Vacuum film pasting device

Abstract

This application relates to the technical field of film lamination equipment, and discloses a vacuum film lamination device. The device includes an infeed conveyor mechanism, a carrier film unwinding mechanism, a vacuum film lamination mechanism, and an outfeed conveyor mechanism. The carrier film unwinding mechanism includes an upper carrier film unwinding assembly, an upper carrier film, a lower carrier film unwinding assembly, and a lower carrier film. The infeed conveyor mechanism is located between the unwinding end of the upper carrier film unwinding assembly and the unwinding end of the lower carrier film unwinding assembly. The outfeed conveyor mechanism is located between the winding end of the upper carrier film unwinding assembly and the winding end of the lower carrier film unwinding assembly. The vacuum film lamination mechanism is located between the upper carrier film unwinding assembly and the lower carrier film unwinding assembly. The upper carrier film is rotatably connected to the upper carrier film unwinding assembly, and the lower carrier film is rotatably connected to the lower carrier film unwinding assembly. The upper carrier film and the lower carrier film are respectively attached to the upper and lower surfaces of the wafer conveyed by the infeed conveyor mechanism, sending the wafer into the vacuum film lamination mechanism and the outfeed conveyor mechanism. This application improves the bonding accuracy between the protective film and the wafer, increases the production yield, and reduces production costs.

Description

Technical Field

[0001] This application relates to the technical field of film application equipment, and in particular to a vacuum film application equipment. Background Technology

[0002] In semiconductor manufacturing, wafers are typically coated with films, primarily for protection, process assistance, and positioning. In terms of physical protection, films prevent damage to the wafer from mechanical stress during dicing and handling, while also isolating dust and other contaminants to avoid affecting process precision. For process assistance, films provide support for wafer thinning, protect high aspect ratio structures from deformation and breakage, and can be applied in special scenarios such as maintaining wafer stability in advanced packaging. At the positioning level, optical markings on the films facilitate precise operations in processes like dicing and adapt to automated workflows, improving production efficiency.

[0003] Traditional roll-on lamination relies on rigid rollers or pressure plates to apply mechanical pressure. This mechanical pressure can easily damage the wafer or cause uneven bonding. Conventional vacuum lamination is also unable to eliminate air trapping in high aspect ratio structures, resulting in problems such as residual bubbles and insufficient bonding accuracy. These issues affect the yield of subsequent semiconductor processes and increase costs. Utility Model Content

[0004] The technical problem to be solved by this application is to provide a vacuum film bonding device to eliminate residual air bubbles, improve the bonding accuracy between the protective film and the wafer, thereby improving the yield of subsequent semiconductor processes and reducing production costs.

[0005] To address the aforementioned problems, this application provides a vacuum laminating device, including a frame, and further comprising an infeed conveying mechanism, a carrier film take-up and untake-up mechanism, a vacuum laminating mechanism, and an outfeed conveying mechanism disposed on the frame. The carrier film take-up and untake-up mechanism includes an upper carrier film take-up and untake-up assembly, an upper carrier film, a lower carrier film take-up and untake-up assembly, and a lower carrier film. The infeed conveying mechanism is disposed between the unwinding end of the upper carrier film take-up and untake-up assembly and the unwinding end of the lower carrier film take-up and untake-up assembly. The outfeed conveying mechanism is disposed between the winding end of the upper carrier film take-up and untake-up assembly and the winding end of the lower carrier film take-up and untake-up assembly. The vacuum laminating mechanism is disposed between the upper carrier film take-up and untake-up assembly and the lower carrier film take-up and untake-up assembly. The upper carrier film is rotatably connected to the upper carrier film take-up and untake-up assembly, and the lower carrier film is rotatably connected to the lower carrier film take-up and untake-up assembly. The upper carrier film and the lower carrier film are respectively attached to the upper and lower surfaces of the wafer conveyed by the infeed conveying mechanism. The upper carrier film and the lower carrier film cooperate to clamp the wafer and feed it into the vacuum laminating mechanism, and then convey the wafer to the outfeed conveying mechanism.

