An electronic device

Abstract

Embodiments of the present application disclose an electronic device, which can be applied in the field of information and communication technology, and can be in the form of a computing device such as a server, a communication device such as an optical communication device, etc., comprising a device to be cooled and a cooling device. The device to be cooled can be, for example, an optical communication component. The device to be cooled comprises two surfaces to be cooled, which are oppositely arranged along a first direction. The cooling device comprises at least two liquid cooling plates. The device to be cooled is provided with the liquid cooling plates on both sides along the first direction, and the liquid cooling plates can be internally provided with liquid cooling working medium in the form of water-based working medium, fluorinated liquid, etc., and the two surfaces to be cooled are both cooled by the liquid cooling plates. The device to be cooled in the electronic device is provided with the liquid cooling plates on both sides along the first direction, so that one device to be cooled can be cooled by at least two liquid cooling plates, the number of the liquid cooling plates can be increased, and the cooling effect of the device to be cooled can be better.

Description

Technical Field

[0001] This application relates to the field of information and communication technology, specifically to an electronic device, which can be a computing device in the form of a server, or a communication device in the form of an optical communication device. Background Technology

[0002] With the rapid growth in computing power demand, the power consumption of devices such as chips and optical modules is also continuously increasing. Consequently, the demand for heat dissipation is also growing, and heat dissipation technology is gradually shifting from air cooling to liquid cooling to improve heat dissipation efficiency. However, electronic devices using these technologies still suffer from inadequate heat dissipation.

[0003] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides an electronic device in which a component to be cooled can be cooled by two liquid cooling plates, resulting in relatively better liquid cooling performance.

[0005] This application provides an electronic device applicable to the field of information and communication technology, such as a computing device like a server, a communication device like an optical communication device, etc. The electronic device includes a device to be cooled and a cooling device. The device to be cooled can be, for example, an optical communication component. The device to be cooled includes two surfaces to be cooled, which are arranged opposite to each other along a first direction. The cooling device includes at least two liquid cooling plates. Liquid cooling plates are provided on both sides of the device to be cooled along the first direction, and the liquid cooling plates can be filled with a liquid cooling medium such as water-based working fluid or fluorinated liquid. Both surfaces to be cooled dissipate heat through the liquid cooling plates.

[0006] With this configuration, the device to be cooled in the above-mentioned electronic device has two surfaces to be cooled that are arranged opposite each other along the first direction, and liquid cooling plates are provided on both sides of the device to be cooled in the first direction, so that both surfaces to be cooled of a device can be cooled and dissipated through the liquid cooling plates. The number of liquid cooling plates can be increased, and the cooling and dissipation effect of the device to be cooled can be better.

[0007] In some possible implementations, the number of devices to be cooled is M, where M>1. The N devices to be cooled can be arranged at intervals along a first direction to form a row group. In one example, M=N, in which case only one row group may exist. In another example, M>N>1, in which case at least two row groups may exist. In a row group, only one liquid cooling plate can be provided between two adjacent devices to be cooled. This single liquid cooling plate can simultaneously cool and dissipate heat from both devices, reducing the number of liquid cooling plates used. This simplifies the structural complexity of the cooling device provided in this application embodiment and helps reduce costs. Simultaneously, it also reduces the number of liquid cooling joints, thereby reducing the potential risk of leakage.

[0008] It is understood that in some other implementations of the embodiments of this application, two liquid cooling plates can also be provided between two adjacent devices to be cooled in a row group. The two liquid cooling plates can be used to cool and dissipate heat for the two devices to be cooled respectively. In this way, the number of liquid cooling plates is increased and the cooling and heat dissipation effect can be better.

[0009] In some possible implementations, the number of devices to be cooled is M, where M>1. P devices to be cooled are arranged at intervals along a second direction to form a column group, with the second direction and the first direction forming an angle. In one example, M=P, in which case only one column group may exist. In another example, M>P, in which case at least two column groups may exist. In a column group, Q adjacent devices to be cooled are cooled by liquid cooling on one side of the first direction through the same liquid cooling plate, where P≥Q>1. This arrangement reduces the number of liquid cooling plates used, thereby simplifying the structural complexity of the cooling device provided in this application embodiment and reducing costs. Simultaneously, the reduction in the number of liquid cooling plates also means a reduction in the number of liquid cooling joints, which correspondingly reduces the number of potential leakage points. This further reduces the risk of leakage in the cooling device, thereby improving the operational stability and service life of the cooling device.

[0010] In some possible implementations, each device to be cooled in a column group is provided with a carrier device. At least a portion of the carrier devices of Q adjacent devices to be cooled is provided with clearance notches, into which the same liquid cooling plate is inserted to reduce the possibility of installation interference between the liquid cooling plate and the carrier device.

