Wafer calibration device and semiconductor apparatus
The positioning components and control module of the wafer calibration device enable automated calibration of the wafer on the heating base, solving the problem of wafer position deviation, ensuring uniform heating and reducing damage, and improving the stability of semiconductor equipment and product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI BANGXIN SEMI TECHNOLOGY CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-28
AI Technical Summary
In the existing technology, the unreasonable design of the vacuum chuck and the insufficient positioning accuracy of the robot arm cause the wafer to be placed on the heating base surface with positional deviation, which affects the uniformity of heating and may cause wafer damage.
The wafer calibration device, including positioning components and control modules, achieves automated wafer calibration through positioning posts, detection components, and telescopic positioning components. This ensures that the center of the wafer in the wafer carrier area coincides with the center of the wafer carrier area, avoiding problems such as human error and insufficient precision of the robotic arm.
This achieves uniform heating of the wafer during the heating process, reduces wafer deformation and damage, improves the stability and yield of the equipment and products, and reduces the need for modifications to the heating base.
Smart Images
Figure CN224571772U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a wafer calibration device and semiconductor equipment. Background Technology
[0002] Dry resist stripping plays a crucial role in integrated circuit manufacturing, helping to improve chip integration and performance. In the high-temperature resist stripping process of semiconductor manufacturing, the wafer needs to be stabilized on the surface of a heated substrate and kept under uniform heating before the stripping process. This is typically achieved by a robotic arm moving the wafer. The robotic arm's accurate placement of the wafer in the optimal position on the heated substrate helps ensure uniform heating of the wafer.
[0003] However, the unreasonable design of the vacuum chuck and the insufficient positioning accuracy of the robot in the existing technology lead to problems such as wafer position deviation when placing the wafer on the heating base surface. For example, the wafer may be placed on the positioning post, which will affect the uniformity of the wafer process temperature and cause damage to the wafer due to friction between the positioning post and the wafer. Utility Model Content
[0004] The purpose of this invention is to provide a wafer calibration device and semiconductor equipment that enables automated calibration of the wafer position and ensures uniform heating of the wafer during processes such as heating on the surface of the wafer carrier area.
[0005] To achieve the above objectives, the wafer calibration device of this invention is applied to a semiconductor device with a heating base. The heating base includes a wafer support area for supporting and heating the wafer. The wafer calibration device includes a positioning assembly and a control module. The positioning assembly is provided in at least two sets. Each set of the positioning assembly includes a positioning post, a first detection element, and a telescopic positioning element. At least two of the positioning posts are arranged at a certain arc around the wafer support area. The first detection element is disposed on the inner side of the positioning post facing the wafer support area and / or the inner wall of the semiconductor cavity and is connected to the control module. The control module is connected to detect the first position information of the wafer on the heating base and transmit it to the control module; the telescopic positioning member is disposed on the inner side of the positioning post facing the wafer support area, and the control module is connected to the telescopic positioning member to determine, based on the first position information, that a portion of the wafer is located outside the wafer support area, control the telescopic positioning member to extend radially towards the wafer support area, and push the wafer toward the center of the wafer support area until the center of the wafer coincides with the center of the wafer support area.
[0006] Preferably, the wafer calibration device further includes a second detection element and a slider respectively connected to the control module. The second detection element is disposed on the working surface of the positioning post facing away from the heating base and / or the second detection element is disposed on the inner sidewall of the semiconductor cavity to detect the second position information when the wafer is carried by the ejector pin. The control module is used to determine, based on the second position information, that a portion of the wafer is located above any of the positioning posts, and then control the slider to drive the positioning post away from the wafer carrying area.
[0007] Preferably, the telescopic positioning component includes a telescopic rod and a wafer pusher. The first end of the telescopic rod is disposed on the positioning post, and the second end of the telescopic rod away from the positioning post is disposed towards the wafer carrier area. The control module is connected to the telescopic rod to control the radial telescopic movement of the telescopic rod along the wafer carrier area. The wafer pusher is detachably disposed on the second end of the telescopic rod so as to move radially towards or away from the wafer carrier area as the telescopic rod extends or shortens.
[0008] Preferably, the wafer pusher includes a flexible contact portion and a mounting portion. The flexible contact portion is disposed on the mounting portion. The end of the mounting portion facing away from the flexible contact portion is provided with a mounting groove adapted to the second end of the telescopic rod. The second end of the telescopic rod is detachably connected to the wafer pusher by inserting into the mounting groove.
[0009] Preferably, the flexible contact portion includes an arc-shaped structure, and the radius of the circle containing the arc-shaped structure is equal to the radius of the wafer. When each of the telescopic rods pushes the wafer until the center of the wafer coincides with the center of the wafer bearing area, the projection of the circle containing each of the arc-shaped structures on the surface of the heating base coincides with the wafer bearing area.
