Wafer test probe cleaning and maintenance device

Abstract

The utility model belongs to wafer test technical field especially for wafer test probe cleaning and maintenance device, including operation box, the inner side fixed mounting of operation box has the baffle, and the baffle divides operation box into first clean needle cavity and second clean needle cavity, the inner wall of first clean needle cavity upper end is provided with brush, the inside movable joint of first clean needle cavity has screen. Through putting test probe into brush and carrying out surface rough cleaning, brush off big granule contaminant, screen high -frequency vibration under the drive of vibration motor, screen the impurity that brushed off to lower layer, avoid secondary attachment, and collect test probe, clean needle board through the magnetic attraction coupling of first magnet and second magnet, produce high -frequency micro -vibration under the action of vibration motor, carry out fine cleaning to probe tip, remove stubborn residual, through shock absorber and the residual vibration of receiving plate of vibration motor absorption, prevent operation box whole shaking, ensure the stability of device in the cleaning process.

Description

Technical Field

[0001] This utility model belongs to the field of wafer testing technology, specifically relating to a wafer testing probe cleaning and maintenance device. Background Technology

[0002] Wafer testing involves probing each die on the wafer. Probes attached to a testing head contact the contacts on the die to test its electrical characteristics. Defective dies are marked. Later, when the wafer is diced into individual dies, the marked defective dies are discarded and not proceed to the next process. During testing, the wafer is held in a vacuum chuck and aligned with a very thin probe electrical tester, with the probes contacting each solder pad on the wafer. One existing method for cleaning probes involves using a brush to clean the particles on the side of the probe, followed by pricking the probe with a polishing sandpaper. However, the particles cleaned by the brush often remain on the brush, resulting in poor subsequent cleaning. Furthermore, the friction between the sandpaper and the probe itself generates tiny debris, requiring repeated pricking to achieve the desired cleaning effect. This results in low overall cleaning efficiency and poor cleaning results. The problem addressed by this device is how to avoid the need for repeated pricking to achieve the desired cleaning effect, thereby improving overall cleaning efficiency and overcoming the issue of poor cleaning results. Utility Model Content

[0003] To address the problems mentioned in the background art, this utility model provides a wafer test probe cleaning and maintenance device, which solves the problem of how to avoid the need for repeated back-and-forth probe punctures to achieve the probe cleaning effect, improves the overall cleaning efficiency, and changes the problem of poor cleaning effect.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a wafer test probe cleaning and maintenance device, comprising an operating box, a partition fixedly installed on the inner side of the operating box, the partition dividing the operating box into a first cleaning chamber and a second cleaning chamber, a brush provided on the inner wall of the upper end of the first cleaning chamber, a screen movably connected inside the first cleaning chamber, a cleaning plate movably installed on the inner side of the upper part of the second cleaning chamber, a base plate provided at the lower end of the cleaning plate, a first magnet provided below the base plate, a second magnet magnetically connected below the first magnet, a limit block provided below the second magnet, a vibration motor provided below the operating box, a shock absorber fixedly connected below the operating box, and a receiving plate fixedly connected below the shock absorber.

[0005] Preferably, a collection box is provided inside the operation box, and the collection box is located below the second magnet.

[0006] Preferably, a door is provided on the left side of the control box, and a handle is fixedly installed on the left side of the door.

[0007] Preferably, the cleaning plate is composed of a silicone layer uniformly mixed with zirconium oxide, and the side wall at the upper end of the second cleaning cavity is provided with a disassembly groove.

[0008] Preferably, a pull-out door is fixedly installed on the right side of the screen, and the side wall of the first needle cleaning chamber has a hole corresponding to the pull-out door, and a round handle is fixedly installed on the right side of the pull-out door.

[0009] Preferably, a sliding groove is fixedly installed on the inner side of the first needle cleaning chamber, and the screen is slidably connected to the first needle cleaning chamber through the sliding groove.

[0010] Preferably, a dust collection groove is provided at the lower end of the first cleaning needle chamber, and a dust collection pipe is fixedly connected to the lower end of the dust collection groove.