[0011] In some possible implementations, the cooling device further includes an inlet pipe and an outlet pipe. Each liquid cooling plate is connected to the inlet pipe, and each liquid cooling plate is connected to the outlet pipe. This effectively reduces the number of inlet and outlet pipes, simplifying the structural complexity of the electronic device provided in this embodiment and thus reducing its cost. Furthermore, reducing the number of inlet and outlet pipes also reduces the space occupied by the cooling device within the device's internal structure, allowing for more internal space to accommodate electronic components and improving the power density of the electronic device.

[0012] It is understood that in some other implementations of the embodiments of this application, the number of at least one of the liquid inlet pipe and the liquid outlet pipe can be at least two. For example, the number of liquid inlet pipes can be at least two. In this case, at least two liquid cooling plates can be fed liquid through different liquid inlet pipes, which is also feasible.

[0013] In some possible implementations, the inlet and outlet pipes are both located on the same side of the liquid cooling plate in a third direction, allowing for centralized arrangement of the inlet and outlet pipes and facilitating their connection to the external liquid supply system of the electronic device. Furthermore, the inlet and outlet pipes are arranged alternately along a second direction, with any two of the first, second, and third directions forming an angle; this further reduces the possibility of interference between the inlet and outlet pipes during installation.

[0014] In some possible implementations, at least a portion of the liquid cooling plate includes a flow-diverting component, which divides the liquid cooling plate into at least two sequentially connected flow-diverting chambers. The liquid cooling plate also has an inlet and an outlet. In each flow-diverting chamber, the upstreammost flow-diverting chamber is connected to the inlet, and the downstreammost flow-diverting chamber is connected to the outlet. With this design, the flow-diverting component divides the liquid cooling plate into at least two sequentially connected flow-diverting chambers. After entering the upstreammost flow-diverting chamber through the inlet, the liquid cooling medium can flow sequentially within each flow-diverting chamber and then exit the liquid cooling plate through the downstreammost flow-diverting chamber and the outlet. This effectively increases the flow path of the liquid cooling medium within the liquid cooling plate, thereby extending the residence time of the liquid cooling medium inside the liquid cooling plate and improving the liquid cooling heat dissipation performance of the liquid cooling plate, thus better achieving cooling of the device to be cooled.

[0015] In some possible implementations, the liquid cooling plate includes a first plate wall and a second plate wall arranged opposite each other along a third direction. The first plate wall is provided with the aforementioned liquid inlet and liquid outlet. The liquid inlet is used for liquid inlet into the liquid cooling plate, and the liquid outlet is used for liquid outlet from the liquid cooling plate. The flow distribution component includes a first-type flow distribution element and a second-type flow distribution element. Both the first-type and second-type flow distribution elements are used to separate two adjacent flow distribution chambers; that is, either a first-type flow distribution element or a second-type flow distribution element is provided between two adjacent flow distribution chambers. The first-type flow distribution element is connected to the first plate wall, and a first connecting port is formed between the first-type flow distribution element and the second plate wall. The first connecting port is used to connect two adjacent flow distribution chambers. The second-type flow distribution element is connected to the second plate wall, and a second connecting port is formed between the second-type flow distribution element and the first plate wall. The second connecting port is also used to connect two adjacent flow distribution chambers. Thus, by separately providing the first-type and second-type flow distribution elements, sequential communication between different flow distribution chambers can be achieved through the first connecting port and the second connecting port.

[0016] In some possible implementations, the surface to be cooled is the larger surface area of ​​the device to be cooled, which increases the contact area between the device and the liquid cooling plate, thereby improving the cooling effect on the device. Furthermore, since the surface to be cooled is the larger surface area of ​​the device, the mounting area of ​​the device is relatively small, allowing for the installation of a larger number of devices to be cooled inside the electronic device. This is of relatively positive significance for improving the power density of the electronic device provided in the embodiments of this application.

[0017] In some possible implementations, the device to be cooled is an optical communication component. The optical communication component includes an optical cage and an optical module inserted into the optical cage. The optical cage has a surface to be cooled. The cage wall of the optical cage has through holes, one port of which is located on the surface to be cooled.

[0018] This configuration creates two heat dissipation paths between the optical module and the liquid cooling plate: first, the optical module can conduct heat to areas without openings in the optical cage, and then the cage transfers the heat to the liquid cooling plate; second, the heat dissipated by the optical module can diffuse to the liquid cooling plate through the opening. In practical use, these two heat dissipation paths can function simultaneously, effectively cooling the optical module.

[0019] It can be seen that the aforementioned through holes may also be absent. In this case, the area of ​​the surface to be cooled can be larger, and correspondingly, the contact area between the optical cage and the liquid cooling plate can also be relatively larger, which has a relatively positive significance for improving cooling efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the electronic device provided in this application;

[0021] Figure 2 This is a schematic diagram of the cooling device.

