Wafer loading and unloading device

Abstract

The utility model belongs to the technical field of semiconductor wafer processing, disclose a kind of wafer feeding and discharging device, including feeding and discharging elevator mechanism and material moving mechanism;The feeding and discharging elevator mechanism includes the load-bearing member that can move along vertical direction, the wafer box is arranged on the top surface of load-bearing member, the wafer box inside is provided with multiple wafers placed in vertical direction layer by layer, the load-bearing member has accommodating space inside, and the load-bearing member is provided with side edge opening, the side edge opening is communicated with the accommodating space, the accommodating space inside is provided with sampling inspection loading platform and detection piece;The material moving mechanism can transfer one of the wafer in the wafer box to the sampling inspection loading platform via the side edge opening, to make the detection piece detect the wafer on the sampling inspection loading platform.The utility model saves the additional sampling inspection equipment investment cost and equipment switching time consumption, is favorable for simplifying production process and improving overall production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, and particularly relates to a wafer loading and unloading device. Background Art

[0002] In the chip preparation process, scribing and cutting to separate the grains on the wafer from the wafer body is an essential key process. At the front end of commonly used fully automatic cutting equipment in the industry, a loading and unloading elevator mechanism is generally equipped. Its main function is to fix the wafer cassette and can drive the wafer cassette to rise and fall to a specified position, so as to cooperate with the subsequent material transfer mechanism to complete the accurate picking and placing of the wafer. It works together with the material transfer mechanism and the subsequent processing and cleaning device to jointly ensure the smooth progress of the wafer cutting process.

[0003] In addition, in order to assist in the quality control of the cutting process, wafer sampling inspection is usually involved before the cutting process, that is, randomly extracting samples from a batch of wafers for inspection to determine whether the batch of products is qualified. However, the existing loading and unloading devices have relatively single functions and can only complete the loading and unloading operations of wafers through the cooperation of the loading and unloading elevator mechanism and the material transfer mechanism. In this way, if wafer sampling inspection is to be carried out, additional equipment and processes must be used, which not only increases the complexity of the production process but also reduces the overall production efficiency.

[0004] Therefore, there is an urgent need to propose a wafer loading and unloading device to solve the above technical problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide a wafer loading and unloading device, enabling the loading and unloading operations of wafers and the sampling inspection process to be coordinated and completed within the same device, eliminating the additional investment cost of sampling inspection equipment and the time consumption of equipment switching, which is beneficial to simplifying the production process and improving the overall production efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a wafer loading and unloading device, including a loading and unloading elevator mechanism and a material transfer mechanism;

[0008] The loading and unloading elevator mechanism includes a carrier capable of moving in the vertical direction. A wafer cassette is arranged on the top surface of the carrier. A plurality of wafers stacked in the vertical direction are arranged inside the wafer cassette. The carrier has an accommodation space inside, and the carrier is provided with a side opening, and the side opening is connected to the accommodation space. A sampling inspection stage and a detection component are arranged inside the accommodation space; the material transfer mechanism can transfer one of the wafers in the wafer cassette to the sampling inspection stage through the side opening, so that the detection component detects the wafer on the sampling inspection stage.

[0009] In some embodiments, the sampling platform is movably connected to the carrier, and the sampling platform can be moved out of the receiving space through the side opening or into the receiving space through the side opening.

[0010] In some embodiments, the sampling stage is provided with a mounting groove, and the wafer is configured to be placed in the mounting groove.

[0011] In some embodiments, the material transfer mechanism includes a vacuum pick-up component and a first moving module. The vacuum pick-up component is connected to the first moving module, and the first moving module can drive the vacuum pick-up component to move so that the vacuum pick-up component can adsorb and transfer the wafer.

[0012] In some embodiments, the wafer loading and unloading device further includes an alignment correction element disposed within the receiving space, the alignment correction element having a V-shaped profile; the vacuum pick-up element has a vacuum adsorption state and a vacuum off state, the vacuum pick-up element in the vacuum adsorption state is configured to move the wafer closer to the V-shaped profile, and after the wafer enters the area enclosed by the two sides of the V-shaped profile, the vacuum pick-up element is switched to the vacuum off state, until the wafer on the vacuum pick-up element in the vacuum off state abuts against both sides of the V-shaped profile, and then the vacuum pick-up element is restored to the vacuum adsorption state.

