Wafer processing calibration positioning device

Abstract

The utility model provides a kind of wafer processing calibration positioning device, including adjusting chamber, detection control unit is equipped in adjusting chamber upper, lower platform is equipped in adjusting chamber lower, illumination unit, rotating bearing unit are sequentially equipped on lower platform, rotating bearing unit is used to provide illumination lighting for adjusting chamber to receive illumination unit, it is convenient for detection control unit to detect the motion track of wafer received by rotating bearing unit, by integrating detection control unit, illumination unit and rotating bearing unit inside adjusting chamber, high-precision dynamic center calibration and capture position identification to wafer are realized, arc-shaped load bar structure of flexible material is used to support wafer at multiple points, improve wafer stability and effectively inhibit reflection interference, guarantee image recognition accuracy;At the same time, hollow design and connect vacuum unit in rotating shaft assembly, guarantee the cleanliness and vacuum stability of device operating environment.

Description

Technical Field

[0001] This utility model relates to the field of coating technology, and more specifically, to a wafer processing calibration and positioning device. Background Technology

[0002] In semiconductor manufacturing equipment, a front-end module system is typically installed at the beginning of the transport path to achieve precise wafer handling and stable positioning. This system mainly consists of a wafer alignment device, a loading interface unit, and a handling robot. Among these, the alignment device, as a key piece of equipment for wafer centering and rotational correction, plays a decisive role in the overall manufacturing quality due to its operational accuracy.

[0003] In practical applications, wafers may have slight positional offsets within the storage cell due to placement tolerances. If these offsets are not corrected before being transferred directly to the process station, misalignment between the wafer and the target workstation can easily occur, affecting the uniformity of the reaction process and potentially leading to edge damage, wafer breakage, and other abnormal risks. Especially in advanced processes, even minute deviations can cause pattern misalignment, impacting chip yield.

[0004] Although traditional methods can correct deviations through manual observation and adjustment, these methods are inefficient and have poor repeatability, making it difficult to meet the current technical requirements for rapid, accurate, and automated production.

[0005] Therefore, before the wafer enters the main process module, an automated alignment system is usually set up to complete the center positioning and angle calibration of the wafer in a clean environment, thereby ensuring the accurate execution of the subsequent robotic arm gripping action and providing a basic guarantee for the stable processing of the wafer. Utility Model Content

[0006] In view of this, in order to solve the above problems, this utility model proposes a wafer processing calibration and positioning device with a simple structure and improved wafer processing accuracy.

[0007] A wafer processing calibration and positioning device is characterized by comprising an adjustment chamber, an upper detection control unit 1 for detecting the wafer movement trajectory of the wafer held in the adjustment chamber and controlling the gripping position of an external robotic arm, and a lower platform 2 for the lower part of the adjustment chamber, on which an illumination unit 3 and a rotating bearing unit 4 are sequentially arranged. The rotating bearing unit 4 is used to provide illumination for the wafer held in the adjustment chamber, and the illumination unit 3 is used to provide illumination to facilitate the detection control unit 1 in detecting the wafer movement trajectory of the wafer held in the rotating bearing unit 4.

[0008] Furthermore, the rotating bearing unit 4 includes a bearing platform 41 and a rotating shaft assembly 42. The rotating shaft assembly 42 is provided on the lower platform 2, and the bearing platform 41 is provided above the rotating shaft assembly 42. The rotating shaft assembly 42 is used to drive the bearing platform 41 to rotate in a circle.

[0009] Furthermore, the upper surface of the support platform 41 is provided with a number of spaced carrier rods 43 along the circumferential direction, and a support gap structure is formed between each carrier rod 43 to stabilize the wafer position and avoid reflection interference.

[0010] Furthermore, the carrier rod 43 is made of a flexible material with an arc-shaped contact surface structure at the top, which is used to stabilize the wafer placement position and reduce surface reflection interference and micro-vibration effects caused by hard contact.

[0011] In some embodiments, the rotating shaft assembly 42 is connected to a vacuum pumping unit 5, which is connected to an external vacuum source via the hollow channel of the rotating shaft assembly 42, and is used to pump out the gas in the regulating chamber so that the regulating chamber reaches the vacuum level required for wafer inspection.

[0012] In some embodiments, the lighting unit 3 includes a structure of multiple symmetrically arranged LED point light sources 31 and a light guide plate 32. The light guide plate is provided with a diffuse reflection film layer to provide uniform illumination and reduce reflection interference on the wafer surface.

[0013] In some embodiments, the detection control unit 1 integrates an image acquisition module and a motion control module. The image acquisition module is triggered synchronously with the illumination unit 3 to achieve high frame rate wafer trajectory image acquisition and dynamic position recognition.

[0014] In some embodiments, a height sensing component is provided between the detection control unit 1 and the rotating bearing unit 4. The height sensing component detects the vertical distance between the wafer and the detection control unit 1 in real time and feeds the height data back to the motion control module to correct the gripping height and lowering depth of the external robot arm in a closed loop.

