Heat dissipation structure of a case
By using a split thermal conductivity structure and axial fan exhaust cooling, the problem of efficient heat dissipation in a closed environment of the data acquisition chassis is solved, and ultra-low thermal resistance directional heat dissipation of high-density board chips is achieved, ensuring normal operation of the chassis in harsh environments.
Patent Information
- Application Number
- CN202521957418.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-11
AI Technical Summary
Existing data acquisition chassis face heat dissipation challenges under high integration and high power density, especially in enclosed environments. Traditional heat dissipation methods cannot meet the requirements for efficient heat dissipation and there is a contradiction between airtightness and protection.
A split thermal conductivity structure is adopted, which uses a first heat pipe, a second heat pipe and a thermally conductive substrate to transfer the heat from the chip to the heat sink. Combined with an axial fan for exhaust cooling, it ensures the airtightness of the chassis, while reducing contact thermal resistance and avoiding the high cost and leakage risk of liquid cooling systems.
It achieves efficient chip heat dissipation in a closed environment, breaks through the thermal conduction barrier of high-density board chips, ensures that the data acquisition chassis can work normally in harsh environments, and avoids the high cost and leakage risk of liquid cooling systems.
Smart Images
Figure CN224684586U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of data acquisition equipment technology, specifically to the heat dissipation structure of a chassis. Background Technology
[0002] With the rapid development of industrial automation, testing and measurement, data centers, and other fields, data acquisition equipment is evolving towards higher integration, higher channel density, and stronger computing power. This has led to a dramatic increase in the power density and heat generation of the chips on the electronic boards inside modern data acquisition chassis.
[0003] Data acquisition chassis may be used in harsh environments such as high temperature, high humidity, and dust. Some special scenarios also involve factors such as vibration and electromagnetic interference. In order to meet the needs of different places, data acquisition chassis adopt the form of a sealed chassis, which has good vibration and shock resistance, three-proof performance and electromagnetic compatibility performance. However, this also isolates the heat-generating components inside the chassis from the outside air, increasing the difficulty of heat dissipation and causing the temperature to rise continuously. A more effective heat dissipation structure is needed to achieve heat dissipation design of internal heat sources.
[0004] Current chassis cooling methods mainly include the following: One method involves installing fans inside the chassis to drive airflow across the circuit boards and heatsinks, carrying heat away from the chassis through convection. This solution requires numerous ventilation holes in the chassis walls, completely compromising the chassis's airtightness and failing to meet protection requirements against harsh environments such as dust and humidity. Furthermore, dust, moisture, and contaminants carried by external air directly enter the chassis, contaminating circuit boards and components, accelerating corrosion and aging, and significantly reducing long-term equipment reliability. For high heat flux density areas at the chip level, the specific heat capacity and thermal conductivity of air are limited, especially when circuit boards are densely packed, making airflow organization difficult and heat dissipation efficiency insufficient for high-power chips. Another method involves using coolant inside a sealed chassis to directly or indirectly cool heat-generating chips through cold plates, microchannels, etc., with a pump driving liquid circulation to carry heat to an external heat exchanger for dissipation by fans. This solution is complex, costly, and difficult to maintain. Moreover, the liquid circulation system is prone to leakage; if a leak occurs, liquid entering the sealed chassis can lead to catastrophic equipment damage. Sealing and long-term operational reliability are significant challenges; another approach is natural convection heat transfer, where thermally conductive materials transfer heat from the chip to the chassis, relying on the surface of the casing and the environment for convection and radiation heat transfer. This solution has very limited heat transfer capacity, limiting it to low-power devices and failing to meet the demands of modern high-power-density data acquisition equipment, as the chip is highly susceptible to overheating. Utility Model Content
[0005] This utility model addresses the technical problems existing in the prior art by providing a heat dissipation structure for the chassis.
[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: The chassis's heat dissipation structure includes: an outer chassis shell, an inner chassis shell housed inside the outer chassis shell, and a heat dissipation airflow channel formed between the outer and inner chassis shells. Both inner walls of the inner chassis shell are provided with first thermally conductive substrates, each connected to one of two first heat pipes and two of two second heat pipes. The ends of the two first heat pipes are connected to second thermally conductive substrates, and the ends of the two second heat pipes are connected to third thermally conductive substrates. Heat sinks are provided on both sides of the outer surface of the inner chassis shell, corresponding to the first thermally conductive substrates. Air inlets are provided on both sides of the front of the outer chassis shell, and two axial fans are symmetrically mounted at the rear of the outer chassis shell.