[0010] Preferably, when the first detection element is disposed on the inner side of the positioning post facing the wafer carrier area, the distance between the first detection element and the heating base is greater than or equal to the distance between the bottom surface of the wafer and the heating base, and less than or equal to the distance between the top surface of the wafer and the heating base, so that the wafer is located in the emission light path of the first detection element; when the first detection element is disposed on the inner sidewall of the semiconductor cavity, the outer edge of the wafer carrier area is located in the emission light path of the first detection element.
[0011] Preferably, the positioning post is disposed on the working surface of the heating base, and the distance between the positioning post and the wafer bearing area is greater than 0 and less than or equal to 5 mm.
[0012] Preferably, the wafer calibration device further includes a third detection element and an alarm module. The third detection element is provided in multiples and is circumferentially disposed on the inner sidewall of the semiconductor cavity. The first detection section of the heating base is located on the emission optical path of the third detection element. The distance between the first detection section and the wafer carrier area is greater than 5 mm and less than 10 mm. The third detection element is connected to the control module to detect the third position information of the first detection section and transmit it to the control module. The control module is connected to the alarm module to determine, based on the third position information, that the wafer is located above the first detection section and then control the alarm module to issue an alarm.
[0013] Preferably, the wafer calibration device further includes a rotating component disposed on the inner sidewall of the semiconductor cavity, a third detection component rotatably disposed on the rotating component, and a control module connected to the rotating component to control the rotating component to drive the third detection component to rotate, so that the emitted light path of the third detection component falls on the outer edge of the wafer carrier area, the working surface of the positioning post facing away from the heating base, and / or the first detection part.
[0014] Preferably, the positioning component is provided in at least 3 sets, and the positioning posts in the at least 3 sets of positioning components are spaced apart and circumferentially located outside the wafer support area.
[0015] Preferably, the positioning components are provided in two sets, and the positioning posts in the two sets of positioning components are spaced apart and circumferentially arranged outside the wafer support area. The two positioning posts are symmetrically arranged with the diameter of the wafer support area as the axis of symmetry, and the perimeter of the arc structure is greater than or equal to one-quarter of the perimeter of the wafer and less than or equal to one-half of the perimeter of the wafer.
[0016] Preferably, the heating base is provided with a plurality of sets of positioning mark components, and the plurality of sets of positioning mark components are arranged with the same center but different radii around the center of the wafer support area. Each set of positioning mark components includes at least two positioning mark elements for positioning the positioning post, and the positioning mark elements in the same set of positioning mark components are evenly distributed on the same circumference with the center of the wafer support area as the center. The radial distance between the positioning mark elements arranged in the same radial direction in adjacent sets of positioning mark components is equal to the difference in the radius of wafers of adjacent sizes.
[0017] Preferably, the semiconductor device includes the aforementioned wafer calibration apparatus.
[0018] The advantages of the wafer calibration device and semiconductor equipment described in this utility model are as follows: (1) The position of the wafer is automatically calibrated, which enables precise positioning of the wafer without relying on the calibrator. This reduces the investment in the pre-aligner workstation and the error of human calibration, ensuring the uniformity of heating of the wafer during processes such as heating on the wafer carrier area, thereby reducing wafer deformation caused by thermal stress and improving the stability and yield of the machine and the product.
[0019] (2) In this application, the first detection element and the telescopic positioning element are disposed on the positioning post or the first detection element is disposed on the inner side wall of the semiconductor cavity, which avoids the modification of the heating base and avoids problems such as different thicknesses in different areas of the heating base, thereby avoiding the impact on the heating uniformity of the wafer. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the wafer calibration device disposed on the heating base according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the distribution structure of the positioning markers on the heating base in the wafer calibration device according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a semiconductor device according to some embodiments of the present invention; Figure 4 This is a structural block diagram of the wafer calibration device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the positioning component in a wafer calibration device according to some embodiments of the present invention; Figure 6 This is a schematic diagram of the positioning component in a wafer calibration device according to other embodiments of the present invention; Figure 7 This is a schematic diagram of the structure of a semiconductor device according to other embodiments of the present invention; Figures 1 to 7 The reference numerals in the attached figures are as follows: 1. Heating base; 11. Wafer carrier area; 101. First wafer carrier area; 102. Second wafer carrier area; 12. Rotating part; 2. Positioning assembly; 21. Positioning post; 22. First detection element; 23. Telescopic positioning element; 231. Telescopic rod; 232. Wafer pushing element; 2321. Flexible contact part; 2322. Mounting part; 24. Second detection element; 3. Control module; 31. Alarm module; 4. Wafer; 5. Third detection element; 51. First detection part; 6. Semiconductor cavity; 7. Rotating part; 8. Positioning marker; 801. First positioning marker; 802. Second positioning marker; 803. Third positioning marker. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.
