A heat dissipation structure applied to an internal power amplifier of an unmanned aerial vehicle countermeasure portable gun

Abstract

The utility model relates to unmanned plane heat dissipation structure technical field, and disclose a kind of heat dissipation structure applied to the inside power amplifier of unmanned plane counter portable gun, including heat sink baseplate, the bottom of heat sink baseplate is provided with power amplifier installation storehouse, the top of heat sink baseplate is provided with heat dissipation fin, power amplifier radio frequency module is installed in the power amplifier installation storehouse, the side of heat dissipation fin is provided with fan mounting groove, the utility model is provided with heat dissipation fin on heat sink baseplate, eddy current fan and bakelite fairing are provided on heat dissipation fin, and further construct the heat dissipation system of " eddy current drive-directional flow-turbulent flow intensification trinity", by a special structure design, in combination with the working principle of eddy current fan, so that the heat generated by counter portable gun inside power amplifier and other heat-generating components directly through heat dissipation fin, directly guide the heat dissipation hole of shell pre-design, can efficiently heat generated inside equipment quickly conducted to equipment outside, prevent equipment internal heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology for unmanned aerial vehicles (UAVs), specifically a heat dissipation structure for the internal power amplifier of a UAV countermeasure portable gun. Background Technology

[0002] With the rapid development of drone technology, its applications in civilian, commercial, and military fields are becoming increasingly widespread. However, the disorderly use and even malicious exploitation of drones have brought about many security risks, such as invasion of privacy, disruption of public order, and threats to the security of important facilities. To address these issues, drone countermeasure technologies have emerged, among which portable drone countermeasure guns, due to their mobility and convenience, have become one of the important countermeasures.

[0003] In the countermeasures between drones and portable guns, the power amplifier, as a core component, plays a crucial role in increasing the output power of the jamming signal to expand the jamming coverage and signal strength, thereby effectively interrupting the drone's control and navigation signals. However, the power amplifier generates a lot of heat when it is working, especially under long-term high-power operation, where its heat dissipation problem becomes extremely prominent.

[0004] Currently, portable countermeasure devices or countermeasure guns on the market mainly adopt three types of heat dissipation solutions: 1. Passive heat sink: Aluminum alloy, a metal with relatively good thermal conductivity, is used as the heat sink fin. However, the average thermal conductivity of this passive heat sink solution is only 15-30W / (m·K). In actual tests, under a 400W power amplifier load, the substrate temperature rose to 112℃ within 10 minutes (exceeding the safe operating temperature). 2. Axial fan convection: Although it can increase the airflow speed to a certain extent, the disordered airflow causes more than 30% of the heat to be unable to be effectively transferred to the outside of the equipment, thus accumulating in the corners of the cavity; 3. Heat dissipation of heat spreader: Heat spreaders made of new thermoelectric semiconductor materials can effectively reduce the temperature of heat source, but they increase the weight of the equipment (about 400-500g) and increase the complexity of power supply management within the equipment, which does not conform to the lightweight design concept. At the same time, they still cannot solve the problem of airflow organization of heat dissipation holes. The above methods are still not applicable to portable countermeasure guns due to the heat dissipation problem of high-power radio frequency modules in such small, enclosed cavities. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a heat dissipation structure for the power amplifier inside a portable anti-drone gun. It solves the problems of existing passive heat sinks (using aluminum alloy, a metal with relatively good thermal conductivity, as heat dissipation fins, but this passive heat dissipation solution has an average thermal conductivity of only 15-30 W / (m·K). In actual testing, under a 400W power amplifier load, the substrate temperature rose to 112℃ within 10 minutes (exceeding the safe operating temperature); axial fan convection (while increasing airflow to some extent, disordered airflow means that more than 30% of the heat cannot be effectively conducted to the outside of the device, thus accumulating in the corners of the cavity); and heat diffusion via a vapor chamber (using a novel thermoelectric semiconductor material to make a vapor chamber heat dissipation plate, which effectively reduces the heat source temperature, but increases the weight of the device (approximately 400-500g) and increases the complexity of power supply management within the device, which does not conform to the lightweight design concept. Furthermore, it still cannot solve the airflow organization problem of the heat dissipation holes; and it is still not suitable for the heat dissipation problem of high-power radio frequency modules in the small, enclosed cavity of a portable anti-drone gun.

