High-efficiency heat dissipation device of liquid crystal display module
By employing a heat dissipation structure combining a heat spreader and a heat sink array with a centrifugal fan in the LCD module, a directional convection circulation is formed, which solves the problem of uneven heat dissipation in the LCD module, achieves efficient heat transfer and discharge, and extends its service life.
Patent Information
- Application Number
- CN202522020579.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-19
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-19
AI Technical Summary
Existing heat dissipation methods for LCD modules cannot efficiently and evenly distribute heat, resulting in uneven temperature distribution on the back side, which cannot meet the requirements of high-load scenarios.
The heat dissipation structure combines a heat spreader and a heat sink array with a centrifugal fan, forming a directional convection circulation through the air inlet and outlet channels to ensure uniform heat distribution and rapid exhaust.
It improves the problem of uneven temperature distribution in LCD modules, enhances heat transfer and dissipation efficiency, and extends the service life of LCD modules.
Smart Images

Figure CN224682503U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to a high-efficiency heat dissipation device for a liquid crystal display module. Background Technology
[0002] With the widespread application of LCD technology in consumer electronics, LCD modules are developing towards higher brightness and higher refresh rates, leading to a sharp increase in power consumption and heat generation. Efficient heat dissipation has become a key technology for ensuring display quality and the lifespan of LCD screens.
[0003] To achieve efficient heat dissipation of LCD modules, existing technologies employ a heat dissipation structure that combines a perforated housing with a rear-mounted fan. This involves setting ventilation chambers and heat dissipation holes in the housing and using a fan to drive airflow across the surface of the LCD module to achieve heat dissipation.
[0004] However, relying solely on airflow combined with direct airflow to the back of the LCD module is insufficient to efficiently and evenly distribute the heat generated by the LCD module. This can easily lead to uneven temperature distribution across the entire back of the LCD module, resulting in the LCD module being unable to meet the requirements of high-load scenarios. Utility Model Content
[0005] To solve the above-mentioned technical problems, this application provides a high-efficiency heat dissipation device for a liquid crystal display module. The device includes: a housing, a heat dissipation plate, a middle frame, a heat dissipation fin array, an air inlet channel, an air outlet channel, a first centrifugal fan, and a second centrifugal fan. The heat spreader is connected to the housing via the middle frame; One end of the heat spreader is connected to the liquid crystal display module; The heat dissipation fin array is located inside the housing and is connected to the other end of the heat spreader. The air inlet channel, the air outlet channel, the first centrifugal fan, and the second centrifugal fan are disposed inside the housing; The first centrifugal fan and the air inlet channel are located on the right side of the housing. The air inlet channel is connected to the first centrifugal fan. The first centrifugal fan is used to draw outside air into the housing through the air inlet channel and guide it to the heat dissipation fin array. The second centrifugal fan and the air outlet channel are located on the left side of the housing. The second centrifugal fan is connected to the air outlet channel. The second centrifugal fan is used to draw in the airflow that flows through the heat dissipation fin array inside the housing and discharge it to the air outlet channel.
[0006] Optionally, the heat spreader and the middle frame are integrally formed, and the heat spreader and the middle frame form a mounting cavity for mounting the liquid crystal display module.
[0007] Optionally, the middle frame is provided with telescopic claws, which are used to fix the liquid crystal display module.
[0008] Optionally, the heat spreader is provided with a thermally conductive gel layer; The thermally conductive gel layer is disposed inside the mounting cavity; The liquid crystal display module is connected to the heat spreader through the thermally conductive gel layer.
[0009] Optionally, the middle frame is provided with positioning holes; The housing is provided with a positioning pin that matches the positioning hole; The middle frame is connected to the housing through the positioning hole and the positioning pin.
[0010] Optionally, the first centrifugal fan is provided with a first installation chamber and an air outlet; The first centrifugal fan is installed inside the first installation chamber; The first mounting compartment is fixed to the right inner side of the housing and connected to the air inlet channel; The air outlet is located on the first mounting compartment and faces the heat dissipation fin array.
