Anti-splashing device for semiconductor electroplating cleaning chamber

Abstract

The utility model provides a semiconductor electroplating cleaning cavity's anti - splash device relates to semiconductor electroplating technical field, this semiconductor electroplating cleaning cavity's anti - splash device, including device body, the device body top is provided with the inner storehouse, the bottom wall on the inside of inner storehouse is fixedly connected with vertical rod, the vertical rod top is provided with center groove and installation slot, the bottom wall on the inside of center groove is rotatably connected with hexagon bar, the hexagon bar outside is slidably provided with the sleeve, the sleeve top is fixedly connected with the placement tray, this semiconductor electroplating cleaning cavity's anti - splash device, through setting adjustable height's placement tray, through the size model of wafer and adjust the height of placement tray, can ensure the distance between wafer rim and baffle, prevent liquid splash, to ensure that liquid can smoothly slide along the inclined surface of baffle after throwing, finally falls into the inner storehouse storehouse bottom, thereby effectively improve the applicability of semiconductor electroplating cleaning cavity's anti - splash device.

Description

Technical Field

[0001] This utility model relates to an anti-splashing device for a semiconductor electroplating cleaning chamber, specifically an anti-splashing device for a semiconductor electroplating cleaning chamber, belonging to the field of semiconductor electroplating technology. Background Technology

[0002] Semiconductor electroplating is one of the key processes in semiconductor manufacturing. It is mainly used to deposit a thin metal film on the surface of semiconductor wafers to create conductive paths and enhance structural durability. Electroplating is the process of depositing a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust).

[0003] In the prior art, the authorized announcement number CN222440540U is a splash prevention device for a semiconductor electroplating cleaning chamber. It includes liquid thrown out by the wafer at high speed. Under the action of centrifugal force and airflow field, the liquid changes its trajectory after being blocked by a circumferential baffle and falls into the bottom of the chamber. Finally, it is discharged through the drain hole after being collected. This solution uses an inclined baffle. In semiconductor manufacturing, the electroplating cleaning chamber is one of the key pieces of equipment used for cleaning wafers. Traditional electroplating cleaning chambers typically use high-speed rotation to use centrifugal force to throw the cleaning solution off the wafer surface to dry the wafer. However, this device is only suitable for wafers of specific sizes. When drying wafers of different sizes or specifications, the distance between the inclined baffle and the wafer can affect the anti-splashing effect, thus reducing the applicability of the anti-splashing device in the semiconductor electroplating cleaning chamber. Summary of the Invention

[0004] (a) Technical problems to be solved The purpose of this invention is to provide an anti-splashing device for a semiconductor electroplating cleaning chamber in order to solve the above-mentioned problems, thereby addressing the issue of low applicability of existing anti-splashing devices for semiconductor electroplating cleaning chambers.

[0005] (II) Technical Solution This utility model is achieved through the following technical solution: a backsplash prevention device for a semiconductor electroplating cleaning chamber, comprising a device body, an inner chamber at the top of the device body, a vertical rod fixedly connected to the bottom wall inside the inner chamber, a central groove and an installation groove at the top of the vertical rod, a hexagonal rod rotatably connected to the bottom wall inside the central groove, a sleeve slidably fitted on the outer side of the hexagonal rod, a placement plate fixedly connected to the top of the sleeve, a fixing ring rotatably connected to the bottom of the placement plate, a cylinder installed in the installation groove, the piston rod end of the cylinder fixedly connected to the bottom of the fixing ring, and an inward tilting baffle installed on the inner wall of the inner chamber.

[0006] Preferably, the bottom of the fixing ring is fixedly connected to a circumferentially arrayed stabilizing rod, and a stabilizing groove is provided at the top of the vertical rod and at a corresponding position relative to each stabilizing rod, and the stabilizing rod is slidably connected inside the stabilizing groove.

