Cleaning device for wafer mechanical polisher
By setting three sets of vertical spray bars and one set of horizontal spray bars on the wafer mechanical polishing machine, the number of nozzles is increased and the angle is adjustable, which enables efficient cleaning of various parts and their detailed structures of the polished parts. This solves the problem of incomplete cleaning in existing devices and improves the cleaning effect and equipment life.
Patent Information
- Application Number
- CN202521054799.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-27
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-05-27
AI Technical Summary
The cleaning devices of existing wafer mechanical polishing machines cannot completely remove the surface and fine structure of the polishing head and robotic arm, resulting in poor cleaning effect and potentially causing wafer scratches or contamination.
The system employs a configuration of three sets of vertical spray bars and one set of horizontal spray bars, increasing the number of nozzles and adding an adjustable nozzle angle function. It utilizes dense longitudinal and oblique water jets, as well as adjustable-angle horizontal water jets, to specifically clean each component and its detailed structure of the grinding parts.
It improves cleaning efficiency and effectiveness, ensures the cleanliness of the wafer mechanical polishing machine, extends the service life of the equipment, and avoids wafer scratches.
Smart Images
Figure CN224674500U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a cleaning device for a wafer mechanical polishing machine, and more particularly to a device with three sets of vertical spray bars and one set of horizontal spray bars, which increases the number of nozzles and adds an adjustable function for the nozzle angle. In particular, it can be adjusted according to cleaning needs to effectively clean each part and its detailed structure of the polishing workpiece, thereby helping to improve the cleaning efficiency and effect. Background Technology
[0002] To ensure the normal operation of the wafer mechanical polishing machine and extend its service life, regular maintenance is required. One of the key points of maintenance is cleaning, which involves regularly cleaning the surface and internal components of the wafer mechanical polishing machine to keep the equipment clean and tidy.
[0003] A wafer mechanical polishing machine typically includes a polishing head, polishing pad, slurry feeder, and a robotic arm equipped with a friction disc. This friction disc has a limited lifespan; after prolonged use, some diamond particles may fall off due to friction, or impurities may become embedded in the diamond surface. Chemical splashes may also adhere to the mechanism and fall onto the polishing disc over time, often causing scratches on the wafer or generating dust and contamination. Therefore, the surfaces of these actuators must be cleaned after a period of use.
[0004] Existing cleaning devices for wafer mechanical polishing machines use two sets of horizontal cleaning bars to clean the polishing head and the friction disc, with two nozzles on each bar. However, the nozzles are all at a fixed angle and cannot be adjusted to meet user needs. This results in incomplete cleaning of the surfaces of the polishing head and robotic arm, as well as a failure to spray the fine details of these surfaces, leading to poor cleaning and potential scratches on the wafers. Therefore, it is essential to design an innovative solution that addresses the maintenance and shortcomings of existing technologies for wafer mechanical polishing machines. Utility Model Content
[0005] The main objective of this invention is to overcome the aforementioned problems encountered in the prior art and to provide a cleaning device for a wafer mechanical polishing machine.
[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A cleaning device for a wafer mechanical polishing machine includes: a polishing table; a wafer mechanical polishing machine disposed on the polishing table, comprising a polishing pad, a first polishing element, and a second polishing element, the first polishing element and the second polishing element being disposed outside the polishing pad; the first polishing element having a polishing disc and a steering unit connected to the polishing table via the steering unit, the front end of the steering unit being connected to the polishing disc; the second polishing element having a friction disc and a rotating arm connected to the polishing table via the rotating arm, the front end of the rotating arm being connected to the friction disc; a first spraying unit erected on the polishing table and located on one side of the second polishing element; the first spraying unit comprising a first vertical spray bar and a plurality of first nozzles, the plurality of first nozzles being spaced apart and located on the first vertical spray bar and corresponding to the rotating arm, for spraying liquid at a fixed angle to clean the rotating arm; and a second spraying unit erected on the polishing table. The first spraying unit is located on the other side of the second grinding element and corresponds to the first grinding element. The second spraying unit includes a second vertical spray bar and several second nozzles. The several second nozzles are spaced apart and located on the second vertical spray bar and corresponding to the friction disc, and are used to spray liquid at a fixed angle to clean the friction disc. The third spraying unit is erected on the grinding table and located on one side of the first grinding element. The third spraying unit includes a third vertical spray bar and several third nozzles. The several third nozzles are spaced apart and located on the third vertical spray bar and corresponding to the steering unit, and are used to spray liquid at a fixed angle to clean the steering unit. The fourth spraying unit is horizontally arranged on the grinding table and located on the other side of the first grinding element. The fourth spraying unit includes a horizontal spray bar and several fourth nozzles. The several fourth nozzles are spaced apart and cross-arranged and located on the horizontal spray bar, and are aimed at the grinding disc at an adjustable angle to spray liquid to clean the grinding disc.
