A 3D display screen

Abstract

The utility model discloses a 3D display screen forms wire grid polarizing layer or pastes high voltage and high temperature polarizing layer directly on the LED wafer surface, and polarizing structure is cut into the chip level with wafer, and the traditional secondary alignment is dispensed with, and the deviation caused by thermal expansion and cold shrinkage is avoided, adopts micro - nanometer processing or domestic material, and the dependence on foreign core film material and equipment is got rid of, and cost and supply chain risk are reduced. On the structure, the wire grid polarizing layer or polarizing layer of chip integration, cooperate adjacent pixel unit vertical absorption axis / reflecting axis and the phase difference film accurate angle setting, guarantee polarized light separation accuracy, improve 3D stability, the wire grid polarizing layer has the characteristics of cutting resistance and high temperature resistance, and the reliability is enhanced by superimposed protective layer, and the high density integration of pixel is realized in combination with COB technology, and the display effect and life are optimized.

Description

Technical Field

[0001] This utility model belongs to the field of display screen technology, and specifically relates to a 3D display screen. Background Technology

[0002] COB (Chip-on-Board) LED displays exhibit significant technological advantages over traditional SMD (Surface Mount Device) processes due to their chip-integrated packaging structure. By directly bonding multiple LED chips to the substrate and encapsulating them as a whole, high-density integration of pixel units is achieved, resulting in a significant reduction in pixel pitch, more delicate image details, and smoother dynamic display effects. At the same time, its integrated optical design effectively optimizes the light emission angle, significantly reducing glare and moiré patterns. Combined with advanced color temperature calibration technology, color uniformity is improved by 20%-30% compared to SMD processes, allowing for the presentation of more realistic colors closer to the natural spectrum.

[0003] In terms of reliability, the COB process eliminates the pin soldering step of the SMD process, reducing failure points such as cold solder joints and desoldering. Its operational stability is improved by more than 40% in harsh environments such as high temperature and high humidity. At the same time, the modular maintenance method reduces the maintenance cost per pixel failure and extends the service life to over 80,000 hours. These characteristics make it widely used in high-end display scenarios such as ultra-high-definition monitoring centers and large exhibition venues.

[0004] However, existing technologies for upgrading COB displays to 3D display functionality have significant limitations. When using surface-mount polarizers and phase retardation films, it is necessary to ensure micron-level alignment accuracy between polarizers and pixel units. In actual production, substrate deformation caused by thermal expansion and contraction can easily lead to alignment deviations, directly affecting the stability of the 3D stereoscopic effect. More importantly, the alternating left-handed and right-handed polarizers required to achieve left / right eye parallax separation rely on high-precision photolithography equipment for the fabrication of their periodic microstructures. Furthermore, the formulation and production process of the core optical film materials are monopolized by a few foreign manufacturers, resulting in high production costs and supply chain security risks, which seriously restricts the industrialization process of independently controllable 3D display technology. Utility Model Content

[0005] The purpose of this invention is to provide a 3D display screen to solve the problems in the prior art.

[0006] Therefore, this utility model provides a 3D display screen, including: a display screen back panel;

[0007] The back panel of the display screen has multiple pixel units distributed thereon, and a phase difference film is attached to the surface of the pixel unit;

[0008] Each pixel unit includes multiple RGB chips, wherein a linear grid polarization layer is deposited on the surface of each RGB chip to achieve light polarization.

[0009] In one embodiment, each of the RGB chips comprises, from top to bottom:

[0010] wafer layer;

[0011] Grid polarization layer and

[0012] Protective layer.

[0013] In one embodiment, the absorption axes of the wire grid polarization layer between adjacent pixel units are perpendicular to each other, or

[0014] The reflection axes are perpendicular to each other.

[0015] In one embodiment, the angle between the absorption axis or reflection axis of the wire grid polarization layer and the wafer layer is +45 degrees or -45 degrees.

[0016] In one embodiment, the angle between the absorption axis or reflection axis of the grating polarization layer and the optical axis of the phase difference film is +45 degrees or -45 degrees.

[0017] In one embodiment, the thickness of the wire grid polarization layer is 80-120 nm, the width of a single wire grid in the wire grid polarization layer is 40-60 nm, and the spacing between the wire grids is 40-60 nm.

