A radio frequency connector
By employing a surface grounding structure in the RF connector where a conductive dielectric connector is directly connected to the inner wall of the metal housing, the problems of low filter drilling accuracy and increased size are solved, achieving higher integration and reduced costs.
Patent Information
- Application Number
- CN202521821151.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-26
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-26
AI Technical Summary
The low grounding accuracy of filters in existing RF connectors leads to increased filter size and high processing costs. Furthermore, IPD filters cannot be grounded by etching on thicker substrates.
A conductive dielectric connector is used to directly connect the filter element of the filter to the inner wall of the metal housing. The surface grounding structure is achieved by avoiding drilling through methods such as applying conductive adhesive, welding, or slotting in the metal sleeve.
It improves amplitude and phase consistency, reduces filter size, lowers processing time and cost, and increases device integration.
Smart Images
Figure CN224683579U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of radio frequency connector technology, specifically relating to a grounding structure on the upper surface of a filter in a radio frequency connector, which effectively reduces device size, reduces process complexity, and lowers costs. Background Technology
[0002] Radio frequency connectors are key components used for high-frequency signal transmission. They ensure low loss, high stability, and electromagnetic shielding of filters and are widely used in communications, aerospace, medical, automotive electronics, and consumer electronics.
[0003] Filter connectors are designed to meet the miniaturization requirements of radio frequency (RF) devices by integrating filters within the connector, thus providing both filtering and connection functions. To achieve effective filtering, filters typically require grounding vias. Existing conventional RF connectors include a microstrip line filter, a metal substrate 1, and a metal housing 2. The microstrip line filter consists of a microstrip line 6 formed on the upper surface of a ceramic substrate 5, and the metal substrate 1 is located on the lower surface of the ceramic substrate 5. The microstrip line 6 is connected to the metal substrate 1 through a metal via 4 penetrating the ceramic substrate. A schematic diagram of a conventional RF connector is shown below. Figure 1 As shown.
[0004] Taking ceramic thin-film filters as an example, grounding is achieved through laser drilling, but the following problems exist:
[0005] 1. Lower accuracy will affect amplitude and phase consistency;
[0006] 2. The diameter of the via is generally 0.5 to 1 times the thickness of the substrate, which will increase the size of the filter;
[0007] 3. Long processing time increases processing costs.
[0008] Existing IPD filters have high processing precision and achieve grounding through etching. The via precision is also very high. However, thicker substrates cannot be grounded by etching. Utility Model Content
[0009] The purpose of this invention is to solve the problems of low accuracy of existing filter grounding vias and the increase in filter size due to through holes, and to provide an RF connector and its surface grounding structure.
[0010] This utility model's radio frequency connector includes a metal housing, a filter, a connector joint, and a surface grounding structure. The connector joints are respectively provided at both ends of the metal housing, and the filter and the surface grounding structure are located inside the metal housing. The surface grounding structure connects the filter element of the filter directly to the inner wall of the metal housing through at least one connector, wherein the connector is a conductive medium.
[0011] This invention addresses the optimization of filter space in RF connectors by designing chip grounding and employing methods such as applying conductive adhesive, soldering, or metal sleeve slotting to achieve direct connection between the filter and the inner wall of the metal housing. Verification in simulation software demonstrates that this design meets the stringent requirements of 5G millimeter wave technology for high-density integrated connector filter components.
[0012] This invention takes the optimization of filter space allocation in RF connectors as its starting point, employing a top-surface grounding structure to address the high cost and poor precision of drilling holes in ceramic thin-film filters. It also provides a solution to the problem of grounding IPD filters on thicker substrates, where etching is not feasible. This invention offers a new direction for optimizing filter space allocation in RF connectors.
[0013] The surface grounding structure of the RF connector described in this utility model has the following beneficial effects:
[0014] 1. Different drilling precision can affect amplitude and phase consistency. The surface grounding structure of the RF connector of this utility model avoids drilling, thereby improving amplitude and phase consistency.
[0015] 2. This surface grounding structure can reduce the size of the filter, and the width of the filter can be reduced from 2.9mm to 2.2mm, thus improving the integration of the device;
[0016] 3. This utility model eliminates the need for drilling, thus reducing processing time, process complexity, and production costs. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of an existing laser-drilled ceramic thin-film filter;
[0018] Figure 2 The image shows the simulation results of an existing laser-drilled ceramic thin-film filter.
[0019] Figure 3 This is a schematic diagram of an RF connector with a surface grounding structure in the embodiment;
[0020] Figure 4 This is a partial schematic diagram showing the connection between the connector and the metal shell in the embodiment.
[0021] Figure 5 This is a simulation result diagram of the RF connector with a surface ground structure in the embodiment;
[0022] Figure 6 This is a schematic diagram of the overall structure of the surface grounding structure of the radio frequency connector of this utility model. Detailed Implementation
[0023] Specific implementation method one: The radio frequency connector in this embodiment includes a metal housing 2, a filter, a connector 3 and a surface grounding structure. The two ends of the metal housing 2 are respectively provided with connector 3, and the filter and the surface grounding structure are located inside the metal housing 2. The surface grounding structure connects the filter element of the filter directly to the inner wall of the metal housing 2 through at least one connector 7, wherein the connector 7 is a conductive medium.
[0024] This implementation method, starting from the research on optimizing the space occupied by filters in RF connectors, proposes a surface grounding structure for filters, which effectively reduces size and cost. It can be achieved by applying conductive adhesive, soldering, or using a metal sleeve with grooved positioning.
[0025] Specific Implementation Method Two: This implementation method differs from Specific Implementation Method One in that the metal shell 2 is a tubular body, which can be a round or square tube.
