A cleaning device for electronic components with batch processing capabilities

Abstract

This application relates to the field of electronic component cleaning technology, specifically disclosing an electronic component cleaning device with batch processing capability. The device includes a drying chamber with an open front end for the adsorption assembly to enter and exit. The top of the drying chamber has several ventilation holes to allow effective evaporation of cleaning agent vapor. An air outlet is located on the left side of the drying chamber, connected to a blower via a pipe. The blower removes dust and excess cleaning agent from the electronic components. Two sliding rails are located on the bottom of the drying chamber, slidably connecting to an electric telescopic frame. An adsorption assembly is fixedly connected above the electric telescopic frame. A vacuum assembly is fixedly connected to the front end of the adsorption assembly for vacuum adsorption of the components, and a low-temperature heating assembly is fixedly connected to the rear end of the adsorption assembly for rapid evaporation of the cleaning agent. Sliding grooves are located on the left and right sides of the adsorption assembly, slidably connecting to cleaning components for cleaning them. This invention has the function of cleaning and timely drying electronic components in batches.

Description

Technical Field

[0001] This application relates to the field of electronic component cleaning technology, and in particular to an electronic component cleaning device with batch processing capabilities. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are commonly used light-emitting devices that release energy through the recombination of electrons and holes. They are widely used in the lighting industry. LEDs have low mechanical strength and are easily broken by external pressure or bending. Furthermore, LEDs are extremely sensitive to chemical cleaning agents; if not dried promptly, the cleaning agent can seep in and directly damage the internal structure.

[0003] Existing cleaning technologies mainly consist of manual wiping and ultrasonic cleaning. Manual wiping involves manually wiping the surface of LEDs with a lint-free cloth dampened with cleaning agent; this method is inefficient and the cleaning effect is inconsistent. Ultrasonic cleaning involves immersing the LEDs in a cleaning solvent and using ultrasonic vibrations to remove dirt adhering to the electronic components. However, immersing the LEDs in the cleaning solvent can easily lead to liquid seepage and damage to the LEDs. Furthermore, due to the high frequency of ultrasound, it can cause some damage to the internal components of the LEDs, thus affecting their performance and quality. Therefore, we propose an electronic component cleaning device with batch processing capabilities to solve the problems of low cleaning efficiency and untimely drying of electronic components. Utility Model Content

[0004] The purpose of this invention is to provide an electronic component cleaning device with batch processing capabilities to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an electronic component cleaning device with batch processing function, including a drying box, the drying box having a hollow structure, the front end of the drying box having an opening, the top of the drying box having several ventilation holes to allow cleaning agent vapor to evaporate effectively, a hair dryer being bolted to one side of the outer surface of the drying box, one end of an air inlet pipe being welded to the side of the hair dryer near the drying box, the end of the air inlet pipe away from the hair dryer penetrating the shell of the drying box, the air inlet pipe being used to guide the air in the hair dryer into the box.

[0006] According to the above technical solution, two slide rails are provided on the bottom surface of the drying box. The sliding direction of the slide rails is the opening direction of the drying box. The slide rails are slidably connected to the electric telescopic frame. The electric telescopic frame is above the slide rails. An adsorption component is welded and fixedly connected above the electric telescopic frame. The electric telescopic frame is used to tilt the adsorption component. The adsorption component is used to adsorb and fix the components to be cleaned. Sliding grooves are provided on the left and right sides of the adsorption component. The sliding grooves are slidably connected to the cleaning component. The sliding grooves are used to support the movement of the cleaning component above the adsorption component. The cleaning component is used to clean the components fixed on the adsorption component.

[0007] According to the above technical solution, the adsorption assembly includes an adsorption plate, the bottom of which is welded and fixed to an electric telescopic frame. The adsorption plate is used to adsorb and fix the components to be cleaned. An air extraction hole is opened on one end face of the adsorption plate, and a vacuum extraction assembly is bolted to the same end face. One end of an extraction pipe is bolted to both sides of the vacuum extraction assembly, and the end of the extraction pipe away from the vacuum extraction assembly passes through the air extraction hole. The vacuum extraction assembly extracts air from the adsorption plate through the extraction pipe, achieving a vacuum adsorption effect. A heating hole is opened on the other end face of the adsorption plate, and a low-temperature heating assembly is bolted to the end face with the heating hole. One end of a heating pipe is welded to both sides of the low-temperature heating assembly, and the end of the heating pipe away from the low-temperature heating assembly passes through the heating hole. The low-temperature heating assembly heats the adsorption plate at a low temperature through the heating pipe. Sliding grooves are provided on both sides of the adsorption plate, and a cleaning assembly is slidably connected to the inner wall of the sliding grooves.

