Positioning and clamping device for wear-resistant thinning and scribing processing

Abstract

The utility model relates to the field of thinning and scribing process technology, especially to a positioning and clamping device for anti-abrasion thinning and scribing processing, technical problem: at present, when thinning and scribing processing is carried out, the disposable fixing mode is used for wafer, which is not cost-saving, and the existing mechanical clamping device cannot position the clamped wafer, affecting processing, technical scheme: a positioning and clamping device for anti-abrasion thinning and scribing processing, comprising a mounting seat, a supporting assembly, a fixing assembly, a mounting assembly, a positioning assembly and a driving assembly, compared with the current disposable fixing mode for wafer when thinning and scribing processing is carried out, the existing mechanical clamping device cannot position the clamped wafer, affecting processing, the device can position and clamp the wafer through the setting of the mold capable of being quickly disassembled, cooperate with the vacuum fixing device to fix the wafer, meet the processing demand, and the mold plate can be repeatedly used, saving cost.

Description

Technical Field

[0001] This utility model relates to the field of thinning and dicing process technology, and in particular to a wear-resistant positioning and clamping device for thinning and dicing processing. Background Technology

[0002] Thinning and dicing is an important process in semiconductor chip manufacturing. Thinning refers to reducing the thickness of a wafer through grinding to meet specific design requirements. Dicing refers to dividing the thinned wafer into multiple independent chips for subsequent packaging and use. During wafer processing, the wafer needs to be positioned and fixed to facilitate processing. For wafers undergoing thinning and dicing, wax or special adhesives are usually used to fix the wafer in the working area. This method of fixing is a one-time process and is not cost-effective.

[0003] The utility model patent with patent number CN217468380U discloses a non-destructive clamping device for ultra-thin wafer thinning. This device adjusts the length of the extension block extending from the support column by driving a connecting rod through a DC electric telescopic rod two, depending on the different diameters of the placed wafer cylinder. The DC electric telescopic rod one drives the clamping block to fix the wafer cylinder, which facilitates the thinning process. Furthermore, a small screw can drive the threaded column to rise slowly, allowing the wafer cylinder placed on the support column fixedly connected to the top of the threaded column to have its lifting distance finely adjusted, which is convenient for grinding the wafer cylinder extending from the fixed clamp. However, this device cannot position the wafer placed on the support column and the extension block, thus affecting the subsequent processing effect of the wafer. Utility Model Content

[0004] To overcome the current problem that using one-time waxing or adhesive to fix wafers during thinning and dicing is not cost-effective, existing wafer mechanical clamping devices cannot position the clamped wafers, thus affecting processing.

[0005] The technical solution of this utility model is as follows: a wear-resistant positioning and clamping device for thinning and dicing processing, including a mounting base; it also includes a support component, a fixing component, a mounting component, a positioning component, a driving component, and a wafer. The support component is disposed above the mounting base, the fixing component is disposed above the support component, the wafer is disposed above the fixing component, the mounting component is disposed above the mounting base and is located around the support component, the positioning component is disposed above the mounting component, and the driving component penetrates through the mounting base and is disposed below the support component. The mounting assembly includes a DC electric telescopic rod, a mounting plate, and positioning holes. Multiple sets of DC electric telescopic rods are fixed to the upper end of the mounting base. The DC electric telescopic rods are located on the periphery of the support assembly. The output end of the DC electric telescopic rod is fixed to the mounting plate. Multiple sets of positioning holes are opened through the upper end of the mounting plate. The positioning assembly includes positioning rods, notch templates, and ceramic rings. The notch template is located on the top of the mounting plate. Multiple sets of positioning rods are fixed to the lower end of the notch template. The positions of the positioning rods correspond one-to-one with the positions of the positioning holes, and the positioning rods and positioning holes engage with each other. Ceramic rings are fixed to the notch sidewalls of the notch template.

[0006] Preferably, a support component is used to support the fixing component and the wafer, a fixing component is used to fix the wafer to prevent it from moving during processing, an installation component is used to install the positioning component to facilitate quick disassembly and installation of the positioning component, a positioning component is used to position the wafer, and a drive component is used to drive the wafer to rotate, thereby cooperating with the thinning and dicing processing steps.

