Vacuum flash apparatus

Abstract

The application relates to the technical field of solar cells, and provides a vacuum flash evaporation device. The vacuum flash evaporation device comprises a flash evaporation lower chamber, a flash evaporation upper chamber provided on the flash evaporation lower chamber and a flash evaporation cavity formed between the flash evaporation lower chamber and the flash evaporation upper chamber; a vacuum obtaining module for communicating with the flash evaporation cavity is arranged on the flash evaporation upper chamber; and the flash evaporation lower chamber comprises a substrate placing table and a refrigeration module arranged at the bottom of the substrate placing table. The vacuum flash evaporation device can provide a temperature condition for low-temperature flash evaporation, the nucleation site density is significantly increased during low-temperature crystallization, the crystal grains are smaller, the grain boundary defects can be reduced, the compactness, uniformity and stability of a perovskite thin film can be improved, and therefore the crystallization quality of the perovskite thin film can be improved.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, and in particular to a vacuum flash evaporation device. Background Technology

[0002] Flash evaporation is one of the important processes in manufacturing perovskite solar cells, mainly used for the preparation and formation of perovskite thin films. This process typically involves coating a perovskite precursor solution onto a substrate material, followed by flash evaporation to remove the solvent and form a perovskite thin film.

[0003] Currently, vacuum crystallization equipment is either a cavity structure or contains a heating device within the cavity structure to facilitate solvent escape and thus rapid crystallization. However, this rapid crystallization method is detrimental to improving the crystallization quality of perovskite thin films. Utility Model Content

[0004] In view of this, this application aims to provide a vacuum flash evaporation device that is beneficial for improving the crystallization quality of perovskite thin films.

[0005] To achieve the above objectives, the technical solution of this application is implemented as follows: A vacuum flash evaporation device includes a lower flash evaporation chamber and an upper flash evaporation chamber that is covered by the lower flash evaporation chamber, wherein the lower flash evaporation chamber and the upper flash evaporation chamber form a flash evaporation chamber. The upper flash chamber is equipped with a vacuum acquisition module that communicates with the flash chamber, and the lower flash chamber includes a substrate placement stage and a cooling module located at the bottom of the substrate placement stage.

[0006] Furthermore, it also includes a drive mechanism connected to the substrate placement stage drive, the drive mechanism being used to drive the substrate placement stage to close the flash evaporation upper chamber to form a sealed flash evaporation chamber or to move away from the flash evaporation upper chamber.

[0007] Furthermore, the driving mechanism includes a first driving unit, a base connected to the driving end of the first driving unit, and a second driving unit disposed on the base. The substrate placement stage is connected to the driving end of the second driving unit. The first driving unit is used to drive the base to move closer to or further away from the flash evaporation upper chamber in the horizontal direction, and the second driving unit is used to drive the substrate placement stage to move up and down in the vertical direction to seal and connect or disconnect from the flash evaporation upper chamber.

[0008] Furthermore, the base is provided with a guide sleeve, and the substrate placement platform is provided with a guide post, which is slidably disposed in the guide sleeve in the vertical direction.

[0009] Furthermore, the substrate placement stage is provided with a substrate placement position and a limiting component located around the substrate placement position, the limiting component being used to limit the circumferential degree of freedom of the substrate.

[0010] Furthermore, the projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks located at two corners of any opposite corner of the substrate placement position.

[0011] Furthermore, the flash chamber includes a flash upper chamber formed on the flash upper chamber; the top of the flash upper chamber is provided with an outlet communicating with the vacuum acquisition module, and the flash upper chamber is provided with a gas equalization plate located in the flash upper chamber. The gas equalization plate is located below the outlet and is used to guide the airflow flowing out of the flash chamber to be uniform.

[0012] Furthermore, the gas equalization plate is connected to the upper cavity wall of the flash evaporation upper chamber, and the gas equalization plate has a central portion located below the gas outlet, and a plurality of through holes arranged circumferentially around the central portion.

[0013] Furthermore, the cooling module includes a semiconductor cooling module disposed at the bottom of the substrate placement stage, and a water cooling module disposed at the bottom of the semiconductor cooling module.

[0014] Furthermore, the vacuum acquisition module includes a vacuum pump, a vacuum pipeline connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve disposed on the vacuum pipeline.