[0013] In some embodiments, the wafer loading and unloading device further includes a notch positioning component, which includes a rotary chuck and a notch sensor. Both the rotary chuck and the notch sensor are disposed within the receiving space. The vacuum pick-up component is configured to transfer the aligned wafer to the rotary chuck and make the center of the wafer coincide with the center of the rotary chuck. The notch sensor is configured to sense the notch position of the wafer when the rotary chuck rotates the wafer.

[0014] In some embodiments, the notch positioning component further includes a first drive motor connected to the carrier, and the rotating suction cup connected to the output end of the first drive motor.

[0015] In some embodiments, the loading and unloading elevator mechanism further includes a second moving module, which includes a second drive motor and a ball screw. The carrier is connected to the ball screw, and the second drive motor can drive the ball screw to rotate, thereby driving the carrier to move in the vertical direction.

[0016] In some embodiments, a wafer slide-out detection assembly is provided on the top of the carrier. The wafer slide-out detection assembly includes a mounting base and a detection sensor. The mounting base is connected to the top of the carrier and is disposed adjacent to the opening of the wafer cassette along a first direction. The detection sensor is fixed to the mounting base and is configured to emit a detection signal upward in a vertical direction, and to determine the state of the wafer by whether the detection signal is blocked by the wafer.

[0017] In some embodiments, the mounting base is movably connected to the top of the carrier, and the mounting base is capable of approaching or moving away from the opening of the wafer cassette along the first direction.

[0018] The beneficial effects of this utility model are:

[0019] The wafer loading and unloading device provided by this utility model integrates a wafer sampling inspection module into the loading and unloading elevator mechanism. The transfer mechanism can directly transfer the wafers in the wafer box to the sampling inspection platform in the carrying space of the carrier, so that the wafer loading and unloading operation and the sampling inspection process can be completed in the same device. This saves the additional cost of sampling inspection equipment and the time consumption of equipment switching, which helps to simplify the production process and improve the overall production efficiency. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0021] Figure 1 This is a three-dimensional structural schematic diagram of the wafer loading and unloading device provided in an embodiment of this utility model.

[0022] In the picture:

[0023] 100. Loading / unloading elevator mechanism; 200. Material transfer mechanism;

[0024] 1. Supporting component; 11. Accommodating space; 12. Side opening;

[0025] 2. Wafer box;

[0026] 3. Wafers;

[0027] 4. Sampling inspection of the platform; 41. Installation of the groove;

[0028] 5. Vacuum material handling components;

[0029] 6. First moving module;

[0030] 7. Centering and correction parts;

[0031] 8. Notch positioning assembly; 81. Rotary suction cup; 82. Notch sensor; 83. First drive motor;

[0032] 9. Second moving module; 91. Second drive motor; 92. Ball screw; 93. Guide rail;

[0033] 10. Mounting base; 20. Detection sensor. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0038] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0041] like Figure 1 As shown, this embodiment provides a wafer loading and unloading device, including a loading and unloading elevator mechanism 100 and a transfer mechanism 200.

[0042] The loading / unloading elevator mechanism 100 includes a carrier 1 capable of moving vertically. A wafer cassette 2 is mounted on the top surface of the carrier 1. Multiple wafers 3 are stacked vertically inside the wafer cassette 2. The carrier 1 has an internal receiving space 11 and a side opening 12 connected to the receiving space 11. A sampling platform 4 and a testing device (not shown) are located inside the receiving space 11. The sampling platform 4 and the testing device together form a wafer sampling module. The transfer mechanism 200 can transfer one of the wafers 3 from the wafer cassette 2 to the sampling platform 4 via the side opening 12, allowing the testing device to inspect the wafer 3 on the sampling platform 4.

[0043] In practice, the transfer mechanism 200 first extends into the wafer box 2 through the opening of the wafer box 2 to take out a wafer 3. The transfer mechanism 200 then enters the receiving space 11 through the side opening 12 of the carrier 1 and transfers the wafer 3 it carries to the sampling stage 4. The testing device in the receiving space 11 can then test the wafer 3 on the sampling stage 4. After the test is completed, the wafer 3 is transferred to the next process through the transfer mechanism 200.

