A multi-channel heat spreading chip liquid cooling heat dissipation assembly
By using a multi-channel thermal expansion chip liquid cooling heat dissipation component, which utilizes the design of a carrier board, end cap, partition, shunt board and thermal expansion components, the heat dissipation problem of high-power multi-module chips is solved, achieving efficient heat conduction and heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN ZHIHAOHANG PRECISION TECH CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional heat dissipation structures such as air cooling, liquid cooling, and immersion cooling cannot meet the heat dissipation requirements of high-power multi-module integrated chips.
A multi-channel thermal expansion chip liquid cooling heat dissipation component is adopted, including a carrier board, end caps, partitions, flow dividers, and thermal expansion components. By installing thermal expansion components above each chip, heat is conducted through the multi-channel flow channels using coolant. Combined with a thermally conductive layer and arc-shaped corner design, the heat exchange efficiency is improved.
It achieves efficient chip heat dissipation, solves the heat dissipation problem of high-power multi-module chips, improves the heat exchange effect of coolant on thermal expansion components and chips, and enhances the heat dissipation effect.
Smart Images
Figure CN224556274U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip heat dissipation technology, specifically a multi-channel thermal expansion chip liquid cooling heat dissipation component. Background Technology
[0002] The importance of chip heat dissipation lies in keeping the chip operating at a normal temperature and preventing performance degradation, damage, or other problems caused by overheating. Effective heat dissipation can ensure the stability and reliability of the chip, extend its lifespan, and improve the performance and security of the overall system. Most existing heat dissipation technologies use methods such as air cooling, liquid cooling, and immersion cooling to dissipate heat from the chip.
[0003] With the rapid development of semiconductor technology, chips are showing a trend towards higher integration, complexity, and higher frequency. In particular, for multi-module integrated chips, the power consumption has increased significantly, and the heat generated by the chips has also increased accordingly, becoming a key factor hindering the improvement of chip performance and reliability. Traditional heat dissipation structures such as air cooling, liquid cooling, and immersion cooling are no longer sufficient to meet the heat dissipation requirements of such chips.
[0004] Therefore, there is an urgent need for a multi-channel thermal expansion chip liquid cooling heat dissipation component to solve the above problems. Utility Model Content
[0005] Based on the above, the purpose of this utility model is to provide a multi-channel thermal expansion chip liquid cooling heat dissipation component to solve the problem that traditional air cooling, liquid cooling, immersion and other heat dissipation structures cannot meet the heat dissipation requirements of high-power multi-module integrated chips.
[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0007] This utility model provides a multi-channel thermal expansion chip liquid cooling heat dissipation component, including a carrier board on which a number of chips are mounted, an end cap on the top of the carrier board, a number of water inlets on one side of the top surface of the end cap, and a number of water outlets on the other side.
[0008] The bottom of the end cap has a cavity structure, and the bottom surface of the end cap is provided with multiple partitions. Each partition will separate a set of inlets and outlets located on the same axis. A flow divider is provided between each set of inlets and outlets located on the same axis. A first flow channel is formed between the flow divider and the partition.
[0009] Each of the chips is provided with a heat spreader on top, and the heat spreader is located inside the first flow channel.
[0010] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the thermal expansion component includes a thermally conductive base plate and multiple heat dissipation parts disposed on the thermally conductive base plate, with a second flow channel formed between the multiple heat dissipation parts.
[0011] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the heat dissipation part is in the form of a sheet.
[0012] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the heat dissipation part is in the shape of a square column.
[0013] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the heat dissipation part is cylindrical.
[0014] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the heat dissipation part and the heat-conducting base plate are integrally formed.
[0015] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, a thermally conductive layer is provided between the thermal expansion component and the chip.
[0016] As an optional technical solution for a multi-channel thermally expandable chip liquid cooling heat dissipation component, the thermally conductive layer is an indium sheet or thermally conductive silicone.
[0017] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, the angle between the first flow channel and the inlet or outlet is arc-shaped.
