A combination adhesive tape, tape member, electrolytic adhesive system

Abstract

The utility model relates to a combined adhesive tape, adhesive tape component, electrolytic adhesive system, the combined adhesive tape includes first adhesive tape and second adhesive tape, and has combination state and non -combination state, when being in non -combination state, first adhesive tape and second adhesive tape are independent of each other, wherein first adhesive tape includes the first release layer, adhesive layer, conductive matrix, electrolytic adhesive layer, second release layer that set gradually, second adhesive tape includes the protective layer, conductive matrix, adhesive layer and release layer that set gradually, and the protective layer is detachably connected with conductive matrix, when being in combination state, the electrolytic adhesive layer of first adhesive tape and the conductive matrix of second adhesive tape are bonded. The utility model provides a combined adhesive tape, and the assembly is convenient and fast, and the assembly precision is high, and the separate storage is convenient, and second spare part can be plastic material, glass material or the insulating property spare part of metal with anodic oxidation treatment, expands the application scope of combined adhesive tape.

Description

Technical Field

[0001] This utility model relates to a combined adhesive tape, an adhesive tape component, and an electrolytic adhesive system. Background Technology

[0002] Two components are bonded together by adhesive backing, such as component one and component two. The adhesive backing includes a general adhesive layer, a conductive substrate, and an electrolytic adhesive layer arranged in sequence. Component one is bonded to the general adhesive layer, and component two is bonded to the electrolytic adhesive layer. The side of the conductive substrate bonded to the electrolytic adhesive layer is conductive.

[0003] Using this adhesive allows for the disassembly and reuse of component one and component two. The working principle of the adhesive is as follows: by passing an electric current through the conductive side of the conductive substrate, an electrochemical effect is exerted on the electrolytic adhesive layer. The adhesive force of the electrolytic adhesive layer is reduced by the application of voltage, causing the interface bonding between the electrolytic adhesive layer and component two to fail, thereby disassembling the bonded component one and component two.

[0004] The existing adhesive backing has the following problems: Part 2 must be a metal part, and the bonding interface between the electrolytic adhesive layer and Part 2 must be conductive when energized. For Part 2, which is an insulating component such as plastic, glass, or anodized metal, this characteristic of the electrolytic adhesive layer cannot be used, thus limiting the application of electrolytic adhesive backing. When operators assemble Part 1, Part 2, and the adhesive backing, the adhesive on the ordinary adhesive layer will stick to the side of Part 1, and the adhesive on the electrolytic adhesive layer will stick to the side of Part 2, affecting the normal use of Part 1 and Part 2. Utility Model Content

[0005] The purpose of this invention is to provide a combined adhesive tape, adhesive tape components, and an electrolytic adhesive system.

[0006] To achieve the above objectives, this utility model provides a composite tape, which includes a first tape and a second tape, and has a combined state and a non-combined state. When in the non-combined state, the first tape and the second tape are independent of each other. The first tape includes a first release layer, an adhesive layer, a conductive substrate, an electrolytic adhesive layer, and a second release layer arranged sequentially. The second tape includes a protective layer, a conductive substrate, an adhesive layer, and a release layer arranged sequentially. The protective layer and the conductive substrate are detachably connected. When in the combined state, the electrolytic adhesive layer of the first tape is bonded to the conductive substrate of the second tape.

[0007] According to some embodiments of this utility model, the sum of the thicknesses of the first tape and the second tape is in the range of 86-3050 μm, and preferably in the range of 100-1000 μm.

[0008] According to some embodiments of the present invention, the thickness of the first tape is 1-50 times the thickness of the second tape, and preferably the thickness of the first tape is 1-20 times the thickness of the second tape.

[0009] According to some embodiments of the present invention, in the first tape, the thickness of the adhesive layer ranges from 10 to 100 μm, the thickness of the conductive substrate ranges from 3.1 to 1100 μm, and the thickness of the electrolytic adhesive layer ranges from 10 to 100 μm. Preferably, the thickness of the adhesive layer is 10 to 80 μm, the thickness of the conductive substrate is 3 to 500 μm, and the thickness of the electrolytic adhesive layer is 20 to 80 μm.