[0007] Preferably, the placement tray includes a central tray, and a placement rod arranged in a circumferential array is fixedly connected to the outer side of the central tray. An adjusting tube is slidably sleeved on the outer side of the placement rod. A through threaded hole is opened at the top of the adjusting tube, and a bolt is threaded into the threaded hole. A through hole arranged in a linear array is opened at the top of the placement rod, and the bolt is located inside the through hole. A clamping member is provided at the top of the adjusting tube.

[0008] Preferably, the clamping component includes a fixing block fixedly connected to the top of the adjusting tube, a pin groove is provided on one side of the fixing block, a clamping block is slidably connected in the pin groove, and a spring is fixedly connected to one end of the clamping block located in the pin groove.

[0009] Preferably, the device body has an annular negative pressure chamber located directly below the inner chamber, and a guide hole is provided between the inner chamber and the negative pressure chamber.

[0010] Preferably, an exhaust pipe and a drain pipe are fixedly connected to one side of the device body, the exhaust pipe is located above the drain pipe, and both the exhaust pipe and the drain pipe are connected to the negative pressure chamber.

[0011] Preferably, a threaded groove is formed at the top opening of the inner compartment, and an external threaded ring is threadedly connected to the inner threaded groove. The external threaded ring is fixedly sleeved on the outside of the inward tilting baffle.

[0012] Preferably, the top of the inward-sloping baffle is provided with a through-type circular groove, and a transparent plate is installed in the circular groove.

[0013] Preferably, a servo motor is installed inside the device body, and the output shaft of the servo motor is fixedly connected to the bottom end of the hexagonal rod.

[0014] This utility model provides an anti-splashing device for a semiconductor electroplating cleaning chamber, which has the following beneficial effects: 1. The anti-splash device of the semiconductor electroplating cleaning chamber, by setting an adjustable height placement tray, can ensure the distance between the edge of the wafer and the baffle by adjusting the height of the placement tray according to the size and model of the wafer, preventing liquid splashing, and ensuring that the liquid can smoothly slide down the inclined surface of the baffle after being thrown out, and finally fall into the bottom of the inner chamber, thereby effectively improving the applicability of the anti-splash device of the semiconductor electroplating cleaning chamber.

[0015] 2. The anti-splash device of the semiconductor electroplating cleaning chamber achieves stable clamping of the wafer through adjusting tubes and bolts, adapting to wafers of different sizes. This design improves the versatility and flexibility of the equipment, making it applicable to wafers of various specifications and enhancing the applicability of the equipment. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is a three-dimensional front view sectional view of the entire utility model; Figure 3 This is a three-dimensional side view sectional diagram of the entire utility model; Figure 4 This utility model Figure 3 Enlarged view of the structure of part A.

[0017] [Explanation of Key Component Symbols] 1. Device body; 2. Inner chamber; 3. Vertical rod; 4. Hexagonal rod; 5. Sleeve; 6. Placement tray; 61. Central plate; 62. Placement rod; 63. Adjustment pipe; 64. Bolt; 65. Clamping block; 66. Perforation; 7. Fixing ring; 8. Cylinder; 9. Inward tilting baffle; 10. Stabilizing rod; 11. Negative pressure chamber; 12. Guide hole; 13. Drain pipe; 14. Exhaust pipe; 15. External threaded ring; 16. Servo motor. Detailed Implementation

[0018] This utility model provides an anti-splashing device for a semiconductor electroplating cleaning chamber.