[0022] To overcome the problems existing in the prior art, this utility model provides a wafer calibration device and semiconductor equipment, which realizes automated calibration of the wafer position and ensures the uniformity of heating of the wafer during processes such as heating on the surface of the wafer carrier area.
[0023] In some embodiments of this utility model, reference is made to Figures 1 to 6 The wafer calibration apparatus is applied to a semiconductor device having a heating base 1, the heating base 1 including a wafer support area 11 for supporting a wafer 4 and performing heating treatment. The wafer calibration apparatus includes a positioning assembly 2 and a control module 3. The positioning assembly 2 has at least two sets, each set including a positioning post 21, a first detection element 22, and a telescopic positioning element 23. At least two of the positioning posts 21 are arranged at a certain arc around the wafer support area 11. The first detection element 22 is disposed on the inner side of the positioning post 21 facing the wafer support area 11 (e.g., ...). Figure 1 (as shown) and / or the inner wall of the semiconductor cavity 6 (as shown) Figure 3 (As shown) and connected to the control module 3 to detect the first position information of the wafer 4 on the heating base 1 and transmit it to the control module 3; the telescopic positioning member 23 is disposed on the inner side of the positioning post 21 facing the wafer support area 11. The control module 3 is connected to the telescopic positioning member 23 to determine, based on the first position information, that a portion of the wafer 4 is located outside the wafer support area 11, and then controls the telescopic positioning member 23 to extend radially toward the wafer support area 11 and push the wafer 4 toward the center of the wafer support area 11 until the center of the wafer 4 coincides with the center of the wafer support area 11.
[0024] In this application, the position of wafer 4 is automatically calibrated, enabling precise positioning of wafer 4 without relying on a calibrator. This reduces the investment in pre-aligner workstations and minimizes errors from manual calibration, ensuring uniform heating of wafer 4 during processes such as heating on the surface of wafer carrier area 11. This reduces wafer 4 deformation caused by thermal stress and improves the stability and yield of the equipment and products. Furthermore, this application places the first detection element 22 and the telescopic positioning element 23 on the positioning post 21 or places the first detection element 22 on the inner wall of the semiconductor cavity 6, avoiding modifications to the heating base 1 and preventing issues such as uneven thickness in different areas of the heating base 1, thereby avoiding any impact on the uniformity of heating of wafer 4.
[0025] In this application, when a robotic arm or other device places the wafer 4 precisely within the wafer support area 11 (preferably, the center of the wafer 4 coincides with the center of the wafer support area 11), the control module will not control the telescopic positioning member 23 to extend radially toward the wafer support area 11. However, when the robotic arm or other device places the wafer 4 outside the wafer support area 11, the control module will control the telescopic positioning member 23 to extend radially toward the wafer support area 11, and after the telescopic positioning member 23 contacts the edge of the wafer 4, it will push the wafer 4 toward the center of the wafer support area 11 until the center of the wafer 4 coincides with the center of the wafer support area 11. Specifically, a preset position information can be set, that is, the position information when the wafer 4 is exactly placed in the wafer carrier area 11. The control module compares and analyzes the first position information with the preset position information to determine whether a part of the wafer 4 is located outside the wafer carrier area 11, thereby deciding whether to control the telescopic positioning member 23 to extend along the radial direction of the wafer carrier area 11 and toward the wafer carrier area 11.
[0026] In some embodiments of this utility model, the first detection element 22 is an infrared sensor or a ranging sensor. The specific structure and principle of the infrared sensor or the ranging sensor are common knowledge in the field and will not be described in detail here.
[0027] In some embodiments of this utility model, reference is made to Figure 1 , Figure 5 and Figure 6The first detection element 22 is disposed on the inner side of the positioning post 21 facing the wafer support area 11, and the distance between the first detection element 22 and the heating base 1 is greater than or equal to the distance between the bottom surface of the wafer and the heating base 1, and less than or equal to the distance between the top surface of the wafer and the heating base 1, so that the wafer 4 is located in the emission light path (such as infrared light, laser, etc.) of the first detection element 22. Accurate detection can be achieved by setting a few first detection elements 22.
[0028] In other embodiments of this utility model, reference is made to Figure 3 The first detection element 22 is disposed on the inner wall of the semiconductor cavity 6, and the outer edge of the wafer carrier region 11 is located in the emission light path of the first detection element 22. When the wafer 4 is located within the wafer carrier region 11, the first detection element 22, for example, a ranging sensor, detects a first distance. When the wafer 4 is facing the wafer carrier region 11... Figure 3 When the left positioning post 21 is offset, the first detection element 22, such as a distance sensor, detects the second distance. The control module can then analyze and compare the first and second distances. Upon detecting a difference between the two distances, it can control the movement of the telescopic positioning element 23. In some specific embodiments of this invention, the first detection element 22 can be disposed within screw holes on the inner wall of the semiconductor cavity 6 for mounting control components and / or in mounting portions for windows, etc. This allows the first detection element 22 to be installed using existing grooves on the inner wall of the semiconductor cavity 6, minimizing modifications to the semiconductor cavity 6 and helping to avoid interference or impact on other components of the semiconductor device.