[0015] Compared with related technologies, this application has the following advantages: (1) The vacuum flash evaporation device described in this application provides a low-temperature flash evaporation temperature condition on the basis of the vacuum condition provided by the vacuum acquisition module by setting a cooling module at the bottom of the substrate placement stage. Furthermore, based on the fact that the nucleation site density increases significantly during low-temperature crystallization and the grains are smaller, grain boundary defects can be reduced, which can help improve the compactness, uniformity and stability of the perovskite film, thereby improving the crystallization quality of the perovskite film.

[0016] (2) By setting up a drive mechanism, the overall automation level of the device can be improved.

[0017] (3) By cooperating with the first driving unit and the second driving unit, the substrate placement stage can move in the horizontal and vertical directions, which facilitates the substrate placement stage to approach and close the flash evaporation upper chamber to form a sealed flash evaporation chamber, or to move away from the flash evaporation upper chamber to facilitate the placement of the substrate.

[0018] (4) The combined use of guide sleeve and guide column can help improve the stability of substrate placement stage lifting.

[0019] (5) By setting a limiting component, the circumferential degree of freedom of the substrate can be limited, ensuring the substrate placement position and avoiding deviations in the substrate placement position that could affect the crystallization effect during flash evaporation.

[0020] (6) The projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks located at two corners of any opposite corner of the substrate placement position, which can ensure that the substrate placement position is not deviated, and also reduce the number of structural components used, which is conducive to simplifying the structure and reducing costs.

[0021] (7) By setting up a gas equalization plate, the flow path of the airflow in the flash evaporation chamber can be optimized, making the airflow more uniform and conducive to forming a stable and uniform airflow field, which helps to improve the thickness uniformity, composition consistency and crystal quality of the perovskite film.

[0022] (8) The uniform air plate has a central part located below the air outlet and multiple through holes arranged circumferentially around the central part. The structure is simple and conducive to optimizing the airflow path, thereby forming a stable and uniform airflow field.

[0023] (9) The cooling module adopts a combination of semiconductor cooling module and water cooling module. The characteristics of semiconductor cooling, fast response and high temperature control accuracy can make up for the shortcomings of water cooling, such as slow adjustment and no active cooling. The high power and high cooling stability of water cooling can solve the problems of heat accumulation and power limitation of semiconductor cooling, which is conducive to improving temperature control accuracy and heat dissipation efficiency.

[0024] (10) By using a vacuum pump, a vacuum valve and a vacuum breaking valve together, it is possible to accurately control the vacuum level and ensure the stability of the vacuuming process and the overall safety of the device. Attached Figure Description

[0025] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the vacuum flash evaporation device described in the embodiments of this application; Figure 2 for Figure 1 A schematic diagram of the structure shown in the image from another perspective; Figure 3 This is an exploded view of the flash evaporation lower chamber as described in the embodiments of this application; Figure 4 This is an exploded view of the flash evaporation upper chamber as described in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the air distribution plate described in the embodiment of this application; Explanation of reference numerals in the attached figures: 100. Flash vaporization lower chamber; 1000, Substrate; 101, Substrate Placement Stage; 1011, Guide Post; 1012, Limiting Block; 1013, Groove; 102, Cooling Module; 1021, Semiconductor Cooling Module; 1022, Water Cooling Module; 200. Flash vaporization upper chamber; 2000, Flash evaporation upper chamber; 201, Upper chamber wall; 2011, Air outlet; 202, Side chamber wall; 203, Gas equalization plate; 2031, Central part; 2032, Through hole; 204, Connecting column; 300. Drive mechanism; 301, guide rail; 302, sliding seat; 303, base; 3031, guide sleeve; 304, second drive unit; 400. Vacuum Acquisition Module. Detailed Implementation

[0026] To make the technical solution and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0028] Furthermore, it should be noted that in the description of this application, if terms such as "upper," "lower," "inner," or "outer" appear, indicating orientation or positional relationship, these are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, if terms such as "first" or "second" appear, they are also used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] Furthermore, in the description of this application, unless otherwise expressly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application in light of the specific circumstances.

