Clamping device for processing of circuit board bottom shells
By setting a clamping mechanism on the side wall of the vacuum clamp on the bottom shell of the circuit board, applying pressure from the side and combining it with vacuum adsorption, the problems of complex clamping and poor adaptability of the existing circuit board bottom shell fixing method are solved, achieving high reliability and wide range of clamping, supporting one-time processing and forming, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KEJIE TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-08-04
AI Technical Summary
Existing circuit board base shell fixing methods suffer from problems such as complex clamping structures, low processing efficiency, and poor adaptability. In particular, for large and irregularly shaped base shells, the vacuum adsorption effect is not ideal, resulting in unstable fixing and affecting processing accuracy.
Employing a fixture with vacuum adsorption function and multiple clamping mechanisms, the fixture applies pressure to the side wall of the workpiece by setting clamping mechanisms on the side wall of the vacuum fixture. Combined with vacuum adsorption, the workpiece is positioned and clamped, achieving high clamping reliability and wide applicability.
It improves the clamping reliability and positioning accuracy of the circuit board bottom shell, supports one-time processing and molding, has a lightweight structure design, reduces production costs, and improves the ease of operation and automation.
Smart Images

Figure CN224588003U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a clamping device for processing the bottom shell of a circuit board, and belongs to the field of circuit board processing technology. Background Technology
[0002] Currently, circuit board base shells are mainly manufactured using injection molding. However, due to the shrinkage characteristics of injection molding materials and the large size of the base shell itself, the flatness of the molded shell is often poor. Therefore, it is necessary to fix it during subsequent processing to ensure processing accuracy. Existing methods for fixing circuit board base shells mainly include two types: one is to use a clamping method to fix the circuit board base shell flatness to the worktable; the other is to use a vacuum adsorption method to fix the circuit board base shell to the worktable.
[0003] However, the aforementioned existing fixing methods all have certain limitations in practical applications. For example, when using pressure-holding, if the bottom shell is large and has a complex internal structure or irregular shape, clamping force needs to be applied at multiple locations to ensure clamping stability and flatness. This not only increases the difficulty of positioning but may also affect the processing technology. For instance, if the bottom shell surface requires further processing, the clamping structure may interfere with the processing area, requiring additional avoidance structures or secondary processing during the process, thus complicating the clamping device, making the processing technology cumbersome, and reducing production efficiency. While vacuum adsorption fixing can avoid the interference problems caused by mechanical clamping, the adsorption effect is often unsatisfactory for bottom shells with irregular shapes or poor surface flatness, and poor sealing can easily lead to insecure fixing, affecting processing accuracy. In addition, vacuum adsorption also has certain requirements on the surface material and structure of the bottom shell, limiting its applicability.
[0004] Therefore, existing technologies for fixing circuit board bottom shells, especially for large and irregularly shaped circuit board bottom shells, still suffer from problems such as complex clamping structures, low processing efficiency, and poor adaptability. Utility Model Content
[0005] This utility model provides a clamping device for processing circuit board bottom shells, aiming to solve at least one of the technical problems existing in the prior art. Therefore, the clamping device for processing circuit board bottom shells proposed in this utility model has high clamping reliability and a wide range of applications, supports one-time processing and forming by the equipment, and simultaneously achieves lightweight structural design, as well as improved operational convenience and automation.
[0006] The technical solution of this utility model relates to a clamping device for processing the bottom shell of a circuit board, including:
[0007] A vacuum clamp with vacuum adsorption function, wherein the vacuum clamp is provided with a cavity for accommodating the workpiece.
[0008] Multiple clamping mechanisms, each clamping mechanism including a clamping bracket and a telescopic actuator, and a clamping block that allows disengagement from or contact with the sidewall of the workpiece in the cavity, the clamping bracket being disposed on the vacuum clamp; the telescopic actuator being fixed on the clamping bracket, and the telescopic end of the telescopic actuator being connected to the clamping block.
[0009] Furthermore, the sidewall of the cavity is provided with multiple perforations, and the clamping block is movably disposed in the perforations.