[0022] Figure 3 This diagram shows the relative positions of the liquid inlet pipe, the liquid cooling plate, and the device to be cooled.

[0023] Figure 4 This diagram shows the relative positions of the liquid outlet pipe, the liquid cooling plate, and the device to be cooled.

[0024] Figure 5 The mounting structure for the device to be cooled and the liquid cooling plate on the carrier device is provided with a clearance notch.

[0025] Figure 6 This is a structural diagram of the installation of the cooling device and supporting components;

[0026] Figure 7 This is a diagram showing the mounting structure of the device to be cooled on the supporting device.

[0027] Figure 8 This is a diagram of the internal structure of a liquid cooling plate;

[0028] Figure 9 This is a diagram showing the internal structure of another type of liquid cooling plate;

[0029] Figure 10 This is a diagram showing the relative positions of a device to be cooled and a liquid cooling plate.

[0030] Figure label:

[0031] 100 - Electronic devices;

[0032] 1000 - Device to be cooled; 1100 - Optical cage; 1110 - Surface to be cooled; 1120 - Through hole; 1200 - Optical module; 1000A - Row group; 1000B - Column group;

[0033] 2000 - Cooling device; 2100 - Liquid cooling plate; 2110 - Inner cavity; 2111 - Flow divider chamber; 2112 - First connecting port; 2113 - Second connecting port; 2120 - First plate wall; 2121 - Liquid inlet; 2122 - Liquid outlet; 2130 - Second plate wall; 2200 - Liquid inlet pipe; 2300 - Liquid outlet pipe; 2400 - Flow divider component; 2410 - Type I flow divider element; 2420 - Type II flow divider element;

[0034] 3000 - Load-bearing device; 3100 - Clearance notch;

[0035] 4000-body. Detailed Implementation

[0036] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0038] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0040] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device provided in this application.

[0041] like Figure 1 As shown, this application provides an electronic device 100 applicable to the field of information and communication technology (ICT). This electronic device 100 can be, for example, a computing device such as a server, a communication device such as an optical communication device, etc. Taking an optical communication device as an example, the electronic device 100 can specifically be a box-type or frame-type device in the fields of optical transceivers, fiber optic transceivers, switches, routers, optical network adapters, fiber optic high-speed dome cameras, base stations, repeaters, telecommunications, etc., and can be used to realize electro-optical conversion interconnection.

[0042] The electronic device 100 may include a device to be cooled 1000, a carrier device 3000, and a body 4000.

[0043] The housing 4000 serves as the external frame of the electronic device 100. The device to be cooled 1000, the supporting device 3000, and other components can all be mounted on this housing 4000 for integrated assembly, thereby improving the structural compactness and power density of the electronic device 100. Furthermore, the housing 4000 essentially determines the structural shape of the electronic device 100. See some implementations for examples. Figure 1 The machine body 4000 can be roughly presented as a cuboid. In other implementations, the machine body 4000 can also be presented as a cylinder, an irregular shape, or other structural shapes, which are not limited here.

[0044] The device to be cooled 1000 is a functional device of the electronic device 100. The device to be cooled 1000 will have a relatively high temperature rise during use. Therefore, it is necessary to cool and dissipate heat in order to ensure the working performance of the device to be cooled 1000.

[0045] The carrier device 3000 is used to mount the device 1000 to be cooled. On one hand, it enables the support and integrated assembly of the device 1000 to be cooled, facilitating its installation and fixation within the housing 4000. On the other hand, the carrier device 3000 can also be provided with related conductive paths and interface modules, which can be used to achieve communication connections between different devices 1000 to be cooled, as well as between devices 1000 to be cooled and other external components. Specifically, the carrier device 3000 can be a printed circuit board (PCB), and the device 1000 to be cooled can be connected to the carrier device 3000 through various methods such as soldering, plug-in, spring connection, and screw connection. The carrier device 3000 can be connected to the housing 4000 through screw connections or other connection methods.

[0046] For ease of description, embodiments of this application may define a first direction X, a second direction Y, and a third direction ( Figure 1 (not shown in the image), any two of the first direction X, the second direction Y, and the third direction can be set at an angle, such as 90 degrees.

[0047] In some implementations, the number of devices 1000 to be cooled can be M, where M > 1, meaning the number of devices 1000 to be cooled can be at least two. Therefore, M represents the total number of devices 1000 to be cooled.

[0048] In some implementations, such as Figure 1 As shown, among the devices 1000 to be cooled, N devices 1000 can be arranged at intervals along the first direction X to form a row group 1000A (see...). Figure 1(The part circled in the middle). It can be seen that N is the number of devices 1000 to be cooled in each row group 1000A.

[0049] In a specific scheme, each device 1000 to be cooled can simply form a row group 1000A, in which case M=N.

