Integrated circuit pin protection cleaning rack device

Abstract

The utility model discloses integrated circuit pin protection cleaning frame device, including bearing box, the drying mechanism of fixed connection in the upper end of bearing box, the sealed box of fixed connection in the upper end of bearing box, the bearing frame of fixed connection in the inner wall of sealed box, place in the upper end of bearing frame's apron, the cleaning mechanism of fixed connection in the bottom surface of bearing box inner wall, fixed connection in the inner wall of sealed box's lifting mechanism, fixed connection in the output of lifting mechanism's E -shaped board, fixed connection in the upper end of E -shaped board's support mechanism, place in the upper end of E -shaped board's multiple integrated circuit body and set up in support mechanism for the positioner of integrated circuit body positioner. The utility model has the advantages of integrated integrated circuit pin protection, fast uniform soaking cleaning, fast air drying and temporary storage function in one, need not frequent integrated circuit taking and placing can complete pretreatment operation, can effectively reduce the pin secondary pollution and secondary damage risk.

Description

Technical Field

[0001] This utility model relates to the field of electronic component maintenance and semiconductor packaging technology, specifically to an integrated circuit pin protection and cleaning rack device. Background Technology

[0002] Integrated circuits, as core components of electronic devices, are widely used in consumer electronics, industrial control, automotive electronics, aerospace, and other fields. Their pins, as key interfaces for the transmission of electrical signals and power, directly determine the stability and reliability of the connection between the integrated circuit and external circuits. As integrated circuit packaging technology develops towards miniaturization and high density, the number of pins increases, and the physical structure of the pins becomes increasingly refined, significantly increasing the requirements for protection and cleaning during storage, transportation, and pre-processing.

[0003] Currently, before soldering integrated circuits, it is necessary to remove contaminants such as dust, flux residue, and oxide layers from the pins. Existing cleaning methods mainly involve manual wiping with cotton swabs dipped in alcohol or using batch spray cleaning equipment. Manual wiping results in uneven cleaning, while batch spray cleaning equipment is more efficient but more expensive. In existing technologies, integrated circuits need to be removed from their protective packaging before cleaning, which increases the risk of secondary contamination and damage to the pins during the process. Furthermore, if cleaned integrated circuits need to be temporarily stored, they still need to be put back into their original protective packaging, making the operation process cumbersome. Existing integrated circuit storage devices are difficult to quickly immerse and clean the pins of integrated circuits during use, and cannot quickly air dry the cleaned pins, which requires further improvement. Utility Model Content

[0004] The purpose of this invention is to provide an integrated circuit pin protection and cleaning rack device, which integrates integrated circuit pin protection, rapid and uniform immersion cleaning, rapid air drying and temporary storage functions. It can complete the pre-treatment operation without frequent picking up and putting down of integrated circuits, effectively reducing the risk of secondary contamination and secondary damage to the pins, and solving the problems in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An integrated circuit pin protection cleaning rack device includes a carrier box, a drying mechanism fixed to the upper end of the carrier box, a sealing box fixed to the upper end of the carrier box, a carrier frame fixed to the inner wall of the sealing box, a cover plate placed on the upper end of the carrier frame, a cleaning mechanism fixed to the bottom surface of the inner wall of the carrier box, a lifting mechanism fixed to the inner wall of the sealing box, an E-shaped plate fixed to the output end of the lifting mechanism, a support mechanism fixed to the upper end of the E-shaped plate, multiple integrated circuit bodies placed on the upper end of the E-shaped plate, and a limiting mechanism provided on the support mechanism for limiting the integrated circuit bodies.

[0007] The container structure consists of a carrying box, a drying mechanism, a sealing box, and a cover plate.

[0008] The integrated circuit body has pins that are evenly distributed on both sides. When the E-shaped plate moves downward, the pins enter the cleaning mechanism and are immersed and cleaned.

[0009] Preferably, the lifting mechanism includes a frame fixed to the inner wall of the sealed box and an electric cylinder fixed to the frame, wherein the lower end of the output shaft of the electric cylinder is fixed to the upper end of the E-shaped plate.

