An inlayed chip logo
The design of the snap-fit components for the bottom and top layers solves the problems of harmful substance emission caused by adhesive bonding and inconvenience in chip replacement, enabling convenient chip installation and maintenance.
Patent Information
- Application Number
- CN202521637941.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-04
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-04
AI Technical Summary
The current method of bonding chips in electronic tags uses glue, which leads to the release of harmful substances and makes chip replacement or repair inconvenient.
It adopts a bottom layer and top layer design, and realizes the installation and removal of chips through snap-fit components, reducing the use of glue. It uses snap-fit blocks and snap-fit components to realize the assembly and disassembly of the bottom layer and top layer.
It enables glue-free installation, simplifies chip replacement and repair processes, and avoids the release of harmful substances.
Smart Images

Figure CN224682658U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of trademarks, specifically, it relates to an embedded chip trademark. Background Technology
[0002] Electronic tags are also known as radio frequency tags, transponders, and data carriers; readers are also known as reading devices, scanners, reading heads, communicators, and reader-writers (depending on whether the electronic tag can wirelessly rewrite data). The electronic tag and the reader achieve spatial (contactless) coupling of radio frequency signals through coupling elements; within the coupling channel, energy transfer and data exchange are achieved according to timing relationships.
[0003] Most existing electronic tags typically have chips set in two layers, which are usually bonded together with glue. The glue can release harmful substances, and it is not easy to remove the glued layer when the chip is damaged and needs to be replaced or repaired.
[0004] In view of this, this utility model is proposed. Utility Model Content
[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an embedded chip trademark, which solves the problems mentioned in the background art.
[0006] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:
[0007] An embedded chip trademark includes: a base layer and a cover layer, wherein an RFID chip is disposed in the base layer;
[0008] Two opposing fixing rods are fixedly connected to one side of the cover layer. Each of the two fixing rods has a locking block at one end. Two placement slots are opened on one side of the bottom layer. Each of the two placement slots is equipped with a locking component that cooperates with the two locking blocks. A pressing rod that cooperates with the two locking components is provided on one side of the bottom layer.
[0009] Optionally, both placement slots have a fixing slot on their lower sides. The snap-fit assembly includes a stop block, and a connecting rod is provided on one side of the stop block. The connecting rod is elastically fitted in the fixing slot. The stop block and the snap-fit block are snapped together. The cross-section of the snap-fit block and the stop block are both triangular. The connecting rod cooperates with the pressing rod.
[0010] Optionally, the bottom layer has an inner cavity that penetrates the two fixing grooves. Two L-shaped rods that are fixedly connected to the two connecting rods are slidably fitted in the inner cavity. Each of the two L-shaped rods has a pressing groove on one side. A concave rod that mates with the two pressing grooves is slidably fitted in the inner cavity. One side of the concave rod is fixedly connected to the pressing rod.
[0011] Optionally, both ends of the two extrusion grooves and the concave rod are provided with mutually cooperating inclined surfaces.
[0012] Optionally, a positioning groove is provided on one side of the bottom layer, the RFID chip is located in the positioning groove, and a positioning block corresponding to the RFID chip is provided on one side of the cover layer.
[0013] Optionally, positioning holes are provided at the corners of the bottom layer, and positioning posts corresponding to the four positioning holes are fixedly connected to one side of the cover layer.
[0014] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all of the following advantages at the same time:
[0015] By using two snap-fit components on the bottom layer to snap into two snap-fit blocks on the top layer, the bottom and top layers can be assembled, and the RFID chip can be installed between the bottom and top layers, reducing the harm of glue bonding. By pressing the push rod, the two snap-fit components on the bottom layer can be disengaged from the two snap-fit blocks on the top layer, making it easy to disassemble the bottom and top layers, thereby facilitating the replacement or repair of the RFID chip.
