A waterproof lga package for a pressure sensor

Abstract

The utility model relates to electronic packaging technical field especially relates to a waterproof LGA package of pressure sensor. Its technical scheme includes: the sensor and chip are installed on the PCB board, the dam body is installed on the PCB board, and the sensor and chip are all located in the dam body, the shell is installed on the outside of the dam body on the PCB board, and the glue injection mouth is set up on the shell. The utility model discloses through the accurate clamping of the clamping block of rectangular array distribution on the PCB board and the dam body clamping groove, realizes the quick positioning and firm installation of the dam body, avoids the deviation and influences the sealing effect, and simultaneously, the shell and the dam body form double -layer protection structure, combine the waterproof glue injection into each gap through the glue injection mouth, build composite waterproof system, effectively resist the water pressure, the vibration, and the reliability and service life of pressure sensor under complex environment are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, specifically to a waterproof LGA package for a pressure sensor. Background Technology

[0002] Pressure sensors, as key components for sensing pressure signals, are widely used in automotive electronics, industrial automation, medical devices, and environmental monitoring. In special operating conditions such as humidity and underwater environments, the waterproof performance of the sensor directly affects its stability and lifespan. Currently, commonly used waterproof encapsulation technologies for pressure sensors mainly include epoxy resin potting, silicone sealing, and LGA (Land Grid Array) encapsulation.

[0003] However, the single sealing structure used in existing solutions is difficult to withstand long-term water pressure impact and mechanical vibration, which can easily cause components to loosen or circuits to short-circuit. At the same time, most packaging solutions lack precise positioning and fixing designs, which can easily lead to displacement during assembly, affecting the waterproofing effect and thus reducing the overall waterproofing performance. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a waterproof LGA package for pressure sensors, solving the problems mentioned in the background art.

[0005] The solution to the above-mentioned technical problems provided by this utility model is as follows:

[0006] A waterproof LGA package for a pressure sensor includes a PCB board on which a sensor and a chip are mounted.

[0007] The dam body is mounted on the PCB board, and the sensors and chips are located inside the dam body. A housing is mounted on the outside of the dam body on the PCB board, and the housing has an injection port.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, the PCB board is provided with card blocks, which are distributed in a rectangular array on the PCB board. The card blocks limit the installation position of the dam body. The card blocks are provided with limiting blocks.

[0010] The beneficial effects of adopting the above-mentioned further solutions are:

[0011] By using rectangular arrays of locking blocks, multi-dimensional positioning references can be formed on the PCB board, allowing the dam body to quickly align with the preset position during installation. This effectively avoids offset problems caused by manual operation or equipment errors, significantly improving assembly efficiency. The positioning blocks further enhance the accuracy of positioning, ensuring a constant relative position between the dam body and the PCB board. This creates stable conditions for the uniform injection of waterproof adhesive and prevents the risk of seal failure due to positional deviation.

[0012] Furthermore, a slot is provided in the body of the dam, and the dam body is mounted on the PCB board by means of a locking block. The dam body is fixed on the PCB board by means of the locking slot and the locking block of the locking block.

[0013] The beneficial effects of adopting the above-mentioned further solutions are:

[0014] The snap-fit ​​design of the slot and the limiting block mechanically locks the dam body to the PCB board, significantly improving the stability of the connection compared to a simple limiting structure. During the waterproofing adhesive injection process, the snap-fit ​​structure can withstand the pressure generated by the flow of adhesive, preventing the dam body from shifting. During sensor use, this structure can resist external vibrations and impacts, preventing the dam body from loosening and ensuring that the double-layer protective structure remains intact, guaranteeing long-term stability of waterproofing performance.

[0015] Furthermore, the injection port is used to inject waterproof adhesive into the housing.

[0016] The beneficial effects of adopting the above-mentioned further solutions are:

[0017] The injection port provides a precise channel for injecting waterproof adhesive, allowing operators to directly deliver the adhesive to the target area inside the casing using the injection equipment, reducing waste and contamination of the adhesive in unsealed spaces. Simultaneously, the injection port's location is designed to fit the gap distribution between the casing, the dam body, and the components, facilitating the full filling of these gaps by utilizing the adhesive's own fluidity and injection pressure.

[0018] Furthermore, waterproof adhesive is filled into the gaps between the outer shell and the dam body, and between the dam body and the sensor and chip.