[0010] And / or, in the second tape, the thickness of the adhesive layer ranges from 10 to 100 μm, and the thickness of the conductive substrate ranges from 3.1 to 1100 μm, wherein the thickness of the adhesive layer is preferably 10 to 80 μm, and the thickness of the conductive substrate is preferably 3 to 500 μm.

[0011] According to some embodiments of this utility model, the conductive substrates of the first tape and the second tape are independently multi-layered structures, the multi-layered structure including a supporting substrate, a conductive layer, and an adhesion layer disposed between the supporting substrate and the conductive layer. In the first tape, the adhesive layer is located on the side of the supporting substrate away from the adhesion layer, and the electrolytic adhesive layer is located on the side of the conductive layer away from the adhesion layer. In the second tape, the adhesive layer is located on the side of the supporting substrate away from the adhesion layer.

[0012] According to some embodiments of the present invention, the conductive substrate of the first tape and / or the second tape further includes an antioxidant layer, the antioxidant layer being located on the side of the conductive layer away from the supporting substrate.

[0013] According to some embodiments of the present invention, the thickness of the antioxidant layer ranges from 0.005 to 2 μm, preferably from 0.005 to 1 μm.

[0014] According to some embodiments of this utility model, in the first tape and the second tape, the thickness range of the supporting substrate is 3-1000μm, preferably 3-500μm; the thickness range of the adhesion layer is 0.005-30μm, preferably 0.005-10μm; the thickness range of the conductive layer is 0.01-50μm, preferably 0.02-10μm; and the thickness range of the first release layer and the second release layer is 12-150μm.

[0015] According to some embodiments of the present invention, in the first tape: the conductive substrate has a protruding portion that protrudes beyond the other layers of the first tape; or, both the conductive substrate and the adhesive layer have protruding portions that protrude beyond the other layers of the first tape.

[0016] In the second tape, both the conductive substrate and the adhesive layer have protruding portions that extend beyond the rest of the second tape.

[0017] According to some embodiments of this utility model, the width of the protruding portion is smaller than the width of the corresponding tape;

[0018] When in the combined state, the protruding portions on the first tape and the second tape are located on different sides of the combined tape, or the protruding portions on the first tape and the second tape are located on the same side of the combined tape, and a distance is maintained between them.

[0019] According to some embodiments of this utility model, the adhesive layer of the first tape and the adhesive layer of the second tape are both pressure-sensitive adhesive layers.

[0020] According to some embodiments of this utility model, the adhesion layer is an adhesive layer or a copolymer resin material, wherein the adhesive layer can be a pressure-sensitive adhesive layer, and the copolymer resin material is prepared from a variety of materials selected from thiol polymers, titanates, fluorocarbon resins, epoxy acrylates, polyurethane acrylates, gold, silver, copper, tin, nickel, and zinc. The adhesion layer provides extremely strong adhesion, enabling the conductive layer to achieve better adhesion to the supporting substrate and enhancing the strength of the conductor matrix, making it less prone to breakage.

[0021] According to some embodiments of this utility model, the conductive layer of the first tape and the conductive layer of the second tape are conductive layers, and the conductive material in the conductive layer includes gold, silver, copper, iron, aluminum, tin, nickel, zinc, lead or carbon, and is applied to the supporting substrate by spraying, coating, printing or plating.

[0022] According to some embodiments of this utility model, the antioxidant layer protects the conductive layer. The antioxidant layer can be an epoxy resin, an acrylic resin, a polyester resin, or a urethane resin. The antioxidant layer is mainly composed of resin and may contain thiosulfate derivatives, imidazole derivatives, chromates, molybdates, tungstates, silazanes, or alkyl thiols.

[0023] According to some embodiments of this utility model, the first release layer and the second release layer of the first tape and the release layer of the second tape are all release paper or release film. The release paper can be glassine paper, wood pulp paper or straw pulp paper; the release film is PET film, PE film, PVC film, PP film or PU film.