[0018] As an optional technical solution for a multi-channel thermal expansion chip liquid cooling heat dissipation component, two sets of diversion valves are mounted on the top of the end cover. One set of diversion valves is connected to multiple water inlets, and the other set of diversion valves is connected to multiple water outlets.
[0019] The beneficial effects of this utility model are as follows:
[0020] This utility model provides a multi-channel thermal expansion chip liquid cooling heat dissipation component. The multi-channel thermal expansion chip liquid cooling heat dissipation component includes a carrier board on which a plurality of chips are mounted. An end cap is encapsulated on the top of the carrier board. Multiple water inlets are provided on one side of the top surface of the end cap, and multiple water outlets are provided on the other side. The bottom of the end cap has a cavity structure, and multiple partitions are provided on the bottom surface of the end cap. Each partition isolates a set of water inlets and outlets located on the same axis. A flow divider is provided between each set of water inlets and outlets located on the same axis. A first flow channel is formed between the flow divider and the partition. A thermal expansion component is provided on top of each chip and is located in the first flow channel.
[0021] In the above structure, by installing a thermal expansion component above each chip module, each individual chip can achieve efficient heat conduction through the thermal expansion component. Since the baffle and diverter plate set at the bottom of the end cover can isolate each group of inlets and outlets located on the same axis and form two first flow channels, after the end cover and carrier board are packaged, the thermal expansion components located on the same axis can be placed in the corresponding first flow channels. Therefore, when the coolant flows in from the inlet, it will flow through the first and second flow channels and finally flow out from the outlet. In this process, the heat on the thermal expansion component can be effectively absorbed, thereby achieving efficient heat dissipation for each individual chip. The multi-channel first and second flow channel structure ensures that each group of chips located on the same axis does not interfere with each other during the heat dissipation process, improves the heat exchange effect of the coolant on the thermal expansion component and the chip, and effectively solves the heat dissipation problem of high-power multi-module chips. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of the multi-channel thermal expansion chip liquid cooling heat dissipation component in Embodiment 1 of this utility model;
[0023] Figure 2 This is an exploded view of the multi-channel thermal expansion chip liquid cooling heat dissipation component in Embodiment 1 of this utility model;
[0024] Figure 3 This is a partial exploded view of the multi-channel thermally expanded chip liquid cooling heat dissipation component in Embodiment 1 of this utility model;
[0025] Figure 4 This is a bottom view of the end cap in Embodiment 1 of this utility model;
[0026] Figure 5 This is a schematic diagram of the structure of the heat-expanding component in Embodiment 2 of this utility model;
[0027] Figure 6 This is a schematic diagram of the structure of the thermal expansion component in Embodiment 3 of this utility model.
[0028] In the picture:
[0029] 1. End cap; 10. Inlet; 11. Outlet; 12. Baffle; 13. Diverter plate; 14. First flow channel;
[0030] 2. Carrier board; 20. Chip; 21. Thermal conductive layer;
[0031] 3. Thermal expansion component; 30. Thermally conductive base plate; 31. Heat dissipation section; 32. Second flow channel;
[0032] 4. PCB substrate;
[0033] 5. Diverter valve. Detailed Implementation
[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0037] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0038] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no specific meaning.
[0039] Example 1
[0040] like Figure 1-4As shown, this utility model provides a multi-channel thermal expansion chip liquid cooling heat dissipation component. The multi-channel thermal expansion chip liquid cooling heat dissipation component includes a carrier plate 2 on which a plurality of chips 20 are mounted. An end cap 1 is encapsulated on the top of the carrier plate 2. A plurality of water inlets 10 are provided on one side of the top surface of the end cap 1, and a plurality of water outlets 11 are provided on the other side. The bottom of the end cap 1 has a cavity structure. A plurality of partitions 12 are provided on the bottom surface of the end cap 1. Each partition 12 isolates a group of water inlets 10 and water outlets 11 located on the same axis. A flow divider 13 is provided between each group of water inlets 10 and water outlets 11 located on the same axis. A first flow channel 14 is formed between the flow divider 13 and the partitions 12. A thermal expansion component 3 is provided above each chip 20 and is located in the first flow channel 14.