[0007] Preferably, the support assembly includes a fixed bracket, a rotating bracket, and a support rod. The fixed bracket is fixedly connected to the upper end of the mounting base, the rotating bracket is rotatably mounted on the fixed bracket, and the support rod is fixedly connected to the upper end of the rotating bracket. The fixed bracket supports and mounts the rotating bracket, and the rotating bracket can rotate on the fixed bracket when the drive assembly provides power, thereby driving the wafer to rotate. The support rod supports and mounts the fixed assembly.

[0008] Preferably, the fixing component includes an adsorption plate and a latex pad. The upper end of the support rod is fixedly connected to the adsorption plate, and the upper end of the adsorption plate is fixedly connected to the latex pad. The wafer is placed and fixed by the adsorption plate. The latex pad can improve the airtightness between the wafer and the adsorption plate and prevent the wafer from rigidly contacting the adsorption plate, thus protecting the wafer.

[0009] Preferably, the fixing assembly also includes a vacuum pump and a connecting pipe. The upper end of the rotating bracket is fixedly connected to a vacuum pump that is symmetrical about the center point of the rotating bracket. The output end of the vacuum pump is fixedly connected to a connecting pipe, and the other end of the connecting pipe is connected to the adsorption disk. By setting the vacuum pump to provide negative pressure to the adsorption disk through the connecting pipe, the wafer is fixed above the adsorption disk under the action of air pressure.

[0010] Preferably, the drive assembly includes a motor and a rotating shaft. The motor is fixedly connected to the lower end of the mounting base, and the output end of the motor is fixedly connected to the rotating shaft that passes through the mounting base. The other end of the rotating shaft is fixedly connected to the lower end of the rotating bracket. By setting the motor to drive the rotating shaft to rotate, the rotating bracket is driven to rotate on the fixed bracket, thereby driving the wafer above to rotate to cooperate with the processing work.

[0011] Preferably, a controller is fixedly connected to the side wall of the mounting base, and a Hall sensor is fixedly connected to the inner wall of the DC electric telescopic rod. The DC electric telescopic rod and the Hall sensor are electrically connected to the controller. Multiple sets of DC electric telescopic rod controller circuits are connected in parallel to ensure that the input voltage and control signal are completely consistent. The telescopic height of the DC electric telescopic rod can be fed back in real time through the Hall sensor.

[0012] Preferably, the adsorption plate has a hollow structure inside, with a through hole at the top of the latex pad and a round hole at the top of the adsorption plate. The round hole, the hollow structure inside the adsorption plate, and the connecting tube are interconnected, allowing for rapid establishment of strong adsorption force during use.

[0013] The beneficial effects of this utility model are: 1. Compared to the current method of using a one-time fixing method for wafers during thinning and dicing, which is not cost-effective and existing mechanical clamping devices cannot position the clamped wafers, affecting processing; this device uses a mold that can be quickly assembled and disassembled to position and clamp the wafers, and works with a vacuum fixing device to fix the wafers, meeting processing requirements. Moreover, the mold can be reused, saving costs. 2. By cooperating with the positioning rod and positioning hole, the notch template is quickly installed on the mounting plate, which facilitates the replacement of notch templates according to wafers of different sizes. The notch template is used to position and clamp the wafer. The ceramic ring contacts the wafer to prevent the wafer and the notch template from rubbing against each other and causing wafer wear. The DC electric telescopic rod and Hall sensor are electrically connected to the controller. The controller circuits of multiple DC electric telescopic rods are connected in parallel. The controller controls multiple DC electric telescopic rods to descend synchronously and slowly during the processing, which facilitates the exposure of the wafer for thinning work. 3. The vacuum pump provides negative pressure to the adsorption disk through the hollow structure inside the circular hole and the connecting pipe, so that the wafer is fixed above the adsorption disk under the action of air pressure. By installing a latex pad on the surface of the adsorption box, the airtightness between the wafer and the adsorption disk can be improved, making the wafer more firmly adsorbed. On the other hand, it can prevent the wafer from rigidly contacting the adsorption disk and protect the wafer. Attached Figure Description

[0014] Figure 1 The diagram shown is a first three-dimensional structural schematic of the anti-wear thinning dicing positioning and clamping device of this utility model. Figure 2 The diagram shown is a three-dimensional cross-sectional view of the anti-wear positioning and clamping device for thinning and scribing of the present invention. Figure 3 The diagram shown is a three-dimensional structural schematic of the fixing component of the anti-wear thinning dicing positioning and clamping device of this utility model. Figure 4The diagram shown is an exploded three-dimensional structural schematic of the wear-resistant, thinning, dicing positioning and clamping device of this utility model. Figure 5 The diagram shown is a cross-sectional view of the DC electric telescopic rod of the anti-wear thinning dicing positioning and clamping device of this utility model.

