Grounding wafers for domain controllers, domain controllers, and movable platforms

Abstract

Grounding spring for domain controller, domain controller and movable platform, the domain controller comprises a shell and a printed circuit board arranged in the shell, the printed circuit board is provided with a connector and a copper exposed area, the grounding spring comprises a connecting portion capable of being arranged on the shell, and a first cantilever and a second cantilever are formed in extension by the connecting portion, the number of the first cantilever is not less than the number of the connector, so that at least one first cantilever can be abutted on each connector, and the second cantilever can be abutted on the copper exposed area.The grounding spring provided by the utility model can be directly arranged on the shell, in the assembling process of the shell and the printed circuit board, the first cantilever replaces the plurality of conductive foam in the prior art, and the second cantilever replaces the plurality of upper springs in the prior art which are welded on the printed circuit board through SMT, so that the overall structure and the assembling process of the domain controller can be simplified, and the manufacturing cost of the domain controller is also reduced.

Description

Technical Field

[0001] This utility model relates to the field of domain controller manufacturing, and more particularly to a grounding spring for a domain controller, as well as a domain controller and a mobile platform with good electromagnetic compatibility. Background Technology

[0002] Electromagnetic compatibility (EMC) of domain controllers (or electronic devices) directly affects their operational stability. A crucial aspect of EMC design is shielding, which effectively suppresses electromagnetic interference within and between systems.

[0003] like Figure 1 As shown, traditional EMC design involves soldering springs onto both sides of a printed circuit board (PCB) using surface-mount technology (SMT). The upper spring contacts the upper housing, and the lower spring contacts the lower housing. Conductive foam is also filled between the connector and the upper (or lower) housing to provide a low-resistivity magnetic path for interfering magnetic fields, thus shunting them. However, this approach requires multiple upper and lower springs, and conductive foam must be filled between each connector and the upper (or lower) housing, resulting in higher material costs and a more complex manufacturing process.

[0004] like Figure 2 As shown, Chinese utility model patent CN221828283U discloses a double-sided grounding spring, a grounding PCB module, and an on-board controller. The double-sided grounding spring 10 includes a mounting portion 100 for connecting the spring as a whole to the PCB motherboard, and a first elastic grounding portion 200 and a second elastic grounding portion 300 connected to the mounting portion 100 and protruding from both sides of the mounting portion 100. The first elastic grounding portion 200 is used to achieve conductive grounding between the PCB motherboard and adjacent components on one side of the PCB motherboard, and the second elastic grounding portion 300 is used to achieve conductive grounding between the PCB motherboard and adjacent components on the other side of the PCB motherboard. The disadvantage of this solution is that the double-sided grounding spring 10 only connects the PCB motherboard to adjacent components on both sides, without considering the grounding of connectors on the PCB motherboard, resulting in imperfect EMC design. Furthermore, the double-sided grounding spring 10 needs to be installed on the PCB motherboard first to form a grounding PCB module, and then the grounding PCB module is assembled with other components. The complex shape of the double-sided grounding spring 10 makes the manufacturing process complex and is not conducive to automated production line assembly. Utility Model Content

[0005] In view of the deficiencies existing in the prior art, the first aspect of this utility model provides a grounding spring for a domain controller, the domain controller including a housing and a printed circuit board disposed in the housing, the printed circuit board having connectors and exposed copper areas, the grounding spring comprising:

[0006] A connecting portion that can be provided on the housing; and

[0007] A first cantilever and a second cantilever extending from the connection portion, wherein the number of the first cantilever is not less than the number of the connectors, such that at least one first cantilever can abut on each of the connectors, and the second cantilever can abut on the exposed copper area.

[0008] In some embodiments of this utility model, a first positioning feature is formed on the housing, and a second positioning feature is formed on the connecting portion. The first positioning feature and the second positioning feature can be combined to define the position of the grounding spring in the housing.