[0011] Optionally, the second centrifugal fan is provided with a second installation chamber and an exhaust port; The second centrifugal fan is installed inside the second installation chamber; The second installation compartment is fixed to the left inner side of the housing and connected to the air outlet duct; The exhaust vent is located on the second mounting compartment and faces the heat dissipation fin array.
[0012] Optionally, the housing is provided with a first magnetic dustproof mesh and a second magnetic dustproof mesh; The first magnetic dustproof net is installed at the entrance of the air inlet channel; The second magnetic dustproof net is installed at the outlet of the air outlet channel.
[0013] Optionally, a controller is provided on the housing, and the controller is electrically connected to the heat spreader, the first centrifugal fan and the second centrifugal fan.
[0014] Optionally, the heat spreader is equipped with a temperature sensor, which is electrically connected to the controller.
[0015] As can be seen from the above technical solutions, this application has the following beneficial effects: This application connects the heat spreader to the housing via a mid-frame, ensuring the heat spreader's stable position within the housing and preventing displacement due to vibration of internal components or external forces. Next, the heat spreader connects to the LCD module, quickly and evenly distributing the heat generated by the LCD module onto the heat spreader, fundamentally preventing localized high temperatures and improving the problem of uneven temperature distribution within the LCD module. Then, a first centrifugal fan on the right side of the housing, in conjunction with the air inlet channel, guides external air to the heat dissipation fin array inside the housing, ensuring the airflow fully contacts the fins to remove heat. Furthermore, a second centrifugal fan on the left side of the housing, connected to the air outlet channel, quickly exhausts the hot airflow after passing through the heat dissipation fin array, forming a highly efficient directional convection heat dissipation path. Compared to traditional perforated ventilation structures, the air inlet and outlet channels reduce airflow loss, optimize wind resistance, further improve heat transfer and exhaust efficiency, ensure long-term stable operation of the LCD module, and extend its service life. Attached Figure Description
[0016] Figure 1 This is an exploded view of the high-efficiency heat dissipation device for the liquid crystal display module of this application; Figure 2 This is a schematic diagram of the mid-frame structure of the high-efficiency heat dissipation device for the liquid crystal display module of this application; Figure 3 This is a schematic cross-sectional view of the middle frame structure of the high-efficiency heat dissipation device for the liquid crystal display module of this application; Figure 4 This is a schematic diagram of the housing structure of the high-efficiency heat dissipation device for the liquid crystal display module of this application; Figure 5 This is a schematic diagram of the first centrifugal fan structure of the high-efficiency heat dissipation device for the liquid crystal display module of this application; Figure 6 This is a schematic diagram of the second centrifugal fan structure of the high-efficiency heat dissipation device for the liquid crystal display module of this application. Detailed Implementation
[0017] To address the aforementioned technical problems, this application provides a high-efficiency heat dissipation device for liquid crystal display modules, which solves the problem that the heat generated by the liquid crystal display module is difficult to dissipate efficiently and evenly, resulting in uneven temperature distribution across the entire back surface of the liquid crystal display module.
[0018] In this application, the terms "upper", "lower", "right", "left", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and other terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to describe the relative positional relationship between the components or parts and do not specifically limit the specific installation orientation of each component or part.
[0019] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0020] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0021] Furthermore, the structures, proportions, sizes, etc., drawn in the accompanying drawings of this application are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modification to the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that this application can produce, should still fall within the scope of the technical content disclosed in this application.