[0030] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The present application will now be described in detail through exemplary embodiments. However, it should be understood that, without further description, elements, structures, and features in one embodiment may be advantageously incorporated into other embodiments.

[0032] This application provides a vacuum flash evaporation device, which is beneficial for improving the crystallization quality of perovskite films and provides more possibilities for the flash evaporation process of perovskite films.

[0033] Among related technologies, flash evaporation is one of the important processes for manufacturing perovskite solar cells, mainly used for the preparation and film formation of perovskite thin films. This process typically involves coating a perovskite precursor solution onto a substrate material, followed by flash evaporation to remove the solvent, thereby forming a perovskite thin film.

[0034] Currently, vacuum crystallization equipment is either a cavity structure or contains a heating device within the cavity structure to facilitate solvent escape and thus rapid crystallization. However, this rapid crystallization method is detrimental to improving the crystallization quality of perovskite thin films.

[0035] In view of this, in order to overcome the shortcomings of related technologies, the vacuum flash evaporation apparatus of this embodiment combines... Figures 1 to 5 As shown, the overall design includes a flash lower chamber 100 and a flash upper chamber 200 covered by the flash lower chamber 100.

[0036] The flash chamber is formed by the lower flash chamber 100 and the upper flash chamber 200. The upper flash chamber 200 is provided with a vacuum acquisition module 400 that communicates with the flash chamber. The lower flash chamber 100 includes a substrate placement stage 101 and a cooling module 102 located at the bottom of the substrate placement stage 101.

[0037] Therefore, by setting a cooling module 102 at the bottom of the substrate placement stage 101, the temperature conditions for flash evaporation at low temperature can be provided on the basis of the vacuum conditions provided by the vacuum acquisition module 400. Furthermore, since the nucleation site density increases significantly and the grains are smaller during low-temperature crystallization, grain boundary defects can be reduced, which can help improve the compactness, uniformity and stability of the perovskite film. This can improve the crystallization quality of the perovskite film and provide more possibilities for the flash evaporation process of perovskite films.

[0038] Based on the above general introduction, specifically, the vacuum flash evaporation device in this embodiment also includes a frame. The flash evaporation lower chamber 100, flash evaporation upper chamber 200 and vacuum acquisition module 400 are all mounted on the frame. The specific structure of the frame can be set and adjusted according to the actual load-bearing and installation requirements of each structure in the vacuum flash evaporation device, which will not be described in detail here.

[0039] It should be noted that the direction-related descriptions in this embodiment are merely illustrative examples. In actual implementation, the direction descriptions in this embodiment vary depending on the orientation of the substrate placement stage 101. That is, each direction in this embodiment refers to a relative coordinate system with the substrate placement stage 101 as the reference. For example, in this embodiment, the horizontal direction refers to the width direction of the substrate placement stage 101, and the vertical direction refers to the height direction of the substrate placement stage 101, etc.

[0040] Continue to combine Figure 1 and Figure 2 As shown, in some exemplary embodiments, the vacuum flash evaporation apparatus of this embodiment further includes a drive mechanism 300 drivenly connected to the substrate placement stage 101. The drive mechanism 300 is used to drive the substrate placement stage 101 to close the upper flash evaporation chamber 200 to form a sealed flash evaporation chamber or to move away from the upper flash evaporation chamber 200. By providing the drive mechanism 300, the overall automation level of the apparatus can be improved.

[0041] Furthermore, in some exemplary embodiments, the drive mechanism 300 includes a first drive unit, a base 303 connected to the drive end of the first drive unit, and a second drive unit 304 disposed on the base 303, with the substrate placement stage 101 connected to the drive end of the second drive unit 304.

[0042] The first driving unit is used to drive the base 303 to move closer to or further away from the flash evaporation upper chamber 200 in the horizontal direction, and the second driving unit 304 is used to drive the substrate placement stage 101 to move up and down in the vertical direction so as to seal and dock with or detach from the flash evaporation upper chamber 200.

[0043] It is understandable that, through the coordinated arrangement of the first driving unit and the second driving unit 304, the substrate placement stage 101 can move in the horizontal and vertical directions, thereby facilitating the substrate placement stage 101 to approach and close the flash evaporation upper chamber 200 to form a sealed flash evaporation chamber, or to move away from the flash evaporation upper chamber 200 to facilitate the placement of the substrate 1000.