[0050] In another specific embodiment, each device 1000 to be cooled can also form at least two row groups 1000A, where M>N>1; each row group 1000A can be arranged along the second direction Y. For different row groups 1000A, the number of devices 1000 to be cooled contained in them can be exactly the same, that is, the N value of each row group 1000A is equal. Alternatively, for different row groups 1000A, the number of devices 1000 to be cooled contained in them can also be not exactly the same, in which case at least two row groups 1000A can have unequal N values.

[0051] Each device 1000 to be cooled in a row group 1000A can be installed on the same carrier device 3000. In this case, the number of carrier devices 3000 can be relatively small, simplifying the internal structure of the devices 1000 to be cooled. Furthermore, when installed on the same carrier device 3000, the devices 1000 to be cooled in the same row group 1000A can be directly connected through conductive lines provided on the carrier device 3000, simplifying the electrical connection structure between the devices 1000 to be cooled in the same row group 1000A. Alternatively, each device 1000 to be cooled in a row group 1000A can also be installed on at least two carrier devices 3000, which is also feasible.

[0052] In some implementations, such as Figure 1 As shown, among the devices 1000 to be cooled, P devices 1000 can be arranged at intervals along the second direction Y to form a group 1000B (see...). Figure 1 (The part circled by the double-dotted line).

[0053] In a specific scheme, each device 1000 to be cooled can simply form a group 1000B, in which case M = P.

[0054] In another specific embodiment, each device 1000 to be cooled can also form at least two column groups 1000B, where M>P>1; each column group 1000B can be arranged along the first direction X. For different column groups 1000B, the number of devices 1000 to be cooled contained in them can be exactly the same, that is, the P value of each column group 1000B is equal. Alternatively, for different column groups 1000B, the number of devices 1000 to be cooled contained in them can also be not exactly the same, in which case at least two column groups 1000B can have unequal P values.

[0055] In a column group 1000B, each device 1000 to be cooled is configured with a carrier device 3000, meaning that the devices 1000 to be cooled in a column group 1000B do not share a carrier device 3000. Of course, in a column group 1000B, two adjacent devices 1000 to be cooled can also be installed on the same carrier device 3000. In this case, devices 1000 to be cooled can be set on both sides of the carrier device 3000 along the second direction Y, which can reduce the number of carrier devices 3000 used and improve the integration and structural compactness of the carrier device 3000 and the devices 1000 to be cooled.

[0056] It should be understood that the above description of the arrangement of the devices 1000 to be cooled is based on the example that the number of devices 1000 to be cooled is at least two. However, in some other implementations of the embodiments of this application, the number of devices 1000 to be cooled can also be only one, which is also feasible.

[0057] Please refer to Figures 2-4 , Figure 2 This is a schematic diagram of the cooling device. Figure 3 This diagram shows the relative positions of the liquid inlet pipe, the liquid cooling plate, and the device to be cooled. Figure 4 This is a diagram showing the relative positions of the liquid outlet pipe, the liquid cooling plate, and the device to be cooled.

[0058] like Figure 2 As shown in the embodiments of this application, the electronic device 100 may further include a cooling device 2000, which may include at least two liquid cooling plates 2100, each containing a liquid cooling medium to provide liquid cooling. The specific type of liquid cooling medium is not limited here; in practical applications, those skilled in the art can select one according to specific needs, as long as it meets the requirements. For example, the liquid cooling medium may be a water-based medium, a fluorinated liquid, etc.

[0059] Combination Figure 3 and Figure 4The device to be cooled 1000 includes two surfaces 1110 arranged opposite each other along a first direction X. Liquid cooling plates 2100 are provided on both sides of the device 1000 along the first direction X, and the two surfaces 1110 are cooled by liquid cooling through the two liquid cooling plates 2100. In this way, a device 1000 can be cooled by two liquid cooling plates 2100, the number of liquid cooling plates 2100 can be increased, and the cooling effect of the device 1000 can be improved.

[0060] It should be understood that the above description of a cooling scheme for one device 1000 to be cooled using two liquid cooling plates 2110 is mainly an exemplary illustration based on the accompanying drawings, and should not be construed as limiting the scope of the electronic device provided in this application. In some other implementations of this application, one device 1000 to be cooled may also be cooled using three or more liquid cooling plates 2100. For example, each surface 1110 to be cooled may be cooled using at least two liquid cooling plates 2100, which is also feasible.

[0061] In some implementations, such as Figure 3 and Figure 4 As shown, in a row group 1000A, only one liquid cooling plate 2100 can be provided between two adjacent devices 1000 to be cooled. With this configuration, one liquid cooling plate 2100 can simultaneously cool two devices 1000 to be cooled, which can reduce the number of liquid cooling plates 2100 used, thereby simplifying the structural complexity of the cooling device 2000 provided in this application embodiment and helping to reduce costs.