[0018] On the other hand, a 3D display screen is also provided, including a display screen back panel;

[0019] The back panel of the display screen has multiple pixel units distributed thereon, and each pixel unit includes multiple RGB chips, with a polarizing layer disposed on the surface of the RGB chips.

[0020] In one embodiment, the polarizing layer is a pressure-resistant and high-temperature-resistant polarizing plate.

[0021] Beneficial effects:

[0022] This invention integrates a wire grid polarization layer on the surface of an RGB chip. The metal material of the wire grid polarization layer is resistant to cutting and high temperatures. Combined with the protective layer, it can effectively prevent the polarizer from deforming during the wafer cutting process, thereby enhancing the stability and reliability of the 3D display effect. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A flowchart of the molding process for the 3D display screen provided by the present invention.

[0025] Figure 2 This is a schematic diagram of a tri-color LED chip in a 3D display screen provided by the present invention.

[0026] Figure 3 This is a schematic diagram of the deposition of grid material on the surface of an LED chip in a 3D display screen provided by the present invention.

[0027] Figure 4 This is a schematic diagram of micro-nano processing of the deposited layer and the addition of a protective layer in the 3D display screen provided by the present invention.

[0028] Figure 5 This is a schematic diagram showing two angles between the LED chip and the wire grid polarization layer in the 3D display screen provided by the present invention.

[0029] Figure 6 The diagram shows an RGB chip capable of generating left-handed polarized light and an RGB chip capable of generating right-handed polarized light in a 3D display screen provided by the present invention.

[0030] Figure 7 This is a schematic diagram illustrating the transfer of RGB chips to the back panel of a 3D display screen provided by the present invention.

[0031] Figure 8 This is a schematic diagram of a left-handed polarizing pixel unit in a 3D display screen provided by the present invention.

[0032] Figure 9 This is a schematic diagram of a right-handed polarizing pixel unit in a 3D display screen provided by the present invention.

[0033] Figure 10 This is a schematic diagram of an embodiment of the pixel unit distribution on the back panel of a 3D display screen provided by the present invention.

[0034] Figure 11 This is a schematic diagram of an embodiment of the pixel unit distribution on the back panel of a 3D display screen provided by the present invention.

[0035] Figure 12 This is a schematic diagram of an embodiment of the pixel unit distribution on the back panel of a 3D display screen provided by the present invention.

[0036] Figure 13 This is a schematic diagram of the 3D display screen covered with a phase retardation film provided by the present invention.

[0037] Figure 14 This is a schematic diagram of a polarizing plate attached to the surface of an LED chip in a 3D display screen provided by the present invention.

[0038] Figure 15 This is a schematic diagram of an embodiment of the 3D display screen provided by the present invention.

[0039] Figure 16 This is a schematic diagram of the RGB chip in the 3D display screen provided by the present invention.

[0040] Figure 17 This is a schematic diagram of an embodiment of the 3D display screen provided by the present invention.

[0041] In the diagram: 1. Display screen back panel; 2. Wafer layer; 3. Grid polarization layer; 4. Protective layer; 5. Phase retardation film; 6. Polarizing layer. Detailed Implementation

[0042] The following detailed description of preferred embodiments of the present invention, along with the included examples, will make the content of the present invention more readily understood. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. In case of any conflict, the definitions in this specification shall prevail.

[0043] This invention provides a 3D display screen that solves the problem in existing technologies that use surface-mount polarizers and phase retardation films. These technologies require micron-level alignment accuracy between the polarizer and pixel units, and the actual production process suffers from substrate deformation due to thermal expansion and contraction, leading to alignment deviations that directly affect the stability of the 3D effect. To address this issue, related technologies involve directly attaching a polarizer to the wafer surface, cutting it to form multiple independent RGB chips, and then arranging these chips on the display backplate as needed to create the 3D display. However, in the actual manufacturing process, because the polarizer is made of resin, the high temperatures during wafer cutting cause deformation of the polarizer, severely impacting the 3D effect of the display.