[0022] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0023] Please see Figures 1 to 6 This application provides a high-efficiency heat dissipation device for a liquid crystal display module. The high-efficiency heat dissipation device includes: a housing 1, a heat dissipation plate 2, a middle frame 3, a heat dissipation fin array 4, an air inlet channel 5, an air outlet channel 6, a first centrifugal fan 7, and a second centrifugal fan 8. The heat spreader 2 is connected to the housing 1 via the middle frame 3; One end of the heat spreader 2 is connected to the LCD display module 22; The heat dissipation fin array 4 is located inside the housing 1 and is connected to the other end of the heat spreader 2; Air inlet duct 5, air outlet duct 6, first centrifugal fan 7 and second centrifugal fan 8 are installed inside housing 1; The first centrifugal fan 7 and the air inlet channel 5 are located on the right side of the housing 1. The air inlet channel 5 is connected to the first centrifugal fan 7. The first centrifugal fan 7 is used to draw outside air into the housing 1 through the air inlet channel 5 and guide it to the heat dissipation fin array 4. The second centrifugal fan 8 and the air outlet channel 6 are located on the left side of the housing 1. The second centrifugal fan 8 is connected to the air outlet channel 6. The second centrifugal fan 8 is used to draw in the airflow that flows through the heat dissipation fin array 4 inside the housing 1 and discharge it to the air outlet channel 6.
[0024] The components of this embodiment are described in detail below: The housing 1 serves as the supporting structure for the entire heat dissipation device. It is equipped with an air inlet channel 5, an air outlet channel 6, a first centrifugal fan 7, and a second centrifugal fan 8. It is also indirectly connected to the heat dissipation plate 2 through the middle frame 3. The interior is also equipped with a space to accommodate the heat dissipation fin array 4, which is mainly used to protect the internal components from external environmental interference and to provide airflow space.
[0025] One end of the middle frame 3 is connected to the housing 1, and the other end is connected to the heat spreader 2; it is mainly used to fix the heat spreader 2 to the housing 1.
[0026] One end of the heat spreader 2 is directly connected to the LCD module 22, and the other end is connected to the heat dissipation fin array 4 inside the housing 1, and is indirectly connected to the housing 1 through the middle frame 3. It is mainly used to absorb the heat generated by the LCD module 22 when it is working, using aluminum alloy as the heat conduction material, and to evenly diffuse the heat to the entire area of the heat spreader 2, while transferring the evenly distributed heat to the heat dissipation fin array 4.
[0027] The heat dissipation fin array 4 is located inside the housing 1 and connected to the heat spreader 2. It is situated between the air inlet channel 5, the airflow path guided by the first centrifugal fan 7, and the exhaust path formed by the second centrifugal fan 8 and the air outlet channel 6. Its main function is to receive the heat transferred from the heat spreader 2 and then quickly diffuse the heat into the surrounding air.
[0028] The air inlet channel 5 is located on the right side of the housing 1 and is connected to the first centrifugal fan 7. It is mainly used to cooperate with the suction action of the first centrifugal fan 7 to guide the external air into the direction.
[0029] The air outlet duct 6 is installed on the left side of the housing 1 and is connected to the air inlet duct 5. It is mainly used to cooperate with the exhaust action of the second centrifugal fan 8 to provide a directional path for the hot air to be discharged outside the housing 1.
[0030] The first centrifugal fan 7 is installed on the right side of the casing 1, with one end connected to the air inlet channel 5 and the other end facing the heat dissipation fin array 4 inside the casing 1. It is mainly used to draw in external cold air through the air inlet channel 5 using its own power, and then direct the drawn-in cold air to the heat dissipation fin array 4, so that the cold air flows through the gaps between the fins and exchanges heat. The second centrifugal fan 8 is installed on the left side of the housing 1. One end is connected to the air outlet channel 6, and the other end faces the heat dissipation fin array 4 inside the housing 1. It is mainly used to draw in the hot airflow that has absorbed heat from the heat dissipation fin array 4 inside the housing 1 through its own power, and then discharge the hot airflow to the air outlet channel 6.
[0031] Working principle: In this embodiment, when the liquid crystal display module 22 generates heat during operation, one end of the heat spreader 2 directly absorbs the heat from the liquid crystal display module 22 and, after uniform heat distribution, transfers the heat to the heat dissipation fin array 4 connected inside the housing 1. Next, the first centrifugal fan 7 on the right side of the housing 1 starts, drawing in external cold air through the air inlet channel 5 and directing it to the heat dissipation fin array 4. Then, as the cold air flows through the gaps between the fins, it fully exchanges heat with the fins, transforming into hot airflow. Further, the second centrifugal fan 8 on the left side of the housing 1 operates, drawing in the hot airflow and discharging it through the air outlet channel 6. Finally, the hot airflow is discharged from the housing 1 through the air outlet channel 6, forming a directional convection cycle of "cold absorption-heat exchange-heat dissipation".