[0044] The wafer loading and unloading device provided in this embodiment integrates a wafer sampling inspection module into the loading and unloading elevator mechanism 100. The transfer mechanism 200 can directly transfer the wafer 3 in the wafer box 2 to the sampling inspection platform 4 in the accommodating space 11 of the carrier 1. This allows the loading and unloading operation of the wafer 3 and the sampling inspection process to be completed in the same device, saving the additional cost of sampling inspection equipment and the time consumption of equipment switching, which helps to simplify the production process and improve the overall production efficiency.

[0045] Optionally, the detection device can be configured as an optical sensor, which detects the flatness of the wafer 3 surface and the presence of foreign objects by emitting and receiving light. For example, using the principle of laser interferometer, the interference fringes of reflected light can be analyzed to determine whether the microstructure of the wafer 3 surface meets the standard. Alternatively, the detection device can also be configured as an electrical detection probe, which quickly detects the electrical properties (such as resistance, capacitance, conductivity, etc.) of the wafer 3 by contacting the electrodes on the wafer 3 surface, and determines whether its circuit function is normal. The specific configuration of the detection device can be determined according to the actual situation, and no specific limitation is made here.

[0046] like Figure 1 As shown, in some embodiments, the sampling platform 4 is movably connected to the carrier 1, and the sampling platform 4 can be moved out of the receiving space 11 through the side opening 12, or moved into the receiving space 11 through the side opening 12. Figure 1 Taking the orientation as an example, that is, the sampling platform 4 can move out of or into the accommodating space 11 along the first direction.

[0047] With this setup, wafer sampling can be completed directly within the containment space 11 using the inspection device, meeting the needs of efficient production line operations. At the same time, the sampling stage 4 can be moved out when needed, making it easier for manual removal of the wafer 3 for more detailed manual re-inspection or special project testing, making the sampling method more flexible.

[0048] like Figure 1 As shown, in some embodiments, the sampling stage 4 is provided with a mounting groove 41, and the wafer 3 is configured to be placed in the mounting groove 41. The mounting groove 41 provides a stable positioning space for the wafer 3, which helps to improve the stability of the wafer 3 when placed on the sampling stage 4.

[0049] like Figure 1As shown, in some embodiments, the material transfer mechanism 200 includes a vacuum pick-up component 5 and a first moving module 6. The vacuum pick-up component 5 is connected to the first moving module 6, and the first moving module 6 can drive the vacuum pick-up component 5 to move so that the vacuum pick-up component 5 can adsorb and transfer the wafer 3.

[0050] With this setup, the vacuum pick-up unit 5 can stably grip the wafer 3 through vacuum adsorption, avoiding potential damage to the wafer 3 surface caused by mechanical clamping and ensuring the stability of the wafer 3 during gripping. Simultaneously, the first moving module 6 can drive the vacuum pick-up unit 5 to achieve precise movement, ensuring that the transfer path of the wafer 3 between the wafer cassette 2, the inspection stage 4, and the next process is precisely controllable.

[0051] like Figure 1 As shown, in this embodiment, the first moving module 6 can drive the vacuum pick-up component 5 to move along the first direction, which cooperates with the carrier component 1, which can move in the vertical direction, to jointly realize the transfer of the wafer 3. Of course, in other embodiments, the first moving module 6 can also be configured to drive the vacuum pick-up component 5 to move in three directions: the first direction, the second direction, and the vertical direction, so as to transfer the wafer 3 more flexibly.

[0052] Due to differences in the manufacturing processes used in wafer 3 and the corresponding product requirements, a single wafer 3 typically integrates hundreds to tens of thousands of independent small dies. Most wafer 3 in the industry have pre-defined dicing paths between these dies for cutting. To ensure that the cutting process can precisely follow the dicing paths, thereby separating numerous small dies into individual dies, wafer 3 must be aligned and corrected before cutting to ensure its accurate position. Simultaneously, the notch location of wafer 3 must be located to determine its orientation, providing a foundation for the accuracy of subsequent cutting.

[0053] Therefore, such as Figure 1 As shown, in some embodiments, the wafer loading and unloading device further includes an alignment and correction element 7, which is disposed within the receiving space 11 and has a V-shaped profile. The vacuum pick-up element 5 has a vacuum adsorption state and a vacuum off state. When in the vacuum adsorption state, the vacuum pick-up element 5 is configured to move the wafer 3 closer to the V-shaped profile, and after the wafer 3 enters the area enclosed by the two sides of the V-shaped profile, the vacuum pick-up element 5 is switched to the vacuum off state until the wafer 3 on the vacuum pick-up element 5 in the vacuum off state abuts against both sides of the V-shaped profile, after which the vacuum pick-up element 5 is restored to the vacuum adsorption state.