[0029] In some embodiments of this utility model, the first detection element 22 is provided in two groups, each group including at least two first detection elements 22. One group of first detection elements 22 is disposed on the inner side of the positioning post 21 facing the wafer support area 11, and the other group of first detection elements 22 is disposed on the inner sidewall of the semiconductor cavity 6. At least two of the first detection elements 22 in the group are spaced apart on the inner sidewall of the semiconductor cavity 6, so that the position of the wafer is dually detected, which is beneficial to improving the accuracy of detection.
[0030] If the robotic arm malfunctions and its accuracy drops significantly, when the robotic arm places wafer 4 onto the ejector pin, part of wafer 4 will be above the positioning post 21. As wafer 4 descends with the ejector pin, part of wafer 4 may rest on the positioning post 21, while the other part will reach the working surface of the heating base 1, causing the wafer to tilt. This could result in damage to the wafer due to slippage or scratches from the positioning post 21. (Refer to some embodiments of this invention.) Figures 1 to 6The wafer calibration device further includes a second detection element 24 and a slider, which are respectively connected to the control module 3. The second detection element 24 is disposed on the working surface of the positioning post 21 facing away from the heating base 1 and / or the second detection element 24 is disposed on the inner sidewall of the semiconductor cavity to detect the second position information when the wafer 4 is carried by the ejector pin. The control module 3 is used to determine, based on the second position information, that a portion of the wafer 4 is located above any of the positioning posts 21, and then control the slider to move the positioning post 21 away from the wafer carrying area 11, thereby avoiding damage caused by excessive deviation in the wafer placement position.
[0031] In some embodiments of this utility model, the second detection element 24 is an infrared sensor or a ranging sensor. The specific structure and principle of the infrared sensor or the ranging sensor are common knowledge in the field and will not be described in detail here.
[0032] In some embodiments of this utility model, reference is made to Figure 1 , Figure 5 and Figure 6 The second detection element 24 is disposed on the working surface of the positioning post 21 facing away from the heating base 1. The light path of the second detection element 24 extends away from the positioning post 21, so that when the wafer 4 is above any of the positioning posts 21, it will block the light path of the second detection element 24, thereby sending the second position information to the control module.
[0033] In other embodiments of this utility model, reference is made to Figure 3 The second detection element 24 is disposed on the inner wall of the semiconductor cavity, and the working surface of the positioning post 21 facing away from the heating base 1 is located on the emission light path of the second detection element 24. The specific detection principle is the same as that of the first detection element 22, and will not be repeated here. In some specific embodiments of this utility model, the second detection element 24 can be disposed in the screw hole for mounting control components and / or the mounting part for mounting windows on the inner side wall of the semiconductor cavity 6, so as to utilize the original groove of the inner side wall of the semiconductor cavity 6 to install the second detection element 24, thereby minimizing modifications to the semiconductor cavity 6 and helping to avoid interference or influence on other components of the semiconductor device.
[0034] In some specific embodiments of this utility model, the second detection element 24 is provided in two groups, each group including at least two second detection elements 24. One group of the second detection elements 24 is disposed on the working surface of the positioning post 21 facing away from the heating base 1, and the other group of the second detection elements 24 is disposed on the inner sidewall of the semiconductor cavity 6. At least two of the second detection elements 24 in the group are spaced apart on the inner sidewall of the semiconductor cavity 6, so that the position of the wafer is dually detected, which is beneficial to improving the accuracy of detection.
[0035] In some embodiments of this invention, the control module 3 can be used to determine, based on the second position information, that a portion of the wafer 4 is above any of the positioning posts 21, and then control all the sliding members to move the corresponding positioning posts 21 away from the wafer support area 11. This ensures that the positioning posts 21 remain on the same circumference centered on the center of the wafer support area 11, allowing the wafer 4 to be synchronously moved towards the center of the wafer support area 11. In other embodiments of this invention, the control module 3 can be used to determine, based on the second position information, that a portion of the wafer 4 is above any of the positioning posts 21, and then control the sliding members of the positioning posts 21 located below the wafer 4 to move those positioning posts 21 away from the wafer support area 11, simplifying the operation.