[0009] In some embodiments of this utility model, one of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

[0010] In some embodiments of this utility model, the connecting part is bent to form an overlapping end, and a rib is formed on the housing so that after the first positioning feature and the second positioning feature are combined with each other, the overlapping end can just overlap the rib, and the first cantilever and the second cantilever are located on both sides of the rib.

[0011] In some embodiments of this utility model, the first cantilever and / or the second cantilever are articulated arms.

[0012] A second aspect of this utility model provides a domain controller, comprising:

[0013] case;

[0014] A printed circuit board with connectors disposed within the housing, the printed circuit board having exposed copper areas; and

[0015] A grounding spring is provided on the housing with a connecting portion, the connecting portion extending to form a first cantilever and a second cantilever, the number of the first cantilever being not less than the number of the connectors, such that at least one first cantilever abuts on each connector, and the second cantilever abuts on the exposed copper area.

[0016] In some embodiments of this utility model, a first positioning feature is formed on the housing, and a second positioning feature is formed on the connecting portion. The first positioning feature and the second positioning feature can be combined to define the position of the grounding spring in the housing.

[0017] In some embodiments of this utility model, one of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

[0018] In some embodiments of this utility model, a limiting portion is formed on the first positioning feature or the second positioning feature to prevent the grounding spring from disengaging from the housing.

[0019] In some embodiments of this utility model, the limiting part is formed by cold riveting, hot deformation, welding, or adhesive curing.

[0020] In some embodiments of this utility model, the housing includes a first housing and a second housing that are fixedly connected to each other. The grounding spring is disposed on the first housing. The exposed copper area is formed on the first side of the printed circuit board. An empty pad is formed on the second side of the printed circuit board. An SMT spring is disposed on the empty pad. The SMT spring abuts against the second housing. The first side and the second side are opposite sides of the printed circuit board.

[0021] A third aspect of this invention provides a mobile platform comprising: any of the domain controllers described above.

[0022] The grounding spring provided by this invention can be directly mounted on the housing. During the assembly process between the housing and the printed circuit board, the first cantilever abuts against the connector, and the second cantilever abuts against the exposed copper area. In other words, the first cantilever of the grounding spring replaces multiple conductive foams in the prior art, and the second cantilever replaces multiple upper springs soldered to the printed circuit board via SMT in the prior art, thereby simplifying the overall structure and assembly process of the domain controller. The material cost of a single grounding spring is far lower than that of conductive foam and SMT springs, significantly reducing the manufacturing cost of the domain controller. Attached Figure Description

[0023] Figure 1 A schematic diagram of the EMC design of an electronic device in the prior art;

[0024] Figure 2 This is a schematic diagram of the structure of a double-sided grounding spring used in a grounding PCB board module in the prior art;

[0025] Figure 3 A schematic diagram of the domain controller provided by this utility model;

[0026] Figure 4 for Figure 3 A schematic diagram of the structure of the first housing shown;

[0027] Figure 5 for Figure 3 The diagram shows the structure of the grounding spring.

[0028] Figure 6 for Figure 3 A schematic diagram of the printed circuit board structure shown (first side);

[0029] Figure 7 for Figure 6 A schematic diagram of the printed circuit board structure shown (second side);

[0030] Figure 8 A schematic diagram of a grounding spring clip installed on the first housing.

[0031] Figure 9 for Figure 3 A partial cross-sectional view of the domain controller shown;

[0032] Figure 10 A flowchart of a manufacturing method for the first domain controller provided by this utility model;

[0033] Figure 11 A flowchart of a manufacturing method for the second type of domain controller provided by this utility model;

[0034] Figure 12 A flowchart of a method for manufacturing a third type of domain controller provided by this utility model;

[0035] Figure 13 A flowchart illustrating the manufacturing method of the fourth domain controller provided by this utility model.