[0062] It is known that a liquid cooling plate 2100 typically has two liquid cooling connectors (an inlet connector and an outlet connector). Leakage is prone to occur at these connectors; therefore, the location of the liquid cooling connector can also be referred to as a potential leak location. In this embodiment, the reduced number of liquid cooling plates 2100 means a reduction in the number of liquid cooling connectors, and consequently, a reduction in the number of potential leak locations. This further reduces the risk of leakage in the cooling device 2000, thereby improving its operational stability and service life.

[0063] It should be understood that the implementation of only one liquid cooling plate 2100 between two adjacent devices 1000 to be cooled in a row group 1000A is merely an exemplary illustration in conjunction with the accompanying drawings, and should not be construed as limiting the scope of the electronic device 100 provided in this application. In some other implementations of this application, the liquid cooling plate 2100 can also adopt other layouts, as long as the corresponding technical effects can be achieved. For example, in a row group 1000A, two liquid cooling plates 2100 can also be provided between two adjacent devices 1000 to be cooled. The two liquid cooling plates 2100 can be used to cool and dissipate heat from the two devices 1000 to be cooled respectively. In this way, the number of liquid cooling plates 2100 is increased, and the cooling and heat dissipation effect can be even better.

[0064] It should be noted that the liquid cooling plate 2100 and the surface 1110 of the device to be cooled 1000 should be in direct contact, or indirect contact via a thermal interface material (TIM), to ensure effective heat conduction between the liquid cooling plate 2100 and the device to be cooled 1000. However, in the accompanying drawings of the embodiments of this application, for example... Figure 3 and Figure 4 As shown, in order to more clearly show the relative positional relationship between the liquid cooling plate 2100 and the device to be cooled 1000, the liquid cooling plate 2100 and the device to be cooled 1000 are not in close contact. However, this does not mean that the electronic device 100 provided in this application embodiment needs to set a gap between the liquid cooling plate 2100 and the device to be cooled 1000 in specific implementation.

[0065] In some implementations, such as Figure 2 As shown, the cooling device 2000 may also include only one inlet pipe 2200 and one outlet pipe 2300.

[0066] Combination Figure 3 Each liquid cooling plate 2100 can be connected to the liquid inlet pipe 2200 to provide liquid cooling fluid to each liquid cooling plate 2100 through the liquid inlet pipe 2200. Figure 4 Each liquid cooling plate 2100 can be connected to the liquid outlet pipe 2300 so that the liquid cooling working fluid in each liquid cooling plate 2100 can be discharged through the liquid outlet pipe 2300. In this way, through the cooperation of the liquid inlet pipe 2200 and the liquid outlet pipe 2300, the liquid cooling working fluid can be circulated within each liquid cooling plate 2100.

[0067] In the above implementation, each liquid cooling plate 2100 can share the same inlet pipe 2200 for liquid intake and the same outlet pipe 2300 for liquid discharge. This effectively reduces the number of inlet pipes 2200 and outlet pipes 2300, simplifying the structural complexity of the electronic device 100 provided in this embodiment and thus reducing its cost. Furthermore, the reduction in the number of inlet pipes 2200 and outlet pipes 2300 also reduces the space occupied by the cooling device 2000 within the housing 4000, allowing more space inside the housing 4000 to accommodate electronic components and improving the power density of the electronic device 100.

[0068] In specific installation, the liquid inlet pipe 2200 and liquid outlet pipe 2300 can both be located on the same side of the liquid cooling plate 2100 in the third direction Z, so as to centrally arrange the liquid inlet pipe 2200 and liquid outlet pipe 2300, thereby facilitating the connection between the liquid inlet pipe 2200 and liquid outlet pipe 2300 and the liquid supply system (not shown in the figure) outside the electronic device 100.

[0069] The inlet pipe 2200 and the outlet pipe 2300 can be arranged alternately along the second direction Y to reduce the possibility of mutual interference between the inlet pipe 2200 and the outlet pipe 2300 during installation.

[0070] It should be understood that the above description of the number and arrangement of the inlet pipe 2200 and outlet pipe 2300 is only a description of the embodiments of this application. Figures 2-4 This is an exemplary description and should not be construed as limiting the scope of the electronic device 100 provided in this application. In some other implementations of this application, the number of inlet pipes 2200 and outlet pipes 2300 can be different, and other layouts can be adopted, as long as the requirements of use are met. For example, the inlet pipes 2200 and outlet pipes 2300 can be located on both sides of the liquid cooling plate 1000 along the third direction Z. For another example, the number of at least one of the inlet pipes 2200 and outlet pipes 2300 can be at least two; for instance, the number of inlet pipes 2200 can be at least two, in which case at least two liquid cooling plates 2100 can be fed liquid through different inlet pipes 2200.

