High-efficiency heat dissipation metal substrate

Abstract

The utility model belongs to metal base plate technical field especially, it is a kind of high -efficient heat dissipation metal base plate more particularly, including the substrate plate, reinforcing heat conduction plate and circuit board that are sequentially arranged from below to above along vertical direction, three are through hot-pressing and constitute composite multilayer structure;Substrate plate, its material is aluminium alloy, its inside evenly distributed with multiple miniature heat dissipation channels, the both ends of miniature heat dissipation channel are respectively set in the upper and lower surface of substrate plate;Reinforcing heat conduction plate, its material is the mixed material of graphene and copper, the inside of reinforcing heat conduction plate evenly has multiple vertical through holes, each vertical through hole is fixed with columnar heat conduction piece, and the material of columnar heat conduction piece is silicon carbide.The utility model has the advantage of fast heat conduction, avoids local heat gathering, and compared with traditional base plate heat dissipation efficiency has remarkable promotion.

Description

Technical Field

[0001] This utility model belongs to the field of metal substrate technology, and in particular relates to a high-efficiency heat dissipation metal substrate. Background Technology

[0002] With the advancement of technology, the development trend of various electronic products is constantly evolving towards being lighter, thinner, shorter, and smaller. As the core component that carries circuits and dissipates heat, the heat dissipation performance of metal substrates directly affects the operational stability and service life of the equipment.

[0003] Chinese utility model patent CN207011074U discloses a high-efficiency heat-dissipating metal substrate. This technology solves the problem of insufficient installation strength in traditional surface mount processes, which can only be used for soldering. The technology has a simple structure and achieves heat dissipation while meeting the interconnection requirements of multilayer circuit boards. Although the aforementioned prior art provides a better mounting structure, it is similar to most existing metal substrates on the market, often using a single material such as aluminum or copper alloy, relying solely on its own heat conduction for heat dissipation. Under high-power operating conditions, heat accumulation on the substrate is likely to occur, and its heat dissipation performance needs further improvement.

[0004] Therefore, there is an urgent need to improve existing metal substrates and provide a more efficient heat dissipation metal substrate that can dissipate heat faster. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a reasonably designed, simple, and faster heat dissipation high-efficiency heat dissipation metal substrate, thereby solving the problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A high-efficiency heat dissipation metal substrate includes a base plate, a heat-conducting plate and a circuit board arranged sequentially from bottom to top in a vertical direction, and the three are hot-pressed to form a composite multilayer structure. The substrate is made of aluminum alloy and has multiple micro heat dissipation channels evenly distributed inside it. The two ends of the micro heat dissipation channels are respectively opened on the upper and lower surfaces of the substrate. The enhanced heat-conducting plate is made of a mixture of graphene and copper. The interior of the enhanced heat-conducting plate has multiple vertical through holes evenly distributed. Each vertical through hole is fixed with a columnar heat-conducting component, which is made of silicon carbide. The circuit board is made of copper foil. Circuit lines are etched on the upper surface of the circuit board, and several thermally conductive pads corresponding to the columnar thermal conductive elements are fixedly arranged inside it. The thermally conductive pads are fixedly connected to the top of the corresponding columnar thermal conductive elements.

[0007] Preferably, the micro heat dissipation channel has a regular hexagonal cross-section, and the inner wall of the micro heat dissipation channel is roughened.

[0008] Preferably, the upper surface of the substrate is provided with an insulating layer, which is formed and attached to the surface of the substrate by a plasma spraying process.

[0009] Preferably, the insulating layer is any one of the following: a nano-ceramic coating, an organosilicon resin coating, and an epoxy ceramic composite coating.

[0010] Preferably, the upper surface of the enhanced heat-conducting plate is provided with a transition layer, which is a zinc-nickel alloy coating formed and attached to the surface of the enhanced heat-conducting plate by an electrodeposition process.

[0011] Preferably, the base plate is provided with heat dissipation fins on the side opposite to the enhanced heat-conducting plate, and a plurality of heat dissipation fins are distributed at equal intervals along the length of the base plate.

[0012] Preferably, the heat dissipation fins are made of any one of pure copper, copper-aluminum alloy, and copper-nickel alloy, and the heat dissipation fins are arranged at an angle.

