A patch component foaming and unloading device
By integrating scanning and area array heating mechanisms and a PLC control system, the problems of low unloading efficiency and high breakage rate of surface mount components in existing technologies have been solved, achieving a highly efficient and precise unloading process for surface mount components.
Patent Information
- Application Number
- CN202521884565.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-02
AI Technical Summary
The existing manual hot air gun heating and unloading method has problems such as low unloading efficiency and high breakage rate of surface mount components, making it difficult to achieve uniform heating and precise temperature control.
It adopts an integrated scanning and area array heating mechanism, combined with a temperature control system of PLC controller and temperature gauge, to achieve uniform heating and precise temperature control through uniform speed movement and matrix fine holes, replacing manual hand operation.
It achieves large-area uniform heating and small-area precise heating, significantly improving unloading efficiency and product yield, and reducing the risk of damage to surface mount components.
Smart Images

Figure CN224684384U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic packaging equipment technology, specifically to a chip component foaming and unloading device. Background Technology
[0002] In electronic packaging processes, before end-capping surface mount components (SMD) devices, two steps must be completed: adhesive application and insertion. Adhesive application involves attaching foam tape to the surface of the end-capping plate, while insertion involves bonding the SMD device through holes in the end-capping plate to the foam tape, thus securing the device to the end-capping plate and preparing it for subsequent end-capping operations. Therefore, after end-capping, a removal operation is necessary to separate the SMD device from the end-capping plate. The core requirement for foam removal is to precisely heat and soften the foam tape to achieve non-destructive separation of the device. Currently, the mainstream removal method in the industry is manual hot air gun heating. This involves an operator holding a hot air gun and blowing heat onto the side of the end-capping plate where the foam tape is attached. This method relies on manual control of the hot air gun's movement speed and direction.
[0003] However, existing technologies have significant drawbacks: on the one hand, manual operation makes it difficult to ensure the uniformity of hot air coverage, resulting in uneven heating of different areas of the foamed tape; on the other hand, it is impossible to accurately control the hot air temperature and the heating time of each area, leading to problems such as some foamed tapes being too hot and others being too cold. Too high a temperature will damage the surface mount components, while too low a temperature will cause a significant decrease in the surface mount component unloading rate, seriously affecting production efficiency and product yield. Therefore, it does not meet the current requirements. In response, we propose a surface mount component foaming unloading device. Utility Model Content
[0004] The purpose of this invention is to provide a surface mount component foaming unloading device to solve the problems of low unloading efficiency and high breakage rate of surface mount components in the existing manual hot air gun heating unloading method mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a chip element foaming unloading device, comprising two fixed plates, each fixedly mounted with a guide rail on its upper inner side, an unloading box slidably fitted between the two guide rails, an unloading platform for limiting the end-sealing plate mounted on the upper end of the unloading box, a fixed frame provided at the rear end of the two fixed plates, upper and lower cylinders fixedly mounted above the top plate of the fixed frame, a heating mechanism provided below the top plate of the fixed frame, and the movable ends of the upper and lower cylinders connected to the heating mechanism.
[0006] Preferably, the rear end of the fixed frame is provided with a gas supply device, the gas outlet end of the gas supply device is provided with a gas delivery pipe, and the gas delivery pipe passes through the top plate of the fixed frame and is connected to the heating mechanism.
[0007] Preferably, the heating mechanism includes a scanning heating device, which has multiple heating tubes inside and performs constant-speed displacement scanning heating above the end cap plate in conjunction with the movement of the guide rail.
[0008] Preferably, the heating mechanism includes a surface array heating device, which has multiple heating tubes inside. At the same time, the bottom of the surface array heating device has multiple fine holes arranged in a rectangular array, through which hot air is blown directly onto the upper surface of the end cap plate.
[0009] Preferably, the heating position corresponding to the array heating device is the position where the unloading platform and the heating plate on the array heating device are parallel and aligned.
[0010] Preferably, the heating mechanism includes a temperature control system, which consists of a PLC controller, a touch screen, a thermometer, and a solid-state relay. The touch screen is electrically connected to the PLC controller, the PLC controller is connected to the thermometer via RS-232 communication protocol, the thermometer is electrically connected to the solid-state relay, and the solid-state relay is electrically connected to the heating element inside the heating mechanism.
[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model integrates two heating mechanisms: scanning and array. The scanning mechanism can achieve uniform heating of a large area of the end-cap plate through uniform speed movement, while the array mechanism can achieve precise heating of a small area through a matrix of fine holes. The two modes can be flexibly switched according to the specifications of the surface mount components and the size of the end-cap plate to meet the unloading requirements in different scenarios.
