end of the main shell 11; the second baffle 122 is screwed onto the plane of another set of protective shells 21, sealing the second end of the main shell 11, facilitating disassembly and maintenance. The first baffle 121 has an interface groove 13, providing a channel for connecting external equipment to the internal circuit board, ensuring both the sealing and protection performance of the equipment and realizing the necessary functional interface. The entire structure ensures reliable protection while also considering ease of assembly and functional integrity.

[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation device for an NPU chip, characterized in that, include: Housing (10), the interior of which is used to mount a circuit board and an interface slot that allows the circuit board to be connected to an external device; A heat dissipation mechanism is provided, wherein the heat dissipation device is installed inside the housing and connected to the circuit board, and the circuit board drives the heat dissipation mechanism to work; the heat dissipation mechanism is used to exhaust the heat generated by the chips on the circuit board inside the housing to the outside of the housing. A protective structure (20) is disposed outside the housing (10) and is used to prevent wear on the outer surface of the housing (10); The housing (10) includes: The main housing (11) is a column with openings at both ends, and the circuit board is installed inside the main housing (11); The main housing (11) includes: First shell (111); The second housing (112) is engaged with the end faces of the first housing (111) and the second housing (112) extending along the length direction, and the first housing (111) is located above the second housing (112); The inner surfaces of the first housing (111) and the second housing (112) are provided with a serrated structure (113), which is used to increase the heat dissipation area.

2. The chip heat dissipation device according to claim 1, characterized in that, The housing (10) further includes: A baffle (12) is provided at both ends of the main housing (11). An interface slot (13) is provided on the baffle (12). The interface slot (13) is used to enable the external device to connect to the circuit board inside the main housing (11).

3. The chip heat dissipation device according to claim 2, characterized in that, The protective structure (20) includes: Two sets of protective shells (21) are symmetrically fitted onto the outside of both ends of the main shell (11); There is a height difference between the outer surface of the protective shell (21) and the outer surface of the main shell (11).

4. The chip heat dissipation device according to claim 1, characterized in that, The second housing (112) is provided with a plurality of studs (114), which are used to fix and support the circuit board.

5. The chip heat dissipation device according to claim 1, characterized in that, The first housing (111) has a mesh (115) formed thereon, and the heat dissipation mechanism includes: A fan is fixed to the circuit board and located at the mesh (115); the fan is connected to the circuit board, and the circuit board drives the fan to rotate.

6. The chip heat dissipation device according to claim 3, characterized in that, Each set of the protective shells (21) has a plane extending towards the center, and mounting holes are provided on the plane. The baffle (12) includes: A first baffle (121) is screwed onto the plane of a set of protective shells (21) to close the first end of the main shell (11); The second baffle (122) is screwed onto the plane of another set of the protective shells (21) to close the second end of the main shell (11); The first baffle (121) has an interface slot (13).

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