[0044] In specific implementations, in some exemplary embodiments, the drive mechanism 300 of this embodiment further includes a guide rail 301 disposed on the frame. The guide rail 301 extends horizontally, and the base 303 is slidably disposed on the guide rail 301 via a sliding seat 302. In this way, the stability of the base 303 moving in the horizontal direction can be improved, that is, the stability of the flash lower chamber 100 moving in the horizontal direction can be improved.

[0045] Of course, the number and arrangement of the guide rails 301 in this embodiment can be set and adjusted according to the actual guiding and sliding requirements of the base 303. For example, they can be two or three arranged at intervals along the length of the substrate placement stage 101.

[0046] Meanwhile, the first drive unit in this embodiment can preferably be a servo motor or a cylinder, and if necessary, a linear module well known to those skilled in the art can be directly used. The second drive unit 304 in this embodiment can preferably be a cylinder, with the cylinder rod passing through the substrate and connected to the substrate placement stage 101 to drive the substrate placement stage 101 to move up and down in the vertical direction.

[0047] Continue to combine Figures 1 to 3 As shown, in some exemplary embodiments, the base 303 is provided with a guide sleeve 3031, and the substrate placement stage 101 is provided with a guide post 1011, which is slidably disposed in the guide sleeve 3031 in the vertical direction. The cooperation between the guide sleeve 3031 and the guide post 1011 can help improve the stability of the substrate placement stage 101 during lifting.

[0048] It should be mentioned that the number and arrangement of the guide sleeve 3031 and the guide post 1011 can be set and adjusted according to the actual guiding requirements of the substrate placement stage 101. For example, the guide post 1011 can slide vertically in the guide sleeve 3031 after passing through the base 303. Or, the guide sleeve 3031 and the guide post 1011 can be arranged in two or three sets at intervals.

[0049] In addition, continue to combine Figures 1 to 3 As shown, in some exemplary embodiments, the substrate placement stage 101 is provided with a substrate placement position and a limiting component located around the substrate placement position, the limiting component being used to limit the circumferential degree of freedom of the substrate 1000.

[0050] It can be understood that by setting a limiting component, the substrate's 1000 circumferential degrees of freedom can be limited, ensuring the substrate's placement position and preventing deviations in the substrate's placement position from affecting the crystallization effect during flash evaporation.

[0051] Furthermore, in some exemplary embodiments, the projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position.

[0052] Here, the projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position. This ensures that the substrate placement position is not deviated and also reduces the number of structural components used, which is beneficial for simplifying the structure and reducing costs.

[0053] Continue to combine Figures 1 to 3 As shown in some exemplary embodiments, in this embodiment, in order to facilitate the placement and removal of the substrate 1000, grooves 1013 are also provided on the substrate placement stage 101, which are arranged opposite to each other along their own length direction. Each groove 1013 extends along the width direction of the substrate placement stage 101, so that it is convenient for the operator to manually place and remove the substrate 1000.

[0054] Continue to combine Figure 1 , Figure 2 and Figure 4 As shown, in some exemplary embodiments, the flash chamber includes a flash upper chamber 2000 formed on the flash upper chamber 200. The top of the flash upper chamber 200 is provided with an outlet 2011 communicating with the vacuum acquisition module 400. A gas equalization plate 203 is provided on the flash upper chamber 200, located within the flash upper chamber 200. The gas equalization plate 203 is located below the outlet 2011 and is used to guide the airflow flowing out of the flash chamber to be uniform.

[0055] By setting up the gas equalization plate 203, the flow path of the airflow in the flash evaporation chamber can be optimized, making the airflow more uniform and conducive to forming a stable and uniform airflow field, thereby helping to improve the thickness uniformity, composition consistency and crystal quality of the perovskite film.

[0056] Continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in some exemplary embodiments, the gas equalization plate 203 is connected to the upper cavity wall 201 of the flash evaporation upper chamber 200, and the gas equalization plate 203 has a central portion 2031 located below the air outlet 2011, and a plurality of through holes 2032 arranged circumferentially around the central portion 2031.

