Automatic labeling machine for semiconductor wafer

Abstract

The utility model discloses a kind of semiconductor wafer automatic labelling machine, including body, the body is erected on ground, further include for constituting automatic feeding mechanism of feeding structure, for constituting combined labelling structure of labelling mechanism and for constituting adjustable type alignment detection structure of detection mechanism, feeding mechanism is arranged in the upper inner side of the body, labelling mechanism is assembled in the upper portion of the body corresponding feeding mechanism, detection mechanism is configured in the side of the body corresponding labelling mechanism, the beneficial effects of the utility model are that feeding mechanism is equipped with and labelling mechanism cooperation, can be carried out automatic feeding labelling operation to wafer disc, different specifications wafer disc can be positioned labelling operation, labelling flexibility is strong, detection mechanism is equipped with, can be positioned to wafer disc while carrying out in-place detection to it, ensure wafer disc in-place accurate, using full-automatic control, degree of automation and integration are high, ensure product quality, improve work efficiency, and loss rate is small.

Description

Technical Field

[0001] This utility model relates to the technical field, and in particular to an automatic labeling machine for semiconductor wafers. Background Technology

[0002] In existing technologies, a wafer refers to a silicon chip made from silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Wafers are the carriers used to produce integrated circuits. Generally speaking, a wafer refers to a single-crystal silicon wafer. Single-crystal wafers are made from ordinary silicon sand, which undergoes a series of processes including dissolution, purification, and distillation to support single-crystal silicon rods. After polishing and slicing, the single-crystal silicon rods become wafers. A wafer disk serves as the carrier for the wafer. After the wafer is mounted on the wafer disk, a label corresponding to the wafer needs to be affixed to the wafer disk to accurately identify and manage the wafer during subsequent processing, inspection, and tracking. Currently, labeling on wafer disks is mostly done manually. Manual labeling is prone to errors, has low efficiency, and the labeling position accuracy is difficult to control, leading to low yield rates.

[0003] Chinese utility model patent application number 202422837034.8 discloses an automatic wafer labeling machine, comprising: a cabinet; a loading platform disposed on the cabinet and used to place wafers; a first conveying mechanism disposed on the cabinet and used to drive the loading platform to move horizontally; a second conveying mechanism disposed on the cabinet; and a suction and identification mechanism disposed on the second conveying mechanism and used to drive the suction and identification mechanism to move horizontally. However, this type of automatic wafer labeling machine lacks a loading function and requires an external robotic arm for loading. The equipment has low integration and cannot perform wafer disk loading and labeling operations with a single device. Furthermore, it can only label wafer disks of a single size and cannot perform positioning and labeling operations on wafer disks of different sizes, resulting in poor labeling flexibility. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic labeling machine for semiconductor wafers.

[0005] To achieve the above objectives, the technical solution proposed by this utility model is as follows: An automatic labeling machine for semiconductor wafers includes a machine body mounted on the ground, a feeding mechanism for forming an automatic feeding structure, a labeling mechanism for forming a combined labeling structure, and a detection mechanism for forming an adjustable alignment and detection structure. The feeding mechanism is arranged on the upper inner side of the machine body, the labeling mechanism is mounted on the upper part of the machine body corresponding to the feeding mechanism, and the detection mechanism is arranged on one side of the machine body corresponding to the labeling mechanism.

[0006] The feeding mechanism includes a feeding box, a moving component, and a feeding robot. The feeding box is located on the upper side of the machine body and is connected to the machine body via an electric lifting tray. The inner wall of the feeding box is provided with a placement groove corresponding to the wafer disk. The wafer disk is arranged in the feeding box through the placement groove. The moving component is located on one side of the machine body. The feeding robot is mounted on one end of the moving component corresponding to the feeding box and is slidably connected to the machine body through the moving component.