[0036] Explanation of reference numerals in the attached figures:

[0037] Domain controller 100;

[0038] Housing 10; First housing 10a; Second housing 10b; First positioning feature 11; Protruding rib 12; Limiting part 13;

[0039] 20 Printed circuit board; 21 Connector; 22 Exposed copper area; 23 Unused pads;

[0040] Grounding spring 30; connecting part 31; first cantilever 32; second cantilever 33; second positioning feature 34; overlapping end 35;

[0041] SMT spring sheet 40;

[0042] Fastener 50. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0044] like Figure 3-9 As shown, one embodiment of the present invention provides a grounding spring 30 for a domain controller 100. The domain controller 100 includes a housing 10 and a printed circuit board 20 disposed in the housing 10. The printed circuit board 20 is provided with connectors 21 and exposed copper areas 22. The grounding spring 30 includes a connecting portion 31 that can be disposed on the housing 10, and a first cantilever 32 and a second cantilever 33 that extend from the connecting portion 31. The number of first cantilever 32 is not less than the number of connectors 21, so that at least one first cantilever 32 can be abutted on each connector 21, and the second cantilever 33 can abut on the exposed copper areas 22.

[0045] For example, the printed circuit board 20 can be a blank PCB board, or a PCBA board (Printed Circuit Board Assembly) that has been assembled from a blank PCB board using SMT.

[0046] For example, the grounding spring 30 can be made of metal materials such as copper, aluminum, or steel.

[0047] For example, the housing 10 can be die-cast from metal materials such as aluminum, aluminum alloy, copper, copper alloy, or steel.

[0048] For example, the housing of connector 21 can be made of metal materials such as copper, aluminum, or steel, so that connector 21 can be grounded to housing 10 through grounding spring 30.

[0049] For example, the grounding spring 30 can be fastened to the housing 10 with screws, or form a bent area to overlap (or interfere with, snap-fit) on the inner wall of the housing 10 (e.g., on the protruding rib 12), or be directly integrally formed with the housing 10, etc.

[0050] Those skilled in the art will understand that the grounding spring 30 of this invention can be directly mounted on the housing 10. During the assembly process of the housing 10 and the printed circuit board 20, the first cantilever 32 abuts against the connector 21, and the second cantilever 33 abuts against the exposed copper area 22. In other words, the first cantilever 32 of the grounding spring 30 replaces multiple conductive foams in the prior art, and the second cantilever 33 of the grounding spring 30 replaces multiple upper springs soldered to the printed circuit board 20 via SMT in the prior art, thereby simplifying the overall structure and assembly process of the domain controller 100. The material cost of a single grounding spring 30 is far lower than the cost of conductive foam and SMT springs, significantly reducing the manufacturing cost of the domain controller 100.

[0051] Special reference Figure 4 , 5 As shown in Figure 8, a first positioning feature 11 is formed on the housing 10, and a second positioning feature 34 is formed on the connecting portion 31. The first positioning feature 11 and the second positioning feature 34 can combine with each other to define the position of the grounding spring 30 in the housing 10.

[0052] Furthermore, one of the first positioning feature 11 and the second positioning feature 34 is a positioning post, and the other is a positioning hole.

[0053] For example, the first positioning feature 11 is manifested as five positioning posts provided on the inner wall of the housing 10. The second positioning feature 34 is manifested as five positioning holes provided on the connecting part 31.

[0054] Those skilled in the art will understand that the first positioning feature 11 and the second positioning feature 34 can work together to define the position of the grounding spring 30 within the housing 10, preventing the grounding spring 30 from shifting relative to the housing 10. This allows the grounding spring 30 to be installed on the housing 10 first, followed by the installation of the printed circuit board 20. At this point, the first cantilever 32 automatically abuts against the connector 21, and the second cantilever 33 automatically abuts against the exposed copper area 22. This simplifies the overall structure and assembly process of the domain controller 100, reducing manufacturing costs.

[0055] Special reference Figure 4 , 5 As shown in Figure 8, the connecting portion 31 is bent to form an overlapping end 35, and a protruding rib 12 is formed on the housing 10 so that after the first positioning feature 11 and the second positioning feature 34 are combined with each other, the overlapping end 35 can just overlap on the protruding rib 12, and the first cantilever 32 and the second cantilever 33 are located on both sides of the protruding rib 12.