[0019] The beneficial effects of adopting the above-mentioned further solutions are:

[0020] By filling key gaps in the double-layer protective structure with waterproof adhesive, the adhesive layer between the outer shell and the dam body forms an external waterproof buffer zone, effectively dispersing external water pressure and water flow impact. The adhesive layer between the dam body and the components isolates moisture, liquids, and electronic components from direct contact, preventing malfunctions such as short circuits and component corrosion caused by moisture intrusion. This comprehensive sealing design, combining physical protection with deep chemical sealing, significantly improves the adaptability and reliability of the pressure sensor in harsh environments such as high humidity and underwater conditions, extending product lifespan.

[0021] This invention provides a waterproof LGA package for a pressure sensor. It offers the following advantages:

[0022] The double-layered protective design, consisting of an outer shell and the main body of the dam, combined with waterproof adhesive to fill gaps, serves as the first line of defense. The outer shell acts as the first line of defense, blocking large particles and water flow; the dam body, on the other hand, reduces the path for liquid penetration, forming an internal isolation layer. After the waterproof adhesive cures, it fills all gaps, creating a composite waterproof system that combines physical barriers and chemical seals. This effectively resists harsh environments such as dampness and underwater conditions, significantly improving the waterproof rating.

[0023] The clips on the PCB board cooperate with the slots and limiting blocks inside the dam body, using a rectangular array of mechanical clips. This design enables rapid positioning of the dam body during installation through precise geometric matching, avoiding installation misalignment; at the same time, the clip structure provides stable mechanical fixation, preventing the dam body from loosening during waterproofing adhesive application or use, ensuring the reliability of the encapsulation structure. Attached Figure Description

[0024] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0025] In the attached diagram:

[0026] Figure 1 This is a schematic diagram of the main appearance of this utility model;

[0027] Figure 2 This is a schematic diagram of the exploded front view of this utility model;

[0028] Figure 3 This is a schematic diagram of the exploded structure of this utility model from a bottom view;

[0029] Figure 4 This is a schematic diagram of the front half-section structure of this utility model.

[0030] The attached diagram lists the components represented by each number as follows:

[0031] 1. Outer shell; 101. Glue injection port; 2. PCB board; 201. Sensor; 202. Limit block; 203. Card block; 204. Chip; 3. Dam body; 301. Card slot. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1 to 4 As shown, the embodiments provided by this utility model are as follows:

[0034] Example 1

[0035] A waterproof LGA package for a pressure sensor includes a PCB board 2, on which a sensor 201 and a chip 204 are mounted. A dam body 3 is mounted on the PCB board 2, with both the sensor 201 and the chip 204 located inside the dam body 3. A housing 1 is mounted on the outside of the dam body 3 on the PCB board 2. The housing 1 has a glue inlet 101 for injecting waterproof glue into the housing 1. The glue inlet 101 provides a precise injection channel for the waterproof glue, allowing operators to directly deliver the glue to the target area inside the housing 1 using glue injection equipment, reducing glue waste and contamination in non-sealed spaces. Simultaneously, the position of the glue inlet 101 is designed to fit the gap distribution between the housing 1, the dam body 3, and the components, facilitating the full filling of gaps using the glue's own fluidity and injection pressure. Waterproof glue is injected into the gaps between the housing 1 and the dam body 3, and between the dam body 3 and the sensor 201 and the chip 204, thus filling the critical gaps of the double-layer protective structure. The adhesive layer between the outer shell 1 and the dam body 3 forms an external waterproof buffer zone, effectively dispersing external water pressure and water flow impact. The adhesive layer between the dam body 3 and the components isolates moisture, liquids, and electronic components from direct contact, preventing short circuits, component corrosion, and other malfunctions caused by moisture intrusion. This comprehensive sealing design combines physical protection with deep chemical sealing, significantly improving the adaptability and reliability of the pressure sensor 201 in harsh environments such as high humidity and underwater conditions, and extending the product's service life.