[0006] This utility model provides the following technical solution: a heat dissipation structure for the internal power amplifier of a portable gun for countering drones, including a heat sink substrate, a power amplifier mounting compartment at the bottom of the heat sink substrate, and heat dissipation fins at the top of the heat sink substrate. The power amplifier mounting compartment houses the power amplifier RF module. The side of the heat sink fins is provided with a fan mounting slot, in which three vortex fans are evenly installed. The top of the heat sink fins is provided with a bakelite air guide plate, and the side of the bakelite air guide plate is evenly provided with three air inlets. The tops of the vortex fans all penetrate through the air inlets. The ends of the heat sink fins are provided with side connecting plates, and the bottom of the heat sink substrate is provided with a bottom sealing plate.

[0007] Preferred technical solution 1: The heat sink substrate is provided with a side closing plate on its side, and two side insertion plates are symmetrically inserted on both sides of the heat sink substrate.

[0008] Preferred technical solution 2: The heat sink substrate and the heat dissipation fins are integrally formed.

[0009] Preferred technical solution 3: The vortex fan and the fan mounting slot are connected by bolts.

[0010] This solution enables a more stable connection between the vortex fan and the heat sink fins.

[0011] Preferred technical solution four: The side closing plate is provided with a number of mounting holes evenly distributed.

[0012] This design allows the end of the power amplifier RF module to better penetrate the side closure plate.

[0013] Preferred technical solution five: The side of the side plug-in plate has two slots symmetrically opened on its side, and the heat sink substrate has two plug blocks symmetrically arranged on both sides.

[0014] This solution enables a more stable connection between the side connector plate and the heat sink substrate.

[0015] Compared with the prior art, this utility model provides a heat dissipation structure for the internal power amplifier of a portable gun for countering drones, which has the following beneficial effects: (1) This utility model constructs a three-in-one heat dissipation system of “vortex drive - directional flow guidance - turbulence enhancement” by setting heat dissipation fins on the heat sink substrate, and setting vortex fan and bakelite flow guide plate on the heat dissipation fins. Through a special structural design, combined with the working principle of vortex fan, the heat generated by the power amplifier and other heat-generating components inside the countermeasure gun is directly guided through the heat dissipation fins in a specific direction to the heat dissipation holes pre-designed in the outer shell. This can efficiently and quickly conduct the heat generated inside the equipment to the outside of the equipment, preventing the accumulation of heat inside the equipment. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is an exploded view of the structure of this utility model; Figure 3 For the present utility model Figure 2 A schematic diagram of the bottom structure of the heat sink substrate; Figure 4 For the present utility model Figure 2 Schematic diagram of a medium-sized vortex fan.

[0017] In the diagram: 1. Heat sink substrate; 2. Power amplifier mounting compartment; 3. Heat sink fins; 4. Power amplifier RF module; 5. Fan mounting slot; 6. Vortex fan; 7. Bakelite air guide plate; 8. Air inlet; 9. Side connecting plate; 10. Bottom sealing plate; 11. Side closing plate; 12. Side plug-in plate. Detailed Implementation

[0018] Please see Figure 1-4 , Example 1: A heat dissipation structure for the internal power amplifier of a portable gun for countering drones, including a heat sink substrate 1, a power amplifier mounting compartment 2 at the bottom of the heat sink substrate 1, and heat dissipation fins 3 at the top of the heat sink substrate 1.

[0019] The power amplifier mounting compartment 2 houses the power amplifier RF module 4. The side of the heat sink fin 3 is provided with a fan mounting slot 5, and three vortex fans 6 are evenly installed in the fan mounting slot 5. The top of the heat sink fin 3 is provided with a bakelite air guide plate 7, and three air inlets 8 are evenly opened on the side of the bakelite air guide plate 7. The top of each vortex fan 6 passes through the air inlet 8. The end of the heat sink fin 3 is provided with a side connecting plate 9. The bottom of the heat sink substrate 1 is provided with a bottom sealing plate 10, and the side of the heat sink substrate 1 is provided with a side closing plate 11. Two side plug-in plates 12 are symmetrically inserted on both sides of the heat sink substrate 1.