[0024] According to some embodiments of this utility model, the supporting substrate of the conductive matrix of the first tape and the second tape is a fiber-based substrate or a plastic-based substrate. If it is a plastic-based substrate, it may be a polyester resin, such as polyethylene terephthalate; if it is a polyolefin resin, such as polyethylene, polypropylene, etc.; if it is an acrylic resin, such as polyurethane resin, polytetrafluoroethylene resin, polymethyl methacrylate. The supporting substrate may be single-layered or multi-layered.

[0025] According to some embodiments of this utility model, the protective layer is a polyethylene terephthalate film, a polypropylene film, a polyethylene film, a polyimide film, or a polyvinyl chloride resin film.

[0026] This utility model also provides a tape component, which is suitable for use in combination with electrolytic tape. The tape component includes a protective layer, a conductive substrate, an adhesive layer and a release layer arranged in sequence, and the protective layer and the conductive substrate are detachably connected.

[0027] According to some embodiments of the present invention, the conductive substrate has a multilayer structure, the multilayer structure including a supporting substrate, a conductive layer, an adhesion layer disposed between the supporting substrate and the conductive layer, and an anti-oxidation layer, the adhesive layer of the tape component is located on the side of the supporting substrate away from the adhesion layer, and the electrolytic tape is located on the side of the anti-oxidation layer of the tape component away from the conductive layer.

[0028] This utility model also provides an electrolytic adhesive system, which includes a combination type adhesive tape, a positive electrode connector for connecting the positive electrode of the power supply to the conductive substrate of the first adhesive tape, and a negative electrode connector for connecting the negative electrode of the power supply to the conductive substrate of the second adhesive tape.

[0029] According to some embodiments of this utility model, both the positive electrode connector and the negative electrode connector are clamping components that can be opened and closed.

[0030] According to some embodiments of this utility model, the positive electrode connector and the negative electrode connector respectively include a first clamping member and a second clamping member that are hinged together. A clamping area is formed between one end of the first clamping member and one end of the second clamping member. One of the other ends of the first clamping member and the second clamping member is used to connect to a power source.

[0031] According to some embodiments of this utility model, both the first clamping member and the second clamping member are made of conductive metal material, and both the positive electrode connector and the negative electrode connector include an insulating sleeve, which is sleeved on the other end of the first clamping member and the other end of the second clamping member.

[0032] According to some embodiments of this utility model, in the first tape: the conductive substrate and the electrolytic adhesive layer each have protruding portions protruding beyond the remaining layers of the first tape, or the conductive substrate, the adhesive layer, and the electrolytic adhesive layer each have protruding portions protruding beyond one end of the first tape, or the conductive substrate and the adhesive layer each have protruding portions protruding beyond the remaining layers of the first tape, and the positive electrode connector is connected to the conductive substrate in the protruding portions; in the second tape, the conductive substrate and the adhesive layer each have protruding portions protruding beyond one end of the second tape, and the negative electrode connector is connected to the conductive substrate in the protruding portions.

[0033] According to some embodiments of the present invention, the electrolytic adhesive system further includes a masking sticker. When the electrolytic adhesive system is in a combined use state, a masking sticker is provided on the surface of the protruding portion of the adhesive layer of the first tape away from the conductive substrate, and / or, a masking sticker is provided on the surface of the protruding portion of the adhesive layer of the second tape away from the conductive substrate.

[0034] According to some embodiments of this utility model, the masking film is a polyester film, and the masking film is preferably a polyethylene terephthalate film.

[0035] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0036] The modular tape provided by this utility model includes a second tape, and the second component can be an insulating component such as plastic, glass, or anodized metal, thus expanding the application range of the modular tape. It also includes a first tape and a second tape, with the first tape bonded to the first component and the second tape bonded to the second component. Further bonding of the first component, the first tape, the second tape, and the second component together allows for convenient and quick assembly with high precision, and facilitates separate storage and transportation.

[0037] The tape component provided by this utility model is suitable for use in combination with electrolytic tape, and is easy and quick to assemble, with high assembly accuracy, and is convenient to store separately.