[0007] The moving assembly includes a moving motor, a moving lead screw, a guide rail, and a moving mounting plate. The moving motor is located on one side of the machine body and is fixedly connected to the machine body via a bracket. The moving lead screw is located at one end of the moving motor and is rotatably connected to the machine body via a bearing seat. One end of the moving lead screw is connected to the output end of the moving motor via a coupling. The guide rail is located on one side of the machine body corresponding to the moving lead screw and is fixedly connected to the machine body via a bracket. The moving mounting plate is located on the upper part of the guide rail and is slidably connected to the guide rail via a slider. One end of the moving mounting plate is connected to the moving lead screw via a lead screw connector. The loading robot is located at the lower part of the moving mounting plate at the end away from the moving lead screw and is fixedly connected to the moving mounting plate.

[0008] It also includes a positioning component, which includes a positioning tray and vacuum nozzles. The positioning tray is composed of several annular tray structures with different diameters. The several annular trays with different diameters are arranged tangentially inside the upper inner side of the machine body and are fixedly connected to the machine body. The positioning tray is located below the loading robot. Several vacuum nozzles are provided, which are arranged at intervals in the lower part of the positioning tray and penetrate the positioning tray. The vacuum nozzles are connected to a vacuum pump.

[0009] The labeling mechanism includes a labeling bracket, a labeling tray, a printer, and a rotating assembly. The labeling bracket is located on the upper inner side of the machine body and is fixedly connected to the machine body. There are two sets of labeling trays, which are arranged side by side and spaced apart on one side of the labeling bracket and are rotatably connected to the labeling bracket through a rotating shaft. The printer is located on the upper part of the machine body corresponding to the labeling tray and is fixedly connected to the machine body through a bracket. The rotating assembly is arranged between the printer and the positioning tray.

[0010] The rotating assembly includes a rotating cylinder, a rotating arm, a labeling cylinder, and a labeling nozzle. The rotating cylinder is located between the printer and the positioning tray and is fixedly connected to the machine body via a bracket. The rotating arm is located at the output end of the rotating cylinder and one end is fixedly connected to the rotating cylinder. The labeling cylinder is located at the end of the rotating arm away from the rotating cylinder and is fixedly connected to the rotating arm. The labeling nozzle is located at the output end of the labeling cylinder and is fixedly connected to the output end of the labeling cylinder. The labeling nozzle is connected to a nozzle pump.

[0011] The testing mechanism includes a testing bracket, a testing motor, a testing shaft, a mounting bracket, and a testing camera. The testing bracket is located on the upper part of the machine body and is fixedly connected to the machine body. The testing motor is located on the upper end of the testing bracket and is fixedly connected to the testing bracket. The testing shaft is located on the upper part of the testing bracket and is assembled and connected to the testing bracket through a bearing seat. The upper end of the testing shaft is driven by the testing motor through a transmission belt and a transmission pulley. The mounting bracket is located on the lower end of the testing shaft and is driven by the testing shaft through a transverse component. The testing camera is located inside the mounting bracket and is fixedly connected to the mounting bracket. The testing end of the testing camera is oriented downwards.

[0012] The lateral movement assembly includes a lateral movement mounting plate, a lateral movement motor, and guide rods. The lateral movement mounting plate is located at the lower end of the detection shaft and is fixedly connected to the detection shaft. The lateral movement motor is located at one end of the lateral movement mounting plate and passes through the lateral movement mounting plate, and is fixedly connected to the lateral movement mounting plate. There are two sets of guide rods, which are arranged side by side at intervals at the lower part of the lateral movement mounting plate and are fixedly connected to the lateral movement mounting plate through brackets. The mounting bracket is located at the lower part of the guide rods and is slidably connected to the guide rods through linear bearings. The mounting bracket is connected to the output end of the lateral movement motor through a transmission pulley, a transmission belt, and a traction plate.

[0013] It also includes a positioning assembly, which includes a positioning cylinder, a positioning spring, and a positioning block. The positioning cylinder is located on the lower side of the mounting bracket and is fixedly connected to the mounting bracket. The output end of the positioning cylinder faces downward. The positioning spring is located on the output end of the positioning cylinder and its upper end is fixedly connected to the output end of the positioning cylinder. The positioning block is located at the lower end of the positioning spring and is fixedly connected to the positioning spring. The positioning block is located above the positioning tray.