[0008] The adsorption plate includes several grooves formed on its upper surface. Each groove has a U-shaped cross-section and is rectangular when viewed from the surface, with the shorter end being the opening. The groove is used to place the component to be cleaned. An adsorption hole is formed at the center of the bottom surface of each groove to adsorb the component. A vacuum chamber is located inside the adsorption plate, and the adsorption hole penetrates the plate and connects to the vacuum chamber. A drain hole is formed on the bottom surface of each groove near the opening. A dirt accumulation chamber is located inside the adsorption plate, above the vacuum chamber and not interconnected. The drain hole penetrates the plate and connects to the dirt accumulation chamber, which holds excess cleaning fluid discharged from the drain hole. A packaging bag is placed below the opening of each groove, in contact with the surface of the adsorption plate. The packaging bag holds the component that falls from the groove after the adsorption is released, allowing for safe removal of the cleaned component.

[0009] The vacuum pumping assembly includes a vacuum pump, which is bolted to one end face of the adsorption plate. Pumping pipes are welded to the left and right sides of the vacuum pump, and the end of the pumping pipe away from the vacuum pump extends into the vacuum chamber through two pumping holes.

[0010] When the component to be cleaned is placed into the groove, the vacuum pump is activated. The vacuum pump draws air from the vacuum chamber through the pumping pipe to create a vacuum environment. At this time, the adsorption holes connected to the vacuum chamber will attract the component in the groove, preparing it for cleaning.

[0011] The low-temperature heating assembly includes a heater, which is fixedly connected to the other end face of the adsorption plate. Heating pipes are welded and fixed on the left and right sides of the heater. The end of the heating pipe away from the heater extends into the adsorption plate through a heating hole. Heating chambers are provided at the left and right ends inside the adsorption plate. The heating chambers are connected to the dirt accumulation chamber. The end of the heating pipe away from the heater extends into the heating chamber.

[0012] After cleaning, excess cleaning agent is discharged into the dirt accumulation chamber through the drain hole. The heater is turned on to heat the air in the heating chamber. Because the heating chamber is connected to the dirt accumulation chamber, the heat in the heating chamber is transferred to the dirt accumulation chamber, which accelerates the evaporation of excess cleaning agent in the dirt accumulation chamber and also raises the temperature of the entire adsorption plate, thus accelerating the drying of the cleaned components.

[0013] According to the above technical solution, the cleaning component includes a cleaning brush. The cleaning component is slidably connected above the adsorption component via a sliding groove. A liquid storage tank is welded to the top of the cleaning brush for storing cleaning agent. An inlet is provided at the top of the liquid storage tank for adding cleaning agent. A low-pressure nozzle is provided at the bottom of the liquid storage tank. The low-pressure nozzle passes through the cleaning brush for discharging the cleaning liquid. An anti-static brush is fixedly installed on the side of the cleaning brush away from the liquid storage tank. The anti-static brush is used to remove dirt from the diode surface. Support frames are provided at both ends of the cleaning brush. A slider is welded to the lowest end of the support frame. The slider is slidably connected to the sliding grooves provided at both ends of the adsorption component.

[0014] During the cleaning process, the cleaning brush slides on the adsorption plate via a sliding groove. The cleaning brush sprays cleaning agent onto the components through a low-pressure nozzle. At the same time, the anti-static brush fixedly connected to the cleaning brush removes dirt from the diodes, improving the cleaning efficiency of the components.

[0015] Compared with the prior art, the beneficial effects achieved by this utility model are: This utility model,

[0016] (1) By setting up a vacuum adsorption plate to adsorb diodes, on the one hand, vacuum adsorption makes the diodes subjected to uniform force and will not be damaged by mechanical clamping. On the other hand, multiple grooves are opened on the vacuum adsorption plate, which can adsorb multiple diodes at one time, and has the function of batch processing diode cleaning, which greatly improves the cleaning efficiency.