[0036] In some embodiments of this utility model, the positioning post 21 is disposed on the working surface of the heating base 1, and the distance between the positioning post 21 and the wafer carrier area 11 is greater than 0 and less than or equal to 5mm. The positioning post 21 is close to the wafer carrier area 11, so that the telescopic positioning member 23 can quickly contact and push the wafer, thereby achieving rapid positioning and saving wafer calibration time.
[0037] In some embodiments of this utility model, reference is made to Figure 3 and Figure 4The wafer calibration device further includes a third detection element 5 and an alarm module 31. Several third detection elements 5 are arranged circumferentially on the inner wall of the semiconductor cavity 6. The first detection part 51 of the heating base 1 is located on the emission light path of the third detection element 5. The distance between the first detection part 51 and the wafer support area 11 is greater than 5 mm and less than 10 mm. The third detection element 5 is connected to the control module 3 to detect the third position information of the first detection part 51 and transmit it to the control module 3. The control module 3 is connected to the alarm module 31 to determine, based on the third position information, that the wafer 4 is above the first detection part 51 and then control the alarm module 31 to issue an alarm. The alarm module 3 detects whether there is a wafer 4 above the first detection unit 51 when the wafer 4 is supported by the ejector pin and part of the wafer 4 is above the first detection unit 51. When the wafer 4 is supported by the ejector pin and not above the first detection unit 51, the light emitted by the third detection element 5 is reflected by the first detection unit 51. This allows the control module 3 to determine whether there is a wafer 4 above the first detection unit 51 based on the third position information. If the control module 3 determines that there is a wafer 4 supported by the ejector pin and part of the wafer 4 is above the first detection unit 51, it controls the alarm module 31 to issue an alarm to remind the operator that there is a large deviation when the robotic arm moves the wafer 4, and that the accuracy of the robotic arm and other components needs to be adjusted or whether there is damage.
[0038] In some embodiments of this utility model, the third detection element 5 is an infrared sensor or a ranging sensor. The specific structure and principle of the infrared sensor or the ranging sensor are common knowledge in the field and will not be described in detail here.
[0039] In some embodiments of this utility model, the third detection element 5 may be disposed in the screw hole for mounting control components and / or the mounting part for mounting windows on the inner wall of the semiconductor cavity 6, so as to utilize the groove portion that is already present on the inner wall of the semiconductor cavity 6 to install the third detection element 5, with minimal modification to the semiconductor cavity 6, which helps to avoid interference or influence on other components of the semiconductor device.
[0040] In some embodiments of this utility model, reference is made to Figure 7The wafer calibration device further includes a rotating component 7, which is disposed on the inner wall of the semiconductor cavity 6. The third detection component 5 is rotatably disposed on the rotating component 7. The control module 3 is connected to the rotating component 7 to control the rotating component 7 to drive the third detection component 5 to rotate, so that the emitted light path of the third detection component 5 falls on the outer edge of the wafer support area 11, the working surface of the positioning post 21 facing away from the heating base 1, and / or the first detection part 51. This allows the third detection component 5 to detect whether the wafer is located at the outer edge of the wafer support area 11, the working surface of the positioning post 21 facing away from the heating base 1, and / or the first detection part 51. In other words, by setting the third detection component 5, the first position information, the second position information, and the third position information can be obtained. Thus, the first and second detection components do not need to be set on the inner wall of the semiconductor cavity, or even on the positioning post, saving the investment in detection components.
[0041] In some embodiments of this utility model, reference is made to Figure 1 , Figure 5 and Figure 6 The telescopic positioning component 23 includes a telescopic rod 231 and a wafer pusher 232. A first end of the telescopic rod 231 is disposed on the positioning post 21, and a second end of the telescopic rod 231, away from the positioning post 21, is disposed towards the wafer carrier region 11. The control module 3 is connected to the telescopic rod 231 to control the radial extension and retraction of the telescopic rod 231 along the wafer carrier region 11. The wafer pusher 232 is detachably disposed on the second end of the telescopic rod 231 to move along the wafer carrier region 11 as the telescopic rod 231 extends or shortens. The wafer pusher 232 moves radially toward or away from the wafer carrier region 11 as the telescopic rod 231 extends, and after contacting the wafer 4, it can push the wafer 4 toward the center of the wafer carrier region 11. After the center of the wafer 4 coincides with the center of the wafer carrier region 11, the wafer pusher 232 moves radially away from the wafer carrier region 11 as the telescopic rod 231 shortens, so as to avoid affecting the wafer 4 for heating and other processing. The telescopic positioning member 23 has a simple structure and can quickly calibrate the position of the wafer 4.
[0042] In some embodiments of this utility model, the maximum length of the telescopic rod 231 in the extended state is at least greater than the distance between the positioning post 21 and the wafer support area 11.