[0044] The technical concept of this utility model is to deposit a metal grid material on the surface of an LED wafer and use micro-nano processing technology such as photolithography, electron beam etching, ion beam etching or nanoimprinting to process and etch the grid material to form a grid polarization layer. This can effectively avoid the problem of polarizer deformation during wafer cutting and ensure the stability of the 3D stereoscopic effect of the display screen.

[0045] The technical concept of this utility model will be specifically described through the following embodiments.

[0046] like Figure 1-13 As shown, in one embodiment, a molding process for a 3D display screen includes the following steps:

[0047] like Figure 2 The provided image shows a tri-color LED wafer, where the tri-color refers to R / G / B, namely the three primary colors: red, green, and blue.

[0048] like Figure 3-4 As shown, a linear grid polarization layer is formed on the surface of each color LED wafer, and then a protective layer is attached to the surface of the linear grid polarization layer. The linear grid polarization layer is the linear polarizing layer. The protective layer is a transparent protective layer that protects the linear grid polarization layer and facilitates the formation of a phase retardation film on the linear grid polarization layer to achieve the polarization effect. Before forming the linear grid polarization layer, the positions of the RGB chips to be cut can be marked on the surface of the LED wafer. For example, several adjacent rectangles can be marked on the surface of the LED wafer. This allows for precise control of the angles between the absorption axis and reflection axis of the linear grid polarization layer and the RGB chips, and also provides precise cutting position guidance for subsequent cutting.

[0049] like Figure 4 As shown, in one embodiment, the step of forming a wire grid polarization layer on the surface of the LED wafer for each color is as follows:

[0050] A grid material is deposited on the surface of the LED wafer, and the angle between the absorption axis or reflection axis of the grid polarization layer and the LED wafer is ±45 degrees.

[0051] The wire grid material is processed using micro-nano fabrication techniques to form a wire grid polarization layer. The LED wafer forming the wire grid polarization layer can be divided into two groups with mutually perpendicular absorption axes (or reflection axes), such as... Figure 5 As shown, one set of linear grid polarization absorption axes (or reflection axes) forms a -45-degree angle with the LED chip, while the other set of linear grid polarization absorption axes (or reflection axes) forms a +45-degree angle with the LED chip.

[0052] like Figure 6 As shown, the LED wafer, after being coated and protected, is then cut to form several independent RGB chips. The cutting process can be blade cutting, laser cutting, or plasma cutting, depending on the thickness of the LED wafer and the requirements.

[0053] In this unit, three RGB chips form a pixel, such as... Figure 7 As shown, pixel units with the same absorption axis or reflection axis angle are alternately arranged on the display screen back panel. Figure 8-9As shown, the pixel unit includes left-handed polarizing pixels and right-handed polarizing pixels. In the left-handed polarizing pixel, the absorption axis or reflection axis of the grid polarization layer in the RGB chip makes an angle of -45 degrees with the LED wafer. In the right-handed polarizing pixel, the absorption axis or reflection axis of the grid polarization layer in the RGB chip makes an angle of +45 degrees with the LED wafer. When the pixel units are alternately arranged on the back panel of the display screen, as... Figure 10 As shown, in one embodiment, pixel units are arranged in alternating rows on the display back panel. For example, one row of pixel units consists of left-handed polarizing pixels, while the adjacent row consists of right-handed polarizing pixels.

[0054] like Figure 11 As shown, in one embodiment, pixels are arranged in alternating columns on the back panel of the display screen. Exemplarily, one column of pixel units is left-handed polarized pixels, and the adjacent column is right-handed polarized pixels.

[0055] like Figure 12 As shown, in one embodiment, individual pixel units are alternately arranged on the display back panel. Exemplarily, one pixel unit is a left-handed polarizing pixel, while adjacent rows and columns of pixel units are right-handed polarizing pixels. Exemplarily, one pixel unit is a right-handed polarizing pixel, while adjacent rows and columns of pixel units are left-handed polarizing pixels.