[0014] It also includes an electrical control unit, which is located on one side of the upper part of the machine body and is fixedly connected to the machine body. The electrical control unit is electrically connected to the feeding robot, the moving motor, the vacuum pump, the printer, the rotary cylinder, the labeling cylinder, the suction pump, the detection motor, the detection camera, the traverse motor, and the positioning cylinder.

[0015] The beneficial effects of this utility model are: Equipped with a feeding mechanism and a labeling mechanism, it can automatically feed and label wafer disks. It can also perform positioning and labeling operations on wafer disks of different specifications, offering high labeling flexibility. It also features a detection mechanism that can perform alignment and positioning detection on the wafer disks, ensuring accurate placement. The equipment adopts fully automatic control, with a high degree of automation and integration, guaranteeing product quality, improving work efficiency, and minimizing waste. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the feeding mechanism and the machine body of this utility model; Figure 3 This is a schematic diagram of the feeding box structure of this utility model; Figure 4 This is a schematic diagram of the cooperation between the positioning component and the moving component of this utility model; Figure 5 This is a schematic diagram showing the cooperation between the labeling mechanism and the machine body of this utility model; Figure 6 This is a schematic diagram of the labeling mechanism and positioning components of this utility model. Figure 7 This is a schematic diagram of the alignment component structure of this utility model; Figure 8 This is the electrical connection diagram of this utility model.

[0017] In the diagram: 1. Machine body; 2. Feeding box; 3. Feeding robot; 4. Moving motor; 5. Moving lead screw; 6. Guide rail; 7. Moving mounting plate; 8. Positioning tray; 9. Vacuum nozzle; 10. Labeling bracket; 11. Labeling paper tray; 12. Printer; 13. Rotary cylinder; 14. Rotating arm; 15. Labeling cylinder; 16. Labeling nozzle; 17. Detection bracket; 18. Detection motor; 19. Detection shaft; 20. Mounting bracket; 21. Detection camera; 22. Horizontal mounting plate; 23. Horizontal motor; 24. Guide rod; 25. Positioning cylinder; 26. Positioning spring; 27. Positioning pressure block; 28. Electrical control unit. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings. An automatic labeling machine for semiconductor wafers includes a body 1 mounted on the ground, a feeding mechanism for an automatic feeding structure, a labeling mechanism for a combined labeling structure, and a detection mechanism for an adjustable alignment and detection structure. The feeding mechanism is located on the upper inner side of the body 1, the labeling mechanism is mounted on the upper part of the body 1 corresponding to the feeding mechanism, and the detection mechanism is located on one side of the body 1 corresponding to the labeling mechanism. A schematic diagram of the overall structure of this invention is shown below. Figure 1 As shown.

[0019] The loading mechanism includes a loading box 2, a moving component, and a loading robot 3. The loading box 2 is located on the upper side of the machine body 1 and is connected to the machine body 1 via an electric lifting tray. The inner wall of the loading box 2 has a placement groove corresponding to the wafer disk, and the wafer disk is arranged in the loading box 2 through the placement groove. The moving component is located on one side of the machine body 1. The loading robot 3 is mounted on one end of the moving component corresponding to the loading box 2 and is slidably connected to the machine body 1 through the moving component. The loading mechanism, through the cooperation of the loading box 2, the moving component, and the loading robot 3, loads the wafers... The wafer trolley performs automatic loading and unloading operations. The loading box 2 provides mounting support for the wafer trolleys. The wafer trolleys are arranged side-by-side at intervals inside the loading box 2 via placement grooves. A moving component provides moving support for the loading robot 3. The loading robot 3 grips the wafer trolleys inside the loading box 2 and moves them to the labeling station under the action of the moving component, thus realizing the loading operation. After labeling, the wafer trolleys at the labeling station are stored in the corresponding placement grooves inside the loading box 2. A schematic diagram of the loading mechanism and the machine body 1 is shown below. Figure 2 As shown.