[0015] Explanation of reference numerals in the attached drawings: 1. Mounting base; 2. Support assembly; 3. Fixing assembly; 4. Mounting assembly; 5. Positioning assembly; 6. Drive assembly; 7. Wafer; 8. Controller; 9. Hall sensor; 201. Fixed bracket; 202. Rotating bracket; 203. Support rod; 301. Adsorption plate; 302. Latex pad; 303. Vacuum pump; 304. Connecting pipe; 305. Through hole; 306. Round hole; 401. DC electric telescopic rod; 402. Mounting plate; 403. Positioning hole; 501. Positioning rod; 502. Notched template; 503. Ceramic ring; 601. Motor; 602. Rotating shaft. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Please see Figure 1-4 This utility model provides an embodiment: a wear-resistant positioning and clamping device for thinning and dicing processing, including a mounting base 1; it also includes a support component 2, a fixing component 3, a mounting component 4, a positioning component 5, a driving component 6, and a wafer 7. The support component 2 is disposed above the mounting base 1, the fixing component 3 is disposed above the support component 2, the wafer 7 is disposed above the fixing component 3, the mounting component 4 is disposed above the mounting base 1 and is located around the support component 2, the positioning component 5 is disposed above the mounting component 4, and the driving component 6 penetrates the mounting base 1 and is disposed below the support component 2. Mounting assembly 4 includes a DC electric telescopic rod 401, a mounting plate 402, and positioning holes 403. Multiple sets of DC electric telescopic rods 401 are fixedly connected to the upper end of the mounting base 1. The DC electric telescopic rods 401 are located on the periphery of the support assembly 2. The output end of the DC electric telescopic rod 401 is fixedly connected to the mounting plate 402. Multiple sets of positioning holes 403 are opened through the upper end of the mounting plate 402. The positioning component 5 includes a positioning rod 501, a notch template 502, and a ceramic ring 503. The notch template 502 is provided on the upper part of the mounting plate 402. Multiple sets of positioning rods 501 are fixedly connected to the lower end of the notch template 502. The positions of the positioning rods 501 correspond one-to-one with the positions of the positioning holes 403, and the positioning rods 501 pass through the positioning holes 403 and engage with each other. The ceramic ring 503 is fixedly connected to the notch side wall of the notch template 502. In use, the positioning component 5 can be installed on the mounting plate 402 by setting the positioning hole 403. The mounting plate 402 can be raised and lowered by setting the DC electric telescopic rod 401, thereby raising and lowering the positioning component 5. By setting the positioning rod 501 and the positioning hole 403 to cooperate, the notch template 502 can be quickly installed on the mounting plate 402, which makes it convenient to replace the notch template 502 according to different sizes of wafers 7. The notch template 502 is used to position and clamp the wafer 7. The ceramic ring 503 is in contact with the wafer 7 to prevent the wafer 7 and the notch template 502 from rubbing against each other and causing the wafer 7 to wear. Please see Figure 2 In this embodiment, the support assembly 2 includes a fixed bracket 201, a rotating bracket 202, and a support rod 203. The fixed bracket 201 is fixedly connected to the upper end of the mounting base 1, and the rotating bracket 202 is rotatably mounted on the fixed bracket 201. The support rod 203 is fixedly connected to the upper end of the rotating bracket 202. By setting the fixed bracket 201 to support and mount the rotating bracket 202, the rotating bracket 202 can rotate on the fixed bracket 201 when the drive assembly 6 provides power, thereby driving the wafer 7 to rotate. Support rod 203 is provided to support and install the fixed component 3; drive component 6 includes motor 601 and rotating shaft 602. Motor 601 is fixedly installed below mounting base 1, and rotating shaft 602 passes through mounting base 1. One end of rotating shaft 602 is fixedly connected to the output end of motor 601, and the other end of rotating shaft 602 is fixedly connected to rotating bracket 202; by setting motor 601 to drive rotating shaft 602 to rotate, rotating bracket 202 is driven to rotate on fixed bracket 201, thereby driving the upper wafer 7 to rotate to cooperate with processing