[0010] Furthermore, the clamp bracket is provided with an installation channel, an inner nut is provided in the installation channel, and the telescopic actuator is provided with an external thread; the telescopic actuator is partially disposed in the installation channel, and the external thread of the telescopic actuator is threadedly connected to the inner nut.
[0011] Furthermore, the protruding end of the telescopic actuator facing away from its telescopic end protrudes from the clamp bracket, and the protruding end is connected to an outer nut.
[0012] Furthermore, the multiple telescopic actuators are connected to several cylinder solenoid valves.
[0013] Furthermore, multiple clamping mechanisms are symmetrically arranged on the vacuum clamp.
[0014] Furthermore, the vacuum clamp is connected to a vacuum generator and a vacuum solenoid valve for controlling the gas supply to and from the vacuum clamp.
[0015] Furthermore, it also includes a base plate and multiple support rods, the lower end of which is connected to the base plate and the upper end of which is connected to the vacuum clamp.
[0016] Furthermore, the vacuum fixture is provided with a groove, and a sealing ring for contacting the outer periphery of the workpiece is provided in the groove.
[0017] Furthermore, the base plate of the vacuum fixture is provided with an air groove and an interface for connecting an air source.
[0018] The beneficial effects of this utility model are as follows.
[0019] This utility model discloses a clamping device for processing the bottom shell of a circuit board. It boasts high clamping reliability and a wide range of applications, supporting one-time processing and achieving a lightweight design that enhances operational convenience and automation. Unlike traditional methods that apply pressure downwards to the upper surface of the workpiece, this clamping device incorporates multiple clamping mechanisms on the sidewall of a vacuum fixture. This applies pressure to the sidewall of the workpiece from the side, while simultaneously utilizing the suction effect of the vacuum fixture. The lightweight structural design improves positioning accuracy and clamping reliability, while also reducing production costs.
[0020] This invention first applies pressure to the side wall of the circuit board bottom shell through the clamping mechanism. At this time, the vacuum clamp is not working. By adjusting the pressure on the two sides of the workpiece, the workpiece is pushed to move in the vacuum clamp to position the workpiece in the vacuum clamp. After the workpiece is positioned, the vacuum clamp is activated to vacuum adsorb the workpiece. Combined with the side pressure of the clamping mechanism, the clamping device has higher clamping reliability and higher workpiece clamping and positioning accuracy. Attached Figure Description
[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0022] Figure 1 This is a schematic diagram of the structure of a clamping device for processing the bottom shell of a circuit board according to an embodiment of the present invention.
[0023] Figure 2 This is a schematic diagram of the structure of a workpiece clamping device according to an embodiment of the present utility model.
[0024] Figure 3 This is a front view of the structure of a clamping device for processing the bottom shell of a circuit board according to an embodiment of the present utility model.
[0025] Figure 4 This is an exploded view of the clamping mechanism according to an embodiment of the present utility model.
[0026] Figure 5 This is a schematic diagram of the first control circuit of the clamping device according to an embodiment of the present utility model.
[0027] Figure 6 This is a schematic diagram of the second control circuit of the clamping device according to an embodiment of the present utility model.
[0028] Explanation of reference numerals in the attached figures:
[0029] 100. Vacuum clamp; 110. Cavity; 120. Perforation; 130. Side wall; 140. Clamp plate; 150. Groove; 160. Air groove; 170. Interface;
[0030] 200. Clamping mechanism; 210. Clamping bracket; 211. Mounting channel; 220. Needle cylinder; 221. First cylinder group; 222. Second cylinder group; 230. Clamping block; 231. Main body; 232. Protrusion; 240. Connecting screw; 250. Inner nut; 260. Outer nut;
[0031] 300, base plate; 400, support rod; 500, workpiece. Detailed Implementation
[0032] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0033] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.
[0034] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and not for limiting the scope of the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.
[0035] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various elements, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from one another. For example, without departing from the scope of this disclosure, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element.