[0017] (2) The diodes are dried in time by setting up a blower, an electric telescopic rod and a low temperature heater in a coordinated manner: the blower blows away the dust and cleaning agent on the surface of the electronic components, and the design of multiple air outlets covers all the diodes; the electric telescopic rod tilts the adsorption plate to allow the excess cleaning agent remaining on the diode to flow to the deposition chamber; the low temperature heating chamber heats the adsorption plate at a low temperature to accelerate the evaporation of the cleaning agent; the three work together to accelerate the evaporation of the cleaning agent, prevent the cleaning agent from seeping into the diode, and maintain the performance and quality of the diode. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of the adsorption component according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the internal structure of the adsorption component according to an embodiment of the present invention;

[0022] Figure 4 This is a partially enlarged schematic diagram of the adsorption component according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the cleaning components according to an embodiment of the present invention;

[0024] In the diagram: 1. Drying box; 101. Ventilation opening; 102. Hair dryer; 103. Air inlet duct; 104. Slide rail; 2. Electric telescopic frame; 3. Adsorption assembly; 301. Adsorption plate; 3011. Groove; 3012. Adsorption hole; 3013. Drain hole; 3014. Packaging bag; 3015. Vacuum chamber; 3016. Sludge accumulation chamber; 3017. Heating chamber; 302. Vacuum extraction assembly; 3021. Air pump; 3022. Air extraction duct; 303. Low temperature heating assembly; 3031. Heater; 3032. Heating duct; 304. Sliding groove; 4. Cleaning assembly; 401. Cleaning brush; 402. Liquid tank; 403. Liquid inlet; 404. Low pressure nozzle; 405. Antistatic brush; 406. Support frame; 407. Slider. Detailed Implementation

[0025] The following detailed, non-limiting description of the present invention, in conjunction with preferred embodiments and accompanying drawings, is provided. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0026] Please see Figure 1-4 The present invention provides the following technical solution:

[0027] like Figure 1 As shown, an electronic component cleaning device with batch processing function includes a drying box 1. The drying box 1 has a hollow structure and an opening on its front end. Several ventilation holes 101 are provided on the top of the drying box 1 to allow cleaning agent vapor to evaporate effectively. A blower 102 is bolted to one outer surface of the drying box 1. One end of an air inlet pipe 103 is welded to the side of the blower 102 near the drying box 1. The end of the air inlet pipe 103 away from the blower 102 passes through the housing of the drying box 1. The air inlet pipe 103 is used to guide the air from the blower 102 into the housing 1.

[0028] Two slide rails 104 are provided on the bottom surface of the air drying box 1. The sliding direction of the slide rails 104 is the opening direction of the air drying box 1. The slide rails 104 are slidably connected to the electric telescopic frame 2. The electric telescopic frame 2 is above the slide rails 104. The adsorption component 3 is welded and fixedly connected to the electric telescopic frame 2. The electric telescopic frame 2 is used to tilt the adsorption component 3. The adsorption component 3 is used to adsorb and fix the components to be cleaned. Sliding grooves 301 are provided on the left and right sides of the adsorption component. The sliding grooves 301 are slidably connected to the cleaning component 4. The sliding grooves 301 are used to support the cleaning component 4 to move above the adsorption component 3. The cleaning component 4 is used to clean the components fixed on the adsorption component 3.

[0029] like Figure 2-4As shown, the adsorption assembly 3 includes an adsorption plate 301, the bottom of which is welded and fixed to the electric telescopic frame 2. The adsorption plate 301 is used to adsorb and fix the components to be cleaned. A vacuum extraction assembly 302 is bolted to the same end face of the adsorption plate 301. One end of the extraction pipe 3022 is welded and fixed to the left and right sides of the vacuum extraction assembly 302. The end of the extraction pipe 3022 away from the vacuum extraction assembly 303 passes through the adsorption plate 301. The vacuum extraction assembly 302 extracts the adsorption plate 301 through the extraction pipe 3022. The air inside 01 causes the adsorption plate 301 to achieve a vacuum adsorption effect; a low-temperature heating component 303 is bolted to the other end of the adsorption plate 301, and one end of a heating pipe 3032 is welded to the left and right sides of the low-temperature heating component 303. The end of the heating pipe 3032 away from the low-temperature heating component 303 passes through the adsorption plate 301, and the low-temperature heating component 303 heats the adsorption plate 301 at low temperature through the heating pipe 3032; sliding grooves 304 are provided on the left and right sides of the adsorption plate 301, and the cleaning component 4 is slidably connected to the inner wall of the sliding groove 304.