work; Please see Figure 3-4In this embodiment, the fixing component 3 includes an adsorption disk 301, a latex pad 302, a vacuum pump 303, and a connecting pipe 304. The upper end of the support rod 203 is fixedly connected to the adsorption disk 301, and the upper end of the adsorption disk 301 is fixedly connected to the latex pad 302. The wafer 7 is placed by setting the adsorption disk 301. The upper end of the rotating bracket 202 is fixedly connected to the vacuum pump 303, which is symmetrical about the center point of the rotating bracket 202. The output end of the vacuum pump 303 is fixedly connected to the connecting pipe 304, and the other end of the connecting pipe 304 is connected to the adsorption disk 301. The adsorption disk 301 has a hollow structure inside, and the upper end of the latex pad 302 is open through it. A through hole 305 is provided, and a circular hole 306 is provided at the upper end of the adsorption disk 301. The circular hole 306, the hollow structure, and the connecting pipe 304 are interconnected. The through hole 305 is located in the middle of the upper end of the latex pad 302, and the circular hole 306 is located in the middle of the upper end of the adsorption disk. By setting the latex pad 302, the airtightness between the wafer 7 and the adsorption disk 301 can be improved, and the rigid contact between the wafer 7 and the adsorption disk 301 can be prevented, thus protecting the wafer 7. By setting the vacuum pump 303 and the connecting pipe 304, negative pressure is provided to the adsorption disk 301, so that the wafer 7 is fixed on the latex pad 302 at the upper end of the adsorption disk 301 under the action of air pressure. Please see Figure 4-5 In this embodiment, a controller 8 is fixedly connected to the side wall of the mounting base 1, and Hall sensors 9 are fixedly connected to the inner wall of multiple sets of DC electric telescopic rods 401. The DC electric telescopic rods 401 and Hall sensors 9 are electrically connected to the controller 8. The multiple sets of DC electric telescopic rods 401 are connected to the controller 8 through a parallel circuit to ensure that the input voltage and control signal are completely consistent. The telescopic height of the DC electric telescopic rods 401 can be fed back in real time through the Hall sensors 9. During operation, the positioning rod 501 and the positioning hole 403 engage with each other, and the appropriate notch template 502 is quickly installed according to the size of the wafer 7 being processed. Multiple sets of DC electric telescopic rods 401 are connected in parallel to the controller 8 to ensure that the input voltage and control signal are completely consistent. The extension height of the DC electric telescopic rods 401 can be fed back in real time through the Hall sensor 9. The DC electric telescopic rods 401 drive the notch template 502 to rise and fall, so that the notch template 502 is level with the adsorption plate 301. The wafer 7 is placed on the adsorption plate 301 through the notch template 502, thereby achieving the positioning of the wafer 7. The latex pad 302 can improve the airtightness between the wafer 7 and the adsorption plate 301 on the one hand, and prevent the wafer 7 from rigidly contacting the adsorption plate 301 on the other hand, thus protecting the wafer 7. A ceramic ring 503 is installed on the notch side wall of the notch template 502 to contact the wafer 7, reduce friction, and prevent the wafer 7 from being worn during the processing. The adsorption disk 301 has a hollow structure inside, and the upper end of the latex pad 302 has a through hole 305. The upper end of the adsorption disk 301 has a round hole 306. The round hole 306, the hollow structure and the connecting pipe 304 are interconnected. The vacuum pump 303 and the connecting pipe 304 provide negative pressure to the adsorption disk 301, so that the wafer 7 is firmly adsorbed and fixed above the adsorption disk 301. The ceramic ring 503 contacts the side wall of the wafer 7 and also plays a clamping role on the side of the wafer 7. The DC electric telescopic rod 401 can slowly descend during the processing to expose the wafer 7 little by little for thinning work. The motor 601 drives the rotating shaft 602 to rotate, which in turn drives the rotating bracket 202 to rotate through the fixed bracket 201, thereby causing the wafer 7 fixed on the adsorption plate to rotate, in conjunction with the thinning and dicing processes.