[0016] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description
[0017] The accompanying drawings described below are merely some embodiments. Those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:
[0018] Figure 1 This is a schematic diagram of the chip trademark structure;
[0019] Figure 2 This is a schematic diagram of the positioning column structure;
[0020] Figure 3 for Figure 2 Schematic diagram of the structure at point A in the middle;
[0021] Figure 4 This is a schematic diagram of the stop block structure;
[0022] Figure 5 for Figure 4 Schematic diagram of the structure at point B.
[0023] The attached diagram lists the components represented by each number as follows:
[0024] Bottom layer 1, cover layer 2, RFID chip 3, fixing rod 8, card block 9, placement slot 10, stop block 11, fixing slot 12, connecting rod 13, inner cavity 14, L-shaped rod 15, pressing rod 16, concave rod 17, extrusion groove 18, positioning hole 19, positioning post 20, positioning groove 21, positioning block 22.
[0025] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation
[0026] The present invention will now be described in further detail with reference to the accompanying drawings.
[0027] Please see Figure 1-5 As shown, this embodiment provides an embedded chip trademark, including: a bottom layer 1 and a cover layer 2, wherein an RFID chip 3 is disposed in the bottom layer 1;
[0028] Two opposing fixing rods 8 are fixedly connected to one side of the cover layer 2. Each of the two fixing rods 8 has a locking block 9 at one end. Two placement slots 10 are opened on one side of the bottom layer 1. Each of the two placement slots 10 has a locking component that cooperates with the two locking blocks 9. A pressing rod 16 that cooperates with the two locking components is provided on one side of the bottom layer 1.
[0029] By using two snap-fit components on the bottom layer 1, it can snap-fit with two snap-fit blocks 9 on the cover layer 2, allowing the bottom layer 1 and the cover layer 2 to be assembled. This allows the RFID chip 3 to be installed between the bottom layer 1 and the cover layer 2, reducing the harm of glue bonding. By pressing the pressing rod 16, the two snap-fit components on the bottom layer 1 can be disengaged from the two snap-fit blocks 9 on the cover layer 2, making it easy to disassemble the bottom layer 1 and the cover layer 2, thereby facilitating the replacement or repair of the RFID chip 3.
[0030] like Figure 3-5 As shown, in this embodiment, both placement slots 10 have a fixing slot 12 on their lower sides. The snap-fit assembly includes a stop block 11, and a connecting rod 13 is provided on one side of the stop block 11. The connecting rod 13 is elastically fitted in the fixing slot 12. The stop block 11 and the snap-fit block 9 are snapped together, and the cross-sections of the snap-fit block 9 and the stop block 11 are both triangular. The connecting rod 13 is fitted with the pressing rod 16. The bottom layer 1 has an inner cavity 14 that penetrates the two fixing slots 12. Two L-shaped rods 15 that are fixedly connected to the two connecting rods 13 are slidably fitted in the inner cavity 14. Each of the two L-shaped rods 15 has a pressing slot 18 on one side. A concave rod 17 that is fitted with the two pressing slots 18 is slidably fitted in the inner cavity 14. One side of the concave rod 17 is fixedly connected to the pressing rod 16. Both ends of the two pressing slots 18 and the concave rod 17 have mutually fitted inclined surfaces.
[0031] When assembling the bottom layer 1 and the top layer 2, the bottom layer 1 and the top layer 2 are pressed together. The second fireproof plate 2 drives the fixing rod 8 to move. The movement of the fixing rod 8 drives the locking block 9 to move. The locking block 9 moves into the placement groove 10. The movement of the locking block 9 presses the triangular inclined surface of the stop block 11 through the triangular inclined surface. The stop block 11 is pressed back into the fixing groove 12. When the locking block 9 moves completely into the placement groove 10, the stop block 11 engages with the locking block 9 through elasticity, so that the RFID chip 3 can be installed between the bottom layer 1 and the top layer 2.