[0010] It is worth noting that using an electric cylinder to drive the E-shaped plate to lift and lower can achieve automated and precise control, ensuring that the integrated circuit pins can accurately and smoothly enter the cleaning mechanism or leave the cleaning solution, avoiding positional deviations and pin damage caused by manual operation, while improving operating efficiency and reducing manual labor intensity.

[0011] Preferably, the drying mechanism includes a blower box fixed to the upper end of the carrier box, an air collecting hood fixed to the air inlet end of the blower box, an axial flow fan fixed to the air inlet end of the air collecting hood, and air heating pipes fixed to both sides of the inner wall of the blower box.

[0012] It is worth noting that the axial flow fan provides a strong airflow, which, together with the hot air generated by the air heating tube, can quickly remove the moisture from the pin surface, enabling the pins to dry quickly after cleaning and avoiding pin oxidation caused by moisture residue. The air collection hood can concentrate the airflow and enhance the drying effect. The whole system is integrated into the carrier box, eliminating the need for additional equipment, saving space and improving the continuity of pretreatment.

[0013] Preferably, the cleaning mechanism includes a support frame fixed to the bottom surface of the inner wall of the support box, multiple cleaning boxes fixed to the support frame, two fixed seats fixed to the lower end of the cleaning boxes, a vibrating rod fixed to the two fixed seats, a wastewater drain pipe fixed to the lower end of the cleaning box, a first connecting pipe fixed to the lower end of the multiple wastewater drain pipes, a second connecting pipe fixed to the lower end of the first connecting pipe, an interconnecting pipe connecting two adjacent cleaning boxes, and one end of an inlet pipe fixed to one of the cleaning boxes. The other end of the inlet pipe passes through the side wall of the support box and extends to the outside of the support box. The lower end of the first connecting pipe passes through the lower end of the support box and extends to the bottom of the support box.

[0014] It is worth noting that multiple cleaning tanks can clean multiple sets of integrated circuit pins simultaneously, improving batch processing efficiency; the vibration generated by the vibrating rod enhances the flushing effect of the cleaning fluid on the pins, making it easier for contaminants such as dust and oxide layers to be removed, improving cleaning uniformity; the interconnecting pipe ensures that the liquid level in each cleaning tank is consistent; and the inlet pipe and wastewater outlet pipe facilitate the addition and discharge of cleaning fluid. The overall structure realizes the automation and convenience of the cleaning process, reducing manual intervention.

[0015] Preferably, the side wall of the cover plate is fitted to the inner wall of the sealing box, and at least one handle is fixedly attached to the upper end of the cover plate.

[0016] It is worth noting that the cover plate fits snugly against the inner wall of the sealed box to form a good seal, preventing external dust and impurities from entering and contaminating the pins during the cleaning and drying process. At the same time, it reduces the evaporation of cleaning fluid and the loss of hot air, improving the cleaning and drying efficiency. The handle design makes it easy to put on and take off the cover plate, and the operation is simple and labor-saving, making it convenient for the installation and removal of integrated circuits.

[0017] Preferably, the support mechanism includes a support frame fixed to the upper end of the E-shaped plate, a fixing plate fixed to the side wall of the support frame, and a fan fixed through the fixing plate.

[0018] It is worth noting that the fan can accelerate the airflow inside the sealed box, assist in the hot air circulation during the drying stage, further shorten the drying time of the pins, and at the same time, during the process of the pins rising after cleaning, it can blow away most of the water droplets on the surface, laying the foundation for subsequent drying and improving the overall pre-treatment efficiency.

[0019] Preferably, the limiting mechanism includes a fixing post fixed to the four corner edges of the lower end of the fixing plate, a first pressure plate fixed to the lower end of the fixing post, and a first rubber disc fixed to the lower end of the first pressure plate, with the lower end of the first rubber disc attached to the upper end of the integrated circuit body.

