A thin-film capacitor that prevents desoldering

Abstract

This utility model discloses a thin-film capacitor with anti-detachment properties, relating to the field of thin-film capacitor technology. It includes a resin casing, with a dielectric film and metal foil wound inside. Vertical pin leads are vertically arranged on both sides of the inner surface of the resin casing. An inner groove is formed inside each pin lead, and a triangular groove is formed at the middle of the bottom end of each pin lead. Two sets of ceramic connecting blocks are fixedly connected between two sets of ceramic inner frames. This anti-detachment thin-film capacitor, with its pin leads, inner groove, and triangular groove, allows for easy insertion of the pin leads along the solder holes on the circuit board. After insertion, tweezers or a knife are inserted along the triangular groove at the end of the pin lead, widening the inner groove and causing the pin lead to press firmly against both sides of the solder hole. This prevents detachment after soldering, addressing the problem of devices lacking anti-detachment functionality.

Description

Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, specifically to a thin film capacitor that prevents desoldering. Background Technology

[0002] A film capacitor is a capacitor constructed by using metal foil as electrodes, overlapping it with a plastic film such as polyethylene, polypropylene, polystyrene, or polycarbonate from both ends, and then winding it into a cylindrical shape.

[0003] Most film capacitors currently on the market are similar in structure, with an inner core made of dielectric film and metal foil, and an outer resin shell. They are connected to the circuit board through two sets of pin leads. However, they have some functional shortcomings in actual use and have room for improvement. For example, the capacitor and circuit board are soldered by insertion, that is, the pin leads are inserted into the corresponding holes of the circuit board and then fixed by soldering. The connection between the pin leads and the circuit board is easy to fall off, resulting in desoldering. The capacitor will then have poor contact and does not have the function of preventing desoldering.

[0004] Now, a novel anti-detachment thin-film capacitor is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a thin-film capacitor that prevents desoldering, so as to solve the problem mentioned in the background art of not having the function of preventing desoldering.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thin-film capacitor with anti-detachment properties, comprising a resin shell, wherein a dielectric film and a metal foil are wound inside the resin shell, and pin leads are vertically arranged on both sides inside the resin shell, wherein an inner groove is formed inside the pin lead, and a triangular groove is formed at the middle position of the bottom end of the pin lead, wherein a positioning plate is arranged below the resin shell, wherein pin holes are formed on both sides of the top of the positioning plate, and the bottom end of the positioning plate is uniformly coated with self-adhesive, wherein multiple sets of ceramic inner skeletons are fixedly connected inside the resin shell, and two sets of ceramic connecting blocks are fixedly connected between two sets of ceramic inner skeletons.

[0007] As a further technical solution of this utility model, the pin leads are symmetrically distributed about the vertical center line of the resin shell, and the metal foil and pin leads are connected together.

[0008] As a further technical solution of this utility model, the inner groove passes through both ends of the pin lead wire, and the inner groove and the triangular groove are connected internally.

[0009] As a further technical solution of this utility model, the inner diameter of the needle eye is consistent with the outer diameter of the needle lead wire, and the needle eye passes through the upper and lower ends of the positioning plate.

[0010] As a further technical solution of this utility model, the pin lead wire and the positioning plate are fixedly connected, and the vertical center lines of the resin shell and the positioning plate coincide.

[0011] As a further technical solution of this utility model, the ceramic inner skeleton is arranged at equal intervals, and the ceramic connecting blocks are symmetrically distributed about the horizontal center line of the ceramic inner skeleton.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the anti-detachment film capacitor not only achieves the function of preventing detachment and facilitating positioning, but also achieves the function of internal support and reinforcement.

[0013] (1) By setting pin leads, inner slots and triangular slots, when in use, dielectric film and metal foil are wound into the inner core of the capacitor, and resin shell covers the inner core. The pin leads are connected to the circuit board. The pin leads are inserted along the solder holes of the circuit board. After the pin leads are inserted, tweezers or knives are inserted along the triangular slot at the end of the pin leads. The inner slot is expanded through the triangular slot, and the pin leads are pressed against both sides of the solder holes. After soldering, they are not easy to fall off, thus realizing the function of preventing desoldering.

[0014] (2) By setting up a positioning plate, pin holes and self-adhesive, when in use, the pin lead is inserted along the solder hole of the circuit board. As the positioning plate presses against the circuit board, the self-adhesive sticks to the circuit board, which facilitates subsequent soldering and realizes the function of easy positioning.

[0015] (3) By setting up a ceramic inner skeleton and ceramic connecting blocks, when in use, the resin shell protects the inner core. On the basis of the resin shell, the inner skeleton composed of the ceramic inner skeleton and ceramic connecting blocks can protect the inner core, thus realizing the function of internal support and reinforcement. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a partial cross-sectional structure of the present invention.

[0017] Figure 2 This is a partially enlarged structural diagram of the dielectric thin film and metal foil of this utility model;

[0018] Figure 3 This is a magnified front view of the pin lead wire of this utility model in the open state;

[0019] Figure 4 This is a magnified view of the positioning plate structure of this utility model from below;

[0020] Figure 5 This is a side view magnified structural diagram of the ceramic inner skeleton of this utility model.