[0032] In practical applications, the heat spreader 2 is connected to the housing 1 via the middle frame 3, ensuring the heat spreader 2 remains stable within the housing 1 and preventing displacement due to vibration of internal components or external forces. Next, the LCD module 22 is connected to the heat spreader 2, quickly and evenly distributing the heat generated by the LCD module 22 onto the heat spreader 2, fundamentally preventing localized high temperatures and improving the uneven temperature distribution of the LCD module 22. Then, the first centrifugal fan 7 on the right side of the housing 1, in conjunction with the air inlet channel 5, guides external air to the heat dissipation fin array 4 inside the housing 1, ensuring sufficient airflow contact with the fins to remove heat. Furthermore, the second centrifugal fan 8 on the left side of the housing 1, connected to the air outlet channel 6, quickly exhausts the hot airflow after passing through the heat dissipation fin array 4, forming a highly efficient directional convection heat dissipation path. Compared to traditional perforated ventilation structures, the air inlet channel 5 and air outlet channel 6 reduce airflow loss, optimize wind resistance, further improve heat transfer and exhaust efficiency, ensure long-term stable operation of the LCD module 22, and extend its service life.
[0033] In an optional embodiment, the heat spreader 2 and the middle frame 3 are integrally formed, and the heat spreader 2 and the middle frame 3 constitute a mounting cavity 9 for mounting the liquid crystal display module 22.
[0034] This embodiment provides a specific implementation of the heat spreader 2 and the middle frame 3. In this implementation, the heat spreader 2 and the middle frame 3 are integrally formed, creating a seamless overall structure. Simultaneously, based on the external dimensions and installation requirements of the LCD module 22, a suitable mounting cavity 9 is milled inside the integral structure to ensure that the back of the LCD module 22 can tightly seal against the inner wall of the heat spreader 2 after insertion. The integral forming completely eliminates the connection gap between the heat spreader 2 and the middle frame 3, simplifies the assembly process of the heat dissipation device and the LCD module 22, reduces the number of parts, improves production efficiency, and provides better sealing, enhanced overall structural rigidity, and improved resistance to deformation.
[0035] In an optional embodiment, the middle frame 3 is provided with a telescopic claw 10, which is used to fix the liquid crystal display module 22.
[0036] In this embodiment, a specific implementation of the middle frame 3 is provided. In this implementation, the middle frame 3 is provided with telescopic claws 10 for fixing the liquid crystal display module 22. When assembling the liquid crystal display module 22 into the mounting cavity 9, a pushing force is first applied along the inside of the telescopic claws 10, forcing the telescopic claws 10 to elastically deform inward and retract, providing space for the liquid crystal display module 22 to be embedded. Then, the liquid crystal display module 22 is placed into the mounting cavity 9. Then, the telescopic claws 10 are released, allowing the telescopic claws 10 to automatically reset due to elasticity, precisely engaging with the edge of the liquid crystal display module 22 to form a firm lock.
[0037] In practical applications, the mechanical locking achieved by the elastic deformation of the telescopic claw 10 can provide a stable and reliable fixation for the liquid crystal display module 22, effectively preventing the liquid crystal display module 22 from loosening or shifting under conditions such as vibration and impact, and ensuring the stability of use.
[0038] In an optional embodiment, the heat spreader 2 is provided with a thermally conductive gel layer 11; The thermally conductive gel layer 11 is disposed inside the mounting cavity 9; The liquid crystal display module 22 is connected to the heat spreader 2 through the thermally conductive gel layer 11.