[0038] The electrolytic adhesive system provided by this utility model is provided with a positive electrode connector connecting the positive electrode of the power supply to the conductive substrate of the first adhesive tape, and a negative electrode connector connecting the negative electrode of the power supply to the conductive substrate of the second adhesive tape. When energized, it can achieve non-destructive disassembly, easily separate the bonded parts, and leave the electrolytic adhesive layer on the desired parts. Attached Figure Description

[0039] Appendix Figure 1 This is a structural diagram of the combined adhesive tape of Example 1;

[0040] Appendix Figure 2 This is an exploded view of the combination tape of Example 1;

[0041] Appendix Figure 3 This is a structural diagram of the first tape of the combined tape in Example 1;

[0042] Appendix Figure 4 This is a schematic diagram of the structure of the second tape of the combined tape in Example 1;

[0043] Appendix Figure 5 This is a structural diagram of the tape component in Example 2;

[0044] Appendix Figure 6 This is a structural diagram of the conductive substrate of the tape component in Example 2;

[0045] Appendix Figure 7 This is a structural diagram of the electrolytic tape of Example 2;

[0046] Appendix Figure 8 This is a structural diagram of the first structure of the electrolytic adhesive system in Example 3;

[0047] Appendix Figure 9 This is an exploded view of the first structure of the electrolytic adhesive system in Example 3;

[0048] Appendix Figure 10 This is an exploded view of the second structure of the electrolytic adhesive system in Example 3;

[0049] Appendix Figure 11 This is an exploded view of the third structure of the electrolytic adhesive system in Example 3;

[0050] Appendix Figure 12 This is a structural diagram of the positive electrode connector and the negative electrode connector in Example 3;

[0051] Appendix Figure 13 This is a structural diagram of the masking sticker in Example 3.

[0052] In the attached diagrams above:

[0053] 1-First adhesive tape, 11-First release layer, 12-Adhesive layer, 13-Conductive substrate, 131-Supporting substrate, 132-Adhesion layer, 133-Conductive layer, 134-Antioxidant layer, 14-Electrolytic adhesive layer, 15-Second release layer;

[0054] 2-Second tape, 21-Protective layer, 22-Conductive substrate, 221-Supporting substrate, 222-Adhesion layer, 223-Conductive layer, 224-Antioxidant layer, 23-Adhesive layer, 24-Release layer;

[0055] 3- Positive electrode connector, negative electrode connector;

[0056] 4-Mask; 5-Protruding part; 6-First component; 7-Second component;

[0057] 8-Adhesive tape component, 81-Protective layer, 82-Conductive substrate, 821-Supporting substrate, 822-Adhesion layer, 823-Conductive layer, 824-Antioxidant layer, 83-Adhesive layer, 84-Release layer;

[0058] 9-Electrolytic tape, 91-First release layer, 92-Adhesive layer, 931-Supporting substrate, 932-Adhesion layer, 933-Conductive layer, 934-Antioxidant layer, 94-Electrolytic adhesive layer, 95-Second release layer. Detailed Implementation

[0059] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0060] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the non-conductive substrate can be understood as a limitation of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0061] Example 1

[0062] See Figure 1-4 This example provides a composite tape, which includes a first tape 1 and a second tape 2, and has a combined state and a non-combined state. When in the non-combined state, the first tape 1 and the second tape 2 are independent of each other. The first tape 1 includes a first release layer 11, an adhesive layer 12, a conductive substrate 13, an electrolytic adhesive layer 14, and a second release layer 15 arranged sequentially. The conductive substrate 13 includes a support substrate 131, an adhesion layer 132, a conductive layer 133, and an anti-oxidation layer 134 arranged sequentially along the thickness direction of the first tape 1. The adhesive layer 12 is bonded to the support substrate 131. The second tape 2 includes a protective layer 21, a conductive substrate 22, an adhesive layer 22, and a release layer 24 arranged sequentially along the thickness direction of the second tape 2. The protective layer 21 is detachably connected to the conductive substrate 22. The conductive substrate 22 includes a support substrate 221 and a conductive layer 223 arranged sequentially. The adhesive layer 22 is bonded to the support substrate 221.