[0007] The beneficial effects of this utility model are as follows: the heat of the chip is absorbed by the second and third thermally conductive substrates, and the heat is transferred to the heat sink by the first heat pipe, the second heat pipe and the first thermally conductive substrate. Then, the axial fan is used for exhaust heat dissipation, thereby achieving the purpose of heat dissipation of the chip and preventing the chip from overheating. Through the split thermal conduction structure with the first and second heat pipes as the core, the heat conduction barrier of high-density board chips is broken through while ensuring the airtight protection of the data acquisition chassis, so as to achieve ultra-low thermal resistance directional heat dissipation. At the same time, the high cost and leakage risk of liquid cooling system are avoided, so that the data acquisition chassis can work normally in harsh environments.
[0008] Furthermore, the first thermally conductive substrate is connected to the inner wall of the chassis inner casing by bolts. Both sides of the chassis inner casing have through slots, and the heat sink is placed within these slots and connected to the first thermally conductive substrate via thermally conductive adhesive. This reduces contact thermal resistance and allows for better heat conduction.
[0009] Furthermore, the third thermally conductive substrate has two third mounting holes, and the evaporation section of the second heat pipe is fixed in the third mounting holes using thermally conductive adhesive. The second thermally conductive substrate also has two second mounting holes, and the evaporation section of the first heat pipe is fixed in the second mounting holes using thermally conductive adhesive. The first thermally conductive substrate has four first mounting holes, and the condensation sections of the two first heat pipes and two second heat pipes are all fixed in the first mounting holes using thermally conductive adhesive. This ensures tight contact between the first and second heat pipes and the second and third thermally conductive substrates and the heat sink, respectively, greatly reducing contact thermal resistance and ensuring stable heat transfer into the heat dissipation channel.
[0010] Furthermore, mounting frames are provided on both sides of the outer surface of the chassis casing, and dust filters are installed on the mounting frames, with the dust filters positioned outside the air inlet. This intercepts dust and impurities in the air entering the cooling duct.
[0011] Furthermore, the mounting frame is bolted to the outside of the chassis housing. The mounting frame can be removed to clean the dust filter.
[0012] Furthermore, temperature sensors are installed on both sides of the inner wall of the heat dissipation duct. Monitoring the temperature inside the heat dissipation duct facilitates timely cleaning of the dust filter.
[0013] Furthermore, the heatsink is made of pure copper, and the direction of the fins on the heatsink surface is consistent with the airflow direction of the axial fan. This ensures that the circulating air can fully contact the fins on the heatsink surface, guaranteeing effective heat dissipation. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the internal structure of the outer casing of the chassis in this utility model; Figure 3 for Figure 2 A top-view structural diagram; Figure 4 This is one of the structural schematic diagrams of the inner casing of the chassis in this utility model; Figure 5 This is the second schematic diagram of the structure of the inner casing of the chassis in this utility model; Figure 6 This is a schematic diagram of the regional structure of the first thermally conductive substrate in this utility model; Figure 7 This is a schematic diagram of the structure of the first heat pipe and the second heat pipe in this utility model.
[0015] The attached diagram lists the components represented by each number as follows: 1. Chassis outer shell; 101. Air inlet; 102. Axial fan; 103. Mounting frame; 104. Dust filter; 2. Chassis inner shell; 201. Heat dissipation duct; 202. First thermal conductive substrate; 2021. First mounting hole; 203. First heat pipe; 204. Second thermal conductive substrate; 2041. Second mounting hole; 205. Second heat pipe; 206. Third thermal conductive substrate; 2061. Third mounting hole; 207. Heat sink; 208. Through slot; 209. Temperature sensor. Detailed Implementation
[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0017] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0018] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.
[0019] In the description of this application, spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., are used herein to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "below" or "under" other elements or features would be oriented "over" other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein are interpreted accordingly.
[0020] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.