[0026] Specific Implementation Method 3: This implementation method differs from Specific Implementation Method 1 or 2 in that the long axis of the filter is set parallel to the central axis of the metal housing 2.
[0027] Specific Implementation Method Four: This implementation method differs from one of the specific implementation methods one to three in that the ceramic substrate 5 is made of alumina ceramic, aluminum nitride ceramic, silicon nitride ceramic, beryllium oxide ceramic, silicon carbide ceramic, or gallium arsenide.
[0028] Specific Implementation Method 5: This implementation method differs from Specific Implementation Methods 1 to 4 in that the thickness of the ceramic substrate 5 is 0.1mm to 2mm.
[0029] Specific Implementation Method Six: This implementation method differs from Specific Implementation Methods One to Five in that the filter described is a microstrip line filter. The microstrip line filter includes a substrate 5 and a microstrip line 6. The microstrip line 6 serves as a filtering element. The microstrip line 6 is disposed on the upper surface of the substrate 5. The microstrip line 6 is directly connected to the inner wall of the metal housing 2 through at least one connector 7.
[0030] Specific Implementation Method Seven: This implementation method differs from one of Specific Implementation Methods One to Six in that the conductive medium is one or more of conductive adhesive, conductive solder, or conductive metal.
[0031] Specific Implementation Method Eight: This implementation method differs from one of the specific implementation methods one to seven in that the connecting body 7 is columnar, branched, or strip-shaped.
[0032] Specific Implementation Method Nine: This implementation method differs from Specific Implementation Method Eight in that when the connector 7 is branch-shaped, the connector 7 is L-shaped.
[0033] Specific Implementation Method 10: This implementation method differs from one of the specific implementation methods 1 to 9 in that a metal substrate 1 is provided on the lower surface of the ceramic substrate 5.
[0034] Specific Implementation Method Eleven: This implementation method differs from Specific Implementation Methods One to Ten in that when there are multiple connectors 7, the conductive media of the connectors 7 may be the same or different.
[0035] Example: The RF connector in this example includes a metal housing 2, a filter, connector connectors 3, and a surface ground structure. Connector connectors 3 are respectively provided on both ends of the metal housing 2. The metal housing 2 is cylindrical, and its central axis is horizontal. The microstrip filter is horizontally placed inside the metal housing 2. The microstrip filter includes a ceramic substrate 5 and a microstrip line 6. The ceramic substrate 5 has a thickness of 0.508 mm. The microstrip line 6 is provided on the upper surface of the ceramic substrate 5. The microstrip line 6 forms an IPD filter. The input feed line and output feed line of the IPD filter are respectively connected to two connector connectors 3. The upper surface of the microstrip line 6 is directly connected to the inner wall of the metal housing 2 through four connectors 7, wherein the connectors 7 are columnar metal bodies.
[0036] In this embodiment, the metal casing 2 is cylindrical, with a length H = 6.7 mm and a radius R = 1.75 mm.
[0037] Figure 1 The thickness of the ceramic substrate 5 of the conventional RF connector is 0.508mm. The microstrip line 6 is connected to the metal substrate 1 through four metal through holes 4 penetrating the ceramic substrate. The diameter of the metal through holes 4 is 0.42mm.
[0038] This embodiment simulates both a surface-grounded RF connector and a conventional RF connector. The S-parameter diagram is shown below. Figure 2 and Figure 5 As shown. From this, we can know Figure 2 and Figure 5 The simulation test results are basically consistent, but conventional RF connectors require drilling. In actual manufacturing, processing errors can cause the holes to shift to varying degrees, thus affecting the amplitude and phase of the product. Figure 5 RF connectors with surface grounding structures eliminate the need for drilling and reduce the width of the RF connector by 0.5mm, saving processing time.
Claims
1. A radio frequency connector, comprising a metal housing (2), a filter, a connector connector (3), and a surface ground structure, wherein connector connectors (3) are respectively provided at both ends of the metal housing (2); characterized in that The surface grounding structure connects the filter element of the filter directly to the inner wall of the metal housing (2) through at least one connector (7), wherein the connector (7) is a conductive medium.
2. The radio frequency connector according to claim 1, characterized in that... The filter is set parallel to the central axis of the metal housing (2).
3. The radio frequency connector according to claim 1, characterized in that... The filter is a microstrip line filter, which includes a substrate (5) and a microstrip line (6). The microstrip line (6) serves as a filtering element and is disposed on the upper surface of the substrate (5). The microstrip line (6) is directly connected to the inner wall of the metal housing (2) through at least one connector (7).
4. The radio frequency connector according to claim 3, characterized in that... The substrate (5) is made of alumina ceramic, aluminum nitride ceramic, silicon nitride ceramic, beryllium oxide ceramic, silicon carbide ceramic or gallium arsenide.
5. The radio frequency connector according to claim 3, characterized in that... A metal substrate (1) is also provided on the lower surface of the ceramic substrate (5).
6. The radio frequency connector according to claim 3, characterized in that... The thickness of the substrate (5) is 0.1 mm to 2 mm.
7. The RF connector according to claim 1, characterized in that... The metal shell (2) is a tubular body, which is either a round tube or a square tube.
8. The radio frequency connector according to claim 1, characterized in that... The conductive medium is one or more of conductive adhesive, conductive solder, or conductive metal.
9. The radio frequency connector according to claim 1 or 3, characterized in that... The connector (7) is columnar, branched, or strip-shaped.
10. The radio frequency connector according to claim 1 or 3, characterized in that... When there are multiple connectors (7), the conductive media of the connectors (7) can be the same or different.