[0036] See Figures 1 to 6 The present invention relates to a clamping device for processing the bottom shell of a circuit board, comprising a vacuum clamp 100 with vacuum adsorption function and multiple clamping mechanisms 200. The vacuum clamp 100 is provided with a cavity 110 for accommodating a workpiece 500. Each clamping mechanism 200 includes a clamping bracket 210, a telescopic actuator, and a clamping block 230 that allows the workpiece 500 to detach from or abut against the side wall 130 of the cavity 110. The clamping bracket 210 is mounted on the vacuum clamp 100. The telescopic actuator is fixed to the clamping bracket 210, and its telescopic end is connected to the clamping block 230. It should be noted that the telescopic actuator can be a needle-type cylinder 220. Further, the side wall 130 of the cavity 110 of the vacuum clamp 100 is provided with multiple through holes 120, and the clamping block 230 is movably disposed in the through holes 120 to detach from or abut against the side wall 130 of the workpiece 500 in the cavity 110.
[0037] See Figure 1 and Figure 2The side wall 130 of the cavity 110 of the vacuum fixture 100 is provided with a plurality of through holes 120, and a plurality of clamping mechanisms 200 are connected to the outside of the side wall 130 of the cavity 110 of the vacuum fixture 100. The clamping block 230 of each clamping mechanism 200 can enter the cavity 110 of the vacuum fixture 100 through a through hole 120 and abut against the side wall 130 of the workpiece 500 in the cavity 110. It is understandable that multiple clamping mechanisms 200 are symmetrically arranged on opposite sides of the workpiece 500. By applying pressure to the inside of the workpiece 500 through the clamping mechanisms 200 on both sides, the workpiece 500 is fixed in the vacuum fixture 100. For example, there are eight clamping mechanisms 200. The circuit board bottom shell of the workpiece 500 is a square plate. Two clamping mechanisms 200 are arranged on each side of the circuit board bottom shell. The workpiece 500 is symmetrically arranged with respect to the clamping mechanisms 200 on the two sides, so that the workpiece 500 is subjected to uniform force and the position of the workpiece 500 can be easily adjusted by pushing and cooperating with the side pressure.
[0038] Specifically, in the clamping device for processing the bottom shell of the circuit board of this utility model, pressure is first applied to the side wall 130 of the bottom shell of the circuit board by the clamping mechanism 200. At this time, the vacuum clamp 100 is not working. By adjusting the pressure on the workpiece 500 relative to both sides, the workpiece 500 is pushed to move in the vacuum clamp 100 to position the workpiece 500 in the vacuum clamp 100. After the workpiece 500 is positioned, the vacuum clamp 100 is activated to vacuum adsorb the workpiece 500. Combined with the side pressure of the clamping mechanism 200, the clamping reliability of the clamping device is higher and the clamping positioning accuracy of the workpiece 500 is also higher.
[0039] This utility model discloses a clamping device for processing circuit board bottom shells. It offers high clamping reliability and a wide range of applications, supporting one-time processing and forming. Simultaneously, it achieves a lightweight structural design, improving operational convenience and automation. Unlike traditional methods that apply pressure downwards to the upper surface of the workpiece 500, this utility model's clamping device features multiple clamping mechanisms 200 on the side wall 130 of the vacuum fixture 100. This applies pressure to the side wall 130 of the workpiece 500 from the side, while simultaneously utilizing the suction effect of the vacuum fixture 100. Through its lightweight structural design, it improves positioning accuracy and clamping reliability, while also reducing production costs.