[0011] Compared with the prior art, the beneficial effects of this utility model are: The test probes are placed in a brush for rough surface cleaning, removing large particulate contaminants. The screen vibrates at high frequency under the drive of a vibrating motor, sieving the brushed-off impurities to the lower layer to prevent secondary adhesion and collecting the test probes. The cleaning plate generates high-frequency micro-vibration under the action of the vibrating motor through the magnetic coupling of the first and second magnets, performing fine cleaning on the probe tips to remove stubborn residues. The residual vibration of the vibrating motor is absorbed by the shock absorber and the receiving plate to prevent the overall shaking of the control box and ensure the stability of the device during the cleaning process. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a first sectional view of the present invention; Figure 3 This is a second cross-sectional view of the present invention.

[0013] In the diagram: 1. Control box; 2. First needle cleaning chamber; 3. Second needle cleaning chamber; 4. Vibration motor; 5. Brush; 6. Screen; 7. Dust collection trough; 8. Needle cleaning plate; 9. Base plate; 10. First magnet; 11. Second magnet; 12. Limiting block; 13. Collection box; 14. Receiving plate; 15. Shock absorber; 16. Door; 17. Handle; 18. Disassembly groove; 19. Sliding door; 20. Circular handle; 21. Slide groove; 22. Dust collection pipe; 23. Partition. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-3 This utility model provides the following technical solution: a wafer test probe cleaning and maintenance device, including an operation box 1, a partition 23 fixedly installed on the inner side of the operation box 1, and the partition 23 divides the operation box 1 into a first probe cleaning chamber 2 and a second probe cleaning chamber 3. A brush 5 is provided on the inner wall of the upper end of the first probe cleaning chamber 2. A screen 6 is movably connected inside the first probe cleaning chamber 2. A probe cleaning plate 8 is movably installed on the inner side of the upper part of the second probe cleaning chamber 3. A base plate 9 is provided at the lower end of the probe cleaning plate 8. A first magnet 10 is provided below the base plate 9. A second magnet 11 is magnetically connected below the first magnet 10. A limit block 12 is provided below the second magnet 11. A vibration motor 4 is provided below the operation box 1. A shock absorber 15 is fixedly connected to the lower end of the operation box 1. A receiving plate 14 is fixedly connected to the lower end of the shock absorber 15.