[0021] In the diagram: 1. Resin shell; 2. Dielectric film; 3. Metal foil; 4. Pin lead wire; 5. Inner groove; 6. Triangular groove; 7. Positioning plate; 8. Pin eye; 9. Adhesive; 10. Ceramic inner skeleton; 11. Ceramic connecting block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Please refer to Figure 1-5 A thin-film capacitor designed to prevent desoldering includes a resin shell 1, with a dielectric film 2 and a metal foil 3 wound inside the resin shell 1. Pin leads 4 are vertically arranged on both sides inside the resin shell 1. The pin leads 4 have internal grooves 5 and a triangular groove 6 at the middle of the bottom end of the pin leads 4. A positioning plate 7 is arranged below the resin shell 1. Pin holes 8 are opened on both sides of the top of the positioning plate 7. The bottom end of the positioning plate 7 is uniformly coated with self-adhesive 9. Multiple sets of ceramic inner skeletons 10 are fixedly connected inside the resin shell 1. Two sets of ceramic connecting blocks 11 are fixedly connected between two sets of ceramic inner skeletons 10.

[0024] The pin leads 4 are symmetrically distributed about the vertical center line of the resin shell 1. The metal foil 3 and the pin leads 4 are connected. The inner groove 5 runs through the front and rear ends of the pin leads 4. The inner groove 5 and the triangular groove 6 are connected to each other to prevent desoldering.

[0025] Specifically, such as Figure 1 , Figure 2 and Figure 3 As shown, the pin lead 4 is inserted along the solder hole of the circuit board. After the pin lead 4 is inserted, tweezers or a knife are inserted along the triangular groove 6 at the end of the pin lead 4. The inner groove 5 is expanded through the triangular groove 6, and the pin lead 4 is pressed against both sides of the solder hole, so it is not easy to fall off after soldering.

[0026] The inner diameter of the pin eye 8 is the same as the outer diameter of the pin lead 4. The pin eye 8 passes through the upper and lower ends of the positioning plate 7. The pin lead 4 and the positioning plate 7 are fixedly connected. The vertical center lines of the resin shell 1 and the positioning plate 7 coincide, which facilitates the positioning of the capacitor.

[0027] Specifically, such as Figure 1 and Figure 4 As shown, the pin lead 4 is inserted along the solder holes of the circuit board. As the positioning plate 7 presses against the circuit board, the adhesive 9 adheres the circuit board, facilitating subsequent soldering.

[0028] The ceramic inner skeleton 10 is arranged at equal intervals, and the ceramic connecting blocks 11 are symmetrically distributed about the horizontal center line of the ceramic inner skeleton 10, which can protect the inner core of the capacitor.

[0029] Specifically, such as Figure 1 and Figure 5 As shown, the resin shell 1 protects the inner core. Based on the resin shell 1, the inner skeleton composed of the ceramic inner skeleton 10 and the ceramic connecting block 11 can protect the inner core.

[0030] Working Principle: In use, the dielectric film 2 and metal foil 3 are first wound to form the inner core of the capacitor. The resin shell 1 encapsulates the inner core. The pin leads 4 are connected to the circuit board. The pin leads 4 are inserted along the solder holes of the circuit board. After the pin leads 4 are inserted, tweezers or a knife are inserted along the triangular groove 6 at the end of the pin leads 4. The inner groove 5 is widened by the triangular groove 6, and the pin leads 4 are pressed against both sides of the solder holes, making them less likely to fall off after soldering. The pin leads 4 are inserted along the solder holes of the circuit board. With the positioning plate 7 pressing against the circuit board, the adhesive 9 adheres to the circuit board, facilitating subsequent soldering. The resin shell 1 protects the inner core. Based on the resin shell 1, the inner skeleton composed of the ceramic inner frame 10 and the ceramic connecting block 11 can protect the inner core.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A thin-film capacitor resistant to solder detachment, comprising a resin casing (1), characterized in that: The resin shell (1) is wound with a dielectric film (2) and a metal foil (3). The resin shell (1) has vertically arranged pin leads (4) on both sides. The pin leads (4) have an inner groove (5) inside. The pin leads (4) have a triangular groove (6) at the middle position of the bottom end. The resin shell (1) has a positioning plate (7) at the bottom. The positioning plate (7) has pin holes (8) on both sides of the top. The bottom end of the positioning plate (7) is uniformly coated with self-adhesive (9). The resin shell (1) has multiple sets of ceramic inner skeletons (10) fixedly connected inside. Two sets of ceramic connecting blocks (11) are fixedly connected between two sets of ceramic inner skeletons (10).

2. The anti-detachment thin-film capacitor according to claim 1, characterized in that: The pin leads (4) are symmetrically distributed about the vertical center line of the resin shell (1), and the metal foil (3) and the pin leads (4) are connected to each other.

3. The anti-detachment thin-film capacitor according to claim 1, characterized in that: The inner groove (5) passes through the front and rear ends of the pin lead wire (4), and the inner groove (5) and the triangular groove (6) are connected internally.

4. A thin-film capacitor for preventing desoldering according to claim 1, characterized in that: The inner diameter of the eyelet (8) is the same as the outer diameter of the lead wire (4), and the eyelet (8) passes through the upper and lower ends of the positioning plate (7).

5. A thin-film capacitor for preventing desoldering according to claim 1, characterized in that: The pin lead wire (4) and the positioning plate (7) are fixedly connected, and the vertical center lines of the resin shell (1) and the positioning plate (7) coincide.

6. A thin-film capacitor for preventing desoldering according to claim 1, characterized in that: The ceramic inner skeleton (10) is arranged at equal intervals, and the ceramic connecting blocks (11) are symmetrically distributed about the horizontal center line of the ceramic inner skeleton (10).

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