[0039] This embodiment provides a specific implementation of the heat spreader 2, in which the heat spreader 2 is provided with a thermally conductive gel layer 11. This thermally conductive gel layer 11 can fully fill the tiny gaps between the liquid crystal display module 22 and the heat spreader 2, eliminating the air insulation layer, significantly reducing thermal resistance, and allowing the heat generated by the liquid crystal display module 22 to be quickly and evenly conducted to the heat spreader 2, significantly improving subsequent heat dissipation efficiency. Simultaneously, the flexible nature of the thermally conductive gel layer 11 provides a buffering effect to the connection, offsetting the impact of vibration or shock on the liquid crystal display module 22 and avoiding damage caused by rigid contact.
[0040] In an optional embodiment, the middle frame 3 is provided with positioning holes 12; The housing 1 is provided with a positioning pin 13 that matches the positioning hole 12; The middle frame 3 is connected to the housing 1 through the positioning hole 12 and the positioning pin 13.
[0041] This embodiment provides a specific implementation method for connecting the middle frame 3 and the housing 1. In this implementation method, the middle frame 3 is provided with a positioning hole 12, and the housing 1 is provided with a positioning pin 13 of matching size at the position of the positioning hole 12. During installation, the positioning pin 13 is aligned with the positioning hole 12, and an axial force is applied to the positioning pin 13 to make the pin fully embedded in the hole. The spatial positioning of the middle frame 3 and the housing 1 is achieved through the clearance fit between the hole and the pin. In practical applications, the positioning function of the positioning hole 12 and the positioning pin 13 can simplify the assembly process of the heat dissipation device, reduce adjustment time, and improve the production efficiency of the heat dissipation device.
[0042] In an optional embodiment, the first centrifugal fan 7 is provided with a first mounting chamber 14 and an air outlet 15; The first centrifugal fan 7 is installed inside the first installation chamber 14; The first installation chamber 14 is fixed to the right inner side of the housing 1 and connected to the air inlet channel 5; The air outlet 15 is located on the first mounting compartment 14 and faces the heat dissipation fin array 4.
[0043] This embodiment provides a specific implementation of a first centrifugal fan 7, in which the first centrifugal fan 7 is provided with a first mounting chamber 14 and an air outlet 15. When the first centrifugal fan 7, which is fixed inside the housing 1 through the first mounting chamber 14, is started, the internal impeller of the first centrifugal fan 7 rotates to generate negative pressure, which causes external cold air to be drawn into the first mounting chamber 14 through the air inlet channel 5. Then, the first mounting chamber 14 gathers the drawn-in airflow to avoid airflow dispersion and loss. Subsequently, the first centrifugal fan 7 blows the gathered airflow through the air outlet 15 on the first mounting chamber 14 toward the heat dissipation fin array 4 inside the housing 1, providing a concentrated airflow supply for heat exchange between the cold air and the heat dissipation fins.
[0044] In practical applications, placing the first centrifugal fan 7 inside the first mounting chamber 14 can buffer the mechanical vibration of the first centrifugal fan 7, thus achieving a certain noise reduction effect. Simultaneously, by placing the air outlet 15 on the first mounting chamber 14, facing the heat dissipation fin array 4, airflow can be accurately guided to the heat dissipation fin array 4, laying the foundation for subsequent hot airflow discharge.
[0045] In an optional embodiment, the second centrifugal fan 8 is provided with a second mounting chamber 16 and an exhaust port 17; The second centrifugal fan 8 is installed inside the second installation chamber 16; The second installation chamber 16 is fixed to the left inner side of the housing 1 and connected to the air outlet duct 6; The exhaust vent 17 is located on the second mounting compartment 16 and faces the heat dissipation fin array 4.
[0046] This embodiment provides a specific implementation of a second centrifugal fan 8, in which the second centrifugal fan 8 is provided with a second mounting chamber 16 and an exhaust port 17. When the second centrifugal fan 8, which is fixed inside the housing 1 by the second mounting chamber 16, is started, the internal impeller rotates at high speed to generate negative pressure. Then, this negative pressure, through the exhaust port 17 on the second mounting chamber 16 facing the heat dissipation fin array 4, draws in the hot airflow that has flowed through the heat dissipation fins and completed heat exchange inside the housing 1, ensuring that the hot airflow is directionally captured. Subsequently, the second centrifugal fan 8 discharges the hot airflow gathered in the second mounting chamber 16 to the air outlet channel 6 connected to the second mounting chamber 16, so that the hot airflow is discharged outside the housing 1.