[0054] Specifically, the vacuum pick-up component 5 can control whether the wafer 3 is adsorbed by the vacuum switch. That is, when the vacuum switch is turned on, the vacuum pick-up component 5 is in a vacuum adsorption state, and the wafer 3 is adsorbed by the vacuum pick-up component 5; when the vacuum switch is turned off, the vacuum pick-up component 5 is in a vacuum off state, and the wafer 3 is in a free state on the vacuum pick-up component 5.

[0055] by Figure 1 Taking the orientation shown in the figure as an example, the process of centering and correcting wafer 3 is as follows:

[0056] The vacuum pick-up component 5 picks up the wafer 3 and enters the receiving space 11 along the first direction, and moves close to the alignment and correction component 7. When the edge of the wafer 3 is close to the two sides of the V-shaped contour of the alignment and correction component 7, the vacuum switch is turned off, so that the wafer 3 on the vacuum pick-up component 5 is in a free state until the free wafer 3 is attached to the two sides of the V-shaped contour. At this time, the center position of the wafer 3 has been corrected by the guiding effect of the V-shaped contour. Then the vacuum switch is turned on again, so that the aligned wafer 3 is vacuum-picked by the vacuum pick-up component 5.

[0057] With this setup, wafer 3 automatically corrects its positional deviation in a free state by naturally contacting the edge of the V-shaped contour. After correction, it is fixed by vacuum adsorption, avoiding secondary offset. No complex sensing control is required; the centering operation can be quickly completed simply by mechanical structure and simple vacuum state switching, which simplifies the design of the correction mechanism and reduces equipment costs.

[0058] Furthermore, such as Figure 1 As shown, in some embodiments, the wafer loading and unloading device further includes a notch positioning component 8, which includes a rotary chuck 81 and a notch sensor 82. Both the rotary chuck 81 and the notch sensor 82 are disposed within the receiving space 11. The vacuum pick-up component 5 is configured to transfer the aligned wafer 3 to the rotary chuck 81 and make the center of the wafer 3 coincide with the center of the rotary chuck 81. The notch sensor 82 is configured to sense the notch position of the wafer 3 when the rotary chuck 81 drives the wafer 3 to rotate.

[0059] In practice, the vacuum pick-up unit 5 first transfers the wafer 3 in the wafer box 2 to the sampling stage 4 for inspection. The qualified wafer 3 is then transferred again by the vacuum pick-up unit 5 to the centering and correction unit 7 for preliminary centering and correction. After centering and correction, the wafer 3 is transferred again by the vacuum pick-up unit 5 to the rotary chuck 81. The rotary chuck 81 rotates, and the wafer 3 adsorbed on the rotary chuck 81 rotates accordingly. When the notch on the wafer 3 is sensed by the notch sensor 82, the signal of the notch sensor 82 changes, thereby accurately determining the notch position of the wafer 3.

[0060] With this setup, the wafer loading and unloading device integrates a wafer sampling module, an alignment and correction component 7, and a notch positioning component 8, enabling the wafer 3 to be picked up, sampled, aligned, and notched in a continuous manner within the same device. This reduces the transfer of wafer 3 between different devices and improves operational efficiency.

[0061] like Figure 1 As shown, in some embodiments, the notch positioning component 8 further includes a first drive motor 83, which is connected to the carrier 1, and a rotating suction cup 81 is connected to the output end of the first drive motor 83. This configuration allows the first drive motor 83 to drive the rotating suction cup 81, causing the wafer 3 to rotate stably, providing stable and reliable power support for accurately identifying the notch on the wafer 3.

[0062] like Figure 1 As shown, in some embodiments, the loading and unloading elevator mechanism 100 further includes a second moving module 9, which includes a second drive motor 91 and a ball screw 92. The carrier 1 is connected to the ball screw 92. The second drive motor 91 can drive the ball screw 92 to rotate, thereby driving the carrier 1 to move in the vertical direction.