[0013] Compared with the prior art, the present invention has the following beneficial effects: In this invention, the micro heat dissipation channels inside the substrate are hexagonal, which increases the contact area with air fluid, thereby improving heat exchange efficiency. The roughening treatment of the inner wall of the channel increases the heat radiation area, which helps to improve heat dissipation capacity. The combination of the two can significantly enhance the heat dissipation capacity of the substrate. At the same time, with the cooperation of the columnar heat-conducting component made of silicon carbide, a multi-level heat dissipation path can be formed, which passes through the circuit board, heat-conducting pads, columnar heat-conducting component, reinforced heat-conducting plate, substrate, micro heat dissipation channels and heat dissipation fins in sequence. The heat dissipation speed is fast, and the micro heat dissipation channels and columnar heat-conducting components correspond one-to-one and are aligned with each other, which has the advantage of rapid heat conduction and avoids local heat accumulation. Compared with traditional substrates, the heat dissipation efficiency is significantly improved.

[0014] The transition layer of this invention uses a common zinc-nickel alloy coating with good thermal conductivity. While ensuring good thermal conductivity, it reduces material costs. Moreover, the zinc-nickel alloy coating is formed by electrodeposition and has excellent corrosion resistance, which helps to extend the overall service life of the metal substrate. The metal substrate can effectively transfer heat and achieve efficient heat dissipation. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings are described as follows: Figure 1 This is a frontal cross-sectional view of the present invention. Figure 2 This is a schematic diagram of the three-dimensional structure of the base plate of this utility model; Figure 3 This is a schematic diagram of the three-dimensional structure of the enhanced heat-conducting plate of this utility model.

[0016] In the picture: 1. Base plate; 2. Micro heat dissipation channel; 3. Insulating layer; 4. Reinforced heat conduction plate; 5. Columnar heat conduction component; 6. Transition layer; 7. Circuit board; 8. Heat dissipation fins. Detailed Implementation

[0017] The embodiments described below are merely some embodiments of the present invention and do not represent all embodiments consistent with the present invention. Exemplary embodiments will now be described with reference to the accompanying drawings: like Figure 1-3 As shown in one example, the high-efficiency heat dissipation metal substrate of this utility model includes a base plate 1, a heat-conducting plate 4 and a circuit board 7 arranged sequentially from bottom to top in a vertical direction. The three components are hot-pressed to form a composite multilayer structure. The base plate 1 is made of aluminum alloy and has multiple micro heat dissipation channels 2 evenly distributed inside it. The two ends of the micro heat dissipation channels 2 are respectively opened on the upper and lower surfaces of the base plate 1. The enhanced heat-conducting plate 4 is made of a mixture of graphene and copper. Multiple vertical through holes are evenly opened inside the enhanced heat-conducting plate 4. A columnar heat-conducting component 5 is fixed in each vertical through hole. The columnar heat-conducting component 5 is made of silicon carbide. The circuit board 7 is made of copper foil. Circuit lines are etched on the upper surface of the circuit board 7, and several thermally conductive pads corresponding to the columnar thermal conductive parts 5 are fixedly arranged inside it. The thermally conductive pads are fixedly connected to the top of the corresponding columnar thermal conductive parts 5.

[0018] As a preferred embodiment, based on the above structure, the cross-section of the micro heat dissipation channel 2 is a regular hexagonal structure, and the inner wall of the micro heat dissipation channel 2 is roughened.

[0019] In this embodiment, the micro heat dissipation channel 2 with a regular hexagonal structure and roughened inner wall can increase the contact area with air fluid and the heat radiation area, thereby playing a role in assisting to improve heat dissipation capacity.

[0020] As a preferred embodiment, based on the above structure, the upper surface of the substrate 1 is provided with an insulating layer 3, which is formed and attached to the surface of the substrate 1 by a plasma spraying process.

[0021] As a preferred embodiment, based on the above structure, the insulating layer 3 is further comprising any one of a nano-ceramic coating, an organosilicon resin coating, and an epoxy ceramic composite coating.

[0022] In this embodiment, the weather resistance of the insulating layer 3 of the nano-ceramic coating material enables it to work stably in harsh environments such as humid and dusty conditions.

[0023] As a preferred embodiment, based on the above structure, the upper surface of the enhanced heat-conducting plate 4 is further provided with a transition layer 6, which is a zinc-nickel alloy coating formed and attached to the surface of the enhanced heat-conducting plate 4 by an electrodeposition process.

[0024] In this embodiment, the transition layer 6, made of zinc-nickel alloy coating material, has excellent corrosion resistance, which helps to extend the overall service life of the metal substrate.

[0025] As a preferred embodiment, based on the above structure, a heat dissipation fin 8 is fixedly provided on the side of the base plate 1 away from the reinforcing heat-conducting plate 4, and a plurality of heat dissipation fins 8 are distributed at equal intervals along the length direction of the base plate 1.