[0030] The adsorption plate 301 includes several grooves 3011, which are formed on the upper surface of the adsorption plate 301. Each groove 3011 has a U-shaped cross-section and is rectangular when viewed from the surface of the adsorption plate 301, with the shorter end being the opening. The grooves 3011 are used to place the components to be cleaned. An adsorption hole 3012 is formed at the center of the bottom surface of each groove 3011 for adsorbing the components. A vacuum chamber 3015 is provided inside the adsorption plate 301, and the adsorption hole 3012 penetrates the adsorption plate 3011 and connects to the vacuum chamber 3015. The bottom surface of the groove 3011 near the opening... A drain hole 3013 is provided on the surface of the adsorption plate 301. A dirt accumulation chamber 3016 is provided inside the adsorption plate 3015. The dirt accumulation chamber 3016 is above the vacuum chamber 3015 and is not interconnected. The drain hole 3013 passes through the adsorption plate 301 and connects to the dirt accumulation chamber 3016. The dirt accumulation chamber 3016 is used to collect excess cleaning liquid discharged from the drain hole 3013. A packaging bag 3014 is placed below one end of the opening of the groove 3011. The packaging bag 3014 is in contact with the surface of the adsorption plate 301. The packaging bag 3014 is used to collect the components that fall from the groove 3011 after the adsorption is released. The packaging bag 3014 facilitates the safe removal of the cleaned components.

[0031] The vacuum pumping assembly 302 includes a vacuum pumping pump 3021, which is bolted to one end face of the adsorption plate 301. Pumping pipes 3022 are welded and fixed to the left and right sides of the vacuum pumping pump 3021. The end of the pumping pipe 3022 away from the vacuum pumping pump 3021 passes through the adsorption plate 301 and extends into the vacuum chamber 3015.

[0032] When the component to be cleaned is placed into the groove, the vacuum pumping assembly 302 is activated. The vacuum pump 3021 draws air from the vacuum chamber 3015 through the vacuum pipe 3022 to form a vacuum environment. At this time, the adsorption hole 3012 connected to the vacuum chamber 3015 will suck up the component in the groove, preparing it for cleaning.

[0033] The low-temperature heating component 303 includes a heater 3031, which is fixedly connected to the other end face of the adsorption plate 301. Heating pipes 3032 are welded and fixed on the left and right sides of the heater 3031. The end of the heating pipe 3032 away from the heater 3031 passes through the adsorption plate 301. Heating chambers 3017 are provided at the left and right ends inside the adsorption plate 301. The heating chambers 3017 are connected to the dirt accumulation chamber 3016. The end of the heating pipe 3032 away from the heater 3031 extends into the heating chamber 3017.

[0034] After cleaning, excess cleaning agent is discharged into the dirt accumulation chamber 3016 through the drain hole 3013. The heater 3031 is turned on to heat the air in the heating chamber 3017. Since the heating chamber 3017 is connected to the dirt accumulation chamber 3016, the heat in the heating chamber 3017 is transferred to the dirt accumulation chamber 3016, which accelerates the evaporation of excess cleaning agent in the dirt accumulation chamber 3016 and also raises the temperature of the entire adsorption plate 301, accelerating the drying of the cleaned components. The commonly used cleaning agents for electronic components are isopropanol or ethanol. The heating temperature of the low-temperature heating component 303 is about 85°C, which meets the evaporation temperature required for both cleaning agents and will not damage the performance of electronic components due to high temperature.

[0035] like Figure 5 As shown, the cleaning component 4 includes a cleaning brush 401, which is slidably connected to the adsorption component 3 above via a sliding groove 304. A liquid storage tank 402 is welded to the top of the cleaning brush 401 for storing cleaning agent. An inlet 403 is provided at the top of the liquid storage tank 402 for adding cleaning agent. A low-pressure nozzle 404 is provided at the bottom of the liquid storage tank 402, which passes through the cleaning brush 401 for discharging cleaning liquid. An antistatic brush 405 is fixedly installed on the side of the cleaning brush 401 away from the liquid storage tank 402. The antistatic brush 405 is used to remove dirt from the diode surface. Support frames 406 are provided at both ends of the cleaning brush 401. A slider 407 is welded to the lowest end of the support frame 406, and the slider 407 is slidably connected to the sliding grooves 304 provided at both ends of the adsorption component 3.