[0006] Preferably, the loading film take-up and take-down assembly includes a drive wheel, a synchronous wheel, several driven wheels, and two sets of first driving members. The drive wheel, synchronous wheel, and each driven wheel are rotatably connected to the frame, and the drive wheel and synchronous wheel are located on both sides of the vacuum film application mechanism. The fixed end of the loading film is sleeved on the drive wheel, and the movable end of the loading film is sequentially wound around several driven wheels and synchronous wheels. The first driving members are disposed on the frame, with the driving end of one set of first driving members connected to the drive wheel and the driving end of the other set of first driving members connected to the synchronous wheel.

[0007] Preferably, the upper film loading and unloading assembly further includes an air knife, which is disposed between two adjacent driven wheels on the feeding side of the vacuum film applicator, and the upper film passes through the air knife.

[0008] Preferably, the vacuum film-applying mechanism includes a vacuum valve, a heating element, a base, an upper mold, a pressing mold, and a second driving element. The vacuum valve is connected to the upper mold, the upper mold is fixedly connected to the top of the base, the pressing mold is slidably connected to the base, and a pressing cavity is formed between the upper mold and the pressing mold. The heating element is respectively disposed on the upper mold and the pressing mold. The second driving element is disposed on the base, and the driving end of the second driving element is fixedly connected to the pressing mold.

[0009] Preferably, the vacuum film-applying mechanism further includes a limiting block, and the base is provided with support columns around its perimeter. The pressing mold is slidably connected to the support columns, and the limiting block is detachably connected to the support columns between the upper mold and the pressing mold.

[0010] Preferably, the vacuum laminating device further includes a first cooling fan, which is respectively disposed on the upper mold and the pressing mold.

[0011] Preferably, the vacuum film laminating equipment further includes a second cooling fan, which is respectively disposed between the upper film receiving and discharging assembly and the lower film receiving and discharging assembly on the material discharge side of the vacuum film laminating mechanism.

[0012] Preferably, the feeding conveying mechanism includes a third driving member, a driving roller, a driven roller, and a conveyor belt. The driving roller and the driven roller are rotatably connected to the frame, the driving end of the third driving member is connected to the driving roller, and the conveyor belt is tumbledly connected to the driving roller and the driven roller.

[0013] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0014] The wafer, placed before the infeed conveyor, has a protective film pre-applied to its surface via spot heating. The infeed conveyor transports the pre-filmed wafer to the feed end of the vacuum laminating mechanism. Simultaneously, the upper and lower film take-up / reel-down components are driven to move the upper and lower films along the wafer's transport direction, respectively, attaching them to the upper and lower surfaces of the wafer to form a "sandwich" clamping structure. This provides uniform support for the wafer during transport and pressing, offsetting mechanical stress and preventing wafer breakage and edge chipping due to uneven clamping force. The upper and lower films employ a take-up / reel-down design, automatically recycling waste material after a single use, reducing film waste (traditional single-sheet lamination requires frequent film replacement). A tension control system maintains film flatness, ensuring consistency across multiple batches of lamination.

[0015] The loading and unloading films feed the wafer into the vacuum lamination mechanism. By evacuating air to create a negative pressure environment, tiny air bubbles between the wafer and the protective film are completely eliminated. This avoids defects such as wrinkles and blistering caused by residual gas in traditional atmospheric pressure lamination, thereby improving the bonding accuracy between the protective film and the wafer, increasing the yield of subsequent semiconductor processes, and reducing production costs. The board feeding and unloading mechanisms, together with the loading and unloading film take-up and take-up components, automate the entire process of wafer lamination from "pre-lamination film feeding → vacuum pressing → lamination completion output" without manual intervention. This shortens the single-wafer lamination cycle, adapts to large-scale mass production needs, and improves production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the vacuum film application device in the embodiments of this application.

[0018] Figure 2 This is a schematic diagram of the infeed conveyor mechanism, the carrier film feeding and unloading mechanism, and the outfeed conveyor mechanism in the embodiments of this application.

[0019] Figure 3 This is a schematic diagram of the vacuum film application mechanism in an embodiment of this application.

[0020] Figure 4 This is a schematic diagram of the feeding conveyor mechanism in the embodiments of this application.

