A memory card device
By linking the outer casing module and the chip module, and utilizing the card slot and spring return force, the problem of difficult disassembly and maintenance of the memory card device is solved, enabling quick disassembly and convenient maintenance, and improving structural stability and safety.
Patent Information
- Application Number
- CN202521400314.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-04
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-07-04
AI Technical Summary
The existing memory card device has a one-piece casing, which is difficult to disassemble and repair, making it inconvenient to inspect the main chip.
The design incorporates a linked shell module and chip module, with slots and blocks facilitating easy assembly and disassembly. Spring return force allows for quick separation of the top cover and bottom plate, while the limiting rod and bump structure facilitate the disassembly and maintenance of the main chip.
It enables quick disassembly and assembly of memory card devices and convenient maintenance, improving structural stability and security.
Smart Images

Figure CN224682656U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of memory card technology, and specifically relates to a memory card device. Background Technology
[0002] Memory cards are used to store information and have a wide range of applications. Many memory card devices are protected by a casing, and many existing casings are unibody structures. This structure makes it difficult to disassemble and repair, and in the event of a malfunction, it is difficult to repair the main chip inside.
[0003] Therefore, further improvements are needed to address the aforementioned issues. Utility Model Content
[0004] The main purpose of this utility model is to provide a memory card device that is linked by a shell module and a chip module, and is easy to disassemble and assemble through a card slot and a card block. When the bottom plate and the top cover are disassembled, the spring return force quickly separates the two, which is convenient for maintenance. It has the advantages of stable structure, high safety and high practicality.
[0005] To achieve the above objectives, this utility model provides a memory card device, including a housing module and a chip module, wherein the chip module is built into the housing module, wherein:
[0006] The outer casing module includes a base plate and a top cover. The base plate is provided with a first slot, a second slot, a third slot, a fourth slot, a chip placement slot, and a flip cover. The chip placement slot is provided with an installation rod on one side and a fifth slot and a sixth slot on the other side. The flip cover is provided with a plurality of sleeves on one side and a first limiting rod and a second limiting rod on the other side. The sleeves are fitted onto the installation rods. The first limiting rod is installed in the fifth slot and the second limiting rod is installed in the sixth slot.
[0007] The upper cover is provided with a first locking block, a second locking block, a third locking block, a fourth locking block, a plurality of connection end placement holes, and a plurality of first heat dissipation holes; the first locking block is installed in the first slot, the second locking block is installed in the second slot, the third locking block is installed in the third slot, and the fourth locking block is installed in the fourth slot;
[0008] The chip module includes a main storage chip and a connection unit. The main storage chip is installed between the chip placement slot and the flip cover, and the connection unit is electrically connected to the main storage chip. The connection unit is provided with a plurality of connection ends, and the connection ends are installed in the connection end placement holes.
[0009] As a further preferred embodiment of the above technical solution, the outer casing module is further provided with a first spring, a second spring, a third spring, and a fourth spring. The first spring, the second spring, the third spring, and the fourth spring are located between the bottom plate and the top cover, and the chip placement slot is located between the first spring, the second spring, the third spring, and the fourth spring (so that when disassembling for maintenance, the top cover and the bottom plate can be quickly separated due to the restoring force of the compression spring).
[0010] As a further preferred embodiment of the above technical solution, the first limiting rod is provided with a first protrusion and the first protrusion is installed in the fifth slot, and the second limiting rod is provided with a second protrusion and the second protrusion is installed in the sixth slot.
[0011] As a further preferred embodiment of the above technical solution, the flip cover is also provided with a number of second heat dissipation holes.
[0012] As a further preferred technical solution to the above technical solution, the first heat dissipation hole and the second heat dissipation hole are aligned one by one (to facilitate heat dissipation of the main storage chip). Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of a memory card device according to the present invention.
[0014] Figure 2 This is a schematic diagram of the structure of a memory card device according to the present invention.
[0015] Figure 3 This is a schematic diagram of the chip placement slot of a memory card device according to this utility model.
[0016] Figure 4 This is a schematic diagram of the chip placement slot of a memory card device according to this utility model.
[0017] Figure 5 This is a schematic diagram of the flip cover structure of a memory card device according to this utility model.
[0018] The reference numerals in the attached drawings include: 100, outer casing module; 110, base plate; 111, first slot; 112, second slot; 113, third slot; 114, fourth slot; 115, chip placement slot; 1151, mounting rod; 1152, fifth slot; 1153, sixth slot; 116, flip cover; 1161, first limiting rod; 1162, second limiting rod; 1163, sleeve; 1164, first protrusion; 1165, [missing information - likely a typo, should be "first protrusion"]. Two protrusions; 1166, second heat dissipation hole; 120, top cover; 121, first locking block; 122, second locking block; 123, third locking block; 124, fourth locking block; 125, connection end placement hole; 126, first heat dissipation hole; 130, first spring; 140, second spring; 150, third spring; 160, fourth spring; 200, chip module; 210, main storage chip; 220, connection unit; 221, connection end. Detailed Implementation
[0019] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.
[0020] This utility model discloses a memory card device. The specific embodiments of the utility model will be further described below with reference to preferred embodiments.
[0021] In the embodiments of this utility model, those skilled in the art will note that the main storage chip and the like involved in this utility model can be considered as prior art.