[0063] The first tape 1 and the second tape 2 can be rectangular, circular, or other feasible structures. In the first tape 1, the conductive substrate 13 has a protruding portion 5 that protrudes beyond the remaining layers of the first tape 1; or, see [link to relevant documentation]. Figure 11 The conductive substrate 13 and the electrolytic adhesive layer 14 both have protruding portions 5 that extend beyond the remaining layers of the first adhesive tape 1; or, see... Figure 10 The conductive substrate 13 and the adhesive layer 12 both have protruding portions 5 that extend beyond the remaining layers of the first adhesive tape 1; or, see... Figure 8-9 The conductive substrate 13, adhesive layer 12, and electrolytic adhesive layer 14 each have a protruding portion 5 extending from one end of the first tape 1. In the second tape 2, the conductive substrate 13 and adhesive layer 12 each have a protruding portion 5 extending beyond the remaining layers of the second tape 2. The protruding portions facilitate power connection during subsequent separation, simplifying operation.

[0064] In this example, the width of the protruding portion of the first tape 1 is smaller than the width of the first tape 1, and the width of the protruding portion of the second tape 2 is smaller than the width of the second tape 2. In some embodiments, the protruding portion is elongated.

[0065] See Figure 1-2 When in the combined state, the protruding parts on the first tape 1 and the protruding parts on the second tape 2 are located on opposite sides of the combined tape.

[0066] When in the combined state, the first release layer 11 and the second release layer 15 of the first tape 1 are removed, the protective layer 21 and the release layer 24 of the second tape 2 are removed, and the first tape 1 and the second tape 2 are bonded together, wherein the electrolytic adhesive layer 14 of the first tape 1 is bonded to the conductive layer 223 of the conductive substrate 22 of the second tape 2.

[0067] In another embodiment, the conductive substrate 22 of the second tape 2 includes a support substrate 221, an adhesion layer 222, a conductive layer 223, and an antioxidant layer 224 arranged sequentially along its thickness direction. The support substrate 221 is bonded to the adhesive layer 12. When in the combined state, the electrolytic adhesive layer 14 of the first tape 1 is bonded to the antioxidant layer 224 of the second tape 2.

[0068] Example 2

[0069] See Figure 5-7This example provides an adhesive tape component 8, which is suitable for use in combination with electrolytic tape. The adhesive tape component 8 includes a protective layer 81, a conductive substrate 82, an adhesive layer 83, and a release layer 84 arranged sequentially. The protective layer 81 and the conductive substrate 82 are detachably connected. When not in the combined state, the conductive substrate 82 includes a support substrate 821, an adhesion layer 822, a conductive layer 823, and an anti-oxidation layer 824 arranged sequentially along its thickness direction. The adhesive layer 83 of the adhesive tape component 8 is located on the side of the support substrate 821 away from the adhesion layer 822. The electrolytic tape 9 includes a first release layer 91, an adhesive layer 92, a conductive substrate, an electrolytic adhesive layer 94, and a second release layer 95 arranged sequentially along its thickness direction. The conductive substrate of the electrolytic tape 9 may include a support substrate 931, an adhesion layer 932, a conductive layer 933, and an anti-oxidation layer 934 arranged sequentially along its thickness direction.

[0070] In some embodiments, the conductive substrate 82 of the tape component 8 includes a support substrate 821 and a conductive layer 823 arranged sequentially along its thickness direction.

[0071] When the tape component 8 and the electrolytic tape 9 are used together, first remove the release layer 84 of the tape component 8 to bond one component to the adhesive layer of the tape component 8, and then remove the first release layer 91 of the electrolytic tape 9 to bond another component to the adhesive layer of the electrolytic tape 9. Next, remove the protective layer 81 of the tape component 8 and the second release layer 95 of the electrolytic tape 9. Then, the tape component 8 and the electrolytic tape 9 are bonded together. After bonding, the electrolytic tape 9 is located on the side of the anti-oxidation layer 934 of the tape component 8 away from the conductive layer 933, wherein the electrolytic adhesive layer 94 of the electrolytic tape 9 is bonded to the anti-oxidation layer 934 of the tape component 8.