[0036] Example 2

[0037] To further improve the installation accuracy and structural stability of the waterproof LGA package for pressure sensors, for example, such as... Figures 1 to 4As shown, this utility model also includes: a locking block 203 on the PCB board 2, the locking blocks 203 being distributed in a rectangular array on the PCB board 2, which limits the installation position of the dam body 3. The locking blocks 203 are equipped with limiting blocks 202. Through the rectangular array of locking blocks 203, a multi-dimensional limiting reference can be formed on the PCB board, allowing the dam body 3 to quickly align with the preset position during installation, effectively avoiding offset problems caused by manual operation or equipment errors, and significantly improving assembly efficiency. The setting of the limiting blocks 202 further enhances the positioning accuracy, ensuring... The constant relative position between the dam body 3 and the PCB board creates stable conditions for the uniform injection of waterproof adhesive, preventing the risk of seal failure due to positional deviation. The dam body 3 has a slot 301, and is mounted on the PCB board 2 by a locking block 203. The dam body 3 is also secured to the PCB board 2 by the interlocking of the slot 301 and the limiting block 202 of the locking block 203. This interlocking design mechanically locks the dam body 3 to the PCB board, significantly improving the stability of the connection compared to a simple limiting structure. During the waterproof adhesive injection process, the interlocking structure can withstand the pressure generated by the adhesive flow, preventing displacement of the dam body 3. During the sensor 201 usage phase, this structure can resist external vibrations and impacts, preventing the dam body 3 from loosening and ensuring the double-layer protective structure remains intact, guaranteeing long-term stability of the waterproof performance.

[0038] Working principle:

[0039] The pressure sensor 201 and the signal processing chip 204 are soldered to designated locations on the PCB board to complete the circuit connection. The pressure sensor 201 is responsible for sensing changes in external pressure and converting the physical pressure signal into an electrical signal; the signal processing chip 204 amplifies, filters, and performs other preprocessing on the electrical signal output by the sensor 201 to ensure the stability and accuracy of the signal. The two form a complete signal transmission link through the conductive lines on the PCB board.

[0040] The dam body 3 is positioned using rectangular array locking blocks 203 on the PCB board, ensuring precise engagement between the locking slot 301 of the dam body 3 and the limiting block 202 on the locking block 203, thus achieving mechanical fixation. The combination of locking block 203 and limiting block 202 forms a mechanical limiting structure, physically limiting the installation position of the dam body 3 and preventing displacement during subsequent processes. This design utilizes geometric fit to achieve precise positioning, ensuring a closed containment space between the dam body 3 and the PCB board, providing a stable boundary for subsequent waterproofing adhesive application.

[0041] An outer shell 1 is installed on the outside of the dam body 3, with the glue injection port 101 on the outer shell 1 aligned with the gap area between the dam body 3 and the outer shell 1. The outer shell 1 serves as an external protective structure, forming a double-layer protective system with the dam body 3. The position design of the glue injection port 101 ensures that waterproof glue can be injected under pressure into the gap between the outer shell 1 and the dam body 3, as well as into the gaps around the sensor 201 and chip 204 inside the dam body 3, providing a channel for subsequent sealing.

[0042] Waterproof adhesive is injected into the housing 1, the gap between the housing 1 and the dam body 3, and the gaps between components within the dam body 3 through the injection port 101. After the adhesive cures, a sealing layer is formed. The waterproof adhesive is fluid and can fill all gaps after injection, forming an elastic seal after curing. Its core function is to isolate external moisture and humidity, preventing liquid from seeping into the PCB board and component surfaces. The double-layer structure of the dam body 3 and the housing 1, combined with the waterproof adhesive, forms a composite waterproof system of physical barrier and chemical seal: the dam body 3 first reduces the liquid penetration path through mechanical limiting, and the waterproof adhesive fills the remaining gaps, achieving a full-coverage seal and ensuring that the pressure sensor 201 can work normally in humid or underwater environments.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A waterproof LGA package for a pressure sensor, comprising a PCB board (2), wherein a sensor (201) and a chip (204) are mounted on the PCB board (2), characterized in that: The PCB board (2) is equipped with a dam body (3), and the sensor (201) and chip (204) are both located inside the dam body (3). A housing (1) is installed on the outside of the dam body (3) on the PCB board (2), and the housing (1) has an injection port (101). The PCB board (2) is provided with a locking block (203), which is distributed in a rectangular array on the PCB board (2). The locking block (203) limits the installation position of the dam body (3). The locking block (203) is provided with a limiting block (204). 2) A slot (301) is provided inside the dam body (3). The dam body (3) is installed on the PCB board (2) by a limiting block (203). The dam body (3) is fixed on the PCB board (2) by the slot (301) and the limiting block (202) of the limiting block (203). The glue injection port (101) is used to inject waterproof glue into the shell (1). The gap between the shell (1) and the dam body (3), and the gap between the dam body (3) and the sensor (201) and the chip (204) are filled with waterproof glue.

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