[0020] It is worth noting that the first rubber disc makes flexible contact with the integrated circuit body, which can not only firmly restrict the position of the integrated circuit and prevent it from shaking or shifting during lifting and cleaning, but also avoid scratching or damaging the surface of the integrated circuit due to rigid contact. The structure is simple, requires no adjustment, is suitable for integrated circuits with uniform specifications, and improves the ease of operation.

[0021] Preferably, the limiting mechanism includes through holes formed at the four corner edges of the upper end of the fixed plate, a screw slidably disposed on the inner wall of the through holes, a second pressure plate fixed to the lower end of the screw, a second rubber disc fixed to the lower end of the second pressure plate, a spring fixed to the upper end of the second pressure plate, and a nut threaded onto the side wall of the screw. The lower end of the nut is in contact with the upper end of the fixed plate, and the upper end of the spring is fixed to the lower end of the fixed plate.

[0022] It is worth noting that the height of the second pressure plate can be changed by adjusting the nut. Combined with the elasticity of the spring, it can adapt to integrated circuits of different thicknesses, enhancing the versatility of the limiting mechanism. The spring's buffering effect can prevent excessive pressure from damaging the integrated circuit, while the second rubber plate further protects the chip surface, ensuring stable limiting in the processing of integrated circuits of various specifications.

[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0024] 1. The cleaning mechanism has multiple cleaning tanks that can simultaneously accommodate multiple integrated circuits. The vibration generated by the vibrating rod on the fixed base enhances the flushing effect of the cleaning fluid on the pins, making it easier to remove contaminants such as dust and oxide layers. This effectively improves the uneven cleaning problem caused by manual wiping. Moreover, the overall structure does not require complex batch spraying components, making it cheaper than traditional batch spraying cleaning equipment, thus balancing cleaning effect and economy.

[0025] 2. The electric cylinder of the lifting mechanism drives the E-shaped plate to move up and down, so that the integrated circuit pins placed on the E-shaped plate can directly enter the cleaning tank of the cleaning mechanism for immersion and cleaning without having to be removed from the protective structure. After cleaning, the E-shaped plate rises and pulls the integrated circuit out of the cleaning solution. Throughout the process, the integrated circuit is always in the box structure consisting of the carrier box, the sealed box and the cover plate, which reduces the manual handling process and thus reduces the risk of secondary contamination and secondary damage to the pins.

[0026] 3. The cleaned integrated circuits can be left directly on the E-shaped board and temporarily stored using the box structure consisting of a carrier box, a sealed box, and a cover plate. There is no need to put them back into the original protective packaging, which saves the tedious operation of repeated loading and unloading. The cover plate fits well with the inner wall of the sealed box to form a good seal, which can continue to protect the pins from external contamination during the temporary storage process, simplifying the pre-processing operation process.

[0027] 4. The cleaning mechanism quickly adds cleaning fluid through the inlet pipe, and the interconnecting pipes ensure that the liquid level in each cleaning tank is consistent, which can quickly complete the soaking preparation of the pins. After cleaning, the fan of the support mechanism blows away most of the water droplets on the pins, and then the axial flow fan of the drying mechanism blows the hot air generated by the air heating pipe through the air collection hood to the pins to accelerate the evaporation of moisture and achieve rapid drying of the pins after cleaning, which solves the problem that existing storage devices are difficult to clean and dry quickly. Attached Figure Description

[0028] Figure 1 The diagram shown is a three-dimensional structural schematic of this utility model;

[0029] Figure 2 The diagram shown is a three-dimensional cross-sectional view of the drying mechanism and the support mechanism of this utility model.

[0030] Figure 3 The diagram shown is a three-dimensional structural diagram of the internal structure of the carrier box of this utility model;

[0031] Figure 4 The diagram shown is a three-dimensional structural schematic of the lifting mechanism of this utility model.