[0015] The working principle of this utility model:

[0016] First, an external wafer transfer robot removes the wafer to be inspected from the wafer cassette and places it on the rotating support unit of this device. The support unit supports the wafer through a flexible carrier rod structure, avoiding damage and glare interference caused by rigid contact.

[0017] Secondly, the illumination unit is activated to provide uniform illumination for the wafer, enabling the detection and control unit above to accurately acquire feature images such as wafer edges and notches. The rotating shaft assembly drives the carrier platform to rotate circumferentially, which, together with the image acquisition module, enables omnidirectional trajectory scanning of the wafer.

[0018] Next, the detection control unit analyzes the center position and rotation angle of the wafer based on the data obtained by the image acquisition module, and combines the feedback from the height sensing component to determine the vertical distance between the wafer and the detection module, forming a complete position information model.

[0019] Then, the motion control module outputs instructions based on the analysis results to adjust the gripping position and lowering angle of the external robotic arm, thereby achieving precise calibration and handling of the wafer.

[0020] Finally, the rotating support unit stops rotating, and the robot arm completes the wafer removal and transfer according to the instructions, thus ending the entire calibration process.

[0021] The beneficial effects of this utility model are as follows: This utility model proposes a wafer processing calibration and positioning device, including an adjustment chamber. A detection and control unit 1 is located above the adjustment chamber. The detection and control unit 1 is used to detect the wafer's motion trajectory and control the gripping position of an external robotic arm. A lower platform 2 is located below the adjustment chamber. An illumination unit 3 and a rotating support unit 4 are sequentially arranged on the lower platform 2. The rotating support unit 4 is used to illuminate the wafer supported by the adjustment chamber. The illumination unit 3 provides illumination to facilitate the detection and control unit 1's detection of the wafer's motion trajectory. By integrating the detection and control unit, the illumination unit, and the rotating support unit inside the adjustment chamber, high-precision dynamic center calibration and gripping position recognition of the wafer are achieved. The use of a flexible, arc-shaped support rod structure provides multi-point support for the wafer, improving wafer stability and effectively suppressing reflective interference, thus ensuring image recognition accuracy. Simultaneously, the hollow design of the rotating shaft assembly, connected to a vacuum unit, ensures the cleanliness and vacuum stability of the device's operating environment. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the wafer processing calibration and positioning device of this utility model.

[0023] Figure 2 This is a schematic diagram of the lower platform of the wafer processing calibration and positioning device of this utility model.

[0024] Figure 3 This is a schematic diagram of the lower platform of the wafer processing calibration and positioning device of this utility model.

[0025] Explanation of main component symbols

[0026] Detection and control unit 1, lower platform 2, lighting unit 3, LED point light source 31, light guide plate 32, rotating bearing unit 4, bearing platform 41, rotating shaft assembly 42, carrier rod 43, vacuum unit 5.

[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation Example 1:

[0028] like Figure 1 The diagram shown is a schematic representation of the overall structure of the wafer processing calibration and positioning device of this utility model; as shown... Figure 2 The diagram shown is a schematic representation of the lower platform of the wafer processing calibration and positioning device of this invention; as shown... Figure 3 The diagram shown is a schematic representation of the lower platform of the wafer processing calibration and positioning device of this invention.

[0029] A wafer processing calibration and positioning device is characterized by comprising an adjustment chamber, an upper detection control unit 1 for detecting the wafer movement trajectory of the wafer held in the adjustment chamber and controlling the gripping position of an external robotic arm, and a lower platform 2 for the lower part of the adjustment chamber, on which an illumination unit 3 and a rotating bearing unit 4 are sequentially arranged. The rotating bearing unit 4 is used to provide illumination for the wafer held in the adjustment chamber, and the illumination unit 3 is used to provide illumination to facilitate the detection control unit 1 in detecting the wafer movement trajectory of the wafer held in the rotating bearing unit 4.

[0030] The rotating bearing unit 4 includes a bearing platform 41 and a rotating shaft assembly 42. The rotating shaft assembly 42 is provided on the lower platform 2, and the bearing platform 41 is provided above the rotating shaft assembly 42. The rotating shaft assembly 42 is used to drive the bearing platform 41 to rotate in a circle.

[0031] The upper surface of the support platform 41 is provided with a number of spaced carrier rods 43 along the circumferential direction. Each carrier rod 43 forms a support gap structure to stabilize the wafer position and avoid reflective interference.

[0032] The carrier rod 43 is made of flexible material and has an arc-shaped contact surface structure at the top, which is used to stabilize the wafer placement position and reduce surface reflection interference and micro-vibration effects caused by hard contact.

[0033] The rotating shaft assembly 42 is connected to a vacuum pumping unit 5, which is connected to an external vacuum source through the hollow channel of the rotating shaft assembly 42. The vacuum pumping unit 5 is used to pump out the gas in the regulating chamber so that the regulating chamber reaches the vacuum level required for wafer inspection.