[0021] Explanation of reference numerals in the attached drawings: 1. Board feeding conveyor mechanism; 11. Third drive component; 12. Drive roller; 13. Driven roller; 14. Conveyor belt; 2. Carrier film take-up and unload mechanism; 21. Upper carrier film take-up and unload assembly; 211. Drive wheel; 212. Synchronous wheel; 213. Driven wheel; 214. First drive component; 215. Air knife; 22. Upper carrier film; 23. Lower carrier film take-up and unload assembly; 24. Lower carrier film; 3. Vacuum laminating mechanism; 31. Vacuum valve; 32. Heating component; 33. Base; 34. Upper mold; 35. Pressing mold; 36. Second drive component; 37. Pressing cavity; 38. Limiting block; 39. Support column; 4. Board discharge conveyor mechanism; 5. First cooling fan; 6. Second cooling fan; 7. Wafer. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0024] It should also be understood that the terminology used in this application specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0025] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0026] Please refer to Figures 1 to 4 This application provides a vacuum laminating device for vacuum laminating pre-laminated wafers. The device includes a frame, and further includes an infeed conveyor mechanism 1, a carrier film delivery mechanism 2, a vacuum laminating mechanism 3, and an outfeed conveyor mechanism 4, all mounted on the frame.

[0027] Specifically, the carrier film take-up and take-up mechanism 2 includes an upper carrier film take-up and take-up assembly 21, an upper carrier film 22, a lower carrier film take-up and take-up assembly 23, and a lower carrier film 24. The board feeding conveyor 1 is located between the unwinding end of the upper carrier film take-up and take-up assembly 21 and the unwinding end of the lower carrier film take-up and take-up assembly 23. The board output conveyor 4 is located between the winding end of the upper carrier film take-up and take-up assembly 21 and the winding end of the lower carrier film take-up and take-up assembly 23. The vacuum laminating mechanism 3 is located between the upper carrier film take-up and take-up assembly 21 and the lower carrier film take-up assembly 23. The upper carrier film 22 is rotatably connected to the upper carrier film take-up and take-up assembly 21, and the lower carrier film 24 is rotatably connected to the lower carrier film take-up assembly 23. The upper carrier film 22 and the lower carrier film 24 are respectively attached to the upper and lower surfaces of the wafer 7 conveyed by the board feeding conveyor 1. The upper carrier film 22 and the lower carrier film 24 cooperate to clamp the wafer 7 and feed it into the vacuum laminating mechanism 3, and then convey the wafer 7 to the board output conveyor 4.

[0028] In this embodiment, the upper film take-up and lower film take-up and upper ...

[0029] In this embodiment, the wafer 7 is placed in front of the infeed conveyor mechanism 1. A protective film has been pre-applied to the surface of the wafer 7 by point heating. The infeed conveyor mechanism 1 is used to transport the pre-applied wafer 7 to the feed end of the vacuum laminating mechanism 3. At the same time, the upper film take-up assembly 21 and the lower film take-up assembly 23 are driven to move the upper film 22 and the lower film 24 along the conveying direction of the wafer 7, respectively, so that the upper film 22 and the lower film 24 are respectively attached to the upper and lower surfaces of the wafer 7, forming a "sandwich" clamping structure. During the conveying and pressing process, it provides uniform support for the wafer 7, offsets mechanical stress, and prevents the wafer 7 from breaking or chipping due to uneven clamping force. The upper film 22 and the lower film 24 adopt a take-up and take-up design, and the waste material can be automatically recycled after a single use, reducing film material waste (traditional single-sheet lamination requires frequent replacement of film material). At the same time, the tension control system maintains the flatness of the film material, ensuring the consistency of multiple batches of lamination.

[0030] The loading film 22 and the unloading film 24 feed the wafer 7 into the vacuum film-laying mechanism 3. By evacuating the air to create a negative pressure environment, the tiny air bubbles between the wafer 7 and the protective film can be completely eliminated. This avoids defects such as film wrinkles and blistering caused by residual gas in traditional atmospheric pressure film-laying, thereby improving the bonding accuracy between the protective film and the wafer 7, increasing the yield of subsequent semiconductor processes, and reducing production costs. The board feeding mechanism 1 and the board output mechanism 4, together with the loading and unloading film take-up and drop-down assembly 23, realize the full automation of the wafer 7 from "pre-film feeding to vacuum pressing to film-laying completion output" without manual intervention, shortening the film-laying cycle of a single wafer 7, adapting to the needs of large-scale mass production, and improving production efficiency.