[0063] By employing a second moving module 9 that combines a second drive motor 91 and a ball screw 92, high-precision driving and positioning can be provided for the vertical movement of the support component 1. The second drive motor 91 can achieve stable power output, while the ball screw 92, with its helical transmission structure and rolling friction characteristics, has the characteristics of high transmission efficiency and smooth operation. It can accurately convert the rotational motion of the second drive motor 91 into the linear motion of the support component 1, ensuring the positional accuracy and motion stability of the support component 1 when it moves in the vertical direction.

[0064] Optionally, the second moving module 9 also includes a guide rail 93 extending vertically, to which the carrier 1 is connected. This configuration provides precise guidance and constraint for the movement of the carrier 1 via the vertically extending guide rail 93, ensuring smooth vertical movement and preventing swaying or offset of the carrier 1.

[0065] Furthermore, two guide rails 93 are provided, located on opposite sides of the ball screw 92, and the support member 1 is connected to both guide rails 93. The two guide rails 93 can provide more balanced support and guidance for the support member 1, avoiding tilting or displacement of the support member 1 due to unilateral force, thus achieving force balance.

[0066] During wafer fabrication, if wafer 3 slides out or protrudes from the opening of wafer cassette 2, it may not only cause damage to wafer 3 itself, but may also collide with the transfer mechanism 200, damaging equipment components and even affecting the accuracy and stability of subsequent processes. Therefore, if... Figure 1As shown, in some embodiments, a wafer slip-out detection component is provided on the top of the carrier 1.

[0067] The wafer slide-out detection assembly includes a mounting base 10 and a detection sensor 20. The mounting base 10 is connected to the top of the support member 1 and is arranged adjacent to the opening of the wafer cassette 2 along a first direction. The detection sensor 20 is fixed to the mounting base 10 and is configured to emit a detection signal upward in a vertical direction. The state of the wafer 3 is determined by whether the detection signal is blocked by the wafer 3. The first direction is the sliding direction of the wafer 3 when it slides out of the wafer cassette 2.

[0068] In practice, when no wafer 3 slides out of the opening of the wafer box 2, the detection signal emitted vertically upward by the detection sensor 20 is unobstructed. Based on this signal state, it can be determined that all wafers 3 in the wafer box 2 are in normal positions. When a wafer 3 protrudes from the opening of the wafer box 2, that is, one or more wafers 3 slide out of the opening of the wafer box 2 along the first direction, the detection signal emitted vertically upward by the detection sensor 20 will be blocked by the slid-out wafer 3. By recognizing this signal blocking state, the detection sensor 20 can determine that there is an abnormal situation where a wafer 3 has slid out.

[0069] With this setup, the detection sensor 20 can determine the state of the wafer 3 by identifying whether the signal is blocked. In this way, the detection of the wafer 3 sliding out can be easily achieved with only one sensor, so that timely measures can be taken when the wafer 3 slides out.

[0070] Optionally, the detection sensor 20 is configured as a reflective sensor, and the detection signal is an optical signal. This configuration achieves slip-out detection by reflecting the optical signal from the wafer 3 itself. Specifically, when no wafer 3 has slid out, the optical signal emitted by the detection sensor 20 is unobstructed and cannot be reflected back to the detection sensor 20; when wafer 3 has slid out, the slid-out wafer 3 will reflect the optical signal, and the detection sensor 20 can determine the anomaly by receiving the reflected signal. Compared to reflective sensors with a reflector, this method eliminates the need for an additional reflector, reduces structural components, avoids detection errors caused by reflector contamination or misalignment, and lowers installation accuracy requirements and maintenance costs.

[0071] It should be noted that when only one wafer 3 slides out, the detection sensor 20 will detect that wafer 3; when multiple wafers 3 slide out at the same time, the detection sensor 20 will detect the wafer 3 closest to itself.

[0072] like Figure 1 As shown, in some embodiments, the mounting base 10 is movably connected to the top of the carrier 1, and the mounting base 10 can move closer to or further away from the opening of the wafer cassette 2 along a first direction.

[0073] With this configuration, the mounting base 10 can move the detection sensor 20 together, allowing the distance between the detection sensor 20 and the opening of the wafer cassette 2 to be flexibly adjusted. When the detection sensor 20 is closer to the opening, the wafer 3 only needs to slide out a small amount to block the detection signal, achieving sensitive detection of minute slippage; when the detection sensor 20 is slightly away from the opening, it can be adapted to the maximum allowable slippage of the wafer 3 that the machine can accept, avoiding misjudgment of minute displacements within the normal range.