[0056] In this embodiment, the overlapping end 35 is the bending area mentioned above. The grounding spring 30 can be overlapped (or press-fitted, snapped) onto the protruding rib 12 using the overlapping end 35. The first cantilever 32 extends downwards (e.g., Figure 5 As shown), the second cantilever 33 extends downwards (as shown). Figure 5 (As shown).

[0057] Those skilled in the art should understand that the second positioning feature (positioning hole) of the grounding spring 30 is sleeved on the first positioning feature 11 (positioning post) of the housing 10, and the overlapping end 35 of the grounding spring 30 overlaps with the protruding rib 12. The first positioning feature 11 and the protruding rib 12 together position the grounding spring 30 and prevent it from moving within the housing 10. Furthermore, the protruding rib 12 can support the grounding spring 30, thereby preventing deformation of the grounding spring 30.

[0058] Furthermore, the first cantilever 32 and / or the second cantilever 33 are articulated arms.

[0059] In this embodiment, both the first cantilever 32 and the second cantilever 33 are curved arms, and their bending angles are different.

[0060] Those skilled in the art should understand that the first cantilever 32 and / or the second cantilever 33 are configured as articulated arms, which have a certain amount of elastic compression, can absorb the tolerances generated during installation and manufacturing, and can spring back when disassembled, ensuring reliability after repeated installation (after maintenance) and reducing after-sales maintenance costs.

[0061] Still refer to Figure 3-9 As shown, one embodiment of the present invention provides a domain controller 100, including a housing 10, a printed circuit board 20 with connectors 21 disposed in the housing 10, an exposed copper area 22 formed on the printed circuit board 20, and a grounding spring 30 disposed on the housing 10 with a connection portion 31. The connection portion 31 extends to form a first cantilever 32 and a second cantilever 33. The number of first cantilever 32 is not less than the number of connectors 21, such that at least one first cantilever 32 abuts on each connector 21, and the second cantilever 33 abuts on the exposed copper area 22.

[0062] For example, nine connectors 21 are provided on the printed circuit board 20. Correspondingly, nine first cantilever arms 32 extend from the connection portion 31, such that each connector 21 can abut against one first cantilever arm 32. A linear exposed copper area 22 (a non-electrically connected area with exposed copper on the surface) is formed on the printed circuit board 20. The exposed copper area 22 is adjacent to the connector 21, and eleven second cantilever arms 33 extend from the connection portion 31, which can be linearly arranged to abut against the exposed copper area 22.

[0063] In other embodiments, the number of connectors 21 can be more (e.g., ten) or less (e.g., five), and the number of first cantilevers 32 can be increased (e.g., ten, twelve) or decreased (e.g., five, seven), as long as at least one first cantilever 32 can abut on each connector 21. The area of ​​the exposed copper region 22 can be larger or smaller, and the shape of the exposed copper region 22 can also be non-linear. The number of second cantilevers 32 can be increased (e.g., thirteen) or decreased (e.g., nine), and the arrangement of the second cantilevers 32 can be adjusted according to the shape of the exposed copper region 22.

[0064] Those skilled in the art will understand that the grounding spring 30 of this invention can be directly mounted on the housing 10. During the assembly process of the housing 10 and the printed circuit board 20, the first cantilever 32 abuts against the connector 21, and the second cantilever 33 abuts against the exposed copper area 22. In other words, the first cantilever 32 of the grounding spring 30 replaces multiple conductive foams in the prior art, and the second cantilever 33 of the grounding spring 30 replaces multiple upper springs soldered to the printed circuit board 20 via SMT in the prior art, thereby simplifying the overall structure and assembly process of the domain controller 100. The material cost of a single grounding spring 30 is far lower than the cost of conductive foam and SMT springs, significantly reducing the manufacturing cost of the domain controller 100.