[0020] The moving assembly includes a moving motor 4, a moving lead screw 5, a guide rail 6, and a moving mounting plate 7. The moving motor 4 is located on one side of the machine body 1 and is fixedly connected to the machine body 1 via a bracket. The moving lead screw 5 is located at one end of the moving motor 4 and is rotatably connected to the machine body 1 via a bearing seat. One end of the moving lead screw 5 is connected to the output end of the moving motor 4 via a coupling. The guide rail 6 is located on one side of the machine body 1 corresponding to the moving lead screw 5 and is fixedly connected to the machine body 1 via a bracket. The moving mounting plate 7 is located on the upper part of the guide rail 6 and is slidably connected to the guide rail 6 via a slider. One end of the moving mounting plate 7 is connected to the moving lead screw 5 via a lead screw connector. The loading robot 3 is located at the lower part of the moving mounting plate 7 away from the moving lead screw 5 and is fixedly connected to the moving mounting plate 7. The moving assembly, through the cooperation of the moving motor 4, the moving lead screw 5, the guide rail 6, and the moving mounting plate 7, provides moving support for the loading robot 3. The moving motor 4 provides rotational support for the moving lead screw 5 and drives the moving lead screw 5 to rotate. The moving lead screw 5 is used to drive the moving motor 4. The downward rotation drives the movable mounting plate 7 to move horizontally via the lead screw connector. The guide rail 6 provides sliding support for the movable mounting plate 7 and guides it. The movable mounting plate 7 provides mounting support for the loading robot 3 and drives the loading robot 3 to perform horizontal movements under the action of the moving motor 4. When it is necessary to load wafer disks, several wafer disks to be labeled are placed side by side at intervals in the loading box 2 through the placement groove. The loading box 2 is placed on the electric lifting tray, and the moving component drives the loading machine. The robotic arm 3 moves to the loading box 2, grips the wafer disk, and moves it to the labeling station under the action of the moving component. After labeling, the robotic arm 3 grips the labeled wafer disk and moves it to the loading box 2 under the action of the moving component, placing the labeled wafer disk back into the original placement groove. Then, the electric lifting tray descends one level, and the robotic arm 3 grips the upper wafer disk of the labeled wafer disk to perform the next loading operation. The structural diagram of the loading box 2 of this utility model is shown below. Figure 3 As shown.

[0021] The system also includes a positioning component, comprising a positioning tray 8 and vacuum nozzles 9. The positioning tray 8 consists of several annular tray structures of different diameters, which are arranged tangentially on the upper inner side of the machine body 1 and fixedly connected to it. The positioning tray 8 is located below the loading robot 3. Several vacuum nozzles 9 are provided, spaced apart at the bottom of the positioning tray 8 and penetrating it. The vacuum nozzles 9 are connected to a vacuum pump. The positioning component, through the cooperation of the positioning tray 8 and the vacuum nozzles 9, forms a positioning structure at the labeling station, thereby positioning the wafer disks to meet labeling requirements. The positioning tray 8 adopts a ring-type tray structure to meet the positioning requirements of wafer disks of different sizes. The vacuum nozzles 9 are used to adsorb and position the wafer disks on the positioning tray 8, thereby meeting the labeling requirements of the wafer disks. A schematic diagram of the cooperation between the positioning component and the moving component of this utility model is shown below. Figure 4 As shown.

[0022] The labeling mechanism includes a labeling bracket 10, a labeling tray 11, a printer 12, and a rotating assembly. The labeling bracket 10 is located on the upper inner side of the machine body 1 and is fixedly connected to the machine body 1. Two sets of labeling trays 11 are arranged side-by-side and spaced apart on one side of the labeling bracket 10, and are rotatably connected to the labeling bracket 10 via a rotating shaft. The printer 12 is located on the upper part of the machine body 1, corresponding to the labeling tray 11, and is fixedly connected to the machine body 1 via a bracket. The rotating assembly is arranged between the printer 12 and the positioning tray 8. The labeling mechanism, through the cooperation of the labeling bracket 10, labeling tray 11, printer 12, and rotating assembly, forms a combined labeling structure for automatic labeling of wafer disks. The labeling bracket 10 provides mounting support for the labeling tray 11, the labeling tray 11 stores label paper, the printer 12 prints the labels, and the rotating assembly affixes the printed labels to the wafer disk. A schematic diagram of the labeling mechanism and the machine body 1 is shown below. Figure 5 As shown.