[0019] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The device includes a main body 1, an inner chamber 2 on the top of the main body 1, a vertical rod 3 fixedly connected to the bottom wall inside the inner chamber 2, a central groove and an installation groove on the top of the vertical rod 3, a hexagonal rod 4 rotatably connected to the bottom wall inside the central groove, a sleeve 5 slidably sleeved on the outside of the hexagonal rod 4, a placement plate 6 fixedly connected to the top of the sleeve 5, a fixing ring 7 rotatably connected to the bottom of the placement plate 6, a cylinder 8 installed in the installation groove, the piston rod end of the cylinder 8 fixedly connected to the bottom of the fixing ring 7, and an inwardly tilting baffle 9 installed on the inner wall of the inner chamber 2. Specifically, this device is generally installed in a water tank or other cleaning equipment. After the wafer cleaning is completed, the placement tray 6 rotates at high speed and generates centrifugal force to spin dry the liquid on the wafer surface. The inward tilting baffle 9 is a prior art structure, mainly used to prevent the spun liquid from splashing back onto the wafer. The inner wall of the inner chamber 2 can be equipped with a flexible direction-changing structure. The cylinder 8 is controlled by an external controller to automatically adjust the height of the placement tray 6 according to the size of the wafer and process requirements. A distance sensor can be installed on the inner wall of the inner chamber 2 or on a transparent plate to monitor the distance between the wafer and the inward tilting baffle 9. Based on the information fed back by the sensor, the controller automatically adjusts the extension and retraction of the cylinder 8 to ensure that the distance between the wafer and the inward tilting baffle 9 is always kept within the optimal range. Since the controller and distance sensor are both prior art devices, their specific forms, usage methods and installation methods are all prior art means, and this application will not elaborate on them.

[0020] Please see Figure 1 , Figure 2 and Figure 3 The bottom of the fixed ring 7 is fixedly connected to a circumferentially arrayed stabilizing rod 10. The top of the vertical rod 3 and the corresponding position of each stabilizing rod 10 are provided with stabilizing grooves, and the stabilizing rod 10 is slidably connected to the inside of the stabilizing groove.

[0021] Please see Figure 1 , Figure 2 and Figure 3 The placement plate 6 includes a central plate 61. A placement rod 62 arranged in a circular array is fixedly connected to the outside of the central plate 61. An adjusting tube 63 is slidably sleeved on the outside of the placement rod 62. A through threaded hole is opened at the top of the adjusting tube 63. A bolt 64 is threadedly connected inside the threaded hole. A through hole 66 arranged in a linear array is opened at the top of the placement rod 62. The bolt 64 is located inside the through hole 66. A clamping member is provided at the top of the adjusting tube 63.

[0022] Please see Figure 2 , Figure 3 and Figure 4 The clamping component includes a fixing block fixedly connected to the top of the adjusting tube 63. A pin groove is provided on one side of the fixing block, and a clamping block 65 is slidably connected in the pin groove. A spring is fixedly connected to one end of the clamping block 65 located in the pin groove. Specifically, the spring provides a certain buffering effect to prevent the clamping block 65 from damaging the wafer. The top of the clamping block 65 is provided with a protrusion, which is located at the top of the rounded edge when the clamping block 65 clamps or contacts the edge of the wafer.

[0023] Please see Figure 2 and Figure 3 The device body 1 has an annular negative pressure chamber 11 inside, which is located directly below the inner chamber 2, and a guide hole 12 is connected between the inner chamber 2 and the negative pressure chamber 11.

[0024] Please see Figure 2 and Figure 3 The device body 1 has an exhaust pipe 14 and a drain pipe 13 fixedly connected on one side. The exhaust pipe 14 is located above the drain pipe 13, and both the exhaust pipe 14 and the drain pipe 13 are connected to the negative pressure chamber 11.

[0025] Please see Figure 2 and Figure 3 The top opening of the inner compartment 2 is formed with a threaded groove, and an external threaded ring 15 is connected to the threaded groove. The external threaded ring 15 is fixedly sleeved on the outside of the inward tilting baffle 9.

[0026] Please see Figure 1 , Figure 2 and Figure 3 The top of the inward-sloping baffle 9 has a through-type circular groove, and a transparent plate is installed inside the groove; Specifically, an exposed panel allows for easy observation of the cleaning process, ensuring the cleaning effect.

[0027] Please see Figure 2 and Figure 3 The device body 1 is equipped with a servo motor 16, and the output shaft of the servo motor 16 is fixedly connected to the bottom end of the hexagonal rod 4. Specifically, the servo motor 16 is electrically connected to the power supply. The models of the servo motor 16 and the cylinder 8 are not limited, but are subject to the compatibility of the equipment.