[0074] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer loading and unloading device, characterized in that, It includes a loading and unloading elevator mechanism (100) and a material transfer mechanism (200); The loading and unloading elevator mechanism (100) includes a carrier (1) that can move vertically. A wafer box (2) is provided on the top surface of the carrier (1). Multiple wafers (3) are stacked vertically inside the wafer box (2). The carrier (1) has a receiving space (11) inside and a side opening (12) is provided on the carrier (1). The side opening (12) is connected to the receiving space (11). A sampling platform (4) and a testing device are provided inside the receiving space (11). The material transfer mechanism (200) can transfer one of the wafers (3) in the wafer box (2) to the sampling platform (4) through the side opening (12) so that the testing device can test the wafer (3) on the sampling platform (4).

2. The wafer loading and unloading device according to claim 1, characterized in that, The sampling platform (4) is movably connected to the carrier (1). The sampling platform (4) can be moved out of the receiving space (11) through the side opening (12) or into the receiving space (11) through the side opening (12).

3. The wafer loading and unloading device according to claim 1, characterized in that, The sampling stage (4) is provided with a mounting groove (41), and the wafer (3) is configured to be placed in the mounting groove (41).

4. The wafer loading and unloading device according to claim 1, characterized in that, The material transfer mechanism (200) includes a vacuum pick-up component (5) and a first moving module (6). The vacuum pick-up component (5) is connected to the first moving module (6), and the first moving module (6) can drive the vacuum pick-up component (5) to move so that the vacuum pick-up component (5) can adsorb and transfer the wafer (3).

5. The wafer loading and unloading device according to claim 4, characterized in that, The wafer loading and unloading device further includes an alignment correction component (7), which is disposed in the accommodating space (11) and has a V-shaped profile. The vacuum pick-up component (5) has a vacuum adsorption state and a vacuum off state. The vacuum pick-up component (5) in the vacuum adsorption state is configured to move the wafer (3) closer to the V-shaped profile, and after the wafer (3) enters the area enclosed by the two sides of the V-shaped profile, the vacuum pick-up component (5) is switched to the vacuum off state until the wafer (3) on the vacuum pick-up component (5) in the vacuum off state abuts against the two sides of the V-shaped profile, and then the vacuum pick-up component (5) is restored to the vacuum adsorption state.

6. The wafer loading and unloading device according to claim 5, characterized in that, The wafer loading and unloading device further includes a notch positioning component (8), which includes a rotary chuck (81) and a notch sensor (82). The rotary chuck (81) and the notch sensor (82) are both located in the receiving space (11). The vacuum pick-up component (5) is configured to transfer the aligned wafer (3) to the rotary chuck (81) and make the center of the wafer (3) coincide with the center of the rotary chuck (81). The notch sensor (82) is configured to sense the notch position of the wafer (3) when the rotary chuck (81) drives the wafer (3) to rotate.

7. The wafer loading and unloading device according to claim 6, characterized in that, The notch positioning component (8) further includes a first drive motor (83), which is connected to the carrier (1), and the rotating suction cup (81) is connected to the output end of the first drive motor (83).

8. The wafer loading and unloading device according to any one of claims 1 to 7, characterized in that, The loading and unloading elevator mechanism (100) further includes a second moving module (9), which includes a second drive motor (91) and a ball screw (92). The carrier (1) is connected to the ball screw (92). The second drive motor (91) can drive the ball screw (92) to rotate, thereby driving the carrier (1) to move in the vertical direction.

9. The wafer loading and unloading device according to any one of claims 1 to 7, characterized in that, The top of the carrier (1) is provided with a wafer slide-out detection assembly, which includes a mounting base (10) and a detection sensor (20). The mounting base (10) is connected to the top of the carrier (1) and is arranged adjacent to the opening of the wafer box (2) along a first direction. The detection sensor (20) is fixed to the mounting base (10) and is configured to emit a detection signal upward in the vertical direction, and determine the state of the wafer (3) by whether the detection signal is blocked by the wafer (3).

10. The wafer loading and unloading device according to claim 9, characterized in that, The mounting base (10) is movably connected to the top of the carrier (1), and the mounting base (10) can move closer to or further away from the opening of the wafer cassette (2) along the first direction.

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