[0065] Special reference Figure 4 , 5 As shown in Figure 8, a first positioning feature 11 is formed on the housing 10, and a second positioning feature 34 is formed on the connecting portion 31. The first positioning feature 11 and the second positioning feature 34 can combine with each other to define the position of the grounding spring 30 in the housing 10.

[0066] Furthermore, one of the first positioning feature 11 and the second positioning feature 34 is a positioning post, and the other is a positioning hole.

[0067] Those skilled in the art will understand that the first positioning feature 11 and the second positioning feature 34 can work together to define the position of the grounding spring 30 within the housing 10, preventing the grounding spring 30 from shifting relative to the housing 10. This allows the grounding spring 30 to be installed on the housing 10 first, followed by the installation of the printed circuit board 20. At this point, the first cantilever 32 automatically abuts against the connector 21, and the second cantilever 33 automatically abuts against the exposed copper area 22. This simplifies the overall structure and assembly process of the domain controller 100, reducing manufacturing costs.

[0068] Special reference Figure 8 As shown, further, a limiting part 13 is formed on the first positioning feature 11 or the second positioning feature 34 to prevent the grounding spring 30 from disengaging from the housing 10.

[0069] Furthermore, the limiting part 13 is formed by cold riveting, hot deformation, welding, or curing with adhesive.

[0070] In this embodiment, the first positioning feature 11 is a positioning post, and the limiting part 13 is formed on the first positioning feature 11, which can be formed using any of the following processes:

[0071] For example, in the cold riveting process, a support device is used to support the housing 10, and a pressing device is used to press the positioning post so that its end is formed into an outwardly expanding limiting part 13.

[0072] For example, in the melting (heat deformation) process, a melting device is used to heat the positioning column, causing it to undergo heat deformation, so that its end is formed into an outwardly expanding limiting part 13.

[0073] For example, in the laser welding (thermal deformation) process, a laser welding device is used to irradiate the positioning column, causing it to undergo thermal deformation, so that its end is formed into an outwardly expanding limiting part 13.

[0074] For example, in a conventional soldering process, the solder forms an outwardly expanding limiting part 13 at the end of the positioning post.

[0075] For example, in the adhesive curing process, an automated dispensing machine applies epoxy resin adhesive to the end of the positioning column, so that the cured epoxy resin adhesive forms an outwardly expanding limiting part 13.

[0076] Those skilled in the art will understand that the limiting portion 13 formed on the first positioning feature 11 or the second positioning feature 33 (positioning post) can both increase the grounding reliability of the grounding spring 30 and effectively prevent the grounding spring 30 from detaching from the housing 10 during transportation and assembly. During assembly, the grounding spring 30 can be first installed on the housing 10, then the limiting portion 13 is formed on the positioning post, and finally the printed circuit board 20 is installed. The first cantilever 32 will automatically abut against the connector 21, and the second cantilever 33 will automatically abut against the exposed copper area 22. This simplifies the overall structure and assembly process of the domain controller 100 and reduces manufacturing costs.

[0077] Furthermore, the first cantilever 32 and / or the second cantilever 33 are articulated arms.

[0078] In this embodiment, both the first cantilever 32 and the second cantilever 33 are curved arms, and their bending angles are different.

[0079] Those skilled in the art should understand that the first cantilever 32 and / or the second cantilever 33 are configured as articulated arms, which have a certain amount of elastic compression, can absorb the tolerances generated during installation and manufacturing, and can spring back when disassembled, ensuring reliability after repeated installation (after maintenance) and reducing after-sales maintenance costs.

[0080] Special reference Figure 3 , 6 As shown in Figures 7 and 9, the housing 10 further includes a first housing 10a and a second housing 10b that are fixedly connected to each other. A grounding spring 30 is disposed on the first housing 10a. An exposed copper area 22 is formed on the first side of the printed circuit board 20. An idle pad 23 is formed on the second side of the printed circuit board 20. An SMT spring 40 is disposed on the idle pad 23. The SMT spring 40 abuts against the second housing 10b. The first side and the second side are opposite sides of the printed circuit board 20.