[0032] Figure 5 The diagram shown is a three-dimensional structural schematic of the cleaning mechanism of this utility model;

[0033] Figure 6The diagram shown is a three-dimensional structural schematic of the support frame of this utility model;

[0034] Figure 7 The diagram shown is a three-dimensional structural schematic of the first embodiment of the limiting mechanism of this utility model;

[0035] Figure 8 The diagram shown is a three-dimensional structural schematic of the second embodiment of the limiting mechanism of this utility model.

[0036] Reference numerals: 1. Carrier box; 2. Drying mechanism; 21. Air blowing box; 22. Air collection hood; 23. Axial flow fan; 24. Air heating pipe; 3. Sealing box; 4. Cover plate; 5. Carrier frame; 6. Lifting mechanism; 61. Frame; 62. Electric cylinder; 7. E-shaped plate; 71. Support frame; 72. Fixing plate; 73. Fan; 8. Limiting mechanism; 81. Fixing column; 82. First pressure plate; 83. First rubber disc; 84. Through hole; 85. Screw; 86. Second pressure plate; 87. Second rubber disc; 88. Spring; 89. Nut; 9. Cleaning mechanism; 91. Carrier frame; 92. Cleaning box; 93. Fixing seat; 94. Vibrator; 95. Wastewater drain pipe; 96. First connecting pipe; 97. Second connecting pipe; 98. Interconnecting pipe; 99. Liquid inlet pipe; 10. Integrated circuit body. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] To address the problems in existing technologies, such as uneven cleaning of integrated circuit pins by manual wiping, high cost of batch spray cleaning equipment, secondary contamination and damage to pins during integrated circuit handling, cumbersome post-cleaning storage, and the inability of existing integrated circuit storage devices to quickly immerse and clean pins or rapidly air dry them, the following technical solution is proposed. Please refer to [link / reference]. Figures 1-8 ;

[0039] An integrated circuit pin protection cleaning rack device includes a carrier box 1, a drying mechanism 2 fixed to the upper end of the carrier box 1, a sealing box 3 fixed to the upper end of the carrier box 1, a carrier frame 5 fixed to the inner wall of the sealing box 3, a cover plate 4 placed on the upper end of the carrier frame 5, a cleaning mechanism 9 fixed to the bottom surface of the inner wall of the carrier box 1, a lifting mechanism 6 fixed to the inner wall of the sealing box 3, an E-shaped plate 7 fixed to the output end of the lifting mechanism 6, a support mechanism fixed to the upper end of the E-shaped plate 7, a plurality of integrated circuit bodies 10 placed on the upper end of the E-shaped plate 7, and a limiting mechanism 8 provided on the support mechanism for limiting the integrated circuit bodies 10.

[0040] The container 1, drying mechanism 2, sealing box 3, and cover plate 4 constitute the box structure;

[0041] The integrated circuit body 10 has pins that are evenly distributed on both sides. When the E-shaped plate 7 moves downward, the pins enter the cleaning mechanism 9 and are immersed and cleaned.

[0042] In use, manually remove the cover plate 4 from the top of the support frame 5, place the integrated circuit body 10 on the top of multiple E-shaped plates 7, and then use the limiting mechanism 8 to limit the integrated circuit body 10 to the top of the E-shaped plates 7. When it is necessary to clean the pins on both sides of the integrated circuit body 10, use the lifting mechanism 6 to lower the E-shaped plates 7 so that the pins of the integrated circuit body 10 enter the cleaning mechanism 9. Open the cleaning mechanism 9 to clean the pins of the integrated circuit body 10.

[0043] In this embodiment, specifically: the lifting mechanism 6 includes a frame 61 fixed to the inner wall of the sealed box 3 and an electric cylinder 62 fixed to the frame 61. The lower end of the output shaft of the electric cylinder 62 is fixed to the upper end of the E-shaped plate 7.

[0044] In this embodiment, specifically: the drying mechanism 2 includes a blower box 21 fixed to the upper end of the carrier box 1, an air collecting hood 22 fixed to the air inlet end of the blower box 21, an axial flow fan 23 fixed to the air inlet end of the air collecting hood 22, and air heating pipes 24 fixed to both sides of the inner wall of the blower box 21.