[0043] In some embodiments of this invention, the telescopic rod includes a pneumatic telescopic rod or an electric telescopic rod. Both pneumatic and electric telescopic rods have the advantages of simple structure, precise positioning, large thrust, and strong controllability, which helps to improve the accuracy of wafer positioning in the wafer carrier area.
[0044] In some specific embodiments of this utility model, the telescopic rod includes an electric telescopic rod, which comprises a motor, a reduction mechanism, a lead screw and nut, a guide mechanism, and a limit switch. The motor provides the power source, the reduction mechanism reduces the rotational speed and increases the torque, the lead screw and nut converts the rotational motion into linear motion, the guide mechanism ensures stable movement, and the limit switch prevents overload. The control module is connected to the motor. After the motor starts, the rotational motion is transmitted to the lead screw via the reduction mechanism, and the lead screw drives the nut to move axially, thereby pushing the telescopic rod to extend or retract. The extension and retraction actions are achieved by controlling the forward and reverse rotation of the motor. The limit switch monitors the extreme positions and automatically stops the machine, ensuring operational safety. The specific structure and principle of the electric telescopic rod are common knowledge and will not be described in detail here.
[0045] In other specific embodiments of this utility model, the telescopic rod includes a pneumatic telescopic rod, which comprises a telescopic rod body, a pneumatic chamber, a control system, and a foot-operated air pump. The telescopic rod body is composed of multiple nested high-strength aluminum alloy or stainless steel tubes, ensuring lightweight and corrosion resistance. The sealed chamber inside the pneumatic chamber uses compressed air to drive a piston, achieving the telescopic function. The control system includes an inlet valve, an exhaust valve, and a pressure regulating valve to control the airflow and telescopic speed. The air pump inflates and deflates the pneumatic chamber. The pneumatic telescopic rod uses pneumatic drive to support stepless length adjustment, making operation labor-saving and positioning precise. The specific structure and principle of the pneumatic telescopic rod are common knowledge and will not be described in detail here.
[0046] In some embodiments of this utility model, reference is made to Figure 1 , Figure 5 and Figure 6 The wafer pusher 232 includes a flexible contact portion 2321 and a mounting portion 2322. The flexible contact portion 2321 is disposed on the mounting portion 2322. The end of the mounting portion 2322 facing away from the flexible contact portion 2321 is provided with a mounting groove adapted to the second end of the telescopic rod 231. The second end of the telescopic rod 231 is detachably connected to the wafer pusher 232 by inserting into the mounting groove. Disassembly and installation are simple and convenient, and the wafer pusher 232 or the telescopic rod 231 can be replaced at any time as needed.
[0047] In some specific embodiments of this utility model, the second end of the telescopic rod 231 and the mounting groove can be connected by a thread or a snap-fit method.
[0048] In some embodiments of this invention, the flexible contact portion is made of a flexible material, enabling it to make flexible contact with the wafer to avoid damage to the wafer.
[0049] In other embodiments of this utility model, the flexible contact portion includes a contact body structure and a flexible portion, wherein the flexible portion is disposed at the end of the contact body structure facing away from the mounting portion.
[0050] In some embodiments of this utility model, reference is made to Figure 6 The flexible contact portion 2321 includes an arc-shaped structure, and the radius of the circle containing the arc-shaped structure is equal to the radius of the wafer 4. When each of the telescopic rods 231 pushes the wafer 4 until the center of the wafer 4 coincides with the center of the wafer support area 11, the projection of the circle containing each arc-shaped structure on the surface of the heating base 1 coincides with the wafer support area 11. This allows each arc-shaped structure to adapt to the edge of the wafer 4, thereby ensuring that the center of the wafer 4 coincides with the center of the wafer support area 11 through the pushing of the arc-shaped structure, avoiding deviations and improving the accuracy of wafer 4 position calibration. Furthermore, the telescopic rod 231 is detachably connected to the wafer pusher 232, allowing calibration of wafers 4 of various sizes to be achieved by replacing the wafer pusher 232. When calibrating a second wafer with a size different from the first wafer, only the wafer pusher 232 adapted to the second wafer needs to be replaced. Even if the radius of the circle containing the replaced arc structure is equal to the radius of the second wafer, when each of the telescopic rods 231 pushes the second wafer until the center of the second wafer coincides with the center of the first wafer support area 101 (e.g., Figure 2 As shown in the figure, the projection of the circle containing each of the arc structures on the surface of the heating base 1 coincides with the first wafer support area 101.
[0051] In other embodiments of this utility model, the flexible contact portion 2321 may also be a rectangular structure (e.g., Figure 5 (as shown), horn-shaped structure, C-shaped claw structure or suction cup-shaped structure, etc.
[0052] In some embodiments of this utility model, the positioning component 2 is provided with at least 3 sets, and the positioning posts 21 in the at least 3 sets of the positioning component 2 are spaced apart and circumferentially located outside the wafer carrier area 11. That is, the three-point positioning center method is used to make the center of the wafer 4 coincide with the center of the wafer carrier area 11 accurately and quickly.
