Chip frame structure for improving pin voltage resistance performance

Abstract

This invention discloses a chip frame structure for improving pin withstand voltage performance, comprising a frame body with a plurality of frame units arranged in an array on the frame body; pins 1, 3, 4, 5, 6, 7, and 8 of uniform width are arranged at intervals on one side of each frame unit; pins 9, 11, 13, and 15 are arranged at intervals on the other side of each frame unit; pin 9 has the same width as pin 1, and pins 11, 13, and 15 have a width 2 to 5 times that of pin 1. This invention widens the pins by merging some pins, which significantly improves the withstand voltage threshold and conduction current capability of the pins, effectively solving the shortcomings of existing SOP16 wide-body frames in terms of current and voltage withstand capability.

Description

Technical Field

[0001] This utility model relates to the field of electronic component frame technology, and in particular to a chip frame structure that improves the pin withstand voltage performance. Background Technology

[0002] In the current field of electronic component manufacturing, the SOP16 wide-body frame is a commonly used electronic component carrier and is widely used in the packaging process of various integrated circuits. However, the pin width of the existing SOP16 wide-body frame is usually fixed at 0.39mm. This structural design greatly limits the frame's ability to conduct current and withstand voltage in practical applications, making it difficult to meet the needs of some high-power, high-voltage electronic devices.

[0003] Meanwhile, as electronic devices develop towards miniaturization and high performance, the requirements for chip wire bonding space are also increasing. The existing SOP16 wide-body frame is a regular and orderly 16L structure with a relatively fixed pin layout. The narrow chip wire bonding space not only brings inconvenience to the wire bonding process, but may also affect the wire bonding quality due to insufficient space, thereby affecting the overall performance and reliability of electronic components.

[0004] To address the issues of insufficient conduction current, voltage withstand capability, and limited space for wire bonding, the industry has attempted to improve current and voltage withstand capabilities by connecting wires in series. However, this approach not only increases the complexity of the production process and raises production costs, but may also introduce new potential faults due to connection problems during the series connection process, failing to fundamentally meet the performance requirements of electronic equipment frames. Utility Model Content

[0005] To address the aforementioned issues, this invention provides a chip frame structure that improves pin withstand voltage performance, effectively enhancing conduction current and withstand voltage while increasing wire bonding space.

[0006] Therefore, the technical solution of this utility model is: a chip frame structure for improving pin withstand voltage performance, comprising a frame body, on which a plurality of frame units arranged in an array are provided; on one side of each frame unit, pins 1, 3, 4, 5, 6, 7, and 8 with the same width are arranged at intervals; on the other side of each frame unit, pins 9, 11, 13, and 15 are arranged at intervals; the width of pin 9 is the same as that of pin 1, and the width of pins 11, 13, and 15 is 2 to 5 times that of pin 1.

[0007] Based on the above scheme and as a preferred embodiment of the above scheme: the frame unit is provided with a first base island, a second base island and a third base island arranged at intervals, wherein pin 15 is connected to the first base island, pins 11 and 13 are connected to the second base island and pin 8 is connected to the third base island.

[0008] Based on the above scheme and as a preferred embodiment of the above scheme: pin 15 is used as a power input terminal, and pins 11 and 13 are used as switch control terminals.

[0009] Based on the above scheme and as a preferred embodiment of the above scheme: the width of the 1st, 3rd, 4th, 5th, 6th, 7th, 8th and 9th pins is 0.39mm; the width of the 11th and 13th pins is 1.25mm; and the width of the 15th pin is 1.66mm.

[0010] Based on the above scheme and as a preferred embodiment of the above scheme: the main frame body is provided with 20 columns along the length direction, and each column is provided with 6 frame units.

[0011] Compared with the prior art, the beneficial effects of this utility model are: By merging some pins to widen the pins, the widened pins can significantly improve the withstand voltage threshold and conduction current capability, easily meeting the requirements of high-power, high-voltage electronic devices for frame conduction and withstand voltage performance. This effectively solves the shortcomings of existing SOP16 wide-body frames in terms of current and voltage withstand capability; no wire bonding is required, which improves the stability and reliability of electronic component production.

[0012] By adjusting the pin layout, the dense distribution of pins is reduced, leaving more operating space for wire bonding. This not only reduces the operational difficulty of the wire bonding process but also effectively avoids wire bonding quality problems caused by limited space, thereby ensuring the overall performance and reliability of electronic components and improving production yield.

[0013] 3. Widening the pins corresponding to the power input terminal and the switch control terminal can optimize the current conduction path, further improve the functional adaptability of the frame in the circuit, and meet the packaging and circuit connection requirements of different electronic components.

[0014] 4. The main frame is arranged in an array of 20 columns with 6 frame units per column along its length. This allows multiple frame units to be processed simultaneously in a single processing run, meeting the needs of large-scale production and effectively improving production efficiency while reducing the manufacturing cost per unit. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a structural schematic diagram of a single frame unit of this utility model; Figure 3 This is a diagram of the pin structure after the present invention is packaged.