[0036] During the cleaning process, the cleaning brush 401 slides on the adsorption plate 301 through the sliding groove 304. The cleaning brush 401 sprays cleaning agent onto the components through the low-pressure nozzle 404. At the same time, the anti-static brush 405 fixedly connected to the cleaning brush 401 removes dirt from the diode, improving the cleaning efficiency of the components.

[0037] Working principle: When cleaning electronic components is required, firstly, the adsorption plate assembly 3 is pulled out of the drying box 1 via the slide rail 104 at the bottom of the drying box 1. Next, the diode component to be cleaned is placed into the groove 3011 on the upper surface of the adsorption plate 301. The vacuum extraction assembly 302 is activated to extract air from the vacuum chamber 3015, causing the component to adhere to the adsorption plate 301. Then, the low-pressure nozzle 404 in the cleaning assembly 4 is activated, and the cleaning brush 401 is slid to allow the anti-static brush 405 to remove dirt from the diode surface. Then, the cleaning assembly 4 is closed, and the electric telescopic frame 2 under the adsorption plate is activated. The electric telescopic rod 2 tilts the adsorption plate 301, allowing excess cleaning agent remaining on the diode to flow through the drain hole 3013 to the deposition chamber 3016. If this is the first use within a certain period, the low-temperature heating assembly on the back of the adsorption plate 301 also needs to be activated. Component 303, the low-temperature heating component 303 heats at a temperature of approximately 85°C. The low-temperature heating component 303 accelerates the evaporation of cleaning agent by heating the low-temperature adsorption plate 301 through the heating pipe 3032. At the same time, the adsorption plate component 303 is pushed into the drying chamber 1, and the blower 102 on the left side of the drying chamber 1 is turned on. The air inlet pipe 103 is used to guide the air from the blower 102 into the chamber 1. The blower 102 blows away the dust and cleaning agent from the surface of the electronic components. After a specified time, the blower 102 is turned off, the adsorption plate component 303 is pulled out of the chamber 1, and the adsorption plate 301 remains tilted. The vacuum pump component 302 is turned off, causing the diode in the groove to be released from adsorption and fall into the packaging bag 3015. The packaging bag 3015 is replaced, the electric telescopic rod 2 is turned off, and the device is returned to its initial position for the next batch of cleaning work.

[0038] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cleaning device for electronic components with batch processing function, comprising a drying box (1), wherein two slide rails (104) are provided on the bottom surface inside the drying box (1), the slide rails (104) are slidably connected to an electric telescopic frame (2), the electric telescopic frame (2) is above the slide rails (104), and an adsorption assembly (3) is welded and fixedly connected above the electric telescopic frame (2); The adsorption assembly (3) includes an adsorption plate (301), the bottom of which is welded and fixed to the electric telescopic frame (2). An air extraction hole (3016) is opened on one end face of the adsorption plate (301). A vacuum extraction assembly (302) is bolted to the same end face of the adsorption plate (301). One end of an air extraction pipe (3022) is bolted to the left and right sides of the vacuum extraction assembly (302). The end of the air extraction pipe (3022) away from the vacuum extraction assembly (302) passes through the air extraction hole (3016). A heating hole (3019) is opened on the other end face of the adsorption plate (301). A low-temperature heating component (303) is bolted to the end face of the adsorption plate (301) with the heating hole (3019). One end of the heating pipe (3032) is fixedly welded to the left and right sides of the low-temperature heating component (303). The end of the heating pipe (3032) away from the low-temperature heating component (303) passes through the heating hole (3019). Sliding grooves (304) are provided on the left and right sides of the adsorption plate (301). A cleaning component (4) is slidably connected to the inner wall of the sliding groove (304).