[0021] Example 1 Figure 1This is a structural diagram of the heat dissipation structure of the chassis provided in an embodiment of the present utility model. Figure 2 This is a schematic diagram of the internal structure of the outer casing of the chassis in this utility model. Figure 3 for Figure 2 Top view structural diagram, Figure 4 This is one of the structural schematic diagrams of the inner casing of the chassis in this utility model. For example... Figures 1 to 4 As shown, the device includes: an outer casing 1, an inner casing 2 disposed inside the outer casing 1, a heat dissipation airflow duct 201 formed between the outer casing 1 and the inner casing 2, a first thermally conductive substrate 202 disposed on both inner walls of the inner casing 2, two first heat pipes 203 and two second heat pipes 205 respectively connected to the first thermally conductive substrates 202, a second thermally conductive substrate 204 disposed at the ends of the two first heat pipes 203, a third thermally conductive substrate 206 disposed at the ends of the two second heat pipes 205, and heat sinks 207 disposed on both sides of the outer surface of the inner casing 2, with the heat sinks 207 corresponding to the first thermally conductive substrates 202. Air inlets 101 are disposed on both sides of the front of the outer casing 1, and two axial fans 102 are symmetrically mounted at the rear of the outer casing 1. The heat sink 207 is made of pure copper, and the direction of the fins on the surface of the heat sink 207 is consistent with the airflow direction of the axial fan 102.
[0022] The two sides of the chip are connected to the second thermally conductive substrate 204 and the third thermally conductive substrate 206 respectively via thermal grease to reduce contact thermal resistance. The second thermally conductive substrate 204 and the third thermally conductive substrate 206 are fixed to the board by four Φ5 bolts to reduce contact thermal resistance. The second thermally conductive substrate 204 and the third thermally conductive substrate 206 absorb the heat generated by the chip and conduct the heat to the first thermally conductive substrate 202 through the first heat pipe 203 and the second heat pipe 205. Then, the heat is conducted into the heat dissipation channel 201 by the heat sink 207. Axial fan 102 draws air, and the airflow path is consistent with the length direction of the fins on heat sink 207. Therefore, it can fully contact heat sink 207 and transfer heat outward to achieve the purpose of heat dissipation and prevent chip overheating. Through the triple heat dissipation architecture of chip-level directional heat conduction, cross-chassis sealed heat transfer, and external air duct heat dissipation, the heat dissipation architecture can break through the thermal conduction barrier of high-density board chips while ensuring the airtight protection of the data acquisition chassis. This achieves ultra-low thermal resistance directional heat dissipation, while avoiding the high cost and leakage risk of liquid cooling system, so that the data acquisition chassis can work normally in harsh environments.
[0023] Figure 4 This is one of the structural schematic diagrams of the inner casing of the chassis in this utility model. Figure 5 This is the second structural schematic diagram of the inner casing of the chassis in this utility model. (See diagram below.) Figure 4 and Figure 5As shown, the first thermally conductive substrate 202 is connected to the inner wall of the inner casing 2 of the chassis by bolts. Both sides of the inner casing 2 of the chassis are provided with through slots 208. The heat sink 207 is disposed in the through slots 208 and connected to the first thermally conductive substrate 202 by thermally conductive adhesive.
[0024] The heat sink 207 is directly mounted on the first thermally conductive substrate 202 with thermally conductive adhesive, which can reduce contact thermal resistance, improve heat conduction, and enhance heat dissipation.
[0025] Figure 6 This is a schematic diagram of the regional structure of the first thermally conductive substrate in this utility model. Figure 6 As shown, the third thermally conductive substrate 206 has two third mounting holes 2061 inside, and the evaporation section of the second heat pipe 205 is fixed in the third mounting hole 2061 by thermally conductive adhesive. The second thermally conductive substrate 204 has two second mounting holes 2041 inside, and the evaporation section of the first heat pipe 203 is fixed in the second mounting hole 2041 by thermally conductive adhesive. The first thermally conductive substrate 202 has four first mounting holes 2021 inside, and the condensation sections of the two first heat pipes 203 and the two second heat pipes 205 are all fixed in the first mounting holes 2021 by thermally conductive adhesive.
[0026] The first heat pipe 203 and the second heat pipe 205 can achieve directional heat transfer in a compact space. The evaporation sections of the first heat pipe 203 and the second heat pipe 205 absorb heat from both sides of the chip and conduct it to the first thermally conductive substrate 202. The heat sink 207 is used to transfer the heat outward. The thermally conductive adhesive ensures that the first heat pipe 203 and the second heat pipe 205 are in close contact with the second thermally conductive substrate 204, the third thermally conductive substrate 206 and the heat sink 207 respectively. This can greatly reduce the contact thermal resistance and ensure that the heat can be stably introduced into the heat dissipation channel 201.