[0045] In this embodiment, specifically: the cleaning mechanism 9 includes a support frame 91 fixed to the bottom surface of the inner wall of the support box 1, multiple cleaning boxes 92 fixed to the support frame 91, two fixed seats 93 fixed to the lower end of the cleaning box 92, a vibrating rod 94 fixed to the two fixed seats 93, a wastewater drain pipe 95 fixed to the lower end of the cleaning box 92, a first connecting pipe 96 fixed to the lower end of the multiple wastewater drain pipes 95, a second connecting pipe 97 fixed to the lower end of the first connecting pipe 96, an interconnecting pipe 98 connecting two adjacent cleaning boxes 92, and one end of an inlet pipe 99 fixed to one of the cleaning boxes 92. The other end of the inlet pipe 99 passes through the side wall of the support box 1 and extends to the outside of the support box 1. The lower end of the first connecting pipe 96 passes through the lower end of the support box 1 and extends to the bottom of the support box 1.

[0046] In this embodiment, specifically: the side wall of the cover plate 4 and the inner wall of the sealing box 3 are attached together, and at least one handle is fixedly connected to the upper end of the cover plate 4.

[0047] In this embodiment, specifically: the support mechanism includes a support frame 71 fixed to the upper end of the E-shaped plate 7, a fixing plate 72 fixed to the side wall of the support frame 71, and a fan 73 fixed through the fixing plate 72.

[0048] Example 1: In this example, the limiting mechanism 8 specifically includes a fixing post 81 fixed to the four corner edges of the lower end of the fixing plate 72, a first pressure plate 82 fixed to the lower end of the fixing post 81, and a first rubber plate 83 fixed to the lower end of the first pressure plate 82. The lower end of the first rubber plate 83 is attached to the upper end of the integrated circuit body 10.

[0049] The fixed column 81 provides stable support for the first pressure plate 82. The first pressure plate 82 flexibly contacts the integrated circuit body 10 through the first rubber plate 83. The pressure of the first pressure plate 82 can stabilize and restrict the position of the integrated circuit body 10, preventing it from shaking or shifting during lifting and cleaning. The first rubber plate 83 can also prevent rigid contact from causing scratches or pressure damage to the surface of the integrated circuit body 10. The overall structure does not require adjustment and is suitable for integrated circuit bodies 10 with uniform specifications, improving the ease of operation.

[0050] Example 2: In this example, the limiting mechanism 8 specifically includes through holes 84 that are opened at the four corner edges of the upper end of the fixed plate 72, a screw 85 that is slidably disposed on the inner wall of the through hole 84, a second pressure plate 86 fixed to the lower end of the screw 85, a second rubber plate 87 fixed to the lower end of the second pressure plate 86, a spring 88 fixed to the upper end of the second pressure plate 86, and a nut 89 that is threaded onto the side wall of the screw 85. The lower end of the nut 89 is in contact with the upper end of the fixed plate 72, and the upper end of the spring 88 is fixed to the lower end of the fixed plate 72.

[0051] The through hole 84 provides a sliding channel for the screw 85. The height of the screw 85 driven by the second pressure plate 86 can be adjusted by rotating the nut 89. With the elasticity of the spring 88, it can adapt to the integrated circuit body 10 of different thicknesses, enhancing the versatility of the limiting mechanism 8. The spring 88 can buffer the pressure and prevent the second pressure plate 86 from causing excessive squeezing damage to the integrated circuit body 10. The second rubber plate 87 further protects the surface of the integrated circuit body 10, ensuring stable limiting for integrated circuit bodies 10 of various specifications.

[0052] Working principle: When in use, the second connecting pipe 97 is connected to the external wastewater collection device through the valve body, and the liquid inlet pipe 99 is connected to the external cleaning fluid supply device. First, the cover plate 4 is removed from the upper end of the support frame 5 through the handle at the upper end of the cover plate 4, so that the inside of the sealed box 3 is open. Then, multiple integrated circuit bodies 10 are placed on the upper end of the E-shaped plate 7 in sequence. At this time, the corresponding limiting mechanism 8 is selected according to the specifications of the integrated circuit body 10 for fixing.