[0071] Please refer to Figure 5 and Figure 6 , Figure 5 The mounting structure for the device to be cooled and the liquid cooling plate on the carrier device is provided with a clearance notch. Figure 6 This is a structural diagram of the installation of the cooling device and supporting components.

[0072] In some implementations, such as Figure 5 and Figure 6 As shown, in a column group 1000B, on one side of each device 1000 to be cooled in the first direction X, liquid cooling heat dissipation can be performed through the same liquid cooling plate 2100.

[0073] With such a setting, one liquid cooling plate 2100 can also cool and dissipate heat from each liquid cooling plate 2100 in the same column group 1000B at the same time, which can reduce the number of liquid cooling plates 2100 used, and thus can simplify the structural complexity of the cooling device 2000 provided in the embodiment of the present application and is beneficial to cost reduction. At the same time, the reduction in the number of liquid cooling plates 2100 also means a reduction in the number of liquid cooling joints. Correspondingly, that is, the number of potential leakage positions can be reduced, which can also reduce the liquid leakage risk of the cooling device 2000, and thus can improve the operation stability and service life of the cooling device 2000.

[0074] As described above, in the same column group 1000B, each device 1000 to be cooled is equipped with a carrier device 3000. To avoid installation interference between the liquid cooling plate 2100 and the carrier device 3000, in the embodiment of the present application, as Figure 5 and Figure 6 shown, in the same column group 1000B, the carrier device 3000 of each device 1000 to be cooled can also be provided with an avoidance notch 3100, and the liquid cooling plate 2100 can be inserted into the avoidance notch 3100.

[0075] It should be understood that the above structural descriptions of the device 1000 to be cooled, the liquid cooling plate 2100, and the carrier device 3000 are only an exemplary description made by the embodiment of the present application in combination with Figure 5 and Figure 6 and cannot be used as a limitation on the implementation scope of the electronic device 100 provided in the embodiment of the present application. In some other implementation manners of the embodiment of the present application, the device 1000 to be cooled, the liquid cooling plate 2100, and the carrier device 3000 can also adopt other structural settings. For example, among the P devices 1000 to be cooled in the same column group 1000B, there may be Q adjacent devices 1000 that are cooled and dissipated heat through the same liquid cooling plate 2100 on one side in the first direction X. In the above Figure 5 and Figure 6 implementation manner, Q = P; while in some other implementation manners of the embodiment of the present application, Q < P. At this time, the carrier device 3000 configured for these Q devices 1000 to be cooled can be provided with an avoidance notch 3100, and the carrier device 3000 of other devices 1000 to be cooled in the column group 1000B can not be provided with an avoidance notch 3100 to ensure the structural strength of the carrier device 3000. For another example, not all of the carrier devices 3000 configured for Q adjacent devices 1000 to be cooled need to be provided with an avoidance notch 3100; for example, referring to Figure 5 Given the orientation and positional relationship, the lowest layer of the supporting device 3000 does not need to have an avoidance gap 3100.

[0076] Please refer to Figure 7 , Figure 7 This is a diagram showing the installation structure of the device to be cooled on the supporting device.

[0077] In some implementations, the surface to be cooled 1110 can be a large surface of the device to be cooled 1000. In the embodiments of this application, "large surface" specifically refers to the surface with a relatively large area among the various surfaces of the device to be cooled 1000. Setting the surface to be cooled 1110 as the large surface of the device to be cooled 1000 can effectively increase the contact area between the device to be cooled 1000 and the liquid cooling plate 2100, thereby improving the cooling and heat dissipation effect of the device to be cooled 1000.

[0078] In a specific solution, such as Figure 7 As shown, the device to be cooled 1000 can be roughly shaped as a cuboid. The dimension of the device to be cooled 1000 in the third direction Z is its length L, the dimension of the device to be cooled 1000 in the second direction Y is its height H, and the dimension of the device to be cooled 1000 in the first direction X is its width W, where L>H>W. The large surface of the device to be cooled 1000 (i.e., the cooling surface 1110) specifically refers to the two surfaces of the device to be cooled 1000 that are opposite each other along the first direction X. The area of ​​the cooling surface 1110 can be L. × H.

[0079] It should be understood that the above description regarding the cuboid shape of the device to be cooled 1000 is merely an exemplary illustration based on the accompanying drawings of this application embodiment, and should not be construed as limiting the scope of the electronic device 100 provided in this application embodiment. Under the condition of meeting the usage requirements, the device to be cooled 1000 can also be configured in other structural forms. For example, the device to be cooled 1000 can also be other prism shapes besides cuboid shapes, such as hexagonal prisms.