[0031] Please refer to Figure 2 In one specific embodiment, the loading film take-up and take-down assembly 21 includes a drive wheel 211, a synchronous wheel 212, several driven wheels 213, and two sets of first driving members 214. The drive wheel 211, synchronous wheel 212, and each driven wheel 213 are rotatably connected to the frame. The drive wheel 211 and synchronous wheel 212 are located on the feeding side and discharging side of the vacuum film applicator 3, respectively. The fixed end of the loading film 22 is sleeved on the drive wheel 211, and the movable end of the loading film 22 is sequentially wound around the several driven wheels 213 and the synchronous wheel 212. The first driving members 214 are mounted on the frame. The driving end of one set of first driving members 214 is connected to the drive wheel 211, and the driving end of the other set of first driving members 214 is connected to the synchronous wheel 212.

[0032] In this embodiment, a set of first driving components 214 are connected to one end of the motor and the drive wheel 211 via a synchronous belt to drive the drive wheel 211. Another set of first driving components 214 are connected to one end of the motor and the synchronous wheel 212 via a synchronous belt to drive the synchronous wheel 212. This loading film take-up and take-down assembly 21 uses dual motors to independently drive the drive wheel 211 and the synchronous wheel 212, achieving high-precision tension control, dynamic speed matching, and fault redundancy protection for the loading film 22 during the wafer 7 lamination process.

[0033] To address this, one set of first drive components 214 directly drives the drive wheel 211, serving as the unwinding power source for the loaded film 22 and controlling the speed at which the film material is released from the initial roll. Another set of first drive components 214 independently drives the synchronous wheel 212, serving as the winding power source and controlling the recovery speed of the used film material. Synchronous control logic: The two motors are synchronously controlled by a servo system, dynamically adjusting the output torque according to preset tension values ​​(e.g., 10 N / m) and linear speeds (e.g., 200 mm / s) to ensure precise matching of the linear speeds of the drive wheel 211 and the synchronous wheel 212 (e.g., error < ±0.1%). Precise tension control prevents plastic deformation of the film material due to overstretching, extending the film material's service life.

[0034] Furthermore, the loading film take-up and take-up assembly 21 also includes an air knife 215. The air knife 215 is located between two adjacent driven rollers 213 on the feeding side of the vacuum film attaching mechanism 3, and the loading film 22 first passes through the air knife 215 and then is attached to the upper surface of the wafer 7.

[0035] The narrow-slit nozzle inside the air knife 215 can accelerate compressed air to 200-300 m / s, forming a uniform airflow sheet. Utilizing the shear force generated by the Coanda effect, particles ≥0.1 μm in diameter (such as silicon chips and photoresist residue) are peeled off from the film surface. Simultaneously, an integrated ion generator (such as a corona discharge ion bar) carries positive and negative ions in the airflow, reducing the electrostatic potential of the film surface from ±5 kV to below ±100 V. Furthermore, the air knife 215 is mounted between two driven wheels 213, using the aerodynamic resistance generated by the airflow impact to assist in adjusting the film tension, preventing stretching deformation of ultra-thin films (such as PI films below 20 μm) during mechanical tension control.

[0036] Please refer to Figure 3 In one specific embodiment, the vacuum film-applying mechanism 3 includes a vacuum valve 31, a heating element 32, a base 33, an upper mold 34, a pressing mold 35, and a second driving element 36. The vacuum valve 31 is connected to the upper mold 34, which is fixedly connected to the top of the base 33. The pressing mold 35 is slidably connected to the base 33, forming a pressing cavity 37 between the upper mold 34 and the pressing mold 35. The heating element 32 is disposed on both the upper mold 34 and the pressing mold 35. The second driving element 36 is disposed on the base 33, and its driving end is fixedly connected to the pressing mold 35. In this embodiment, the second driving element 36 is rolledly connected to one end of a servo motor and a lifting shaft via a synchronous belt to drive the lifting shaft, while the other end of the lifting shaft is connected to the bottom of the pressing mold 35.