[0047] In practical applications, the second centrifugal fan 8 is fixed in the second mounting chamber 16 to prevent it from shaking or shifting during operation. It also precisely connects to the air outlet duct 6, regulating the flow of hot air to ensure efficient heat dissipation. Furthermore, the second mounting chamber 16 buffers the mechanical vibration of the fan and the noise of airflow turbulence, providing a certain degree of noise reduction and weakening the operating noise of the heat dissipation device. The suction action of the second centrifugal fan 8 through the exhaust port 17 and the air delivery action of the first centrifugal fan 7 on the right side through the exhaust port 15 form an efficient convection coordination, further perfecting the complete heat dissipation cycle of "cooling absorption-heat exchange-heat dissipation," thereby ensuring the rapid removal of heat from the casing 1 and ensuring the stable operation of the heat dissipation device.
[0048] In an optional embodiment, the housing 1 is provided with a first magnetic dustproof mesh 18 and a second magnetic dustproof mesh 19; The first magnetic dustproof net 18 is installed at the entrance of the air inlet channel 5; The second magnetic dustproof net 19 is installed at the outlet of the air outlet 6.
[0049] This embodiment provides a specific implementation of the housing 1. In this implementation, the housing 1 is provided with a first magnetic dustproof mesh 18 and a second magnetic dustproof mesh 19. By placing the first magnetic dustproof mesh 18 at the entrance of the air inlet channel 5 and the second magnetic dustproof mesh 19 at the exit of the air outlet channel 6, dust and impurities in the outside air can be efficiently intercepted, preventing them from entering the housing 1 with the airflow. This prevents dust accumulation on the heat dissipation fin array 4 from affecting heat exchange efficiency and also reduces operational malfunctions caused by dust adhering to the inside of the first centrifugal fan 7 and the second centrifugal fan 8, ensuring stable operation of the core heat dissipation components. At the same time, the magnetic installation design requires no tools; the dustproof mesh and housing 1 can be tightly attached using only magnetic force. This avoids the cumbersome disassembly and assembly of traditional screw fixing and ensures a seamless connection between the dustproof mesh and the channel opening without any dust leakage gaps. When cleaning, it can be removed with a gentle pull, greatly improving the convenience of maintenance, and does not affect the smooth airflow of the air inlet channel 5 and the air outlet channel 6. While effectively preventing dust, it provides a stable guarantee for the "cooling and heat dissipation" cycle of the heat dissipation device.
[0050] In an optional embodiment, a controller 20 is provided on the housing 1, and the controller 20 is electrically connected to the heat spreader 2, the first centrifugal fan 7 and the second centrifugal fan 8.
[0051] In this embodiment, another specific implementation of the housing 1 is provided. In this implementation, a controller 20 is provided on the housing 1. The controller 20 collects the temperature signal of the heat spreader 2 in real time through electrical connection and compares and analyzes the collected temperature data with the internal preset temperature threshold. When the temperature is lower than the threshold, the controller 20 can control the first centrifugal fan 7 and the second centrifugal fan 8 to shut down or maintain low-speed operation to reduce energy consumption. When the temperature is higher than the threshold, the controller 20 immediately sends control commands to the two centrifugal fans to start or increase the fan speed synchronously, ensuring that the first centrifugal fan 7 efficiently draws in cold air and the second centrifugal fan 8 quickly discharges hot air, forming strong convection.
[0052] In practical applications, the controller 20 achieves real-time temperature monitoring and dynamic control of the fan through electrical connection, allowing the heat dissipation system to operate on demand, ensuring the heat dissipation efficiency of the heat dissipation device and avoiding energy waste.
[0053] In an optional embodiment, the heat spreader 2 is provided with a temperature sensor 21, which is electrically connected to the controller 20.