[0057] It can be understood that the air distribution plate 203 has a central part 2031 located below the air outlet 2011, and multiple through holes 2032 arranged circumferentially around the central part 2031. The structure is simple and conducive to optimizing the airflow path, thereby forming a stable and uniform airflow field.

[0058] In specific implementations, in some exemplary embodiments, the flash evaporation upper chamber 200 includes the aforementioned upper chamber wall 201 and a side chamber wall 202 disposed below the upper chamber wall 201. The side chamber wall 202 is arranged circumferentially around the upper chamber wall 201, and the aforementioned flash evaporation upper chamber 2000 is formed by the side chamber wall 202 and the upper chamber wall 201.

[0059] Meanwhile, in some exemplary embodiments, the gas equalization plate 203 can be connected to the upper cavity wall 201 through connecting columns 204. The number and arrangement of the connecting columns 204 can be set and adjusted according to the actual installation requirements of the gas equalization plate 203. For example, there are four connecting columns 204, and the line connecting each connecting column 204 is rectangular.

[0060] Furthermore, in some exemplary embodiments, the number of through holes 2032 on the gas equalization plate 203 can be three, four, or five, as long as it ensures that a stable and uniform airflow field is formed in the flash chamber. At the same time, the shape of the gas equalization plate 203 can also be set and adjusted according to the requirements of uniform airflow, such as being visually triangular or rhomboid.

[0061] In addition, continue to combine Figures 1 to 3 As shown, in some exemplary embodiments, the cooling module 102 includes a semiconductor cooling module 1021 disposed at the bottom of the substrate placement stage 101, and a water cooling module 1022 disposed at the bottom of the semiconductor cooling module 1021.

[0062] It can be understood that the cooling module 102 adopts a combination of semiconductor cooling module 1021 and water cooling module 1022. The semiconductor cooling module can make up for the shortcomings of water cooling, such as slow adjustment and lack of active cooling, by using the characteristics of fast response and high temperature control accuracy. The water cooling module can also solve the problems of heat accumulation and power limitation of semiconductor cooling by using the high power and high cooling stability of water cooling, which is conducive to improving temperature control accuracy and heat dissipation efficiency.

[0063] The cooling module 102 combines a semiconductor cooling module 1021 and a water cooling module 1022, which can quickly reduce the temperature of the substrate 1000 to 10°C or even below 0°C, thus helping to improve the quality of perovskite thin film forming.

[0064] Furthermore, in some exemplary embodiments, the base 303 of this embodiment is provided with a clearance hole for avoiding the cooling module 102. The main advantage of this arrangement is that it can improve the overall vertical integration of the device, save space, and also achieve a weight reduction effect, contributing to the overall lightweighting of the device. Moreover, the clearance hole also facilitates the arrangement and installation of the water inlet and outlet pipes of the water-cooling module 1022.

[0065] In this embodiment, in some exemplary implementations, the cooling module 102 is attached to or placed on the bottom of the substrate placement stage 101, which can facilitate the reduction of heat transfer medium and achieve rapid and uniform cooling, thereby improving the perovskite thin film forming quality.

[0066] In some exemplary embodiments, the substrate 1000 is placed in close contact with the substrate placement stage 101, which makes the structure of the vacuum flash evaporation device of this embodiment more compact, significantly reducing the volume of the flash evaporation chamber and thus accelerating the vacuuming speed.

[0067] Continue to combine Figure 1 As shown, in some exemplary embodiments, the vacuum acquisition module 400 includes a vacuum pump, a vacuum line connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve disposed on the vacuum line. The main advantage of this arrangement is that it allows for precise control of the vacuum level and ensures the stability of the vacuum extraction process and the overall safety of the device.

[0068] In this embodiment of the vacuum flash evaporation device, after the vacuum acquisition module 400 is started, the vacuum pump is first turned on, and the vacuum extraction valve and vacuum breaking valve are closed by default. Then, the semiconductor cooling module 1021 and the water cooling module 1022 are turned on together to achieve rapid cooling of the lower flash chamber 100. At this time, driven by the drive mechanism 300, the lower flash chamber 100 is moved horizontally away from the upper flash chamber 200 to the standby position. Then, the substrate 1000 can be manually placed and removed. After the substrate is placed, the lower flash chamber 100 is moved horizontally to below the upper flash chamber 200 by the drive mechanism 300, and then raised to close and seal with the upper flash chamber 200. Finally, the vacuum extraction valve is opened. Since the vacuum pump is turned on in advance and is in a high speed state, the vacuum degree in the chamber can be pumped to less than 10 Pa within 30 seconds after the vacuum extraction valve is opened, thus achieving low-temperature flash evaporation.