[0080] In addition, since the surface to be cooled 1110 is the large surface of the device to be cooled 1000, the mounting area of ​​the device to be cooled 1100 and the carrier device 3000 is relatively small. Under the condition that the structural dimensions of the carrier device 3000 remain unchanged, the carrier device 3000 may be able to mount a larger number of devices to be cooled 1100, which is of relatively positive significance for improving the power density of the electronic equipment provided in the embodiments of this application.

[0081] Please refer to Figure 8 and Figure 9 , Figure 8This is a diagram showing the internal structure of a liquid cooling plate. Figure 9 This is a diagram of the internal structure of another type of liquid cooling plate.

[0082] In some implementations, at least a portion of the liquid cooling plate 2100 of the electronic device 100 provided in this application embodiment may be provided with a shunt component 2400.

[0083] The flow divider 2400 is used to divide and form at least two sequentially connected flow divider chambers 2111 within the liquid cooling plate 2100. The liquid cooling plate 2100 may have an inlet 2121 and an outlet 2122. In the flow path between the inlet 2121 and the outlet 2122, the upstream chamber 2111 can be connected to the inlet 2121, and the downstream chamber 2111 can be connected to the outlet 2122. After the liquid cooling medium is introduced into the liquid cooling plate 2100 through the inlet 2121, it can flow sequentially in each flow divider chamber 2111, and finally, it can flow out of the liquid cooling plate 2100 through the outlet 2122. With the aforementioned diversion component 2400, the flow path of the liquid cooling medium within the liquid cooling plate 2100 is relatively long, thereby extending the residence time of the liquid cooling medium inside the liquid cooling plate 2100 and improving the liquid cooling performance of the liquid cooling plate 2100. This configuration allows the liquid cooling plate 2100 to better cool the devices 1000 to be cooled. Specifically, when Q adjacent devices 1000 to be cooled in a single group 1000B share the same liquid cooling plate 2100 for cooling, the diversion component 2400 within the same liquid cooling plate 2100 effectively increases the time for the liquid cooling medium to flow out of the liquid cooling plate 2100, thus enabling the liquid cooling medium to provide relatively better liquid cooling to the Q devices 1000 to be cooled.

[0084] Reference Figure 8 and Figure 9 The liquid cooling plate 2100 may include a first plate wall 2120 and a second plate wall 2130 disposed opposite each other along a third direction Z. The first plate wall 2120 is provided with a liquid inlet 2121 and a liquid outlet 2122. The liquid inlet 2121 is used to communicate with the liquid inlet pipe 2200, and the liquid outlet 2122 is used to communicate with the liquid outlet pipe 2300.

[0085] The flow splitting component 2400 may include a first-type flow splitting element 2410 and a second-type flow splitting element 2420. Both the first-type flow splitting element 2410 and the second-type flow splitting element 2420 can be disposed between two adjacent flow splitting chambers 2111. The first-type flow splitting element 2410 can be connected to the first plate wall 2120, and a first connecting port 2112 can be formed between the first-type flow splitting element 2410 and the second plate wall 2130, the first connecting port 2112 being used to connect the two adjacent flow splitting chambers 2111. The second-type flow splitting element 2420 is connected to the second plate wall 2130, and a second connecting port 2113 can be formed between the second-type flow splitting element 2420 and the first plate wall 2120, the second connecting port 2113 also being used to connect the two adjacent flow splitting chambers 2111. Thus, by setting up a first-class diversion element 2410 and a second-class diversion element 2420 respectively, the sequential conduction between different diversion chambers 2111 can be achieved through the first connecting port 2112 and the second connecting port 2113.

[0086] Here, the embodiments of this application do not limit the specific structural form and arrangement of the first-class shunt element 2410 and the second-class shunt element 2420. In practical applications, those skilled in the art can select according to specific needs, as long as the requirements of use are met. For example, see [link to relevant documentation]. Figure 8 Both the first-type shunt element 2410 and the second-type shunt element 2420 can be flat. The first-type shunt element 2410 can extend along the third direction Z, while the second-type shunt element 2420 can be set at an angle to the third direction Z, and this angle can be less than 90 degrees. For example, see also... Figure 9 Both the first-type shunt element 2410 and the second-type shunt element 2420 can be flat plates, and both can extend along a third direction Z. For example, at least one of the first-type shunt element 2410 and the second-type shunt element 2420 can be a bent plate, such as an arc-shaped plate. For another example, the first-type shunt element 2410 and the second-type shunt element 2420 may not be mounted on the first plate wall 2120 and the second plate wall 2130, as shown in the reference... Figure 8 The orientation and positional relationship within the liquid cooling plate 2100 are as follows: for example, a type 2410 flow divider can be installed on the top wall of the liquid cooling plate 2100, and a type 2420 flow divider can be installed on the bottom wall of the liquid cooling plate 2100. In this implementation, the flow path of the liquid cooling medium within the liquid cooling plate 2100 is similar to that described above. Figure 8 as well as Figure 9 They are all different.