[0072] Example 3

[0073] See Figure 8-11 This example provides an electrolytic adhesive system, including a combination tape of Embodiment 1, a positive electrode connector for connecting the positive electrode of the power supply to the conductive substrate of the first tape 1, and a negative electrode connector for connecting the negative electrode of the power supply to the conductive substrate of the second tape 2.

[0074] In the first tape 1, both the conductive substrate 13 and the electrolytic adhesive layer 14 have protruding portions 5 that extend beyond the other layers of the first tape 1. See [reference needed]. Figure 11 Alternatively, both the conductive substrate 13 and the adhesive layer 12 have protruding portions 5 that extend beyond the remaining layers of the first adhesive tape 1, see [reference]. Figure 10 Alternatively, the conductive substrate 13, adhesive layer 12, and electrolytic adhesive layer 14 may each have a protruding portion 5 extending beyond one end of the length direction or one end of the width direction of the first adhesive tape 1, see [reference]. Figure 8-9 The positive electrode connector 3 is connected to the protruding part mentioned above.

[0075] In the second tape 2, the conductive substrate 22 and the adhesive layer 23 both have protruding portions that extend from one end of the length direction or one end of the width direction of the second tape 2, and the negative electrode connector 3 is connected to the protruding portions.

[0076] In this example, both the positive terminal connector and the negative terminal connector 3 are openable and closable clamping components. See [link / reference]. Figure 12 The positive and negative connectors 3 each include a first clamping member and a second clamping member hinged together. A clamping area is formed between one end of the first clamping member and one end of the second clamping member. One of the other ends of the first and second clamping members is connected to the power supply via a wire. The protruding parts and the positive and negative connectors facilitate quick and safe operation by the operator.

[0077] In some embodiments, both the first clamping member and the second clamping member are made of conductive metal. Both the positive and negative electrode connectors also include an insulating sleeve. The insulating sleeve is fitted over the other end of the first clamping member and the other end of the second clamping member. The insulating sleeve may also be fitted over one end of the first clamping member and one end of the second clamping member, but does not cover one end of the first clamping member and the second clamping member. The insulating sleeve can protect the user.

[0078] In this example, when the electrolytic adhesive bonding system is working, the first release layer 11 of the first tape 1 is first removed, so that the first component 6 is bonded to the adhesive layer of the first tape 1; at the same time, the release layer of the second tape 2 is removed, so that the second component 7 is bonded to the adhesive layer of the second tape 2; then the second release layer 15 of the first tape 1 and the protective layer 21 of the second tape 2 are removed, and then the first tape 1 and the second tape 2 are bonded. At this time, the first component 6 and the second component 7 are located on opposite surfaces of the composite tape. This combination is simple and quick to use, and the assembly accuracy of the first component 6 and the second component 7 is high.

[0079] When it is necessary to separate the first component 6 from the second component 7, the positive electrode connector clamps the protruding part of the first adhesive tape 1, and the negative electrode connector clamps the protruding part of the second adhesive tape 2. After energizing, the adhesive force of the electrolytic adhesive layer is reduced by the applied voltage, allowing the first adhesive tape 1 and the second adhesive tape 2 to separate. The positive and negative electrode connectors can easily and quickly clamp the protruding parts, thereby quickly separating the first adhesive tape 1 from the second adhesive tape 2. After the first adhesive tape 1 and the second adhesive tape 2 are separated, the first adhesive tape 1 and the first component 6 become one unit, and the second adhesive tape 2 and the second component 7 become one unit. The positive electrode connector connects the positive terminal of the power supply to the conductive substrate of the first adhesive tape, and the negative electrode connector connects the negative terminal of the power supply to the conductive substrate of the second adhesive tape. Energizing allows for non-destructive disassembly, and the electrolytic adhesive layer can be left on the desired component.

[0080] In this example, the electrolytic adhesive layer is made of electrolytic adhesive, which is a well-known material.