[0069] It is worth noting that, regarding the vacuum flash evaporation device of this embodiment, based on the above exemplary embodiments, in specific implementation, as a preferred embodiment, it is still composed of... Figures 1 to 5 As shown, it may include, for example, a flash lower chamber 100 and a flash upper chamber 200 covered by the flash lower chamber 100.

[0070] The flash chamber is formed by the lower flash chamber 100 and the upper flash chamber 200; and the upper flash chamber 200 is provided with a vacuum acquisition module 400 that communicates with the flash chamber. The lower flash chamber 100 includes a substrate placement stage 101 and a cooling module 102 located at the bottom of the substrate placement stage 101.

[0071] It also includes a drive mechanism 300 that is connected to the substrate placement stage 101. The drive mechanism 300 is used to drive the substrate placement stage 101 to close the flash evaporation upper chamber 200 to form a sealed flash evaporation chamber or to move away from the flash evaporation upper chamber 200.

[0072] The drive mechanism 300 includes a first drive unit, a base 303 connected to the drive end of the first drive unit, and a second drive unit 304 disposed on the base 303. The substrate placement stage 101 is connected to the drive end of the second drive unit 304. The first drive unit is used to drive the base 303 to move closer to or further away from the flash evaporation upper chamber 200 in the horizontal direction, and the second drive unit 304 is used to drive the substrate placement stage 101 to rise and fall in the vertical direction, so as to seal and connect or disconnect from the flash evaporation upper chamber 200.

[0073] The base 303 is provided with a guide sleeve 3031, and the substrate placement platform 101 is provided with a guide post 1011. The guide post 1011 is slidably disposed in the guide sleeve 3031 in the vertical direction.

[0074] The substrate placement stage 101 is provided with a substrate placement position and a limiting component located around the substrate placement position. The limiting component is used to limit the circumferential degree of freedom of the substrate 1000.

[0075] The substrate placement position has a rectangular projection outline along the vertical direction, and the limiting component includes limiting blocks 1012 located at two corners of any opposite corner of the substrate placement position.

[0076] The flash chamber includes a flash upper chamber 2000 formed on the flash upper chamber 200; and the top of the flash upper chamber 200 is provided with an outlet 2011 that communicates with the vacuum acquisition module 400. The flash upper chamber 200 is provided with a gas equalization plate 203 located inside the flash upper chamber 200. The gas equalization plate 203 is located below the outlet 2011 and is used to guide the airflow flowing out of the flash chamber to be uniform.

[0077] The gas equalization plate 203 is connected to the upper cavity wall 201 of the flash evaporation upper chamber 200, and the gas equalization plate 203 has a central portion 2031 located below the air outlet 2011, and a plurality of through holes 2032 arranged circumferentially around the central portion 2031.

[0078] The cooling module 102 includes a semiconductor cooling module 1021 disposed at the bottom of the substrate placement stage 101, and a water cooling module 1022 disposed at the bottom of the semiconductor cooling module 1021.

[0079] The vacuum acquisition module 400 includes a vacuum pump, a vacuum pipeline connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve located on the vacuum pipeline.

[0080] In the preferred embodiment of the above-described vacuum flash evaporation device, the specific configuration and arrangement of the lower flash chamber 100, upper flash chamber 200, drive mechanism 300, vacuum acquisition module 400, etc., can still be referred to the descriptions in the above-described exemplary embodiments. Furthermore, in this preferred embodiment, the beneficial effects brought about by the design of the lower flash chamber 100, upper flash chamber 200, drive mechanism 300, and vacuum acquisition module 400 can also be referred to the descriptions in the above-described exemplary embodiments.