[0020] The heat sink substrate 1 and the heat dissipation fins 3 are integrally formed.

[0021] Example 2: The difference between this example and Example 1 is that the vortex fan 6 and the fan mounting slot 5 are connected by bolts.

[0022] This makes the connection between the vortex fan 6 and the heat sink fin 3 more stable.

[0023] Example 3: The difference between this example and Example 1 is that the side closing plate 11 is provided with a number of mounting holes evenly distributed.

[0024] This allows the end of the power amplifier RF module 4 to better penetrate the side closure plate 11.

[0025] Example 4: The difference between this example and Example 1 is that the side plug-in plate 12 has two slots symmetrically opened on its side, and the heat sink substrate 1 has two plugs symmetrically arranged on both sides.

[0026] This makes the connection between the side plug plate 12 and the heat sink substrate 1 more stable.

[0027] In this embodiment, currently available portable countermeasures devices or countermeasures guns mainly employ three types of heat dissipation solutions: 1. Passive heat sinks: using aluminum alloy, a metal with relatively good thermal conductivity, as heat dissipation fins. However, the average thermal conductivity of this passive heat dissipation solution is only 15-30 W / m·K. In actual tests, under a 400W power amplifier load, the substrate temperature rose to 112°C within 10 minutes, exceeding the safe operating temperature; 2. Axial fan convection: although it can increase the airflow speed to a certain extent, the disordered airflow causes more than 30% of the heat to be unable to be effectively conducted to the outside of the device, thus accumulating in the corners of the cavity; 3. Heat diffusion of the heat spreader: using a heat spreader made of a new type of thermoelectric semiconductor material. Although it can effectively reduce the temperature of the heat source, it increases the weight of the device by about 400-500g and increases the complexity of power supply management within the device, which does not conform to the lightweight design concept. At the same time, it still cannot solve the problem of airflow organization in the heat dissipation holes. The above methods are still not applicable to portable countermeasures guns, which face the heat dissipation problem of high-power radio frequency modules in such a small and sealed cavity.

[0028] In summary, in specific implementation, a power amplifier mounting compartment 2 is provided on the side of the heat sink substrate 1, and the power amplifier RF module 4 is installed in the power amplifier mounting compartment 2. A heat sink fin 3 is provided on the top of the heat sink substrate 1, and a fan mounting slot 5 is opened on the heat sink fin 3. A vortex fan 6 is installed in the fan mounting slot 5, so that the heat generated by the power amplifier RF module 4 when operating at high power can be transferred to the heat sink substrate 1. The heat is then discharged through the heat sink fin 3 provided on the heat sink substrate 1 and the airflow generated by the vortex fan 6 when it is working, so as to dissipate heat and cool down the power amplifier RF module 4.

[0029] The vortex fan 6 is connected to the heat sink bolt of the power amplifier RF module 4 through the corresponding mounting threaded hole. The direct contact area is close to 100%, which fully guides the high-pressure airflow generated by the heat generated by the power amplifier RF module 4 through the vortex to the directional airflow formed between the bakelite guide plate 7 and the heat sink fin 3.

[0030] The bakelite air guide plate 7 forms a 19mm high gap air duct with the inner wall of the outer shell. The spacing of the heat dissipation fins 3 is uniformly 3.0mm. The bakelite air guide plate 7 is directly connected to the heat dissipation fins 3 through corresponding mounting threaded holes. The direct contact area between the bakelite air guide plate 7 and the heat dissipation fins 3 is ≥80%, which avoids displacement caused by vibration, thereby affecting the airflow direction and generating disordered airflow.

[0031] The power amplifier RF module 4 is mounted on the heat sink substrate 1 using thermal grease. The heat sink substrate 1 and the heat sink fins 3 are manufactured using an integrated molding process to avoid insufficient contact caused by welding or other bonding methods.

[0032] The heat dissipation hole assembly is directly formed on the ABS shell of the countermeasure gun, and the hole positions are directly guided to the directional airflow channel formed by the bakelite baffle 7 and the heat dissipation fins 3.