[0032] When disassembling the bottom layer 1 and the cover layer 2, press the pressing rod 16. The pressing rod 16 drives the concave rod 17 to move. The movement of the concave rod 17 drives the two L-shaped rods 15 to move relative to each other through the inclined surface of the pressing groove 18. The relative movement of the two L-shaped rods 15 drives the two stop blocks 11 to move relative to each other. The relative movement of the two stop blocks 11 drives the two connecting rods 13 to move. The movement of the two connecting rods 13 drives the two stop blocks 11 to move relative to each other. The relative movement of the two stop blocks 11 releases the engagement with the two locking blocks 9, making it easier to disassemble the bottom layer 1 and the cover layer 2, thereby facilitating the replacement or repair of the RFID chip 3.
[0033] like Figure 2 As shown, a positioning groove 21 is provided on one side of the bottom layer 1 in this embodiment, and the RFID chip 3 is located in the positioning groove 21. A positioning block 22 corresponding to the RFID chip 3 is provided on one side of the cover layer 2. The positioning block 22 can fix the RFID chip 3 in the positioning groove 21, reducing the possibility of misalignment of the RFID chip 3.
[0034] like Figure 1 As shown, in this embodiment, positioning holes 19 are provided at the corners of the bottom layer 1. Positioning posts 20 corresponding to the four positioning holes 19 are fixedly connected to one side of the cover layer 2. The four positioning posts 20 enter the positioning holes 19, which reduces the possibility of misalignment between the bottom layer 1 and the cover layer 2 during installation.
[0035] This utility model is not limited to the above-described embodiments. Anyone should know that structural changes made under the guidance of this utility model, and any technical solutions that are the same as or similar to this utility model, fall within the protection scope of this utility model. Technical aspects, shapes, and structures not described in detail in this utility model are all publicly known technologies.
Claims
1. An embedded chip trademark, characterized in that, include: The bottom layer (1) and the cover layer (2) are provided with an RFID chip (3) in the bottom layer (1); Two opposing fixing rods (8) are fixedly connected to one side of the cover layer (2). Each of the two fixing rods (8) has a locking block (9) at one end. Two placement slots (10) are opened on one side of the bottom layer (1). Each of the two placement slots (10) has a locking component that cooperates with the two locking blocks (9). A pressing rod (16) that cooperates with the two locking components is provided on one side of the bottom layer (1).
2. The embedded chip trademark according to claim 1, characterized in that, Both of the placement slots (10) have a fixing slot (12) on their lower sides. The snap-fit assembly includes a stop block (11). A connecting rod (13) is provided on one side of the stop block (11). The connecting rod (13) is elastically fitted in the fixing slot (12). The stop block (11) and the snap-fit block (9) snap-fit each other. The cross-section of the snap-fit block (9) and the stop block (11) are both triangular. The connecting rod (13) cooperates with the pressing rod (16).
3. The embedded chip trademark as described in claim 2, characterized in that, The bottom layer (1) has an inner cavity (14) that penetrates the two fixed grooves (12). The inner cavity (14) has two L-shaped rods (15) that are fixedly connected to the two connecting rods (13). Each of the two L-shaped rods (15) has a squeezing groove (18) on one side. The inner cavity (14) has a concave rod (17) that cooperates with the two squeezing grooves (18). One side of the concave rod (17) is fixedly connected to the pressing rod (16).
4. The embedded chip trademark according to claim 3, characterized in that, Both ends of the two extrusion grooves (18) and the concave rod (17) are provided with mutually cooperating inclined surfaces.
5. The embedded chip trademark according to claim 1, characterized in that, The bottom layer (1) has a positioning groove (21) on one side, the RFID chip (3) is located in the positioning groove (21), and the cover layer (2) has a positioning block (22) corresponding to the RFID chip (3) on one side.
6. The embedded chip trademark according to claim 1, characterized in that, The bottom layer (1) has positioning holes (19) at each corner, and the cover layer (2) has positioning posts (20) corresponding to the four positioning holes (19) fixedly connected to one side.