[0041] This utility model provides a multi-channel thermal expansion chip liquid cooling heat dissipation component. By installing a thermal expansion element 3 above each chip 20 module, each individual chip 20 can achieve efficient heat conduction through the thermal expansion element 3. Since the partition plate 12 and the diverter plate 13 at the bottom of the end cover 1 can isolate each set of inlets 10 and outlets 11 located on the same axis and form two first flow channels 14, after the end cover 1 and the carrier plate 2 are encapsulated, the thermal expansion elements 3 located on the same axis can be placed in the corresponding first flow channels 14. Therefore, when… When the coolant flows in from the inlet 10, it flows through the first channel 14 and the second channel 32, and finally flows out from the outlet 11. In this process, the heat on the heat expansion component 3 can be effectively absorbed, so that each individual chip 20 can be efficiently cooled. The structure of the multi-channel first channel 14 and the second channel 32 makes it so that each group of chips 20 located on the same axis does not interfere with each other during the heat dissipation process, which improves the heat exchange effect of the coolant on the heat expansion component 3 and the chips 20, and effectively solves the heat dissipation problem of high-power multi-module chips 20.
[0042] Specifically, such as Figure 2 and Figure 3As shown, the heat expansion component 3 includes an integrally formed thermally conductive base plate 30 and a heat dissipation part 31. In this embodiment, the heat dissipation part 31 consists of multiple sheet-shaped heat dissipation fins disposed above the thermally conductive base plate 30. The structure of the multiple heat dissipation fins allows the heat generated by the chip 20 to be absorbed and dispersed more quickly. Multiple second flow channels 32 are formed between the heat dissipation fins. After the end cover 1 and the carrier plate 2 are encapsulated, the heat expansion component 3 will be located in the first flow channel 14, and the second flow channel 32 and the first flow channel 14 are arranged in the same direction. This allows the coolant to flow more linearly and smoothly through the second flow channel 32 when it flows in the first flow channel 14, reducing the resistance of the coolant flow and the flow time in the first flow channel 14 and the second flow channel 32. This increases the heat exchange effect of the coolant on the heat expansion component 3 and the chip 20, effectively absorbing the heat generated by the chip 20 and enhancing the heat dissipation effect of the chip 20.
[0043] Furthermore, in order to increase the heat conduction between the heat spreader 3 and the chip 20, a heat-conducting layer 21 is provided between the chip 20 and the heat-conducting base plate 30. The heat-conducting layer 21 can be an indium sheet or thermally conductive silicone. The thermal conductivity of the indium sheet can reach 82W / mk, which is far superior to that of traditional heat dissipation materials. Its soft texture can closely fit the irregular surface with a gap of 0.1mm, and its temperature resistance is far higher than that of traditional heat dissipation materials. Therefore, in order to achieve high heat conduction efficiency, in this embodiment, the heat-conducting layer 21 is preferably an indium sheet.
[0044] In this embodiment, as Figure 4 As shown, the inner corners between each first flow channel 14 and the inlet 10 and outlet 11 are respectively set as arc-shaped structures. The arc-shaped corners can effectively make the coolant flow in and out faster and more smoothly. Compared with right-angled corners, the arc shape can not only make the coolant flow in and out quickly, but more importantly, it will not cause the coolant to backflow in the first flow channel 14 like the right-angled corners, further improving the heat dissipation effect on the chip 20.
[0045] Furthermore, such as Figure 1 As shown, in order to effectively input the coolant from the inlet 10 into the first flow channel 14 and to discharge it from the outlet 11, two sets of diversion valves 5 are installed above the end cap 1. The diversion valves 5 can be installed and mounted using external brackets. Multiple ports on one set of diversion valves 5 are connected to multiple inlets 10 via pipes, while multiple ports on the other set of diversion valves 5 are connected to multiple outlets 11 via pipes. Since the diversion valves 5 can distribute and receive coolant to each branch according to the same or proportional flow rate, there is no need to worry about the flow rate and backflow of coolant in the first flow channel 14. This not only improves the flow rate and flow of coolant in each first flow channel 14, but also effectively improves the heat exchange efficiency of the chip 20.