[0081] The vacuum flash evaporation apparatus of this embodiment adopts the above design. By setting a cooling module 102 at the bottom of the substrate placement stage 101, it can provide the temperature conditions for low-temperature flash evaporation on the basis of the vacuum conditions provided by the vacuum acquisition module 400. Furthermore, since the nucleation site density increases significantly during low-temperature crystallization and the grains are smaller, grain boundary defects can be reduced, which can help improve the compactness, uniformity and stability of the perovskite film, thereby improving the crystallization quality of the perovskite film.

[0082] The above descriptions are merely some embodiments of this application and are not intended to limit this application. The technical features or structures in the foregoing different embodiments can be arbitrarily combined to form other specific technical solutions as needed. For those skilled in the art, this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of the claims of this application.

Claims

1. A vacuum flash evaporation apparatus, characterized in that: It includes a flash lower chamber (100) and a flash upper chamber (200) covered by the flash lower chamber (100), and a flash chamber is formed between the flash lower chamber (100) and the flash upper chamber (200); The upper flash chamber (200) is provided with a vacuum acquisition module (400) that communicates with the flash chamber. The lower flash chamber (100) includes a substrate placement stage (101) and a cooling module (102) located at the bottom of the substrate placement stage (101).

2. The vacuum flash evaporation apparatus according to claim 1, characterized in that: It also includes a drive mechanism (300) that is driven to the substrate placement stage (101), the drive mechanism (300) being used to drive the substrate placement stage (101) to close the flash evaporation upper chamber (200) to form a sealed flash evaporation chamber or to move away from the flash evaporation upper chamber (200).

3. The vacuum flash evaporation apparatus according to claim 2, characterized in that: The driving mechanism (300) includes a first driving unit, a base (303) connected to the driving end of the first driving unit, and a second driving unit (304) disposed on the base (303). The substrate placement stage (101) is connected to the driving end of the second driving unit (304). The first driving unit is used to drive the base (303) to move closer to or away from the flash evaporation upper chamber (200) in the horizontal direction, and the second driving unit (304) is used to drive the substrate placement stage (101) to rise and fall in the vertical direction so as to seal and connect or disconnect from the flash evaporation upper chamber (200).

4. The vacuum flash evaporation apparatus according to claim 3, characterized in that: The base (303) is provided with a guide sleeve (3031), and the substrate placement platform (101) is provided with a guide post (1011). The guide post (1011) is slidably disposed in the guide sleeve (3031) in the vertical direction.

5. The vacuum flash evaporation apparatus according to claim 1, characterized in that: The substrate placement stage (101) is provided with a substrate placement position and a limiting component located around the substrate placement position. The limiting component is used to limit the circumferential degree of freedom of the substrate (1000).

6. The vacuum flash evaporation apparatus according to claim 5, characterized in that: The projection outline of the substrate placement position along the vertical direction is rectangular, and the limiting component includes limiting blocks (1012) located at two corners of any opposite corner of the substrate placement position.

7. The vacuum flash evaporation apparatus according to claim 1, characterized in that: The flash chamber includes a flash upper chamber (2000) formed on the flash upper chamber (200); The top of the flash evaporation upper chamber (200) is provided with an air outlet (2011) that connects to the vacuum acquisition module (400). The flash evaporation upper chamber (200) is provided with a gas equalization plate (203) located inside the flash evaporation upper chamber (2000). The gas equalization plate (203) is located below the air outlet and is used to guide the airflow flowing out of the flash evaporation chamber to be uniform.

8. The vacuum flash evaporation apparatus according to claim 7, characterized in that: The gas equalization plate (203) is connected to the upper cavity wall of the flash evaporation upper chamber (200), and the gas equalization plate (203) has a central portion (2031) located below the gas outlet, and a plurality of through holes (2032) arranged circumferentially around the central portion (2031).

9. The vacuum flash evaporation apparatus according to claim 1, characterized in that: The cooling module (102) includes a semiconductor cooling module (1021) disposed at the bottom of the substrate placement stage (101) and a water cooling module (1022) disposed at the bottom of the semiconductor cooling module (1021).

10. The vacuum flash evaporation apparatus according to any one of claims 1 to 9, characterized in that: The vacuum acquisition module (400) includes a vacuum pump, a vacuum pipeline connecting the vacuum pump and the flash chamber, and a vacuum extraction valve and a vacuum breaking valve disposed on the vacuum pipeline.

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