[0053] In some embodiments of this utility model, the positioning component 2 is provided in two sets, and the positioning posts 21 in the two sets of positioning components 2 are spaced apart and circumferentially arranged outside the wafer support area 11. The two positioning posts 21 are symmetrically arranged about the diameter of the wafer support area 11, and the perimeter of the arc-shaped structure is greater than or equal to one-quarter of the perimeter of the wafer 4, and less than or equal to half the perimeter of the wafer 4, so that the arc-shaped structure can cover half or all of the outer edge of the wafer 4, thus ensuring that the wafer 4 moves toward the center of the wafer support area 11 without deviating. In some specific embodiments of this utility model, when the positioning component 2 is provided in two sets, the arc-shaped structure is a semi-circular arc structure, such as... Figure 6 As shown.
[0054] In some embodiments of this utility model, reference is made to Figure 2 The heating base 1 is provided with several sets of positioning mark components, and the several sets of positioning mark components are arranged with the center of the wafer support area 11 as the center of the same circle but with different radii. Each set of positioning mark components includes at least two positioning mark elements 8 for positioning the positioning post 21. The positioning mark elements 8 in the same set of positioning mark components are evenly distributed on the same circumference with the center of the wafer support area 11 as the center. The radial distance between the positioning mark elements 8 arranged in the same radial direction in adjacent sets of positioning mark components is equal to the difference in the radius of the wafer 4 of adjacent sizes, so that the wafer calibration device is suitable for calibrating wafers of any size among 6-inch, 8-inch and 12-inch.
[0055] In some specific embodiments of this utility model, the positioning markers 8 arranged radially include a first positioning marker 801, a second positioning marker 802, and a third positioning marker 803. When calibrating 6-inch wafers, 8-inch wafers, and 12-inch wafers respectively, the positioning posts 21 can be correspondingly arranged on the first positioning marker 801, the second positioning marker 802, and the third positioning marker 803, or can be slid to the first positioning marker 801, the second positioning marker 802, and the third positioning marker 803 by means of a sliding member, so that the calibration of 6-inch wafers, 8-inch wafers, and 12-inch wafers can be achieved by the same wafer calibration device. Specifically, when calibrating a 6-inch wafer, the positioning post 21 is disposed on the first positioning marker 801, which is arranged in a certain arc around the wafer carrier area 11; when calibrating an 8-inch wafer, the positioning post 21 is disposed on the second positioning marker 802, which is arranged in a certain arc around the first wafer carrier area 101; when calibrating a 12-inch wafer, the positioning post 21 is disposed on the third positioning marker 803, which is arranged in a certain arc around the second wafer carrier area 102.
[0056] In some embodiments of this utility model, reference is made to Figure 2 The difference between the radius of the circle formed by the group of positioning marker components and the radius of the nearest wafer carrier area 11 is greater than 0 and less than 5 mm, so as to save wafer 4 calibration time.
[0057] In some embodiments of this utility model, reference is made to Figure 1 , Figure 3 and Figure 7 The semiconductor device includes the wafer calibration apparatus.
[0058] In some embodiments of this utility model, reference is made to Figure 1 , Figure 3 and Figure 7 The semiconductor device further includes a rotating part 12. The heating base 1 includes a support part, a heating part, a supporting part, and an electrode part arranged sequentially from top to bottom. The rotating part 12 is connected to the support part to drive the support part to rotate. The specific structure of the heating base 1 is common knowledge in the art and will not be described in detail here.
[0059] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.
Claims
1. A wafer calibration device, characterized in that, Applied to semiconductor devices having a heating base, the heating base including a wafer support region for supporting and heating a wafer; The wafer calibration device includes a positioning component and a control module. The positioning component is provided in at least two sets. Each set of the positioning component includes a positioning post, a first detection element, and a telescopic positioning element. At least two of the positioning posts are arranged in a certain arc around the outside of the wafer support area. The first detection element is disposed on the inner side of the positioning post facing the wafer carrier area and / or the inner sidewall of the semiconductor cavity and is connected to the control module to detect the first position information of the wafer on the heating base and transmit it to the control module. The telescopic positioning component is disposed on the inner side of the positioning post facing the wafer carrier area. The control module is connected to the telescopic positioning component to determine, based on the first position information, that a portion of the wafer is located outside the wafer carrier area, and then controls the telescopic positioning component to extend radially toward the wafer carrier area and push the wafer toward the center of the wafer carrier area until the center of the wafer coincides with the center of the wafer carrier area.