[0081] In this example, the first component 6 and the second component 7 can be non-metallic parts. In particular, the second component 7 can be made of insulating materials such as plastic, glass, or anodized metal, thus expanding its application range. Alternatively, both the first component 6 and the second component 7 can be metallic parts.

[0082] In this example, in the first tape 1, the protruding portions of the conductive substrate 13, the adhesive layer 12, and the electrolytic adhesive layer 14 all protrude from one end of the first component 6; the protruding portions of the conductive substrate 13 and the adhesive layer 12 all protrude from one end of the first component 6. In the second tape 2, the protruding portions of the conductive substrate 21 and the adhesive layer 23 all protrude from one end of the second component 7.

[0083] After the first component 6 and the second component 7 are bonded to the combined adhesive tape, the system also includes a masking sticker 4 to better protect the first component 6 and the second component 7. When the electrolytic adhesive system is in combined use, the masking sticker 4 is provided on the surface of the protruding part of the adhesive layer 12 of the first adhesive tape 1 away from the conductive substrate 13 (the surface of the protruding part of the adhesive layer 12 of the first adhesive tape 1 away from the conductive substrate 13 is flush with the surface where the first component 6 and the adhesive layer 12 of the first adhesive tape 1 are bonded, that is, the masking sticker 4 and the first component 6 are both located on the same surface of the adhesive layer 12). The masking sticker 4 is provided on the surface of the protruding part of the adhesive layer 23 of the second adhesive tape 2 away from the conductive substrate 22 (the surface of the protruding part of the adhesive layer 23 of the second adhesive tape 2 away from the conductive substrate 22 is flush with the surface where the second component 7 and the adhesive layer 23 of the second adhesive tape 2 are bonded, that is, the masking sticker 4 and the second component 7 are both located on the same surface of the adhesive layer 23). The masking sticker 4 is adhered to the protruding part of the adhesive layer. The masking sticker 4 protects the side of the first component 6 from being adhered to the adhesive layer and prevents the second component 7 from being adhered to the adhesive layer, thus better protecting the first component 6 and the second component 7. When one side of the first clamping member of the positive electrode connector clamps the masking sticker 4 on the protruding part of the adhesive layer 12 of the first adhesive tape 1, and one side of its second clamping member clamps the electrolytic adhesive layer 14, and one side of the first clamping member of the negative electrode connector clamps the masking sticker 4 on the protruding part of the adhesive layer 23 of the second adhesive tape 2, and one side of its second clamping member clamps the conductive layer 223 of the second adhesive tape 2, conductivity is also achieved, reducing the adhesive force of the electrolytic adhesive layer and allowing the first component 6 and the second component 7 to separate.

[0084] In this example, the masking sticker 4 can have the same shape and size as the protruding part 5.

[0085] The electrolytic adhesive system in this example avoids the requirement that the parts bonded to the electrolytic adhesive layer must be conductive, and can be used on insulating interfaces such as plastics, glass, ceramics, and anodized metal surfaces, thereby expanding the application range of electrolytic adhesives.

[0086] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A composite adhesive tape, characterized in that, The composite tape includes a first tape and a second tape, and has a combined state and a non-combined state. When in the non-combined state, the first tape and the second tape are independent of each other. The first tape includes a first release layer, an adhesive layer, a conductive substrate, an electrolytic adhesive layer, and a second release layer arranged in sequence. The second tape includes a protective layer, a conductive substrate, an adhesive layer, and a release layer arranged in sequence. The protective layer and the conductive substrate are detachably connected. When in the combined state, the electrolytic adhesive layer of the first tape is bonded to the conductive substrate of the second tape.

2. The composite tape according to claim 1, characterized in that, The sum of the thicknesses of the first tape and the second tape ranges from 86 to 3050 μm; and / or, the thickness of the first tape is 1 to 50 times the thickness of the second tape.

3. The composite tape according to claim 1, characterized in that, In the first tape, the thickness of the adhesive layer ranges from 10 to 100 μm, the thickness of the conductive substrate ranges from 3.1 to 1100 μm, and the thickness of the electrolytic adhesive layer ranges from 10 to 100 μm; and / or, in the second tape, the thickness of the adhesive layer ranges from 10 to 100 μm, and the thickness of the conductive substrate ranges from 3.1 to 1100 μm.