[0087] Regarding the above-described implementation methods, the embodiments of this application do not limit the specific type of the device to be cooled 1000. In practical applications, those skilled in the art can determine the type based on the type of electronic device 100, etc. For example, the device to be cooled 1000 can be an optical communication component, a chip, a capacitor, an inductor, a hard disk, a memory module, etc.

[0088] Please refer to Figure 10 , Figure 10 This is a diagram showing the relative positions of a device to be cooled and a liquid cooling plate.

[0089] In some implementations, such as Figure 10 As shown, the device to be cooled, 1000, can be an optical communication component.

[0090] The optical communication component may include an optical cage 1100 and an optical module 1200 inserted into the optical cage 1100. The cage wall of the optical cage 1100 may be provided with through holes 1120, one port of which is located on the surface to be cooled 1110. In this way, two heat dissipation paths can be formed between the optical module 1200 and the liquid cooling plate 2100: first, the optical module 1200 can transfer heat through thermal conduction to the area of ​​the optical cage 1100 without through holes 1120, and then from the optical cage 1100 to the liquid cooling plate 2100; second, the heat dissipated by the optical module 1200 can diffuse to the liquid cooling plate 2100 through the through hole 1120. In practical use, these two heat dissipation paths can function simultaneously, effectively cooling the optical module 1200.

[0091] It should be understood that in some other implementations of the embodiments of this application, the optical cage 1100 may not be provided with the above-mentioned through hole 1120, which is also feasible.

[0092] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An electronic device, characterized in that, The device includes a device to be cooled and a cooling device. The device to be cooled includes two surfaces to be cooled that are arranged opposite each other along a first direction. The cooling device includes at least two liquid cooling plates. The liquid cooling plates are arranged on both sides of the device to be cooled along the first direction. Both surfaces to be cooled are cooled by liquid cooling through the liquid cooling plates.

2. The electronic device according to claim 1, characterized in that, The number of devices to be cooled is M, where M>1; N of the devices to be cooled are arranged at intervals along the first direction to form a row group, M≥N>1; in a row group, a liquid cooling plate is provided between two adjacent devices to be cooled.

3. The electronic device according to claim 1, characterized in that, The number of devices to be cooled is M, where M>1; P devices to be cooled are arranged at intervals along a second direction to form a column group, the second direction and the first direction are set at an angle, M≥P>1; in a column group, Q adjacent devices to be cooled are cooled by liquid cooling through the same liquid cooling plate on one side of the first direction, P≥Q>1.

4. The electronic device according to claim 3, characterized in that, In one of the column groups, each of the devices to be cooled is provided with a carrier device; at least a portion of the carrier devices disposed in the adjacent Q devices to be cooled is provided with a clearance notch, and the same liquid cooling plate is inserted into the clearance notch.

5. The electronic device according to any one of claims 1-4, characterized in that, The cooling device further includes an inlet pipe and an outlet pipe, each of the liquid cooling plates is connected to the inlet pipe and each of the liquid cooling plates is connected to the outlet pipe.

6. The electronic device according to claim 5, characterized in that, The inlet pipe and the outlet pipe are both located on the same side of the liquid cooling plate in a third direction, and the inlet pipe and the outlet pipe are arranged at intervals along the second direction, with any two of the first direction, the second direction and the third direction forming an angle.

7. The electronic device according to any one of claims 1-4, characterized in that, At least a portion of the liquid cooling plate is provided with a flow-dividing component, which is used to divide the liquid cooling plate into at least two sequentially connected flow-dividing chambers; the liquid cooling plate has a liquid inlet and a liquid outlet, and in each of the flow-dividing chambers, the upstream flow-dividing chamber is connected to the liquid inlet, and the downstream flow-dividing chamber is connected to the liquid outlet.

8. The electronic device according to claim 7, characterized in that, The liquid cooling plate includes a first plate wall and a second plate wall arranged opposite to each other along a third direction, and the first plate wall is provided with the liquid inlet and the liquid outlet. The flow splitting component includes a type I flow splitting element and a type II flow splitting element, both of which are used to separate two adjacent flow splitting chambers; The first type of diversion element is connected to the first plate wall, and a first communication port is formed between the first type of diversion element and the second plate wall. The first communication port is used to connect two adjacent diversion chambers. The second type of diversion element is connected to the second plate wall, and a second communication port is formed between the second type of diversion element and the first plate wall. The second communication port is also used to connect two adjacent diversion chambers.

9. The electronic device according to any one of claims 1-4, characterized in that, The surface to be cooled is the large surface of the device to be cooled.

10. The electronic device according to any one of claims 1-4, characterized in that, The device to be cooled is an optical communication component, which includes an optical cage and an optical module plugged into the optical cage. The optical cage has the surface to be cooled.

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