[0026] As a preferred embodiment, based on the above structure, the heat dissipation fins 8 are made of any one of pure copper, copper-aluminum alloy, and copper-nickel alloy, and the heat dissipation fins 8 are arranged in an inclined state.

[0027] In this embodiment, the heat dissipation fins 8 enable rapid heat dissipation and dissipation, which can further improve the heat dissipation efficiency of the metal substrate.

[0028] The working principle of this utility model is as follows: During the use of this metal substrate, heat can be transferred through the thermally conductive pads inside the circuit board 7 and the columnar thermally conductive element 5 made of silicon carbide. This forms a multi-level heat dissipation path that passes sequentially through the circuit board 7, thermally conductive pads, columnar thermally conductive element 5, reinforced thermally conductive plate 4, base plate 1, micro heat dissipation channel 2, and heat dissipation fins 8. Moreover, the micro heat dissipation channel 2 corresponds to and is aligned with the columnar thermally conductive element 5, which has the advantage of rapid heat conduction and avoids local heat accumulation. At the same time, the cross-section of the micro heat dissipation channel 2 is a regular hexagon, which can increase the contact area with the air fluid, thereby improving the heat exchange efficiency. The roughening treatment of the inner wall of the micro heat dissipation channel 2 can increase the heat radiation area and further improve the heat dissipation capacity. The combination of the two can significantly enhance the heat dissipation capacity of the base plate 1. Compared with traditional substrates, the heat dissipation efficiency of this metal substrate is significantly improved. The insulating layer 3 of the nano-ceramic coating material in this metal substrate has good weather resistance, which enables it to work stably in harsh environments such as humidity and dust. The transition layer 6 adopts a common zinc-nickel alloy coating with good thermal conductivity, which reduces material costs while ensuring good thermal conductivity. Moreover, it has excellent corrosion resistance, which helps to extend the overall service life of this metal substrate.

[0029] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any equivalent changes, modifications, substitutions, and variations made by those skilled in the art based on the concept of this utility model and on the basis of existing technology through logical analysis, reasoning, or limited experiments shall be within the scope of protection defined by the claims.

Claims

1. A high-efficiency heat dissipation metal substrate, characterized in that, The structure includes a base plate (1), a heat-conducting plate (4), and a circuit board (7) arranged vertically from bottom to top, which are combined to form a composite multilayer structure by hot pressing. The base plate (1) is made of aluminum alloy and has multiple micro heat dissipation channels (2) evenly distributed inside. The two ends of the micro heat dissipation channels (2) are respectively opened on the upper and lower surfaces of the base plate (1). The enhanced heat-conducting plate (4) is made of a mixture of graphene and copper. Multiple vertical through holes are uniformly opened inside the enhanced heat-conducting plate (4). A columnar heat-conducting component (5) is fixed in each vertical through hole. The columnar heat-conducting component (5) is made of silicon carbide. The circuit board (7) is made of copper foil. The upper surface of the circuit board (7) is etched with circuit lines, and a number of heat-conducting pads corresponding to the columnar heat-conducting components (5) are fixedly arranged inside it. The heat-conducting pads are fixedly connected to the top of the corresponding columnar heat-conducting components (5).

2. The high-efficiency heat dissipation metal substrate according to claim 1, characterized in that: The micro heat dissipation channel (2) has a regular hexagonal cross section, and the inner wall of the micro heat dissipation channel (2) is roughened.

3. The high-efficiency heat dissipation metal substrate according to claim 1, characterized in that: The upper surface of the substrate (1) is provided with an insulating layer (3), which is formed by plasma spraying and attached to the surface of the substrate (1).

4. The high-efficiency heat dissipation metal substrate according to claim 3, characterized in that: The insulating layer (3) is any one of the following: nano-ceramic coating, organosilicon resin coating, and epoxy ceramic composite coating.

5. The high-efficiency heat dissipation metal substrate according to claim 1, characterized in that: The upper surface of the enhanced heat-conducting plate (4) is provided with a transition layer (6), which is a zinc-nickel alloy coating formed by an electrodeposition process and attached to the surface of the enhanced heat-conducting plate (4).

6. The high-efficiency heat dissipation metal substrate according to claim 1, characterized in that: The base plate (1) is fixedly provided with heat dissipation fins (8) on the side away from the heat-conducting plate (4), and a plurality of heat dissipation fins (8) are distributed at equal intervals along the length direction of the base plate (1).

7. The high-efficiency heat dissipation metal substrate according to claim 6, characterized in that: The heat dissipation fins (8) are made of any one of pure copper, copper-aluminum alloy and copper-nickel alloy, and the heat dissipation fins (8) are arranged in an inclined state.

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