[0012] 2. This utility model uses the PID control function of the temperature gauge, combined with the synergistic effect of the PLC controller and solid-state relay, to adjust the heating current of the heating tube in real time, ensuring a constant hot air temperature. This avoids the problem of surface mount components being damaged due to temperature fluctuations in traditional manual operation, and significantly improves product yield.
[0013] 3. This utility model uses a PLC controller as its core, linking servo motors, upper and lower cylinders and air supply devices to achieve fully automated operation of the entire process, including heating position positioning, heating mechanism lifting and lowering, and hot air supply. It replaces the traditional method of manually holding a hot air gun, which not only reduces the cost of manual intervention, but also greatly improves the unloading efficiency through constant moving speed and heating time. Attached Figure Description
[0014] Figure 1 This is a perspective view of Embodiment 1 of the present invention; Figure 2 This is a side view of the scanning heating device in Embodiment 1 of this utility model; Figure 3 This is a perspective view of Embodiment 2 of the present invention; Figure 4 This is a side view of the array heating device in Embodiment 2 of this utility model; Figure 5 This is a flowchart of the temperature control process of this utility model; Figure 6 This is a circuit diagram of the scanning heating device and the area array heating device of this utility model.
[0015] In the diagram: 1. Fixing plate; 2. Guide rail; 3. Unloading box; 4. Unloading platform; 5. End sealing plate; 6. Fixing frame; 7. Upper and lower cylinders; 8. Heating mechanism; 9. Scanning heating device; 10. Air supply device; 11. Air transmission pipeline; 12. Array heating device. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Example 1
[0017] Please see Figure 1 and Figure 2 An embodiment of this utility model provides a chip element foaming unloading device, including two fixed plates 1. The upper end of the inner side of each fixed plate 1 is fixedly installed with a guide rail 2. An unloading box 3 that slides between the two guide rails 2 is installed therewith. An unloading platform 4 for limiting the end sealing plate is installed at the upper end of the unloading box 3. A fixed frame 6 is provided at the rear end of the two fixed plates 1. An upper and lower cylinder 7 is fixedly installed above the top plate of the fixed frame 6. A heating mechanism 8 is provided below the top plate of the fixed frame 6, and the movable end of the upper and lower cylinder 7 is connected to the heating mechanism 8. The upper and lower cylinders 7 can drive the heating mechanism 8 to rise and fall, enabling the heating mechanism 8 to be attached to or separated from the end-sealing plate on the unloading platform 4. The unloading platform 4 can slide along the guide rail 2 with the unloading box 3, enabling the end-sealing plate to move between different workstations, providing a basis for position adjustment for the heating and foaming unloading process after adhesive application. The high-precision design achieves precise alignment between the heating mechanism 8 and the end-sealing plate, replacing manual hand operation, improving position control accuracy, and providing stable structural support for subsequent automated heating and unloading.
[0018] Please see Figure 1An air supply device 10 is provided at the rear end of the mounting frame 6. An air supply pipe 11 is provided at the outlet end of the air supply device 10, and the air supply pipe 11 passes through the top plate of the mounting frame 6 and connects to the heating mechanism 8. The airflow generated by the air supply device 10 is delivered to the heating mechanism 8 through the air supply pipe 11. After being heated by the heating element inside the heating mechanism 8, it forms hot air, which acts on the foamed adhesive tape on the end-sealing plate, softening the tape and causing it to lose its stickiness, thus separating the patch element from the end-sealing plate. This avoids the airflow fluctuation problem caused by manually holding a hot air gun, and the hot air can be concentrated on the target area, reducing heat loss and improving heating efficiency.
[0019] Please see Figure 5 and Figure 6 The heating mechanism 8 includes a temperature control system, which consists of a PLC controller, a touch screen, a temperature gauge, and a solid-state relay. The touch screen is electrically connected to the PLC controller, which in turn connects to the temperature gauge via RS-485 communication. The temperature gauge is electrically connected to the solid-state relay, which in turn connects to the heating element within the heating mechanism. The operator inputs the target temperature parameters via the touch screen, and the PLC controller transmits these parameters to the temperature gauge. The temperature gauge adjusts its output current using a PID control algorithm, which in turn controls the heating power of the heating element via the solid-state relay, stabilizing the heating element temperature at the preset value and ensuring a constant hot air temperature. This closed-loop temperature control achieves precise temperature adjustment, avoiding the temperature fluctuations common in traditional manual operation. It prevents damage to surface-mount components due to excessive heat and incomplete unloading due to excessively low temperatures. Furthermore, digital operation improves the convenience and consistency of parameter settings.