[0007] This invention replaces the traditional cleaning device with two sets of horizontal spray bars with three sets of vertical spray bars and one set of horizontal spray bars, increases the number of nozzles and adds an adjustable nozzle angle function. By using dense vertical straight and angled water jets and dense horizontal adjustable angled diffused water jets, adjustments can be made according to needs to effectively clean each part and its detailed structure of the grinding workpiece, thereby helping to improve the cleaning efficiency and effect.
[0008] In the above embodiments of this utility model, the plurality of first nozzles are arranged in a row along the longitudinal direction of the first straight spray bar.
[0009] In the above embodiments of this utility model, the plurality of second nozzles are arranged in a row along the longitudinal direction of the second straight spray bar.
[0010] In the above embodiments of this utility model, the plurality of third nozzles are arranged in a row along the longitudinal direction of the third straight spray bar.
[0011] In the above embodiments of this utility model, the plurality of fourth nozzles are arranged in two rows along the transverse direction of the transverse spray bar.
[0012] In the above embodiment of the present invention, the plurality of third nozzles are tilted at an angle to face the steering unit.
[0013] In the above embodiments of this utility model, the plurality of fourth nozzles have an adjustable angle between 0 and 180 degrees.
[0014] In the above embodiments of this utility model, the liquid is deionized water or cleaning solution. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the cleaning device of the wafer mechanical polishing machine of this utility model.
[0016] In the figure Cleaning device for 100-wafer mechanical polishing machine; 1-Grinding table; 2-Wafer mechanical grinding machine; 21-Abrasive pad; 22-First grinding component; 221-Grinding disc; 222-Steering unit; 23-Second grinding component; 231-Friction disc; 232-Rotating arm; 3-First spraying unit; 31-First linear spray bar; 32-First nozzle; 4-Second spraying unit; 41-Second vertical spray bar; 42-Second nozzle; 5-Third spraying unit; 51-Third vertical spray bar; 52-Third nozzle; 6-Fourth spraying unit; 61-Horizontal spray bar; 62-Fourth nozzle. Detailed Implementation
[0017] As shown in Figure 1, the cleaning device 100 of the wafer mechanical polishing machine in this embodiment comprises a polishing table 1, a wafer mechanical polishing machine 2, a first spraying unit 3, a second spraying unit 4, a third spraying unit 5, and a fourth spraying unit 6.
[0018] The wafer mechanical polishing machine 2 is mounted on the polishing table 1 and includes a polishing pad 21, a first polishing element 22, and a second polishing element 23. The first polishing element 22 and the second polishing element 23 are located on the outer side of the polishing pad 21. The first polishing element 22 has a polishing disk 221 and a steering unit 222. The first polishing element 22 is connected to the polishing table 1 through the steering unit 222, and the front end of the steering unit 222 is connected to the polishing disk 221. The second polishing element 23 has a friction disk 231 and a rotating arm 232. The second polishing element 23 is connected to the polishing table 1 through the rotating arm 232, and the front end of the rotating arm 232 is connected to the friction disk 231.
[0019] The first spraying unit 3 is erected on the grinding table 1 and located on one side of the second grinding element 23. The first spraying unit 3 includes a first vertical spray bar 31 and several first nozzles 32. The several first nozzles 32 are located on the first vertical spray bar 31, and are arranged in a row at intervals along the longitudinal direction of the first vertical spray bar 31 and corresponding to the rotating arm 232, so as to spray liquid at a fixed angle to clean the rotating arm 232.
[0020] The second spraying unit 4 is erected on the grinding table 1 and located on the other side of the second grinding element 23, corresponding to the first spraying unit 3. The second spraying unit 4 includes a second vertical spray bar 41 and several second nozzles 42. The several second nozzles 42 are located on the second vertical spray bar 41, arranged in a row at intervals along the longitudinal direction of the second vertical spray bar 41 and corresponding to the friction disk 231, so as to spray liquid at a fixed angle to clean the friction disk 231.
[0021] The third spraying unit 5 is erected on the grinding table 1 and located on one side of the first grinding element 22. The third spraying unit 5 includes a third vertical spray bar 51 and several third nozzles 52. The several third nozzles 52 are located on the third vertical spray bar 51, and are arranged in a row at intervals along the longitudinal direction of the third vertical spray bar 51 and are corresponding to the turning unit 222, so as to spray liquid at a fixed angle to clean the turning unit 222.