[0037] After wafer 7 enters the lamination chamber 37 along with the upper film 22 and the lower film 24, the vacuum valve 31 is activated to draw a vacuum, eliminating any residual air between the protective film and wafer 7. The second drive unit 36 ​​(a servo motor driving the lifting shaft via a synchronous belt) pushes the lamination mold 35 upward, creating a sealed space between the upper mold 34 and the lamination mold 35 and applying uniform pressure. Simultaneously, the heating element 32 (such as a ceramic heating plate) embedded in the upper mold 34 and the lamination mold 35 rapidly raises the temperature to the process setting value (e.g., UV film curing temperature 120-150℃), activating the molecular chains of the film adhesive layer to generate adhesion, thereby completely bonding the protective film to the surface of wafer 7. Through a closed-loop control system, the equipment can dynamically adjust the vacuum, pressure, and temperature curves to ensure consistency in the lamination process.

[0038] Furthermore, the vacuum film application mechanism 3 also includes a limiting block 38. The base 33 has support columns 39 arranged around its perimeter, the pressing mold 35 is slidably connected to the support columns 39, and the limiting block 38 is detachably connected to the support columns 39 between the upper mold 34 and the pressing mold 35 via bolts or slots.

[0039] When the vacuum laminating mechanism 3 is in a resting state or under maintenance, the limit block 38 can be installed on the support column 39 to prevent accidental contact by the operator or abnormal control system from causing a hard collision between the pressing mold 35 and the upper mold 34, which could lead to equipment damage or personal injury. When the vacuum laminating mechanism 3 is in working state, removing the limit block 38 will allow it to work normally.

[0040] In one specific embodiment, the vacuum film application device further includes a first cooling fan 5, which is respectively disposed on the upper mold 34 and the pressing mold 35.

[0041] During the film application process, the heating element 32 (such as a resistance wire or semiconductor heater) inside the upper mold 34 and the pressing mold 35 heats up to the set temperature. When the temperature sensor detects that the real-time temperature exceeds the process threshold or the pressing process is completed and enters the cooling stage, the first cooling fan 5 starts and quickly dissipates heat through forced convection. The first cooling fan 5 can reduce the ambient temperature of the heating element 32, thereby reducing the aging rate of the heating element 32 and minimizing circuit aging failures caused by overheating.

[0042] Please refer to Figure 2 In one specific embodiment, the vacuum film laminating device further includes a second cooling fan 6, which is respectively disposed between the upper film receiving and discharging assembly 21 and the lower film receiving and discharging assembly 23 on the material discharge side of the vacuum film laminating mechanism 3.

[0043] On the discharge side of the vacuum laminating mechanism 3, after the upper carrier film 22 and the lower carrier film 24 are pressed and separated, they are wound and recycled by synchronous rollers 212. During the process, frictional heat or residual heat from vacuum pressing can easily cause the film material to soften and deform. The second cooling fan 6 is located between the two sets of take-up and release components, driving airflow to blow on the surface of the film material and the wafer 7 to quickly dissipate heat. On the other hand, it can reduce the failure rate of film material sticking due to overheating, especially for PET carrier film, the peel strength stability is improved after cooling, so as to prevent film material from remaining on the upper surface of the protective film or the lower surface of the wafer 7.

[0044] Please refer to Figure 4 In one specific embodiment, the feeding conveyor mechanism 1 includes a third driving member 11, a driving roller 12, a driven roller 13, and a conveyor belt 14. The driving roller 12 and the driven roller 13 are rotatably connected to the frame, the driving end of the third driving member 11 is connected to the driving roller 12, and the conveyor belt 14 is tactilely connected to both the driving roller 12 and the driven roller 13. In this embodiment, the third driving member 11 drives the driving roller 12 by tactilely connecting it to a motor and one end of the driving roller 12 via a synchronous belt.