[0046] like Figure 2 As shown, during the installation and use of the multi-channel thermal expansion chip 20 liquid cooling heat dissipation component provided in this embodiment, the chip 20 passes through the carrier plate 2 through its pins and has solder balls implanted at its bottom. The solder balls are electrically connected to the PCB substrate 4. The encapsulation between the carrier plate 2 and the bottom of the end cap 1 can be sealed by adhesive or other methods with high sealing, strong temperature resistance, and corrosion resistance. Of course, this structure can also directly connect the chip 20 to the PCB substrate 4, and the end cap 1 is sealed to the PCB substrate 4 to increase its assembly applicable environment.
[0047] Example 2
[0048] like Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that the heat expansion component 3 in this embodiment is composed of a heat-conducting base plate 30 and a plurality of square heat dissipation pillars integrally formed on the heat-conducting base plate 30, so as to further improve the heat exchange efficiency of the heat expansion component 3 for the chip 20.
[0049] Example 3
[0050] like Figure 6 As shown, the difference between this embodiment and the above embodiment is that the heat expansion component 3 in this embodiment is composed of a heat-conducting base plate 30 and a plurality of cylindrical heat dissipation columns integrally formed on the heat-conducting base plate 30, so as to further improve the heat exchange efficiency of the heat expansion component 3 for the chip 20.
[0051] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.
Claims
1. A multi-channel thermally expandable liquid-cooled heat dissipation component for chips, comprising a carrier board on which a plurality of chips are mounted, characterized in that, The carrier plate is encapsulated with an end cap on its top surface. The end cap has multiple water inlets on one side of its top surface and multiple water outlets on the other side. The bottom of the end cap has a cavity structure, and the bottom surface of the end cap is provided with multiple partitions. Each partition will separate a set of inlets and outlets located on the same axis. A flow divider is provided between each set of inlets and outlets located on the same axis. A first flow channel is formed between the flow divider and the partition. Each of the chips is provided with a heat spreader on top, and the heat spreader is located inside the first flow channel.
2. The multi-channel thermally expandable chip liquid cooling heat dissipation component according to claim 1, characterized in that, The heat expansion component includes a heat-conducting base plate and a plurality of heat dissipation parts disposed on the heat-conducting base plate, with a second flow channel formed between the plurality of heat dissipation parts.
3. The multi-channel thermally expandable chip liquid cooling heat dissipation component according to claim 2, characterized in that, The heat dissipation section is in the form of a sheet.
4. The multi-channel thermally expandable chip liquid cooling heat dissipation component according to claim 2, characterized in that, The heat dissipation section is in the shape of a square column.
5. A multi-channel thermally expandable liquid-cooled heat dissipation component for chips according to claim 2, characterized in that, The heat dissipation section is cylindrical.
6. A multi-channel thermally expandable liquid-cooled heat dissipation component for chips according to claim 2, characterized in that, The heat dissipation unit and the heat-conducting base plate are integrally formed.
7. The multi-channel thermally expandable chip liquid cooling heat dissipation component according to claim 1, characterized in that, A thermally conductive layer is provided between the thermal expansion component and the chip.
8. A multi-channel thermally expandable liquid-cooled heat dissipation component for chips according to claim 7, characterized in that, The thermally conductive layer is an indium sheet or thermally conductive silicone.
9. A multi-channel thermally expandable liquid-cooled heat dissipation component for chips according to claim 8, characterized in that, The angle between the first flow channel and the inlet or outlet is arc-shaped.
10. A multi-channel thermally expandable chip liquid cooling heat dissipation component according to claim 9, characterized in that, Two diversion valves are mounted above the end cap. One set of diversion valves is connected to multiple water inlets, and the other set of diversion valves is connected to multiple water outlets.