[0056] like Figure 13 As shown, after all pixel units are transferred to the back panel of the display screen and the LED display screen is manufactured, a 1 / 4 phase retardation film is applied to its surface. The angle between the optical axis of the phase retardation film and the absorption or reflection axis of the grid polarization layer is +45 degrees or -45 degrees. This ensures that the light emitted by each row or column of pixel units in the 3D display screen is left-handed or right-handed polarized light. The entire 3D display screen will emit alternating left-handed and right-handed polarized light, which, when used with appropriate 3D polarized glasses, enables the viewing of 3D videos. The optical axis of the phase retardation film is 0 degrees or 90 degrees. It should be noted that... Figure 13 The horizontal and vertical arrows in the image represent the optical axis of the phase difference. The two directions of the arrows indicate that either of the two axes of the optical axis can be chosen, not that both axes are present simultaneously.

[0057] As shown in the figure, in one embodiment, a molding process for a 3D display screen includes the following steps:

[0058] like Figure 2 As shown, a three-color LED wafer is provided. Similar to the previous embodiment, this embodiment is also based on LED wafers with three colors: red, green, and blue.

[0059] A polarizing layer is coated on the surface of the LED wafer for each color. The angle between the absorption axis or reflection axis of the polarizing layer and the RGB chip inside the LED wafer is ±45 degrees, specifically in two sets. One set has an angle of -45 degrees between the absorption axis or reflection axis of the polarizing layer and the RGB chip inside the LED wafer, and the other set has an angle of +45 degrees. The structure of the polarizing layer itself includes at least a phase retardation film and a linear polarizer. The polarizing layer is a voltage-resistant and high-temperature-resistant polarizer.

[0060] For example, the polarizer can be a high-temperature resistant PVA-based polarizer. By chemically crosslinking the traditional polyvinyl alcohol (PVA) film (such as introducing formaldehyde or boric acid crosslinking agents) and using a high-temperature resistant TAC (cellulose triacetate) protective film, the long-term temperature resistance can be increased to 85-105℃, the short-term temperature resistance can reach 120℃, and the tensile strength can be increased to more than 80MPa. It can withstand the thermal stress (typically <50MPa) during the COB packaging process.

[0061] For example, the polarizer is a PET-based composite polarizer: using polyethylene terephthalate (PET) as the substrate, a metal nanowire polarizing layer (such as silver nanowires) is deposited by magnetron sputtering, combined with a high-temperature pressure-sensitive adhesive (Tg > 150℃), extending the temperature range to -40℃ to 150℃, and the tensile strength to 150MPa, which can withstand the high-temperature pressing process (120℃-180℃) during COB module assembly.

[0062] For example, the polarizer is an inorganic or inorganic-organic hybrid polarizer: it uses graphene or carbon nanotubes as the polarization functional layer, composites it with a polyimide (PI) substrate, has a temperature resistance exceeding 200℃, a compressive strength exceeding 200MPa, and excellent chemical corrosion resistance. Its polarization efficiency can reach over 99.5%, which can meet the polarization accuracy requirements of 3D displays.

[0063] A protective layer is attached to the surface of the polarizing layer, wherein the protective layer is a transparent protective layer;

[0064] The LED wafer covered with the protective layer is then cut to form several independent RGB chips. This step is the same as the cutting step in the previous embodiment, such as... Figure 4 As shown, the difference is that the wire grid polarization layer is replaced with a polarizing layer;

[0065] like Figure 8-12 As shown, three-color RGB chips are combined into a pixel unit, and the pixel units with the same absorption axis or reflection axis angle are alternately arranged on the back panel of the display screen.

[0066] Based on the above process, polarizing material is pre-placed on the raw materials before the screen is manufactured. With the support of COB technology, it is precisely fixed together with the chip, eliminating the need for secondary alignment and attachment. Furthermore, all of this can be accomplished using domestic technology, freeing us from dependence on foreign raw materials and technologies. This also advances 3D polarizer manufacturing to the chip level.

[0067] like Figure 15-16 As shown, in one embodiment, a 3D display screen manufactured according to the above-described molding process includes:

[0068] Display screen back panel 1;

[0069] The back panel 1 of the display screen has multiple pixel units distributed on it, and a phase difference film 5 is attached to the surface of the pixel unit.

[0070] Each pixel unit includes multiple RGB chips, wherein a linear grid polarization layer 3 is deposited on the surface of each RGB chip to achieve light polarization.