[0022] Preferred embodiment.
[0023] like Figure 1-5 As shown, this utility model discloses a memory card device, including a housing module 100 and a chip module 200, wherein the chip module 200 is built into the housing module 100, wherein:
[0024] The outer casing module 100 includes a base plate 110 and a top cover 120. The base plate 110 is provided with a first slot 111, a second slot 112, a third slot 113, a fourth slot 114, a chip placement slot 115, and a flip cover 116. The chip placement slot 115 is provided with a mounting rod 1151 on one side and a fifth slot 1152 and a sixth slot 1153 on the other side. The flip cover 116 is provided with a plurality of sleeves 1161 on one side and a first limiting rod 1162 and a second limiting rod 1163 on the other side. The sleeves 1161 are sleeved on the mounting rods 1151. The first limiting rod 1162 is installed in the fifth slot 1152 and the second limiting rod 1163 is installed in the sixth slot 1153.
[0025] The upper cover 120 is provided with a first locking block 121, a second locking block 122, a third locking block 123, a fourth locking block 124, a plurality of connecting end placement holes 125, and a plurality of first heat dissipation holes 126; the first locking block 121 is installed in the first locking slot 111, the second locking block 122 is installed in the second locking slot 112, the third locking block 123 is installed in the third locking slot 113, and the fourth locking block 124 is installed in the fourth locking slot 114;
[0026] The chip module 200 includes a main storage chip 210 and a connection unit 220. The main storage chip 210 is installed between the chip placement slot 115 and the flip cover 116, and the connection unit 220 is electrically connected to the main storage chip 210. The connection unit 220 is provided with a plurality of connection ends 221, and the connection ends 221 are installed in the connection end placement holes 125.
[0027] Specifically, the outer casing module 100 is further provided with a first spring 130, a second spring 140, a third spring 150, and a fourth spring 160. The first spring 130, the second spring 140, the third spring 150, and the fourth spring 160 are located between the bottom plate 110 and the top cover 120, and the chip placement slot 115 is located between the first spring 130, the second spring 140, the third spring 150, and the fourth spring 160 (so that when disassembling for maintenance, the top cover and the bottom plate can be quickly separated due to the restoring force of the compression springs).
[0028] More specifically, the first limiting rod 1162 is provided with a first protrusion 1164 and the first protrusion 1164 is installed in the fifth slot 1152, and the second limiting rod 1163 is provided with a second protrusion 1165 and the second protrusion 1165 is installed in the sixth slot 1153.
[0029] Furthermore, the flip cover 116 is also provided with a number of second heat dissipation holes 1166.
[0030] Furthermore, the first heat dissipation hole 126 and the second heat dissipation hole 1166 are aligned one-to-one (to facilitate heat dissipation of the main storage chip).
[0031] Regarding this utility model:
[0032] When disassembly is required, simply disengage the top cover from the bottom plate's slot and use the spring to quickly remove the top cover. Then, disengage the flip cover's protrusion from the chip placement slot's slot so that the flip cover's sleeve can rotate around the chip placement slot's mounting rod, allowing the main storage chip to be removed for inspection. Disassembly and assembly are quick and convenient.
[0033] It is worth mentioning that the technical features such as the main storage chip involved in this utility model patent application should be regarded as prior art. The specific structure, working principle, and possible control methods and spatial arrangement of these technical features can be adopted using conventional choices in the field, and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated in detail.
[0034] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A memory card device, characterized by comprising: It includes a housing module and a chip module, wherein the chip module is built into the housing module, wherein: The outer casing module includes a base plate and a top cover. The base plate is provided with a first slot, a second slot, a third slot, a fourth slot, a chip placement slot, and a flip cover. The chip placement slot is provided with an installation rod on one side and a fifth slot and a sixth slot on the other side. The flip cover is provided with a plurality of sleeves on one side and a first limiting rod and a second limiting rod on the other side. The sleeves are fitted onto the installation rods. The first limiting rod is installed in the fifth slot and the second limiting rod is installed in the sixth slot. The upper cover is provided with a first locking block, a second locking block, a third locking block, a fourth locking block, a plurality of connection end placement holes, and a plurality of first heat dissipation holes; the first locking block is installed in the first slot, the second locking block is installed in the second slot, the third locking block is installed in the third slot, and the fourth locking block is installed in the fourth slot; The chip module includes a main storage chip and a connection unit. The main storage chip is installed between the chip placement slot and the flip cover, and the connection unit is electrically connected to the main storage chip. The connection unit is provided with a plurality of connection ends, and the connection ends are installed in the connection end placement holes.
2. The memory card apparatus according to claim 1, wherein The outer casing module is further provided with a first spring, a second spring, a third spring, and a fourth spring. The first spring, the second spring, the third spring, and the fourth spring are located between the base plate and the top cover, and the chip placement slot is located between the first spring, the second spring, the third spring, and the fourth spring.
3. The memory card apparatus according to claim 2, wherein The first limiting rod has a first protrusion and the first protrusion is installed in the fifth slot, and the second limiting rod has a second protrusion and the second protrusion is installed in the sixth slot.
4. The memory card apparatus according to claim 3, wherein The flip cover also has several second heat dissipation holes.
5. The memory card apparatus according to claim 4, wherein The first heat dissipation hole and the second heat dissipation hole are aligned one to one.