[0020] Please see Figure 1 and Figure 2 The heating mechanism 8 includes a scanning heating device 9, which has multiple heating tubes inside. It performs constant-speed displacement scanning heating above the end cap plate in conjunction with the movement of the guide rail 2. Before the unloading operation begins, the heating element inside the scanning heating device 9 needs to be heated to the preset temperature. Once the temperature is reached, the servo motor of the guide rail 2 pushes the unloading platform 4 to move backward along the guide rail 2. When the unloading platform 4 moves to the scanning heating position, the upper and lower cylinders 7 contract to lower the scanning heating device 9. At the same time, the air supply device 10 starts to supply air to the scanning heating device 9 through the air supply pipe 11. The airflow flows out of the air supply pipe 11 and is heated by the heating element, eventually forming hot air. The hot air is then blown out through the air outlet below the scanning heating device 9. The servo motor continues to push the unloading platform 4 to move backward at a constant speed. The foam tape on the end plate will be slightly rolled up after being blown by the hot air, and the surface mount components will quickly separate from the foam tape. After separation, the surface mount components fall into the unloading box 3. When the unloading platform 4 reaches the unloading completion position, the upper and lower cylinders 7 drive the scanning heating device 9 to rise, and at the same time, the air supply device 10 stops supplying air. At this time, the unloading operation is completed. Example 2
[0021] Please see Figure 3 and Figure 4 The heating mechanism 8 includes a surface array heating device 12. The surface array heating device 12 has multiple heating tubes inside. At the same time, the bottom of the surface array heating device 12 has multiple fine holes in a rectangular array. Hot air is blown directly onto the upper surface of the end plate through the fine holes. The heating position corresponding to the surface array heating device 12 is the position where the unloading platform 4 is parallel and aligned with the heating plate on the surface array heating device 12. Before starting the unloading operation, it is necessary to wait for the heating elements in the array heating device 12 to heat up and reach the preset temperature. Once the temperature is reached, the servo motor pushes the unloading platform 4 to move backward along the guide rail 2. When the unloading platform 4 moves to the unloading position, the upper and lower cylinders 7 contract to lower the array heating device 12. When the heating plate and the end-sealing plate on the unloading platform 4 are in contact, the air supply device 10 starts to supply air to the array heating device 12 through the air supply pipe 11. The airflow flows out from the air supply pipe 11 and is heated by the heating elements in the heating plate to form hot air. The hot air is then blown out through the small holes of the heating plate. There are 264 small holes at the bottom of the heating plate, arranged in a 24-row * 11-column pattern. At this time, the surface mount components and the foam tape quickly separate, and the surface mount components fall into the unloading box 3 after separation. When the heating time is reached, the upper and lower cylinders 7 push upward, causing the heating plate and the end-sealing plate to separate, and at the same time, the air supply device 10 stops supplying air. At this time, the unloading operation is completed.
[0022] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A surface mount component foaming unloading device, comprising two fixing plates (1), characterized in that: The upper inner side of each fixed plate (1) is fixedly installed with a guide rail (2), and a material unloading box (3) is installed between the two guide rails (2) and slides with them. The upper end of the material unloading box (3) is installed with a material unloading platform (4) for limiting the end sealing plate. The rear end of the two fixed plates (1) is provided with a fixed frame (6). The top plate of the fixed frame (6) is fixedly installed with an upper and lower cylinder (7). The bottom of the top plate of the fixed frame (6) is provided with a heating mechanism (8), and the movable end of the upper and lower cylinder (7) is connected to the heating mechanism (8).
2. The surface mount component foaming unloading device according to claim 1, characterized in that: The rear end of the fixed frame (6) is provided with a gas supply device (10), and the gas supply device (10) is provided with a gas transmission pipe (11) at the gas outlet end, and the gas transmission pipe (11) passes through the top plate of the fixed frame (6) and is connected to the heating mechanism (8).
3. The surface mount component foaming unloading device according to claim 1, characterized in that: The heating mechanism (8) includes a scanning heating device (9), which has multiple heating tubes inside. It performs constant speed displacement scanning heating above the end plate in conjunction with the movement of the guide rail (2).
4. The surface mount component foaming unloading device according to claim 1, characterized in that: The heating mechanism (8) includes a surface array heating device (12), which has multiple heating tubes inside. At the same time, the bottom of the surface array heating device (12) has multiple fine holes in a rectangular array, through which hot air is blown directly onto the upper surface of the end plate.
5. The surface mount component foaming unloading device according to claim 4, characterized in that: The heating position corresponding to the array heating device (12) is the position where the unloading platform (4) and the heating plate on the array heating device (12) are parallel and aligned.
6. The surface mount component foaming unloading device according to claim 1, characterized in that: The heating mechanism (8) includes a temperature control system, which consists of a PLC controller, a touch screen, a thermometer, and a solid-state relay. The touch screen is electrically connected to the PLC controller. The PLC controller is connected to the thermometer via RS-485 communication protocol. The thermometer is electrically connected to the solid-state relay. The solid-state relay is electrically connected to the heating tube inside the heating mechanism.