[0016] A partition 23 is fixedly installed inside the operating box 1, dividing the operating box 1 into a first cleaning chamber 2 and a second cleaning chamber 3. A brush 5 is provided on the inner wall of the upper end of the first cleaning chamber 2, and a screen 6 is movably connected inside the first cleaning chamber 2. The test probe first passes through the brush 5 for rough surface cleaning, removing large particulate contaminants. The screen 6 vibrates at high frequency under the drive of the vibration motor 4, screening the brushed-off impurities to the lower layer to avoid secondary adhesion and collecting the test probe. A cleaning plate 8 is movably installed on the inner side of the upper part of the second cleaning chamber 3. A base plate 9 is provided at the lower end of the cleaning plate 8. A first magnet 10 is provided below the base plate 9. A second magnet 11 is magnetically connected below the first magnet 10. A limit block 12 is provided below the second magnet 11. The first magnet 10 and the second magnet 11 between the base plate 9 and the limit block 12 convert the horizontal vibration of the vibration motor into high-frequency micro-amplitude oscillation in the vertical direction, enhancing the directional cleaning of the probe by the cleaning plate 8. To achieve effective cleaning while avoiding mechanical wear, a vibration motor 4 is installed at the bottom of the operating box 1. The cleaning plate 8 is magnetically coupled through the first magnet 10 and the second magnet 11, generating high-frequency micro-vibration under the action of the vibration motor 4 to finely clean the probe tip and remove stubborn residues. A shock absorber 15 is fixedly connected to the bottom of the operating box 1, and a support plate 14 is fixedly connected to the lower end of the shock absorber 15. The shock absorber 15 and the support plate 14 absorb the residual vibration of the vibration motor 4, preventing the operating box 1 from shaking and ensuring the stability of the cleaning process. The cleaning plate 8 is composed of a silicone layer uniformly mixed with zirconium oxide. The side wall at the upper end of the second cleaning cavity 3 is provided with a disassembly groove 18. The elasticity of the silicone gives the cleaning plate 8 flexibility, adapting to the contact pressure of probes of different diameters and avoiding rigid scratching damage to the needle tip. Through the disassembly groove 18 on the side wall, the cleaning plate 8 can be slid out or installed laterally without disassembling the entire cavity structure, simplifying the maintenance process. Regarding the installation of the pull-out door 19, a pull-out door 19 is fixedly installed on the right side of the screen 6, and a hole corresponding to the pull-out door 19 is opened on the side wall of the first needle cleaning chamber 2. A circular handle 20 is fixedly installed on the right side of the pull-out door 19. The screen 6 forms a sliding closed structure by cooperating with the hole on the side wall of the first needle cleaning chamber 2 through the pull-out door 19. The circular handle 20 provides a force point, which makes it easy for the operator to manually pull out or push in the screen 6, and to easily remove the probes after cleaning in the first needle cleaning chamber 2. Regarding the installation of the collection box 13, a collection box 13 is installed inside the operation box 1, and the collection box 13 is located below the second magnet 11. After magnetic cleaning, the metal debris on the probe is attracted to the second magnet 11, while the cleaned probe falls naturally due to gravity or vibration. The cleaned probe falls into the collection box 13 located below the second magnet 11, completing the automatic storage.Regarding the door 16, a door 16 is provided on the left side of the control box 1, and a handle 17 is fixedly installed on the left side of the door 16. The door 16 is located on the left side of the control box 1 and serves as a discharge port for removing the cleaned probe. The door 16 can be easily pulled by the handle 17 to achieve opening and closing operations, which is convenient for operators to load and unload probes. Regarding the chute 21, a chute 21 is fixedly installed on the inner side of the first needle cleaning chamber 2, and the screen 6 is slidably connected to the first needle cleaning chamber 2 through the chute 21. The chute 21 is fixed on the inner side of the first needle cleaning chamber 2, and the screen 6 is slidably installed through the chute 21, so that the screen 6 can be freely pushed in or pulled out along the direction of the chute 21, reducing frictional wear when the screen 6 slides and extending its service life. Regarding the setting of the dust collection trough 7, a dust collection trough 7 is opened at the lower end of the first cleaning needle chamber 2. A dust collection pipe 22 is fixedly connected to the lower end of the dust collection trough 7. The dust collection trough 7 collects impurities in a concentrated manner, avoiding the accumulation of pollutants in the chamber and reducing the frequency of manual cleaning. The impurities are directly discharged through the closed dust collection pipe 22, avoiding the scattering of pollutants during the cleaning process and ensuring a clean operating environment. All electrical equipment in this device is powered by an external power supply.

[0017] In one aspect of this embodiment, regarding the arrangement of the collection box 13, a collection box 13 is provided inside the operation box 1, and the collection box 13 is located below the second magnet 11. After magnetic cleaning, the metal debris on the probe is attracted to the second magnet 11, while the cleaned probe falls naturally due to gravity or vibration and falls into the collection box 13 located below the second magnet 11, completing automatic storage. Regarding the arrangement of the door 16, a door 16 is provided on the left side of the operation box 1, and a handle 17 is fixedly installed on the left side of the door 16. The door 16 is located on the left side of the operation box 1 and serves as a discharge port for taking out the cleaned probe. The door 16 can be easily pulled by the handle 17 to realize the opening and closing operation, which is convenient for the operator to load and unload the probe.