[0027] Example 2 Based on Embodiment 1, the present invention can be further improved in the following ways, such as... Figures 1 to 3 As shown, mounting frames 103 are provided on both sides of the outer surface of the chassis cover 1. Dustproof nets 104 are provided on the mounting frames 103, and the dustproof nets 104 cover the outside of the air inlet 101. The mounting frames 103 are fixed to the outside of the chassis cover 1 with bolts. Temperature sensors 209 are installed on both sides of the inner wall of the heat dissipation duct 201.
[0028] The dust filter 104 intercepts dust and impurities from the air entering the cooling duct 201, preventing them from adhering to the fins of the radiator 207 and the blades of the axial fan 102, thus reducing heat dissipation efficiency. Furthermore, the temperature sensor 209 monitors the temperature within the cooling duct 201. When a large amount of dust and impurities are trapped on the surface of the dust filter 104, less air enters the cooling duct 201, reducing heat dissipation and causing the temperature inside the cooling duct 201 to rise. Therefore, the temperature sensor 209 can monitor the temperature in real time. When a temperature increase is detected, the bolts on the mounting frame 103 can be removed to remove the dust filter 104 for cleaning, preventing excessively high temperatures that could lead to burnout or malfunction of electronic components if not detected in time.
[0029] While embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the above embodiments are merely exemplary embodiments or examples, and the scope of this utility model is not limited by these embodiments or examples, but only by the granted claims and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. Furthermore, the steps may be performed in a different order than that described in this disclosure. Further, various elements in the embodiments or examples may be combined in various ways. Importantly, as the technology evolves, many elements described herein can be replaced by equivalents that appear after this disclosure.
Claims
1. A heat dissipation structure for a chassis, characterized in that, include: The chassis outer shell (1) has an inner chassis shell (2) inside it. A heat dissipation air duct (201) is formed between the chassis outer shell (1) and the inner chassis shell (2). The inner walls on both sides of the inner chassis shell (2) are provided with a first heat-conducting substrate (202). Two first heat pipes (203) and two second heat pipes (205) are respectively connected to the first heat-conducting substrate (202). The ends of the two first heat pipes (203) are provided with a second heat-conducting substrate (204), and the ends of the two second heat pipes (205) are provided with a third heat-conducting substrate (206). Heat sinks (207) are provided on both sides of the outer surface of the inner chassis shell (2), and the heat sinks (207) correspond to the first heat-conducting substrates (202). The front two sides of the chassis outer shell (1) are provided with air inlets (101), and two axial flow fans (102) are symmetrically installed at the rear of the chassis outer shell (1).
2. The heat dissipation structure of the chassis according to claim 1, characterized in that, The first thermally conductive substrate (202) is connected to the inner wall of the inner casing (2) of the chassis by bolts. Both sides of the inner casing (2) of the chassis are provided with through slots (208). The heat sink (207) is disposed in the through slots (208) and connected to the first thermally conductive substrate (202) by thermally conductive adhesive.
3. The heat dissipation structure of the chassis according to claim 1, characterized in that, The third thermally conductive substrate (206) has two third mounting holes (2061) inside, and the evaporation section of the second heat pipe (205) is fixed in the third mounting holes (2061) by thermally conductive adhesive. The second thermally conductive substrate (204) has two second mounting holes (2041) inside, and the evaporation section of the first heat pipe (203) is fixed in the second mounting hole (2041) by thermally conductive adhesive; The first thermally conductive substrate (202) has four first mounting holes (2021) inside. The condensation sections of the two first heat pipes (203) and the two second heat pipes (205) are fixed in the first mounting holes (2021) by thermally conductive adhesive.
4. The heat dissipation structure of the chassis according to claim 1, characterized in that, The outer surface of the chassis cover (1) is provided with mounting frames (103) on both sides, and dustproof nets (104) are provided on the mounting frames (103), and the dustproof nets (104) are covered on the outside of the air inlet (101).
5. The heat dissipation structure of the chassis according to claim 4, characterized in that, The mounting frame (103) is fixed to the outside of the outer casing (1) of the chassis by bolts.
6. The heat dissipation structure of the chassis according to claim 4, characterized in that, Temperature sensors (209) are installed on both sides of the inner wall of the heat dissipation duct (201).
7. The heat dissipation structure of the chassis according to claim 1, characterized in that, The heat sink (207) is made of pure copper, and the direction of the fins on the surface of the heat sink (207) is consistent with the airflow direction of the axial fan (102).