[0045] The wafer feeding conveyor 1 achieves high-precision and stable conveying of the wafer 7 through a motor-driven synchronous belt transmission system. The third drive unit 11 transmits power to the drive roller 12 via the synchronous belt. The drive roller 12 drives the annular conveyor belt 14 to move by friction, while the driven roller 13 assists in tensioning the conveyor belt 14 and maintaining smooth operation. In addition, when the wafer 7 is placed on the conveyor belt 14, the antistatic coating on the surface of the conveyor belt 14 prevents the wafer 7 from slipping or shifting during acceleration or deceleration.

[0046] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vacuum laminating device, comprising a frame, characterized in that: It also includes a board feeding mechanism, a carrier film feeding and unloading mechanism, a vacuum film application mechanism, and a board output conveying mechanism, all mounted on the frame. The carrier film take-up and untake-down mechanism includes an upper carrier film take-up and untake-down assembly, an upper carrier film, a lower carrier film take-up and untake-down assembly, and a lower carrier film. The board feeding conveying mechanism is located between the unwinding end of the upper carrier film take-up and untake-down assembly and the unwinding end of the lower carrier film take-up and untake-down assembly. The board exiting conveying mechanism is located between the winding end of the upper carrier film take-up and untake-down assembly and the winding end of the lower carrier film take-up and untake-down assembly. The vacuum film application mechanism is located between the upper carrier film take-up and untake-down assembly and the lower carrier film take-up and untake-down assembly. The upper loading film is rotatably connected to the upper loading film receiving and dispensing assembly, and the lower loading film is rotatably connected to the lower loading film receiving and dispensing assembly. The upper loading film and the lower loading film are respectively attached to the upper and lower surfaces of the wafer conveyed by the board feeding conveyor mechanism. The upper loading film and the lower loading film cooperate to clamp the wafer to feed it into the vacuum film attaching mechanism and convey the wafer to the board exit conveyor mechanism.

2. The vacuum laminating device according to claim 1, characterized in that, The loading film take-up and take-down assembly includes a drive wheel, a synchronous wheel, several driven wheels, and two sets of first driving members. The drive wheel, synchronous wheel, and each driven wheel are rotatably connected to the frame, and the drive wheel and synchronous wheel are located on both sides of the vacuum film application mechanism. The fixed end of the loading film is sleeved on the drive wheel, and the movable end of the loading film is sequentially wound around several driven wheels and synchronous wheels. The first driving members are disposed on the frame, with the driving end of one set of first driving members connected to the drive wheel and the driving end of the other set of first driving members connected to the synchronous wheel.

3. The vacuum laminating device according to claim 2, characterized in that, The upper film loading and unloading assembly also includes an air knife, which is located between two adjacent driven wheels on the feeding side of the vacuum film applicator, and the upper film passes through the air knife.

4. The vacuum laminating device according to claim 1, characterized in that, The vacuum film-applying mechanism includes a vacuum valve, a heating element, a base, an upper mold, a pressing mold, and a second driving element. The vacuum valve is connected to the upper mold, which is fixedly connected to the top of the base. The pressing mold is slidably connected to the base, and a pressing cavity is formed between the upper mold and the pressing mold. The heating element is respectively disposed on the upper mold and the pressing mold. The second driving element is disposed on the base, and the driving end of the second driving element is fixedly connected to the pressing mold.

5. A vacuum laminating device according to claim 4, characterized in that, The vacuum film-applying mechanism also includes a limiting block, and the base is provided with support columns around its perimeter. The pressing mold is slidably connected to the support columns, and the limiting block is detachably connected to the support columns between the upper mold and the pressing mold.

6. A vacuum laminating device according to claim 4, characterized in that, The vacuum film laminating equipment also includes a first cooling fan, which is respectively located on the upper mold and the pressing mold.

7. A vacuum laminating device according to claim 1, characterized in that, The vacuum film laminating equipment also includes a second cooling fan, which is respectively located between the upper film receiving and discharging assembly and the lower film receiving and discharging assembly on the material discharge side of the vacuum film laminating mechanism.

8. A vacuum laminating device according to claim 1, characterized in that, The feeding conveying mechanism includes a third driving member, a driving roller, a driven roller, and a conveyor belt. The driving roller and the driven roller are rotatably connected to the frame, the driving end of the third driving member is connected to the driving roller, and the conveyor belt is tumbledly connected to the driving roller and the driven roller.

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