[0071] Among them, the grating polarization layer 3 can be a deposited metal layer. Since the grating polarization layer 3 that realizes polarization is a metal layer, when cutting with laser or plasma, the problem of high temperature causing deformation of polarizers such as those in the prior art, which in turn affects the 3D display effect, can be avoided.

[0072] like Figure 16 As shown, in one embodiment, each of the RGB chips comprises, from top to bottom:

[0073] Wafer layer 2, which is the LED wafer;

[0074] Grid polarization layer 3 and

[0075] Protective layer 4.

[0076] The protective layer 4 is a transparent protective layer, which is set on the surface of the linear grid polarization layer 3. On the one hand, it can ensure the normal passage of light. On the other hand, due to the presence of the protective layer 4, when the phase retardation film 5 is attached to the surface of the linear grid polarization layer 3, the problem of the gap between the grids in the linear grid polarization layer 3 affecting the effect of the phase retardation film 5 can be avoided.

[0077] In one embodiment, the absorption axes of the wire grid polarization layer 3 between adjacent pixel units are perpendicular to each other, or

[0078] The reflection axes are perpendicular to each other.

[0079] For example, the angle between the absorption axis and / or reflection axis of the grid polarization layer 3 of the RGB chip in one column / row and the wafer layer 2 is -45 degrees, and the angle between the absorption axis and / or reflection axis of the grid polarization layer 3 of the RGB chip in the adjacent column / row and the wafer layer 2 is +45 degrees.

[0080] In one embodiment, when the phase retardation film 5 is applied, the angle between the absorption axis or reflection axis of the grid polarization layer 3 in the RGB chip and the optical axis of the phase retardation film 5 is +45 degrees or -45 degrees. The optical axis of the phase retardation film 5 is 0 degrees or 90 degrees.

[0081] In one embodiment, the thickness of the wire grid polarization layer 3 is 80-120 nm, preferably 100 nm. The width of a single wire grid in the wire grid polarization layer 3 is 40-60 nm, preferably 50 nm, and the spacing between the wire grids is 40-60 nm, preferably 50 nm.

[0082] like Figure 17 As shown, in one embodiment, a 3D display screen includes:

[0083] Display screen back panel 1;

[0084] The display screen back panel 1 has multiple pixel units distributed on it, and each pixel unit includes multiple RGB chips. A polarizing layer 6 is disposed on the surface of the RGB chips.

[0085] The polarizing layer 6 is a pressure-resistant and high-temperature-resistant polarizing film, which can effectively reduce the deformation and other effects caused by the high temperature generated during cutting.

[0086] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A 3D display screen, characterized in that, include: Display screen back panel; The back panel of the display screen has multiple pixel units distributed thereon, and a phase difference film is attached to the surface of the pixel unit; Each pixel unit includes multiple RGB chips, wherein a linear grid polarization layer is deposited on the surface of each RGB chip to achieve light polarization.

2. The 3D display screen according to claim 1, characterized in that, Each of the RGB chips, from top to bottom, comprises: wafer layer; Grid polarization layer and Protective layer.

3. The 3D display screen according to claim 2, characterized in that, The absorption axes of the wire grid polarization layer between adjacent pixel units are perpendicular to each other, or The reflection axes are perpendicular to each other.

4. The 3D display screen according to claim 3, characterized in that, The angle between the absorption axis or reflection axis of the grating polarization layer and the wafer layer is +45 degrees or -45 degrees.

5. The 3D display screen according to claim 2, characterized in that, The angle between the absorption axis or reflection axis of the grating polarization layer and the optical axis of the phase difference film is +45 degrees or -45 degrees.

6. The 3D display screen according to claim 2, characterized in that, The thickness of the wire grid polarization layer is 80-120 nm, the width of a single wire grid in the wire grid polarization layer is 40-60 nm, and the spacing between the wire grids is 40-60 nm.

7. A 3D display screen, characterized in that, Including the display screen back panel; The back panel of the display screen has multiple pixel units distributed thereon, and each pixel unit includes multiple RGB chips, with a polarizing layer disposed on the surface of the RGB chips.

8. The 3D display screen according to claim 7, characterized in that, The polarizing layer is a pressure-resistant and high-temperature-resistant polarizing plate.

Images