[0034] The lighting unit 3 includes a structure of multiple symmetrically arranged LED point light sources 31 and a light guide plate 32. The light guide plate is provided with a diffuse reflection film layer to provide uniform illumination and reduce reflection interference on the wafer surface.

[0035] The detection and control unit 1 integrates an image acquisition module and a motion control module. The image acquisition module is triggered synchronously with the illumination unit 3 to achieve high frame rate wafer trajectory image acquisition and dynamic position recognition.

[0036] A height sensing component is provided between the detection control unit 1 and the rotating bearing unit 4. The height sensing component detects the vertical distance between the wafer and the detection control unit 1 in real time and feeds the height data back to the motion control module to correct the gripping height and lowering depth of the external robot arm in a closed loop.

[0037] The beneficial effects of this utility model are as follows: This utility model proposes a wafer processing calibration and positioning device, including an adjustment chamber. A detection and control unit 1 is located above the adjustment chamber. The detection and control unit 1 is used to detect the wafer's motion trajectory and control the gripping position of an external robotic arm. A lower platform 2 is located below the adjustment chamber. An illumination unit 3 and a rotating support unit 4 are sequentially arranged on the lower platform 2. The rotating support unit 4 is used to illuminate the wafer supported by the adjustment chamber. The illumination unit 3 provides illumination to facilitate the detection and control unit 1's detection of the wafer's motion trajectory. By integrating the detection and control unit, the illumination unit, and the rotating support unit inside the adjustment chamber, high-precision dynamic center calibration and gripping position recognition of the wafer are achieved. The use of a flexible, arc-shaped support rod structure provides multi-point support for the wafer, improving wafer stability and effectively suppressing reflective interference, thus ensuring image recognition accuracy. Simultaneously, the hollow design of the rotating shaft assembly, connected to a vacuum unit, ensures the cleanliness and vacuum stability of the device's operating environment.

[0038] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer processing calibration positioning apparatus, characterized by: The device includes an adjustment chamber. A detection control unit (1) is provided above the adjustment chamber. The detection control unit (1) is used to detect the wafer movement trajectory of the wafer held in the adjustment chamber and control the gripping position of the external robot arm. A lower platform (2) is provided below the adjustment chamber. An illumination unit (3) and a rotating bearing unit (4) are provided on the lower platform (2) in sequence. The rotating bearing unit (4) is used to support the wafer held in the adjustment chamber. The illumination unit (3) is used to provide illumination to facilitate the detection control unit (1) to detect the wafer movement trajectory of the wafer held in the rotating bearing unit (4).

2. The wafer processing calibration positioning apparatus of claim 1, wherein: The rotating bearing unit (4) includes a bearing platform (41) and a rotating shaft assembly (42). The rotating shaft assembly (42) is provided on the lower platform (2), and the bearing platform (41) is provided above the rotating shaft assembly (42). The rotating shaft assembly (42) is used to drive the bearing platform (41) to rotate in a circle.

3. The wafer processing calibration positioning apparatus of claim 1, wherein: The upper surface of the support platform (41) is provided with a number of spaced carrier rods (43) along the circumferential direction. A support gap structure is formed between each carrier rod (43) to stabilize the wafer position and avoid reflective interference.

4. The wafer processing calibration positioning apparatus of claim 1, wherein: The carrier rod (43) is made of flexible material and has an arc-shaped contact surface structure at the top, which is used to stabilize the wafer placement position and reduce surface reflection interference and micro-vibration effects caused by hard contact.

5. The wafer processing calibration positioning apparatus as set forth in claim 1, wherein: The rotating shaft assembly (42) is connected to a vacuum pumping unit (5). The vacuum pumping unit (5) is connected to an external vacuum source through the hollow channel of the rotating shaft assembly (42) and is used to pump out the gas in the regulating chamber so that the regulating chamber reaches the vacuum level required for wafer detection.

6. The wafer processing calibration positioning apparatus of claim 1, wherein: The lighting unit (3) includes a structure of multiple symmetrically arranged LED point light sources (31) and a light guide plate (32). The light guide plate is provided with a diffuse reflection film layer to provide uniform illumination and reduce reflective interference on the wafer surface.

7. The wafer processing calibration positioning apparatus of claim 1, wherein: The detection control unit (1) integrates an image acquisition module and a motion control module. The image acquisition module is triggered synchronously with the illumination unit (3) to achieve high frame rate wafer trajectory image acquisition and dynamic position recognition.

8. The wafer processing calibration positioning apparatus of claim 1, wherein: A height sensing component is provided between the detection control unit (1) and the rotating bearing unit (4). The height sensing component detects the vertical distance between the wafer and the detection control unit (1) in real time and feeds the height data back to the motion control module to correct the gripping height and lowering depth of the external robot arm in a closed loop.

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