4. The composite tape according to claim 1, characterized in that, The conductive substrates of the first tape and the second tape are independently multi-layered structures, each multi-layered structure including a supporting substrate, a conductive layer, and an adhesion layer disposed between the supporting substrate and the conductive layer. In the first tape, the adhesive layer is located on the side of the supporting substrate away from the adhesion layer, and the electrolytic adhesive layer is located on the side of the conductive layer away from the adhesion layer. In the second tape, the adhesive layer is located on the side of the supporting substrate away from the adhesion layer. Alternatively, the protective layer may be a polyethylene terephthalate film, a polypropylene film, a polyethylene film, a polyimide film, or a polyvinyl chloride resin film.

5. The composite tape according to claim 4, characterized in that, The conductive substrate of the first tape and / or the second tape further includes an antioxidant layer, the antioxidant layer being located on the side of the conductive layer away from the supporting substrate; Or, in the first tape and the second tape, the thickness range of the supporting substrate is 3-1000μm, the thickness range of the adhesion layer is 0.005-30μm, and the thickness range of the conductive layer is 0.01-50μm.

6. The composite tape according to claim 1, characterized in that, In the first tape: the conductive substrate has a protruding portion that protrudes beyond the remaining layers of the first tape; or, both the conductive substrate and the adhesive layer have protruding portions that protrude beyond the remaining layers of the first tape. In the second tape, both the conductive substrate and the adhesive layer have protruding portions that extend beyond the rest of the second tape.

7. The composite tape according to claim 6, characterized in that, The width of the protruding portion is less than the width of the corresponding tape; when in the combined state, the protruding portions on the first tape and the second tape are located on different sides of the combined tape, or the protruding portions on the first tape and the second tape are located on the same side of the combined tape, and a distance is maintained between them.

8. A tape component, characterized in that, The tape component is suitable for use in combination with electrolytic tape. The tape component includes a protective layer, a conductive substrate, an adhesive layer and a release layer arranged in sequence. The protective layer and the conductive substrate are detachably connected.

9. The tape component according to claim 8, characterized in that, The conductive substrate has a multilayer structure, which includes a supporting substrate, a conductive layer, an adhesion layer disposed between the supporting substrate and the conductive layer, and an anti-oxidation layer. The adhesive layer of the tape component is located on the side of the supporting substrate away from the adhesion layer, and the electrolytic tape is located on the side of the anti-oxidation layer of the tape component away from the conductive layer.

10. An electrolytic adhesive system, characterized in that, The invention includes the combined adhesive tape as described in any one of claims 1 to 7, a positive electrode connector for connecting the positive terminal of the power supply to the conductive substrate of the first adhesive tape, and a negative electrode connector for connecting the negative terminal of the power supply to the conductive substrate of the second adhesive tape.

11. The electrolytic adhesive system according to claim 10, characterized in that, Both the positive and negative terminals are clamping components that can be opened and closed.

12. The electrolytic adhesive system according to claim 10, characterized in that, In the first tape: the conductive substrate and the electrolytic adhesive layer each have protruding portions that extend beyond the remaining layers of the first tape; or the conductive substrate, the adhesive layer, and the electrolytic adhesive layer each have protruding portions that extend beyond one end of the first tape; or the conductive substrate and the adhesive layer each have protruding portions that extend beyond the remaining layers of the first tape. The positive electrode connector is connected to the conductive substrate in the protruding portions. In the second tape: the conductive substrate and the adhesive layer each have protruding portions that extend beyond one end of the second tape. The negative electrode connector is connected to the conductive substrate in the protruding portions. The electrolytic adhesive system further includes a masking sticker. When the electrolytic adhesive system is used in combination, a masking sticker is provided on the surface of the protruding portion of the adhesive layer of the first tape away from the conductive substrate, and / or, a masking sticker is provided on the surface of the protruding portion of the adhesive layer of the second tape away from the conductive substrate.

Images