[0040] In some embodiments, see Figure 2 and Figure 3The vacuum clamp 100 of this invention includes a clamping plate 140 and a side wall 130. The side wall 130 protrudes from the upper surface of the clamping plate 140 to form a cavity 110. The clamping plate 140 is provided with an air groove 160 and an interface 170 for connecting a vacuum source, so that the cavity 110 on the clamping plate 140 can be a vacuum chamber. When the workpiece 500 is placed in the cavity 110 and covers the air groove 160 and the interface 170, the vacuum source causes the workpiece 500 to be vacuum-adsorbed onto the clamping plate 140. Furthermore, the vacuum source connecting the vacuum clamp 100 is controlled by a vacuum solenoid valve. At the same time, a vacuum detector is provided on the clamping plate 140. The vacuum solenoid valve controls the on / off of the vacuum source, and the vacuum detector detects the vacuum level of the cavity 110 of the vacuum clamp 100. When the vacuum level does not meet the requirements, it can be promptly fed back to the equipment system, realizing an effective prompting and early warning function, which is beneficial to improving the processing effect and product qualification rate.
[0041] In some application embodiments, the vacuum fixture 100 of the present invention includes a fixture plate 140, the periphery of which is provided with sidewalls 130, and the interior of the fixture plate 140 forms a cavity 110 for accommodating the workpiece 500. Further, the shape of the cavity 110 of the vacuum fixture 100 can be matched with the shape of the workpiece 500. The outer periphery of the cavity 110 of the vacuum fixture 100 is provided with a sealing groove according to the shape of the workpiece 500, and a sealing ring is disposed in the sealing groove. The middle of the cavity 110 of the vacuum fixture 100 is provided with multiple air grooves 160 and multiple interfaces 170 for connecting air sources. The air grooves 160 and interfaces 170 are disposed within the sealing ring. When the workpiece 500 is placed in the cavity 110, the outer periphery of the workpiece 500 contacts or abuts against the sealing ring, and the bottom surface of the workpiece 500 covers the air grooves 160 and interfaces 170, thereby forming a sealed space between the fixture plate 140 and the workpiece 500. Through the action of the vacuum air source connected to the interface 170, the sealed space forms a vacuum cavity, and the workpiece 500 is adsorbed onto the vacuum fixture 100. Furthermore, the multiple air grooves 160 and multiple interfaces 170 are evenly distributed within the sealing ring or symmetrically arranged, which can make the vacuum adsorption effect of the vacuum fixture 100 more reliable.
[0042] In some embodiments, the clamping mechanism 200 of this utility model includes a clamping bracket 210, a telescopic driver, and a clamping block 230. The clamping bracket 210 is fixed to the outside of the vacuum clamp 100, and the telescopic driver is fixed to the clamping bracket 210. The telescopic end of the telescopic driver is connected to the clamping block 230, so that the clamping block 230 can be driven to perform telescopic movement by the telescopic driver. It is understood that the telescopic driver in this embodiment of the utility model can be a telescopic cylinder, a telescopic motor, a telescopic servo motor, or a telescopic stepper motor, etc. Further, the clamping mechanism 200 in this embodiment of the utility model uses a needle cylinder 220 as a telescopic driver, which makes the clamping device small in size and compact in structure, achieves lightweight design, and improves response speed and control accuracy.
[0043] In some application embodiments, the telescopic actuator is exemplified here as a needle-type cylinder 220. The clamp support 210 is a square block shape, and the clamp support 210 is fixed to the side wall 130 of the vacuum clamp 100 by connecting screws 240, and covers the through hole 120 of the vacuum clamp 100. See also Figure 1 and Figure 4 The fixture bracket 210 has an installation channel 211, and an inner nut 250 is provided in the installation channel 211. The part of the needle cylinder 220 near the telescopic end is set in the installation channel 211 of the fixture bracket 210. The external thread of the needle cylinder 220 is threadedly connected with the inner nut 250 in the installation channel 211 of the fixture bracket 210, so that the needle cylinder 220 is fixed on the fixture bracket 210. The protruding part of the needle cylinder 220 opposite to its telescopic end protrudes from the fixture bracket 210 to connect the signal line. Furthermore, an outer nut 260 is fitted on the protruding end of the needle cylinder 220. The external thread of the needle cylinder 220 is threadedly connected with the outer nut 260, so that the needle cylinder 220 is double-locked and fixed, which can make the needle cylinder 220 more securely installed. Furthermore, the width of the mounting channel 211 facing the vacuum clamp 100 is smaller. When the inner nut 250 is in the mounting channel 211, the side of the inner nut 250 facing the vacuum clamp 100 contacts the mounting channel 211, thereby positioning the inner nut 250.