[0081] In this embodiment, the first housing 10a, the second housing 10b, and the printed circuit board 20 are fixedly connected to each other by fasteners 50 (screws).

[0082] Those skilled in the art will understand that the split housing 10 is easier to manufacture and assemble. For better electromagnetic compatibility, an additional SMT spring 40 is provided to connect the second side of the printed circuit board 20 to the second housing 10b. During assembly, the grounding spring 30 can be first installed on the first housing 10a, then the printed circuit board 20 is installed, and finally the second housing 10b is stacked on top of the printed circuit board 20. Fasteners 50 are used to sequentially connect the second housing 10b, the printed circuit board 20, and the first housing 10a. The first cantilever 32 automatically abuts against the connector 21, the second cantilever 33 automatically abuts against the exposed copper area 22, and the SMT spring 40 abuts against the second housing 10b.

[0083] Furthermore, the domain controller 100 described above can also be used as a mobile platform. The mobile platform can be a car, boat, unmanned aerial vehicle, remote-controlled car, or robot. The car can be an unmanned vehicle or a manned vehicle, and the unmanned aerial vehicle can be a drone or other unmanned aerial vehicle. Of course, the mobile platform is not limited to the mobile platforms listed above and can also be other mobile platforms.

[0084] Those skilled in the art should understand that, since the portable platform employs the aforementioned domain controller 100, it possesses all the technical effects brought about by the domain controller 100. For example, the grounding spring 30 of this invention can be directly disposed on the housing 10. During the assembly process of the housing 10 and the printed circuit board 20, the first cantilever 32 abuts against the connector 21, and the second cantilever 33 abuts against the exposed copper area 22. That is to say, the first cantilever 32 of the grounding spring 30 replaces multiple conductive foams in the prior art, and the second cantilever 33 of the grounding spring 30 replaces multiple upper springs soldered to the printed circuit board 20 by SMT in the prior art, thereby simplifying the overall structure and assembly process of the domain controller 100. The material cost of a single grounding spring 30 is far lower than the cost of conductive foam and SMT springs, greatly reducing the manufacturing cost of the domain controller 100.

[0085] Combination Figure 10 As shown, one embodiment of this utility model provides a method for manufacturing a domain controller 100, including:

[0086] S101, Provide a housing 10 with a first positioning feature 11;

[0087] S102. A grounding spring 30 with a second positioning feature 34 is provided, and the grounding spring 30 is disposed on the housing 10 by combining the first positioning feature 11 with the second positioning feature 34. The grounding spring 30 extends to form a first cantilever 32 and a second cantilever 33.

[0088] S103. A printed circuit board 20 with connectors 21 is disposed in the housing 10. An exposed copper area 22 is formed on the printed circuit board 20. The number of first cantilever 32 is not less than the number of connectors 21, so that at least one first cantilever 31 abuts on each connector 21, and a second cantilever 32 abuts on the exposed copper area 22.

[0089] Those skilled in the art will understand that the manufacturing method of the domain controller 100 provided by this utility model allows the grounding spring 30 to be directly mounted on the housing 10. During the assembly process of the housing 10 and the printed circuit board 20, the first cantilever 32 abuts against the connector 21, and the second cantilever 33 abuts against the exposed copper area 22. In other words, the first cantilever 32 of the grounding spring 30 replaces multiple conductive foams in the prior art, and the second cantilever 33 of the grounding spring 30 replaces multiple upper springs soldered to the printed circuit board 20 via SMT in the prior art, thereby simplifying the overall structure and assembly process of the domain controller 100. The material cost of a single grounding spring 30 is far lower than the cost of conductive foam and SMT springs, significantly reducing the manufacturing cost of the domain controller 100.