[0018] Through the above steps, the support component 2 supports the fixing component 3 and the wafer 7, the fixing component 3 fixes the wafer 7 to prevent the wafer 7 from moving during the processing, the mounting component 4 installs the positioning component 5 to facilitate quick disassembly and installation of the positioning component 5, the positioning component 5 positions the wafer 7, and the drive component 6 can drive the wafer 7 to rotate, thereby cooperating with the thinning and dicing processing steps.

[0019] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A wear-resistant positioning and clamping device for thinning and dicing sheet processing, comprising a mounting base (1); characterized in that: It also includes a support component (2), a fixing component (3), a mounting component (4), a positioning component (5), a driving component (6), and a wafer (7). The support component (2) is located above the mounting base (1), the fixing component (3) is located above the support component (2), the wafer (7) is located above the fixing component (3), the mounting component (4) is located above the mounting base (1) and is situated around the support component (2), the positioning component (5) is located above the mounting component (4), and the driving component (6) penetrates the mounting base (1) and is located below the support component (2). The mounting assembly (4) includes a DC electric telescopic rod (401), a mounting plate (402) and positioning holes (403). Multiple sets of DC electric telescopic rods (401) are fixedly connected to the upper end of the mounting base (1). The DC electric telescopic rods (401) are located on the periphery of the support assembly (2). The output end of the DC electric telescopic rods (401) is fixedly connected to the mounting plate (402). Multiple sets of positioning holes (403) are opened through the upper end of the mounting plate (402). The positioning component (5) includes a positioning rod (501), a notch template (502) and a ceramic ring (503). The notch template (502) is provided on the upper part of the mounting plate (402). Multiple sets of positioning rods (501) are fixed to the lower end of the notch template (502). The position of the positioning rod (501) corresponds to the position of the positioning hole (403) one by one, and the positioning rod (501) and the positioning hole (403) are engaged with each other. The ceramic ring (503) is fixed to the notch side wall of the notch template (502).

2. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 1, characterized in that: The support assembly (2) includes a fixed bracket (201), a rotating bracket (202) and a support rod (203). The fixed bracket (201) is fixedly connected to the upper end of the mounting base (1). The rotating bracket (202) is rotatably mounted on the fixed bracket (201). The support rod (203) is fixedly connected to the upper end of the rotating bracket (202).

3. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 2, characterized in that: The fixing component (3) includes an adsorption plate (301) and a latex pad (302). The upper end of the support rod (203) is fixed with the adsorption plate (301) and the upper end of the adsorption plate (301) is fixed with the latex pad (302).

4. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 3, characterized in that: The fixed assembly (3) also includes a vacuum pump (303) and a connecting pipe (304). The upper end of the rotating bracket (202) is fixedly connected to a vacuum pump (303) that is symmetrical about the center point of the rotating bracket (202). The output end of the vacuum pump (303) is fixedly connected to the connecting pipe (304), and the other end of the connecting pipe (304) is connected to the adsorption plate (301).

5. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 2, characterized in that: The drive assembly (6) includes a motor (601) and a rotating shaft (602). The motor (601) is fixedly connected to the lower end of the mounting base (1). The output end of the motor (601) is fixedly connected to the rotating shaft (602) that passes through the mounting base (1). The other end of the rotating shaft (602) is fixedly connected to the lower end of the rotating bracket (202).

6. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 1, characterized in that: The side wall of the mounting base (1) is fixed with a controller (8), and the inner wall of the DC electric telescopic rod (401) is fixed with a Hall sensor (9). The DC electric telescopic rod (401) and the Hall sensor (9) are electrically connected to the controller (8).

7. The anti-wear positioning and clamping device for thinning and scribing processing according to claim 4, characterized in that: The adsorption plate (301) has a hollow structure inside. The upper end of the latex pad (302) has a through hole (305) and the upper end of the adsorption plate (301) has a round hole (306). The round hole (306), the adsorption plate (301) has a hollow structure inside and a connecting pipe (304) are interconnected.

Images