[0044] In some application embodiments, multiple needle cylinders 220 can share a single solenoid valve for control, which helps ensure synchronized operation of the needle cylinders 220 and simplifies system control. Furthermore, multiple solenoid valves are provided, allowing each needle cylinder 220 to be individually controlled by a single solenoid valve, making control more flexible. Additionally, several needle cylinders 220 on the same side can share a single solenoid valve for control, or several needle cylinders 220 on opposite sides can share a single solenoid valve for control. Furthermore, the vacuum clamp 100 has a near-square structure, and the multiple cylinder solenoid valves are divided into two groups, namely the first solenoid valve group and the second solenoid valve group. Correspondingly, the multiple needle cylinders 220 are also divided into two groups. One group of needle cylinders 220 is located on two sides of one right angle of the vacuum clamp 100, and the other group of needle cylinders 220 is located on the remaining two sides of the vacuum clamp 100, that is, the other needle cylinder 220 is located on the two diagonal sides of the aforementioned right angle. The first solenoid valve group and the second solenoid valve group control the two groups of needle cylinders 220 respectively.
[0045] In some application embodiments, the clamping block 230 is movably disposed in the through hole 120. It is understood that the clamping block 230 and the through hole 120 are in clearance fit. The through hole 120 guides the extension and retraction of the clamping block 230. When the workpiece 500 is placed in the cavity 110 of the vacuum fixture 100, the needle cylinder 220 pushes the clamping block 230 to move inward, so that the end of the clamping block 230 leaves the through hole 120 and contacts the side wall 130 of the workpiece 500. The clamping block 230 presses against the side wall 130 of the workpiece 500, and at the same time, the workpiece 500 is clamped by the joint action of the clamping mechanisms 200 on both sides.
[0046] Further, see Figure 4 The clamping block 230 includes a main part 231 and a protrusion 232. The protrusion 232 is disposed on the upper side of the end of the main part 231 that contacts the workpiece 500. When the clamping block 230 contacts the workpiece 500, the end face of the main part 231 contacts the side wall 130 of the workpiece 500, and the lower plane of the protrusion 232 contacts the upper plane of the workpiece 500. This allows the bottom surface of the workpiece 500 to be sucked in by the vacuum clamp 100, which is beneficial for the workpiece 500 to be fastened on the clamping device.
[0047] In some application embodiments, the clamping bracket 210 and the needle cylinder 220 are connected by threads. The distance between the needle cylinder 220 and the circuit board base can be adjusted according to the actual shape and size of the circuit board base, thereby flexibly adjusting the clamping distance of the clamping block 230. Furthermore, the number and position of the through hole 120 and the clamping mechanism 200 can be adjusted according to the actual shape and size of the workpiece 500, resulting in a more reasonable layout and higher clamping accuracy and reliability for the workpiece 500.
[0048] In some embodiments, the clamping device of this utility model further includes a base plate 300 and a plurality of support rods 400. The lower end of the support rod 400 is connected to the base plate 300, and the upper end of the support rod 400 is connected to the vacuum clamp 100. The base plate 300 is fixed on the processing equipment, and the height of the support rod 400 can be adjusted according to the actual processing. It is understood that the plurality of support rods 400 are evenly distributed on the base plate 300. For example, four support rods 400 are provided, the base plate 300 has a near-square structure, and the four support rods are distributed at the four corners of the base plate 300. Furthermore, the four support rods 400 are set at the same height, making installation convenient and adjustment efficient.