[0022] The fourth spraying unit 6 is horizontally disposed on the grinding table 1 and located on the other side of the first grinding component 22. The fourth spraying unit 6 includes a horizontal spray bar 61 and several fourth nozzles 62. The several fourth nozzles 62 are located on the horizontal spray bar 61, spaced apart and arranged in two rows along the lateral direction of the horizontal spray bar 61, spraying liquid at an adjustable angle onto the grinding disk 221 to clean the grinding disk 221. Thus, the above-disclosed structure constitutes a novel cleaning device 100 for a wafer mechanical polishing machine.
[0023] In a preferred embodiment of this invention, the liquid is deionized water or a cleaning solution.
[0024] When this invention is in operation, the first spray unit 3 and the second spray unit 4 use several first nozzles 32 and several second nozzles 42 to spray several longitudinally arranged straight water columns onto the rotating arm 232 and friction disk 231 of the second grinding component 23, respectively; the third spray unit 5 uses several third nozzles 52 to spray several longitudinally arranged oblique water columns at an angle to the turning unit 222 of the first grinding component 22; and the fourth spray unit 6 uses several fourth nozzles 62 with adjustable angles between 0 and 180 degrees to spray several transversely arranged scattered water columns onto the grinding disk 221 and its detailed structure of the first grinding component 22.
[0025] Therefore, this utility model replaces the traditional cleaning device with two sets of horizontal spray bars with three sets of vertical spray bars and one set of horizontal spray bars, increases the number of nozzles and adds an adjustable nozzle angle function. By using dense vertical straight and angled water jets and dense horizontal adjustable angled scattered water jets, adjustments can be made according to cleaning needs to effectively clean each part and its detailed structure of the grinding workpiece, thereby helping to improve the cleaning efficiency and effect.
[0026] In summary, the cleaning device of the wafer mechanical polishing machine of this utility model effectively improves upon the various shortcomings of existing devices. It replaces the traditional cleaning device with two sets of horizontal spray bars with three sets of vertical spray bars and one set of horizontal spray bars, increasing the number of nozzles and adding adjustable nozzle angles. Utilizing dense vertical and angled water jets, as well as dense horizontal adjustable-angle scattering water jets, adjustments can be made to meet cleaning needs, effectively cleaning each component and its detailed structure of the workpiece. This helps improve cleaning efficiency and effectiveness, making this utility model more advanced, practical, and user-friendly, thus meeting the conditions for a utility model patent application. Therefore, a patent application is filed in accordance with the law.
[0027] The above-disclosed embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Therefore, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the specification of this utility model shall fall within the scope of this utility model patent.
Claims
1. A cleaning device for a wafer mechanical polishing machine, characterized in that, include: A grinding table; A wafer refining machine is provided on a refining table and includes a refining pad, a first refining component, and a second refining component. The first refining component and the second refining component are disposed on the outside of the refining pad. The first refining component has a refining disc and a steering unit, which is connected to the refining table through the steering unit. The front end of the steering unit is connected to the refining disc. The second refining component has a friction disc and a rotating arm, which is connected to the refining table through the rotating arm. The front end of the rotating arm is connected to the friction disc. A first spraying unit is erected on the grinding table and located on one side of the second grinding piece. The first spraying unit includes a first vertical spray bar and several first nozzles. The several first nozzles are spaced apart and located on the first vertical spray bar and corresponding to the rotating arm, so as to spray liquid at a fixed angle to clean the rotating arm. A second spraying unit is erected on the grinding table and located on the other side of the second grinding piece, corresponding to the first spraying unit. The second spraying unit includes a second vertical spray bar and several second nozzles. The several second nozzles are spaced apart and located on the second vertical spray bar and corresponding to the friction disc, so as to spray liquid at a fixed angle to clean the friction disc. A third spraying unit is erected on the grinding table and located on one side of the first grinding piece. The third spraying unit includes a third vertical spray bar and several third nozzles. The several third nozzles are spaced apart and located on the third vertical spray bar and corresponding to the turning unit, so as to spray liquid at a fixed angle to clean the turning unit. as well as A fourth spraying unit is horizontally disposed on the grinding table and located on the other side of the first grinding component. The fourth spraying unit includes a horizontal spray bar and several fourth nozzles. The several fourth nozzles are spaced apart and cross-arranged and located on the horizontal spray bar, spraying liquid at an adjustable angle to clean the grinding disc.
2. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of first nozzles are arranged in a row along the longitudinal direction of the first straight spray bar.
3. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of second nozzles are arranged in a row along the longitudinal direction of the second straight spray bar.
4. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of third nozzles are arranged in a row along the longitudinal direction of the third straight spray bar.
5. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of fourth nozzles are arranged in two rows along the transverse direction of the transverse spray bar.
6. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of third nozzles are tilted at an angle in front of the steering unit.
7. The cleaning device for a wafer mechanical polishing machine according to claim 1, characterized in that, The plurality of fourth nozzles have an adjustable angle between 0 and 180 degrees.