[0053] If the integrated circuit body 10 is of uniform specifications, the first pressure plate 82 is supported by the fixing column 81 of the limiting mechanism 8, so that the first rubber plate 83 at the lower end of the first pressure plate 82 is in contact with the upper end of the integrated circuit body 10, and the limiting is completed by the pressure of the first pressure plate 82.

[0054] If the integrated circuit body 10 has different thicknesses, the position of the screw 85 is adjusted through the through hole 84, and the nut 89 is rotated to make the screw 85 drive the second pressure plate 86 to move down. With the elastic action of the spring 88, the second rubber plate 87 at the lower end of the second pressure plate 86 makes flexible contact with the upper end of the integrated circuit body 10 to achieve stable positioning.

[0055] After the integrated circuit body 10 is placed and positioned, the electric cylinder 62 of the lifting mechanism 6 is activated. The output shaft of the electric cylinder 62 extends and retracts downward, driving the E-shaped plate 7 to move downward along the inner wall of the sealed box 3 until the pins on both sides of the integrated circuit body 10 are completely immersed in the cleaning fluid in the cleaning tank 92 of the cleaning mechanism 9. At this time, an appropriate amount of cleaning fluid is injected into the cleaning tank 92 through the liquid inlet pipe 99. The adjacent cleaning tanks 92 maintain the same liquid level through the interconnecting pipe 98. The vibrating rod 94 on the fixed base 93 is activated. The vibration generated by the vibrating rod 94 is transmitted to the cleaning fluid through the cleaning tank 92, enhancing the flushing effect of the cleaning fluid on the pins and effectively removing dust, flux residue and oxide layer on the pins. The wastewater generated during the cleaning process flows into the first connecting pipe 96 through the wastewater drain pipe 95 at the lower end of the cleaning tank 92, and then is discharged to the outside of the carrier box 1 through the second connecting pipe 97.

[0056] It should be noted that valves can be installed on both the first connecting pipe 96 and the second connecting pipe 97 to open or close the water circuit. When the valve is closed, the level of the cleaning fluid in the cleaning tank 92 remains consistent.

[0057] After cleaning, the output shaft of the electric cylinder 62 is extended and retracted upward, driving the E-shaped plate 7 and the integrated circuit body 10 to rise, so that the pins are removed from the cleaning fluid. At this time, the fan 73 of the support mechanism is started, and the airflow generated by the fan 73 blows towards the pin surface, initially removing most of the water droplets attached to the pin surface.

[0058] Then the drying mechanism 2 is started, and the axial flow fan 23 operates to draw external air into the air collection hood 22. The air is heated by the air heating pipe 24 in the air box 21 to form hot air. The hot air is continuously blown onto the pin surface to accelerate the evaporation of residual moisture on the pin surface and achieve rapid air drying of the pin.

[0059] After air drying, if the integrated circuit body 10 needs to be temporarily stored, the cover plate 4 is placed back on the upper end of the support frame 5 so that the side wall of the cover plate 4 fits against the inner wall of the sealing box 3 to form a seal. The box structure consisting of the support box 1, the drying mechanism 2, the sealing box 3 and the cover plate 4 protects the integrated circuit body 10 and prevents the pins from being contaminated or damaged during the temporary storage process.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0061] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. An integrated circuit pin protection and cleaning rack device, characterized in that: It includes a carrier box (1), a drying mechanism (2) fixed to the upper end of the carrier box (1), a sealing box (3) fixed to the upper end of the carrier box (1), a carrier frame (5) fixed to the inner wall of the sealing box (3), a cover plate (4) placed on the upper end of the carrier frame (5), a cleaning mechanism (9) fixed to the bottom surface of the inner wall of the carrier box (1), a lifting mechanism (6) fixed to the inner wall of the sealing box (3), an E-shaped plate (7) fixed to the output end of the lifting mechanism (6), a support mechanism fixed to the upper end of the E-shaped plate (7), multiple integrated circuit bodies (10) placed on the upper end of the E-shaped plate (7), and a limiting mechanism (8) set on the support mechanism for limiting the integrated circuit bodies (10); The container structure consists of a carrying box (1), a drying mechanism (2), a sealing box (3), and a cover plate (4); The integrated circuit body (10) has pins that are evenly distributed on both sides. When the E-shaped plate (7) moves downward, the pins enter the cleaning mechanism (9) and are soaked and cleaned.