[0049] It should be noted that when using traditional clamping devices to clamp the circuit board base, the circuit board base is first placed flat on the worktable. The clamping device applies pressure from above to the circuit board base, making the bottom surface of the circuit board base adhere tightly to the worktable and fix it in place. At this time, the circuit board base must be parallel to the worktable. To ensure optimal clamping flatness, especially for cases with irregular internal shapes, such as uneven bottom surfaces, multiple clamping positions are generally required for the circuit board base. This operation is cumbersome and positioning accuracy is difficult to control. Furthermore, when the surface of the circuit board base needs to be machined, the clamping positions often cover the surface to be machined, requiring secondary clamping and positioning processing, or the use of custom-designed clamping devices with clearance designs. This complicates the processing technology and increases production costs. In addition, the traditional method of relying solely on vacuum adsorption to fix the workpiece 500 is prone to workpiece displacement during processing, especially for non-standard shaped circuit board bases, particularly those with irregular shapes such as uneven bottom surfaces. The clamping device of this utility model can effectively avoid secondary clamping caused by obstruction by clamping the side wall 130 of the circuit board bottom shell. Furthermore, the use of vacuum adsorption combined with the clamping mechanism 200 can effectively solve the problems of low clamping stability and low positioning accuracy reliability of existing clamping methods, as well as the problems of limited applicability, complex structure, and cumbersome operation. The clamping device of this utility model for processing circuit board bottom shells has a simple structure, is easy to operate, and has a low manufacturing cost.
[0050] This invention relates to a clamping device for processing circuit board bottom shells. First, the workpiece 500 is positioned and fixed by the side-pressing action of the clamping mechanism 200, ensuring the circuit board bottom shell is in a set position and tightly adhered to the vacuum clamp 100. Then, the vacuum clamp 100 is activated to adsorb the circuit board bottom shell. This dual action of side-pressing and vacuum adsorption results in a more stable and secure clamping. This invention uses vacuum adsorption of the workpiece 500, combined with a side-pressing structure that applies pressure to the sidewall 130 of the workpiece 500, to fix the circuit board bottom shell in the clamping device, improving clamping reliability. Furthermore, the clamping distance of the clamping mechanism 200 is adjustable, and the clamping position and number are also adjustable, serving to guide and fix the workpiece 500, replacing the traditional method of pressing the workpiece 500 from top to bottom. Multiple clamping mechanisms 200 can be controlled synchronously, simplifying operation and reducing the need for secondary clamping.
[0051] Specifically, the clamping device first controls the needle cylinder 220 to operate, causing the needle cylinder 220 to drive the clamping block 230 to press against the side wall 130 of the circuit board bottom shell from the side. It can be understood that the positions of the through hole 120 and the clamping mechanism 200 can be set according to the shape of the side wall 130 of the circuit board bottom shell, thereby guiding and clamping the workpiece. Then, the vacuum solenoid valve is activated to control the on / off of the air source of the vacuum generator. When the equipment needs to perform processing, the vacuum solenoid valve opens, causing the vacuum generator to operate. Under the combined action of the vacuum air source and the sealing ring of the vacuum clamp 100, the circuit board bottom shell is vacuum-drawn in, thus completing the clamping of the workpiece 500. The equipment then processes the workpiece 500.
[0052] In some embodiments, see Figure 5 and Figure 6 A vacuum generator is installed between the vacuum fixture 100 and the gas source. A vacuum gauge or vacuum detector is installed on the vacuum fixture 100. During the machining of workpiece 500, the vacuum gauge detects the vacuum level of the vacuum fixture 100. When the vacuum level in the cavity 110 of the vacuum fixture 100 is found to be insufficient, a signal is fed back to the control system. The control system then stops the machining process, thus enabling vacuum level detection throughout the machining process and providing a good early warning system, which helps improve product yield. Furthermore, a pressure switch is installed between the vacuum fixture 100 and the vacuum generator. When the pressure in the cavity 110 of the vacuum fixture 100 exceeds the set range, the pressure switch can also control the on / off of the gas source and promptly feed back to the control system to stop the machining process.
[0053] Specifically, after the fixture mechanism 200 positions and clamps the workpiece 500, the control system receives the workpiece 500 processing instruction and connects the vacuum solenoid valve through the output of the control relay, so that the vacuum generator works. In conjunction with the operation of the fixture mechanism 200 to press the workpiece 500, the workpiece 500 is fixed on the clamping device. At the same time, during the processing of the workpiece 500, the vacuum gauge continuously monitors the vacuum degree of the vacuum fixture 100 and feeds it back to the control system to ensure the reliability of clamping, thereby helping to ensure the processing quality of the workpiece 500.