[0028] Working principle: The product is placed on the placement tray 6. At the same time, the position of the clamping component is adjusted according to the size or radius of the placement tray 6, so that the clamping block 65 contacts and slightly squeezes the product. Then, the cylinder 8 is activated according to the product size and model. The cylinder 8 drives the placement tray 6 and the fixing ring 7 to rise and fall, thereby adjusting the product height and the distance between the product edge and the inclined surface of the inward baffle 9. Then, the servo motor 16 is activated to drive the hexagonal rod 4 to rotate. The hexagonal rod 4 drives the placement tray 6 to rotate through the sleeve 5. The inward baffle 9 is designed with an inclination angle so that the liquid flows downward along the baffle under the action of centrifugal force, changing the movement trajectory of the liquid and preventing the liquid from splashing back onto the wafer surface.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A backsplash prevention device for a semiconductor electroplating cleaning chamber, comprising a device body (1), characterized in that: The device body (1) has an inner chamber (2) on top. A vertical rod (3) is fixedly connected to the bottom wall inside the inner chamber (2). A central groove and an installation groove are opened on the top of the vertical rod (3). A hexagonal rod (4) is rotatably connected to the bottom wall inside the central groove. A sleeve (5) is slidably fitted on the outside of the hexagonal rod (4). A placement plate (6) is fixedly connected to the top of the sleeve (5). A fixing ring (7) is rotatably connected to the bottom of the placement plate (6). A cylinder (8) is installed in the installation groove. The piston rod end of the cylinder (8) is fixedly connected to the bottom of the fixing ring (7). An inwardly tilting baffle (9) is installed on the inner wall of the inner chamber (2).

2. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The bottom of the fixed ring (7) is fixedly connected to a circumferentially arrayed stabilizing rod (10). The top of the vertical rod (3) and the corresponding position of each stabilizing rod (10) are provided with stabilizing grooves. The stabilizing rod (10) is slidably connected to the inside of the stabilizing groove.

3. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The placement tray (6) includes a central tray (61), and a placement rod (62) arranged in a circular array is fixedly connected to the outside of the central tray (61). An adjusting tube (63) is slidably sleeved on the outside of the placement rod (62). A through threaded hole is opened at the top of the adjusting tube (63), and a bolt (64) is threadedly connected inside the threaded hole. A through hole (66) arranged in a linear array is opened at the top of the placement rod (62), and the bolt (64) is located inside the through hole (66). A clamping member is provided at the top of the adjusting tube (63).

4. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The clamping component includes a fixing block fixedly connected to the top of the adjusting tube (63). A pin groove is provided on one side of the fixing block, and a clamping block (65) is slidably connected in the pin groove. A spring is fixedly connected to one end of the clamping block (65) located in the pin groove.

5. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The device body (1) has an annular negative pressure chamber (11) inside. The negative pressure chamber (11) is located directly below the inner chamber (2), and a guide hole (12) is connected between the inner chamber (2) and the negative pressure chamber (11).

6. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The device body (1) has an exhaust pipe (14) and a drain pipe (13) fixedly connected on one side. The exhaust pipe (14) is located above the drain pipe (13), and both the exhaust pipe (14) and the drain pipe (13) are connected to the negative pressure chamber (11).

7. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The inner compartment (2) has a threaded groove formed at the top opening, and an external threaded ring (15) is threadedly connected to the inner threaded groove. The external threaded ring (15) is fixedly sleeved on the outside of the inward baffle (9).

8. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: The top of the inward-tilting baffle (9) is provided with a through-type circular groove, and a transparent plate is installed in the circular groove.

9. The anti-splashing device for the semiconductor electroplating cleaning chamber according to claim 1, characterized in that: A servo motor (16) is installed inside the main body (1) of the device, and the output shaft of the servo motor (16) is fixedly connected to the bottom end of the hexagonal rod (4).

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