[0033] Meanwhile, the installation angle of the bakelite air guide plate 7 is completely perpendicular to the heat dissipation fins 3 and the heat sink surface, eliminating the pressure loss caused by the tilt angle and maximizing the efficiency of the direct airflow. The bakelite air guide plate 7 is made of high-temperature resistant bakelite, ensuring a lightweight design while minimizing disordered heat dissipation.

[0034] The fixed heat conduction channel of "air intake hole 8 - vortex fan 6 - heat dissipation fins 3 - directional air duct - heat dissipation hole" reduces the generation of disordered airflow and minimizes the accumulation of heat in dead corners in small and complex spaces due to disordered airflow. The asymmetrical heat dissipation holes utilize the pressure difference drive principle to more efficiently remove heat from the interior of the counter-attack gun cavity.

[0035] This patent aims to construct a three-in-one heat dissipation system of "vortex drive - directional flow guidance - turbulence enhancement". Through a special structural design, combined with the working principle of the vortex fan 6, the heat generated by the power amplifier and other heat-generating components inside the countermeasure gun is directly guided through the heat dissipation fins in a specific direction to the heat dissipation holes pre-designed on the outer shell. This can efficiently and quickly conduct the heat generated inside the device to the outside of the device, preventing heat buildup inside the device.

[0036] Specifically, the advantages can be broken down into the following four points: 1. Controllable heat flow path: The disordered airflow is transformed into an axial jet by the bakelite guide plate 7, ensuring that >85% of the heat can be directly discharged to the heat dissipation hole along the preset path; 2. Customized air intake 8 and heat dissipation vents: Based on the principle that hot air is less dense, the air intake 8 of the vortex fan 6 is designed at the bottom, while the heat dissipation vents are designed on the top surface of the countermeasure gun, so that the heat flow can be more efficiently diffused to the outside of the equipment. 3. High reliability: Local hot spots are eliminated, and the highest temperature is reduced from 115℃ to below 70℃, extending the power amplifier module life to more than 5000 hours; Lightweight design: The total weight of the vortex fan 6 and the heat dissipation structure system made of aluminum-based composite material is less than 600g, which meets the requirements for portability.

Claims

1. A heat dissipation structure for the internal power amplifier of a portable anti-drone gun, characterized in that: It includes a heat sink substrate (1), with a power amplifier mounting compartment (2) at the bottom end of the heat sink substrate (1) and heat dissipation fins (3) at the top end of the heat sink substrate (1). The power amplifier mounting compartment (2) is equipped with a power amplifier RF module (4). The side of the heat sink fin (3) is provided with a fan mounting slot (5). Three vortex fans (6) are evenly installed in the fan mounting slot (5). The top of the heat sink fin (3) is provided with a bakelite guide plate (7). The side of the bakelite guide plate (7) is evenly provided with three air inlets (8). The top of each vortex fan (6) passes through the air inlet (8). The end of the heat sink fin (3) is provided with a side connecting plate (9). The bottom of the heat sink substrate (1) is provided with a bottom sealing plate (10).

2. The heat dissipation structure for the internal power amplifier of a portable anti-drone gun according to claim 1, characterized in that: The heat sink substrate (1) is provided with a side closing plate (11) on its side, and two side plug-in plates (12) are symmetrically inserted on both sides of the heat sink substrate (1).

3. The heat dissipation structure for the internal power amplifier of a portable anti-drone gun according to claim 2, characterized in that: The heat sink substrate (1) and the heat dissipation fins (3) are integrally formed.

4. The heat dissipation structure for the internal power amplifier of a portable anti-drone gun according to claim 3, characterized in that: The vortex fan (6) and the fan mounting slot (5) are connected by bolts.

5. A heat dissipation structure for the internal power amplifier of a portable anti-drone gun according to claim 4, characterized in that: The side closure plate (11) has several mounting holes evenly distributed on it.

6. A heat dissipation structure for an internal power amplifier of a portable anti-drone gun according to claim 5, characterized in that: The side of the side plug-in plate (12) has two slots symmetrically opened on its side, and the heat sink substrate (1) has two plugs symmetrically arranged on both sides.

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