[0090] Combination Figure 11As shown, step S102 further includes: providing a grounding spring 30 with a second positioning feature 34, placing the grounding spring 30 on the housing 10 by combining the first positioning feature 11 and the second positioning feature 34, forming a limiting part 13 on the first positioning feature 11 or the second positioning feature 34 to prevent the grounding spring 30 from detaching from the housing 10, and the grounding spring 30 extendingly forming a first cantilever 32 and a second cantilever 33.

[0091] In this embodiment, the first positioning feature 11 is a positioning post, and the limiting part 13 is formed on the first positioning feature 11, which can be formed using any of the following processes:

[0092] For example, in the cold riveting process, a support device is used to support the housing 10, and a pressing device is used to press the positioning post so that its end is formed into an outwardly expanding limiting part 13.

[0093] For example, in the melting (heat deformation) process, a melting device is used to heat the positioning column, causing it to undergo heat deformation, so that its end is formed into an outwardly expanding limiting part 13.

[0094] For example, in the laser welding (thermal deformation) process, a laser welding device is used to irradiate the positioning column, causing it to undergo thermal deformation, so that its end is formed into an outwardly expanding limiting part 13.

[0095] For example, in a conventional soldering process, the solder forms an outwardly expanding limiting part 13 at the end of the positioning post.

[0096] For example, in the adhesive curing process, an automated dispensing machine applies epoxy resin adhesive to the end of the positioning column, so that the cured epoxy resin adhesive forms an outwardly expanding limiting part 13.

[0097] Those skilled in the art will understand that the limiting portion 13 formed on the first positioning feature 11 or the second positioning feature 33 (positioning post) can both increase the grounding reliability of the grounding spring 30 and effectively prevent the grounding spring 30 from detaching from the housing 10 during transportation and assembly. During assembly, the grounding spring 30 can be first installed on the housing 10, then the limiting portion 13 is formed on the positioning post, and finally the printed circuit board 20 is installed. The first cantilever 32 will automatically abut against the connector 21, and the second cantilever 33 will automatically abut against the exposed copper area 22. This simplifies the overall structure and assembly process of the domain controller 100 and reduces manufacturing costs.

[0098] like Figure 12 As shown, one embodiment of this utility model provides another method for manufacturing a domain controller 100, including:

[0099] S201, Provide a first housing 10a with a first positioning feature 11 on its inner wall, and invert the first housing 10b;

[0100] S202, A grounding spring 30 with a second positioning feature 34 is provided, and the grounding spring 30 is disposed on the first housing 10a by combining the first positioning feature 11 with the second positioning feature 34. The grounding spring 30 extends to form a first cantilever 32 and a second cantilever 33.

[0101] S203. A printed circuit board 20 with connector 21 is stacked on the first housing 10a. The number of first cantilever 31 is not less than the number of connector 21. A copper exposed area 22 is formed on the first side of the printed circuit board 20 facing the grounding spring 30. An idle pad 23 is formed on the second side of the printed circuit board 20 away from the grounding spring 30. An SMT spring 40 is provided on the idle pad 23.

[0102] S204. The second housing 10b is stacked on the printed circuit board 20, and the first housing 10a and the second housing 10b form a receiving cavity, so that the grounding spring 30 and the printed circuit board 20 are located in the receiving cavity.

[0103] S205. The second housing 10b, the printed circuit board 20 and the first housing 10a are connected in sequence with fasteners 50, such that at least one first cantilever 32 abuts on each connector 21 and the second cantilever 33 abuts on the exposed copper area 22.

[0104] Those skilled in the art will understand that the split housing 10 is easier to manufacture and assemble. For better electromagnetic compatibility, an additional SMT spring 40 is provided to connect the second side of the printed circuit board 20 to the second housing 10b. During assembly, the grounding spring 30 can be first installed on the first housing 10a, then the printed circuit board 20 is installed, and finally the second housing 10b is stacked on top of the printed circuit board 20. Fasteners 50 are used to sequentially connect the second housing 10b, the printed circuit board 20, and the first housing 10a. The first cantilever 32 automatically abuts against the connector 21, the second cantilever 33 automatically abuts against the exposed copper area 22, and the SMT spring 40 abuts against the second housing 10b.