[0018] In one aspect of this embodiment, the cleaning plate 8 is composed of a silicone layer uniformly mixed with zirconium oxide. A disassembly groove 18 is provided on the upper sidewall of the second cleaning cavity 3. The elasticity of the silicone gives the cleaning plate 8 flexibility, adapting to the contact pressure of probes of different diameters and preventing rigid scratching damage to the needle tips. The cleaning plate 8 can be slidably removed or installed via the disassembly groove 18 on the sidewall without disassembling the entire cavity structure, simplifying the maintenance process. Regarding the pull-out door 19, a pull-out door 19 is fixedly installed on the right side of the screen 6, and a hole corresponding to the pull-out door 19 is opened on the sidewall of the first cleaning cavity 2. A circular handle 20 is fixedly installed on the right side of the pull-out door 19. The screen 6, through the pull-out door 19 and the hole in the sidewall of the first cleaning cavity 2, forms a slidable closed structure. The circular handle 20 provides a force point, facilitating manual pulling out or pushing in the screen 6 by the operator, making it easy to remove the cleaned probes from the first cleaning cavity 2.

[0019] In one aspect of this embodiment, regarding the setting of the chute 21, a chute 21 is fixedly installed on the inner side of the first cleaning chamber 2, and the screen 6 is slidably connected to the first cleaning chamber 2 through the chute 21. The chute 21 is fixed on the inner side of the first cleaning chamber 2, and the screen 6 is slidably installed through the chute 21, so that the screen 6 can be freely pushed in or pulled out along the direction of the chute 21, reducing frictional wear when the screen 6 slides and extending its service life. Regarding the setting of the dust collection tank 7, a dust collection tank 7 is opened at the lower end of the first cleaning chamber 2, and a dust collection pipe 22 is fixedly connected to the lower end of the dust collection tank 7. The dust collection tank 7 collects impurities in a concentrated manner, avoiding the accumulation of pollutants in the chamber and reducing the frequency of manual cleaning. Impurities are directly discharged through the closed dust collection pipe 22, preventing pollutants from scattering during the cleaning process and ensuring a clean operating environment.

[0020] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer test probe cleaning and maintenance device, comprising an operation box (1), characterized in that: The operating box (1) is fixedly installed with a partition (23), and the partition (23) divides the operating box (1) into a first needle cleaning chamber (2) and a second needle cleaning chamber (3). A brush (5) is provided on the inner wall of the upper end of the first needle cleaning chamber (2). A screen (6) is movably connected inside the first needle cleaning chamber (2). A needle cleaning plate (8) is movably installed on the inner side of the upper part of the second needle cleaning chamber (3). A base plate (9) is provided at the lower end of the needle cleaning plate (8). A first magnet (10) is provided below the base plate (9). A second magnet (11) is magnetically connected below the first magnet (10). A limit block (12) is provided below the second magnet (11). A vibration motor (4) is provided below the operating box (1). A shock absorber (15) is fixedly connected below the operating box (1). A receiving plate (14) is fixedly connected below the shock absorber (15).

2. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: The inner side of the operation box (1) is provided with a collection box (13), and the collection box (13) is located below the second magnet (11).

3. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: The control box (1) has a door (16) on its left side, and a handle (17) is fixedly installed on the left side of the door (16).

4. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: The cleaning plate (8) is composed of a silicone layer uniformly mixed with zirconium oxide, and the side wall at the upper end of the second cleaning cavity (3) is provided with a disassembly groove (18).

5. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: A pull-out door (19) is fixedly installed on the right side of the screen (6), and the side wall of the first needle cleaning chamber (2) is provided with a hole corresponding to the pull-out door (19). A round handle (20) is fixedly installed on the right side of the pull-out door (19).

6. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: A sliding groove (21) is fixedly installed on the inner side of the first needle cleaning chamber (2), and the screen (6) is slidably connected to the first needle cleaning chamber (2) through the sliding groove (21).

7. The wafer test probe cleaning and maintenance device according to claim 1, characterized in that: The lower end of the first cleaning needle chamber (2) is provided with a dust collection groove (7), and the lower end of the dust collection groove (7) is fixedly connected with a dust collection pipe (22).

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