2. The electronic component cleaning device with batch processing function according to claim 1, characterized in that: The front end of the drying box (1) is open, and several ventilation holes (101) are opened on the top of the drying box (1) to allow the cleaning agent vapor to evaporate effectively. A hair dryer (102) is bolted to one side of the outer surface of the drying box (1). One end of the air inlet pipe (103) is welded to the side of the hair dryer (102) near the drying box (1). The end of the air inlet pipe (103) away from the hair dryer (102) passes through the shell of the drying box (1). The air inlet pipe (103) is used to guide the air in the hair dryer (102) into the box.

3. The electronic component cleaning device with batch processing function according to claim 2, characterized in that: The adsorption component (3) has sliding grooves (304) on its left and right sides. The sliding grooves (304) are slidably connected to the cleaning component (4). The sliding grooves (304) are used to support the cleaning component (4) to move above the adsorption component (3). The cleaning component (4) is used to clean the components fixed on the adsorption component (3).

4. The electronic component cleaning device with batch processing function according to claim 3, characterized in that: The adsorption plate (301) includes several grooves (3011), which are formed on the upper surface of the adsorption plate (301). Each groove (3011) has a U-shaped cross-section and is rectangular when viewed from the surface of the adsorption plate (301), with the shorter end of the rectangle being the opening. The grooves (3011) are used to place the components to be cleaned. An adsorption hole (3012) is formed at the center of the bottom surface of each groove (3011) for adsorbing the components. A vacuum chamber (3015) is provided inside the adsorption plate (301), and the adsorption hole (3012) penetrates the adsorption plate (301) and connects to the vacuum chamber (3015). The bottom surface of each groove (3011) near the opening end has... The adsorption plate (301) has a drain hole (3013) and a dirt accumulation chamber (3017) inside. The dirt accumulation chamber (3017) is above the vacuum chamber (3015) and is not interconnected. The drain hole (3013) passes through the adsorption plate (301) and connects to the dirt accumulation chamber (3017). The dirt accumulation chamber (3017) is used to hold excess cleaning liquid discharged from the drain hole (3013). A packaging bag (3014) is placed below one end of the opening of the groove (3011). The packaging bag (3014) is in contact with the surface of the adsorption plate (301). The packaging bag (3014) is used to hold the components that fall from the groove (3011) after the adsorption is released. The packaging bag (3014) facilitates the safe removal of the cleaned components.

5. The electronic component cleaning device with batch processing function according to claim 4, characterized in that: The vacuum pumping assembly (302) includes a vacuum pump (3021), which is bolted to one end face of the adsorption plate (301). Pumping pipes (3022) are welded to the left and right sides of the vacuum pump (3021). The end of the pumping pipe (3022) away from the vacuum pump (3021) extends into the vacuum chamber (3015) through two pumping holes (3016).

6. The electronic component cleaning device with batch processing function according to claim 5, characterized in that: The low-temperature heating component (303) includes a heater (3031), which is fixedly connected to the other end face of the adsorption plate (301). Heating pipes (3032) are welded and fixed on the left and right sides of the heater (3031). The end of the heating pipe (3032) away from the heater (3031) extends into the adsorption plate (301) through the heating hole (3019). Heating chambers (3018) are provided at the left and right ends inside the adsorption plate (301). The heating chambers (3018) are connected to the dirt accumulation chamber (3017). The end of the heating pipe (3032) away from the heater (3031) extends into the heating chamber (3018).

7. The electronic component cleaning device with batch processing function according to claim 6, characterized in that: The cleaning component (4) includes a cleaning brush (401). The cleaning component (4) is slidably connected above the adsorption component (3) via a sliding groove (304). A liquid storage tank (402) is welded to the top of the cleaning brush (401) for storing cleaning agent. An inlet (403) is provided at the top of the liquid storage tank (402) for adding cleaning agent. A low-pressure nozzle (404) is provided at the bottom of the liquid storage tank (402), and the low-pressure nozzle (404) penetrates the cleaning brush (401). 401) is used for the discharge of cleaning fluid. An antistatic brush (405) is fixedly installed on the side of the cleaning brush (401) away from the liquid storage tank (402). The antistatic brush (405) is used to remove dirt from the diode surface. Support frames (406) are provided at the left and right ends of the cleaning brush (401). A fixed slider (407) is welded to the lowest end of the support frame (406). The slider (407) is slidably connected to the sliding grooves (304) opened at the left and right ends of the adsorption component (3).

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