[0105] Combination Figure 13 As shown, step S202 further includes: providing a grounding spring 30 with a second positioning feature 34, combining the first positioning feature 11 and the second positioning feature 34 to make the grounding spring 30 disposed on the first housing 10a, forming a limiting part 13 on the first positioning feature 11 or the second positioning feature 34 to prevent the grounding spring 30 from disengaging from the first housing 10a, and the grounding spring 30 extendingly forming a first cantilever 32 and a second cantilever 33.

[0106] Those skilled in the art will understand that the limiting portion 13 formed on the first positioning feature 11 or the second positioning feature 33 (positioning post) can both increase the grounding reliability of the grounding spring 30 and effectively prevent the grounding spring 30 from detaching from the housing 10 during transportation and assembly. During assembly, the grounding spring 30 can be first installed on the housing 10, then the limiting portion 13 is formed on the positioning post, and finally the printed circuit board 20 is installed. The first cantilever 32 will automatically abut against the connector 21, and the second cantilever 33 will automatically abut against the exposed copper area 22. This simplifies the overall structure and assembly process of the domain controller 100 and reduces manufacturing costs.

[0107] In the description of this specification, the references to terms such as "certain embodiments," "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0108] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not restrictive. Although this utility model has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model do not depart from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A grounding spring for a domain controller, the domain controller comprising a housing and a printed circuit board disposed within the housing, the printed circuit board having connectors and exposed copper areas, characterized in that, The grounding spring includes: A connecting portion that can be provided on the housing; and A first cantilever and a second cantilever extending from the connection portion, wherein the number of the first cantilever is not less than the number of the connectors, such that at least one first cantilever can abut on each of the connectors, and the second cantilever can abut on the exposed copper area.

2. The grounding spring according to claim 1, characterized in that: A first positioning feature is formed on the housing, and a second positioning feature is formed on the connecting portion. The first positioning feature and the second positioning feature can be combined to define the position of the grounding spring in the housing.

3. The grounding spring according to claim 2, characterized in that: One of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

4. The grounding spring according to claim 2, characterized in that: The connecting part is bent to form an overlapping end, and a rib is formed on the housing so that after the first positioning feature and the second positioning feature are combined, the overlapping end can just overlap the rib, and the first cantilever and the second cantilever are located on both sides of the rib.

5. The grounding spring according to claim 1, characterized in that: The first cantilever and / or the second cantilever are articulated arms.

6. A domain controller, characterized in that, include: case; A printed circuit board with a connector is disposed in the housing, and the printed circuit board has an exposed copper area; as well as A grounding spring is provided on the housing with a connecting portion, the connecting portion extending to form a first cantilever and a second cantilever, the number of the first cantilever being not less than the number of the connectors, such that at least one first cantilever abuts on each connector, and the second cantilever abuts on the exposed copper area.

7. The domain controller according to claim 6, characterized in that: A first positioning feature is formed on the housing, and a second positioning feature is formed on the connecting portion. The first positioning feature and the second positioning feature can be combined to define the position of the grounding spring in the housing.

8. The domain controller according to claim 7, characterized in that: One of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

9. The domain controller according to claim 7, characterized in that: A limiting portion is formed on the first positioning feature or the second positioning feature to prevent the grounding spring from disengaging from the housing.

10. The domain controller according to claim 9, characterized in that: The limiting part is formed by cold riveting, hot deformation, welding, or adhesive curing.

11. The domain controller according to any one of claims 6-10, characterized in that: The housing includes a first housing and a second housing that are fixedly connected to each other. The grounding spring is disposed on the first housing. The exposed copper area is formed on the first side of the printed circuit board. An empty pad is formed on the second side of the printed circuit board. An SMT spring is disposed on the empty pad. The SMT spring abuts against the second housing. The first side and the second side are opposite sides of the printed circuit board.

12. A mobile platform, characterized in that, include: The domain controller as described in any one of claims 6-11.

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