[0054] In this embodiment, another specific implementation of the heat spreader 2 is provided. In this implementation, the heat spreader 2 is equipped with a temperature sensor 21, which is electrically connected to the controller 20. The temperature sensor 21 can directly capture the real-time temperature of the heat spreader 2 and transmit the data to the controller 20 in real time. This allows the controller 20 to quickly identify the temperature change trend and control the speed of the first centrifugal fan 7 and the second centrifugal fan 8. This timely adjustment of the heat dissipation power effectively prevents the LCD module 22 from being damaged due to overheating and also reduces unnecessary energy consumption of the heat dissipation device, ensuring a dynamic balance between high efficiency and energy saving in the heat dissipation device.
[0055] It should be noted that the above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A high-efficiency heat dissipation device for a liquid crystal display module, characterized in that, include: The casing, heat spreader, middle frame, heat dissipation fin array, air inlet channel, air outlet channel, first centrifugal fan and second centrifugal fan; The heat spreader is connected to the housing via the middle frame; One end of the heat spreader is connected to the liquid crystal display module; The heat dissipation fin array is located inside the housing and is connected to the other end of the heat spreader. The air inlet channel, the air outlet channel, the first centrifugal fan, and the second centrifugal fan are disposed inside the housing; The first centrifugal fan and the air inlet channel are located on the right side of the housing. The air inlet channel is connected to the first centrifugal fan. The first centrifugal fan is used to draw outside air into the housing through the air inlet channel and guide it to the heat dissipation fin array. The second centrifugal fan and the air outlet channel are located on the left side of the housing. The second centrifugal fan is connected to the air outlet channel. The second centrifugal fan is used to draw in the airflow that flows through the heat dissipation fin array inside the housing and discharge it to the air outlet channel.
2. The high-efficiency heat dissipation device according to claim 1, characterized in that, The heat spreader and the middle frame are integrally formed, and the heat spreader and the middle frame form a mounting cavity for mounting the liquid crystal display module.
3. The high-efficiency heat dissipation device according to claim 2, characterized in that, The middle frame is provided with telescopic claws, which are used to fix the liquid crystal display module.
4. The high-efficiency heat dissipation device according to claim 3, characterized in that, The heat spreader is provided with a thermally conductive gel layer; The thermally conductive gel layer is disposed inside the mounting cavity; The liquid crystal display module is connected to the heat spreader through the thermally conductive gel layer.
5. The high-efficiency heat dissipation device according to claim 4, characterized in that, The middle frame is provided with positioning holes; The housing is provided with a positioning pin that matches the positioning hole; The middle frame is connected to the housing through the positioning hole and the positioning pin.
6. The high-efficiency heat dissipation device according to claim 5, characterized in that, The first centrifugal fan is equipped with a first installation chamber and an air outlet; The first centrifugal fan is installed inside the first installation chamber; The first mounting compartment is fixed to the right inner side of the housing and connected to the air inlet channel; The air outlet is located on the first mounting compartment and faces the heat dissipation fin array.
7. The high-efficiency heat dissipation device according to claim 6, characterized in that, The second centrifugal fan is equipped with a second installation chamber and an exhaust port; The second centrifugal fan is installed inside the second installation chamber; The second installation compartment is fixed to the left inner side of the housing and connected to the air outlet duct; The exhaust vent is located on the second mounting compartment and faces the heat dissipation fin array.
8. The high-efficiency heat dissipation device according to claim 7, characterized in that, The housing is provided with a first magnetic dustproof mesh and a second magnetic dustproof mesh; The first magnetic dustproof net is installed at the entrance of the air inlet channel; The second magnetic dustproof net is installed at the outlet of the air outlet channel.
9. The high-efficiency heat dissipation device according to claim 1, characterized in that, A controller is provided on the housing, and the controller is electrically connected to the heat spreader, the first centrifugal fan and the second centrifugal fan.
10. The high-efficiency heat dissipation device according to claim 9, characterized in that, The heat spreader is equipped with a temperature sensor, which is electrically connected to the controller.