[0016] The components in the diagram are labeled as follows: main frame 1, frame unit 2, first base island 21, second base island 22 and third base island 23, pin 1 P1, pin 3 P3, pin 4 P4, pin 5 P5, pin 6 P6, pin 7 P7, pin 8 P8, pin 9 P9, pin 11 P11, pin 13 P13, and pin 15 P15. Detailed Implementation

[0017] See the attached figures. The chip frame structure for improving pin withstand voltage performance described in this embodiment includes a frame body 1. The frame body follows the SOP16 wide-body frame design specification and uses the Matrax design for connection. The Matrax design improves the utilization rate of the frame. The frame size is 272.093*78mm, with a total of 6 rows and 20 columns, and the number of frame units 2 is 120EA.

[0018] The frame unit 2 has a set of pins P1, P3, P4, P5, P6, P7, and P8 of the same width arranged on one side. These pins have the same width as the pins on a standard SOP16 wide-body frame, which is 0.39mm. The original pin 2 is omitted, which increases the spacing between pins P1 and P3, making it easier to wire.

[0019] On the other side of the frame unit 2, pins 9 (P9), 11 (P11), 13 (P13), and 15 (P15) are arranged at intervals; pin 9 (P9) is the same as pin 9 on a standard SOP16 wide-body frame, with a width H1 of 0.39 mm, omitting pin 10; a new pin 11 (P11) is set at the positions of pins 11 and 12 on the standard SOP16 wide-body frame, with a width H2 of 1.25 mm; on the standard SOP16 wide-body frame... On the OP16 wide-body frame, a new pin 13, P13, with a width H3 of 1.25mm, is set at the positions of pins 13 and 14. Pins 11, P11, and 13, P13, can be used as switch control terminals in subsequent use. On the standard SOP16 wide-body frame, a new pin 15, P15, with a width H4 of 1.66mm, is set at the positions of pins 15 and 16. Pin 15, P15, can be used as a power input terminal in subsequent use.

[0020] The frame unit 2 includes a first base island 21, a second base island 22, and a third base island 23 arranged at intervals. The first base island 21 is used to carry power chips, the second base island 22 is used to carry control chips, and the third base island 23 carries other chips according to its function. Pin 15 P15 is connected to the first base island 21, pins 11 P11 and 13 P13 are connected to the second base island 22, and pin 8 P8 is connected to the third base island 23.

[0021] In this embodiment, the pin structure fabrication process abandons the existing SOP16 wide-body frame with its regular and orderly 16L pin structure. Instead, it adopts an irregularly shaped pin width frame design and merges some pins through specific die stamping or etching processes. During the pin merging process, the size and shape of the merging area are precisely controlled to ensure that the merged pins can stably withstand conduction current and voltage far exceeding that of normal pins. Simultaneously, by optimizing the pin arrangement spacing and shape, sufficient space is reserved for wire bonding (WB) of the chip pins based on the merged pins, ensuring the smooth progress and quality of subsequent wire bonding processes.

[0022] After the frame is fabricated, it undergoes performance testing, focusing on the pin conduction current, withstand voltage, and wire bonding space dimensions after the pins are merged. Professional electrical testing equipment is used to measure the pin conduction current and withstand voltage values, ensuring they are several times higher than those of normal pins. Precision measuring tools are used to check the wire bonding space dimensions to ensure they meet the requirements of the chip wire bonding process. The qualified frame can then be used in the packaging production of various electronic components. For example, in the production of high-power integrated circuit modules, this frame provides stable current conduction and voltage withstand capability for the chip, and the ample wire bonding space improves the reliability of the connection between the chip and the frame, thereby enhancing the performance and lifespan of the entire integrated circuit module.

[0023] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A chip frame structure for improving pin withstand voltage performance, comprising a frame body, wherein a plurality of frame units are arranged in an array on the frame body; characterized in that: The frame unit has pins 1, 3, 4, 5, 6, 7, and 8 of equal width spaced apart on one side; and pins 9, 11, 13, and 15 of equal width spaced apart on the other side. Pin 9 has the same width as pin 1, and the width of pins 11, 13, and 15 is 2 to 5 times that of pin 1.

2. The chip frame structure for improving pin withstand voltage performance as described in claim 1, characterized in that: The frame unit is provided with a first base island, a second base island and a third base island arranged at intervals, wherein pin 15 is connected to the first base island, pins 11 and 13 are connected to the second base island and pin 8 is connected to the third base island.

3. The chip frame structure for improving pin withstand voltage performance as described in claim 1, characterized in that: Pin 15 is used as the power input terminal, and pins 11 and 13 are used as switch control terminals.

4. The chip frame structure for improving pin withstand voltage performance as described in claim 1, characterized in that: The width of pins 1, 3, 4, 5, 6, 7, 8, and 9 is 0.39 mm; the width of pins 11 and 13 is 1.25 mm; and the width of pin 15 is 1.66 mm.

5. The chip frame structure for improving pin withstand voltage performance as described in claim 1, characterized in that: The main frame has 20 columns along its length, with 6 frame units in each column.

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