2. The wafer calibration apparatus according to claim 1, characterized in that, The wafer calibration device further includes a second detection element and a slider connected to the control module. The second detection element is disposed on the working surface of the positioning post facing away from the heating base and / or disposed on the inner sidewall of the semiconductor cavity to detect the second position information when the wafer is carried by the ejector pin. The control module is used to determine, based on the second position information, that a portion of the wafer is located above any of the positioning posts, and then control the slider to move the positioning post away from the wafer carrying area.
3. The wafer calibration apparatus according to claim 1, characterized in that, The telescopic positioning component includes a telescopic rod and a wafer pusher. The first end of the telescopic rod is disposed on the positioning post, and the second end of the telescopic rod away from the positioning post is disposed towards the wafer carrier area. The control module is connected to the telescopic rod to control the radial telescopic movement of the telescopic rod along the wafer carrier area. The wafer pusher is detachably disposed on the second end of the telescopic rod so as to move radially towards or away from the wafer carrier area as the telescopic rod extends or shortens.
4. The wafer calibration apparatus according to claim 3, characterized in that, The wafer pusher includes a flexible contact portion and a mounting portion. The flexible contact portion is disposed on the mounting portion. The end of the mounting portion facing away from the flexible contact portion is provided with a mounting groove that is adapted to the second end of the telescopic rod. The second end of the telescopic rod is detachably connected to the wafer pusher by inserting into the mounting groove.
5. The wafer calibration apparatus according to claim 4, characterized in that, The flexible contact portion includes an arc-shaped structure, and the radius of the circle containing the arc-shaped structure is equal to the radius of the wafer. When each of the telescopic rods pushes the wafer until the center of the wafer coincides with the center of the wafer bearing area, the projection of the circle containing each arc-shaped structure on the surface of the heating base coincides with the wafer bearing area.
6. The wafer calibration apparatus according to claim 1, characterized in that, When the first detection element is disposed on the inner side of the positioning post facing the wafer carrier area, the distance between the first detection element and the heating base is greater than or equal to the distance between the bottom surface of the wafer and the heating base, and less than or equal to the distance between the top surface of the wafer and the heating base, so that the wafer is located in the emission light path of the first detection element; when the first detection element is disposed on the inner sidewall of the semiconductor cavity, the outer edge of the wafer carrier area is located in the emission light path of the first detection element.
7. The wafer calibration apparatus according to claim 1 or 2, characterized in that, The positioning post is disposed on the working surface of the heating base, and the distance between the positioning post and the wafer carrier area is greater than 0 and less than or equal to 5 mm.
8. The wafer calibration apparatus according to claim 1, characterized in that, The wafer calibration device further includes a third detection element and an alarm module. Several third detection elements are arranged circumferentially on the inner wall of the semiconductor cavity. The first detection section of the heating base is located on the emission optical path of the third detection element. The distance between the first detection section and the wafer carrier area is greater than 5 mm and less than 10 mm. The third detection element is connected to the control module to detect the third position information of the first detection section and transmit it to the control module. The control module is connected to the alarm module to determine, based on the third position information, that the wafer is located above the first detection section and then control the alarm module to issue an alarm.
9. The wafer calibration apparatus according to claim 8, characterized in that, The wafer calibration device further includes a rotating component disposed on the inner sidewall of the semiconductor cavity. The third detection component is rotatably disposed on the rotating component. The control module is connected to the rotating component to control the rotating component to drive the third detection component to rotate, so that the emitted light path of the third detection component falls on the outer edge of the wafer carrier area, the working surface of the positioning post facing away from the heating base, and / or the first detection part.
10. The wafer calibration apparatus according to claim 5, characterized in that, The positioning component is provided in at least 3 sets, and the positioning posts in the at least 3 sets of positioning components are spaced apart and are all located outside the wafer support area in the circumferential direction; Alternatively, the positioning components may be provided in two sets, and the positioning posts in the two sets of positioning components are spaced apart and circumferentially arranged outside the wafer support area. The two positioning posts are symmetrically arranged with the diameter of the wafer support area as the axis of symmetry, and the perimeter of the arc structure is greater than or equal to one-quarter of the perimeter of the wafer, and less than or equal to one-half of the perimeter of the wafer.
11. The wafer calibration apparatus according to claim 1, characterized in that, The heating base is provided with several sets of positioning mark components, and the several sets of positioning mark components are arranged with the same center but different radii around the center of the wafer support area. Each set of positioning mark components includes at least two positioning mark elements for positioning the positioning post. The positioning mark elements in the same set of positioning mark components are evenly distributed on the same circumference with the center of the wafer support area as the center. The radial distance between the positioning mark elements arranged in the same radial direction in adjacent sets of positioning mark components is equal to the difference in radius between wafers of adjacent sizes.
12. A semiconductor device, characterized in that, Includes the wafer calibration apparatus as described in any one of claims 1-11.