2. The integrated circuit pin protection cleaning rack device according to claim 1, characterized in that: The lifting mechanism (6) includes a frame (61) fixed to the inner wall of the sealed box (3) and an electric cylinder (62) fixed to the frame (61). The lower end of the output shaft of the electric cylinder (62) is fixed to the upper end of the E-shaped plate (7).

3. The integrated circuit pin protection cleaning rack device according to claim 1, characterized in that: The drying mechanism (2) includes a blower box (21) fixed to the upper end of the carrier box (1), an air collection hood (22) fixed to the air inlet end of the blower box (21), an axial flow fan (23) fixed to the air inlet end of the air collection hood (22), and air heating pipes (24) fixed to both sides of the inner wall of the blower box (21).

4. The integrated circuit pin protection cleaning rack device according to claim 1, characterized in that: The cleaning mechanism (9) includes a support frame (91) fixed to the bottom of the inner wall of the support box (1), multiple cleaning boxes (92) fixed to the support frame (91), two fixed seats (93) fixed to the lower end of the cleaning box (92), a vibrating rod (94) fixed to the two fixed seats (93), a wastewater drain pipe (95) fixed to the lower end of the cleaning box (92), a first connecting pipe (96) fixed to the lower end of the multiple wastewater drain pipes (95), a second connecting pipe (97) fixed to the lower end of the first connecting pipe (96), an interconnecting pipe (98) connecting two adjacent cleaning boxes (92) and one end of an inlet pipe (99) fixed to one of the cleaning boxes (92), the other end of the inlet pipe (99) passing through the side wall of the support box (1) and extending to the outside of the support box (1), and the lower end of the first connecting pipe (96) passing through the lower end of the support box (1) and extending to the bottom of the support box (1).

5. The integrated circuit pin protection cleaning rack device according to claim 1, characterized in that: The side wall of the cover plate (4) is fitted to the inner wall of the sealing box (3), and at least one handle is fixed to the upper end of the cover plate (4).

6. The integrated circuit pin protection cleaning rack device according to claim 1, characterized in that: The support mechanism includes a support frame (71) fixed to the upper end of the E-shaped plate (7), a fixing plate (72) fixed to the side wall of the support frame (71), and a fan (73) fixed through the fixing plate (72).

7. The integrated circuit pin protection cleaning rack device according to claim 6, characterized in that: The limiting mechanism (8) includes a fixing post (81) fixed to the four corner edges of the lower end of the fixing plate (72), a first pressure plate (82) fixed to the lower end of the fixing post (81), and a first rubber plate (83) fixed to the lower end of the first pressure plate (82). The lower end of the first rubber plate (83) is attached to the upper end of the integrated circuit body (10).

8. The integrated circuit pin protection cleaning rack device according to claim 6, characterized in that: The limiting mechanism (8) includes a through hole (84) that is opened at the four corner edges of the upper end of the fixed plate (72), a screw (85) that is slidably disposed on the inner wall of the through hole (84), a second pressure plate (86) fixed to the lower end of the screw (85), a second rubber plate (87) fixed to the lower end of the second pressure plate (86), a spring (88) fixed to the upper end of the second pressure plate (86), and a nut (89) threadedly installed on the side wall of the screw (85). The lower end of the nut (89) is in contact with the upper end of the fixed plate (72), and the upper end of the spring (88) is fixed to the lower end of the fixed plate (72).

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