[0054] In some embodiments, see Figure 3 and Figure 6 In this embodiment of the invention, the vacuum clamp 100 has a near-square structure. The multiple cylinder solenoid valves are divided into two groups, namely the first solenoid valve group and the second solenoid valve group. Correspondingly, the multiple needle cylinders 220 are also divided into two groups, namely the first cylinder group 221 and the second cylinder group 222. The first cylinder group 221 is located on two sides of one of the right angles of the vacuum clamp 100, and the second cylinder group 222 is located on the remaining two sides of the vacuum clamp 100, that is, the second cylinder group 222 is located on the two diagonal sides of the aforementioned right angle. The first solenoid valve group is used to control the first cylinder group 221, and the second solenoid valve group is used to control the second cylinder group 222.
[0055] The above description is merely a preferred embodiment of this utility model. This utility model is not limited to the above-described embodiments. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this disclosure, as long as they achieve the same technical effect, should be included within the scope of protection of this disclosure and fall under the protection scope of this utility model. Within the protection scope of this utility model, the technical solutions and / or implementation methods can have various modifications and variations.
Claims
1. A clamping device for processing a circuit board bottom case, characterized by, include: A vacuum clamp (100) with vacuum adsorption function, wherein the vacuum clamp (100) is provided with a cavity (110) for accommodating a workpiece (500). Multiple clamping mechanisms (200) are provided, each clamping mechanism (200) including a clamping bracket (210) and a telescopic actuator, and a clamping block (230) that allows disengagement from or contact with the side wall (130) of a workpiece (500) in the cavity (110). The clamping bracket (210) is disposed on the vacuum clamp (100). The telescopic actuator is fixed to the clamping bracket (210), and the telescopic end of the telescopic actuator is connected to the clamping block (230).
2. The clamping device for processing a circuit board bottom case according to claim 1, wherein The sidewall (130) of the cavity (110) is provided with a plurality of perforations (120), and the clamping block (230) is movably disposed in the perforations (120).
3. The clamping device for processing a circuit board bottom case according to claim 1, wherein The clamp bracket (210) is provided with an installation channel (211), and an inner nut (250) is provided in the installation channel (211). The telescopic actuator is provided with an external thread. The telescopic actuator is partially disposed in the installation channel (211), and the external thread of the telescopic actuator is threadedly connected to the inner nut (250).
4. The clamping device for processing a circuit board bottom case according to claim 3, wherein The protruding end of the telescopic actuator, facing away from its telescopic end, protrudes from the clamp bracket (210), and the protruding end is connected to an outer nut (260).
5. The clamping device for processing a circuit board bottom case according to claim 1, wherein The multiple telescopic actuators are connected to several cylinder solenoid valves.
6. The clamping device for processing a circuit board bottom case according to claim 1, wherein Multiple clamping mechanisms (200) are symmetrically arranged on the vacuum clamp (100).
7. The clamping device for processing a circuit board bottom case according to claim 1, wherein The vacuum clamp (100) is connected to a vacuum generator and a vacuum solenoid valve for controlling the gas supply to and from the vacuum clamp (100).
8. The clamping device for processing a circuit board bottom case according to claim 1, wherein It also includes a base plate (300) and a plurality of support rods (400), the lower end of which is connected to the base plate (300) and the upper end of which is connected to the vacuum clamp (100).
9. The clamping device for processing a circuit board bottom case according to claim 1, wherein The vacuum fixture (100) is provided with a groove (150), and a sealing ring for abutting against the outer periphery of the workpiece (500) is provided in the groove (150).
10. The clamping device for processing a circuit board bottom case according to claim 1, wherein The base plate (300) of the vacuum clamp (100) is provided with an air groove (160) and an interface (170) for connecting an air source.