[0023] The rotating assembly includes a rotary cylinder 13, a rotating arm 14, a labeling cylinder 15, and a labeling nozzle 16. The rotary cylinder 13 is positioned between the printer 12 and the positioning tray 8 and is fixedly connected to the machine body 1 via a bracket. The rotating arm 14 is located at the output end of the rotary cylinder 13, and one end of the rotating arm 14 is fixedly connected to the rotary cylinder 13. The labeling cylinder 15 is located at the end of the rotating arm 14 away from the rotary cylinder 13 and is fixedly connected to the rotating arm 14. The labeling nozzle 16 is located at the output end of the labeling cylinder 15 and is connected to the output end of the labeling cylinder 15. The labeling nozzle 16 is fixedly connected to the end and communicates with the nozzle pump. The rotating assembly, through the cooperation of the rotary cylinder 13, the rotary arm 14, the labeling cylinder 15, and the labeling nozzle 16, applies the printed label paper onto the wafer disk. The rotary cylinder 13 provides mounting support for the rotary arm 14 and drives it to rotate a certain angle. The rotary arm 14 provides mounting support for the labeling cylinder 15 and, under the action of the rotary cylinder 13, drives it to rotate a certain angle. The labeling cylinder 15 is used to apply the labeling nozzle 16... The system provides mounting support and moves the labeling nozzle 16 via the telescopic movement of its output end. The labeling nozzle 16 is used to pick up the printed labels and affix them to the wafer disk. When labeling the wafer disk is required, the wafer disk is placed on the upper end of the positioning tray 8 under the gripping of the loading robot 3. The printer 12 prints the label paper and extends out of the label outlet. The rotary cylinder 13 drives the rotary arm 14 to rotate so that the labeling cylinder 15 and the labeling nozzle 16 are kept horizontal relative to the printer 12. The output end of the labeling cylinder 15 extends, and the labeling suction nozzle 16, under the action of the suction pump, adsorbs the label paper. After adsorption, the output end of the labeling cylinder 15 retracts. Then, the rotary cylinder 13 drives the rotary arm 14 to rotate so that the labeling cylinder 15 and the labeling suction nozzle 16 are in a vertical position corresponding to the wafer disk. The output end of the labeling cylinder 15 extends, and the labeling suction nozzle 16 affixes the label paper to the wafer disk. The output end of the labeling cylinder 15 retracts, thus completing the labeling operation. A schematic diagram of the labeling mechanism and positioning component of this utility model is shown below. Figure 6 As shown.

[0024] The testing mechanism includes a testing bracket 17, a testing motor 18, a testing shaft 19, a mounting bracket 20, and a testing camera 21. The testing bracket 17 is located on the upper part of the machine body 1 and is fixedly connected to the machine body 1. The testing motor 18 is located on the upper end of the testing bracket 17 and is fixedly connected to the testing bracket 17. The testing shaft 19 is located on the upper part of the testing bracket 17 and is assembled and connected to the testing bracket 17 through a bearing seat. The upper end of the testing shaft 19 is connected to the testing motor 18 via a transmission belt and a transmission pulley. The mounting bracket 20 is located on the lower end of the testing shaft 19 and is connected to the testing shaft 19 via a transverse movement assembly. The testing camera 21 is located inside the mounting bracket 20 and is fixedly connected to the mounting bracket 20. The detection end of the camera 21 is set downwards. The detection mechanism, through the cooperation of the detection bracket 17, the detection motor 18, the detection shaft 19, the mounting bracket 20, and the detection camera 21, detects the wafer disk during the labeling process. The detection bracket 17 provides mounting support for the detection motor 18. The detection motor 18 drives the detection shaft 19 to rotate through the transmission belt and the transmission pulley. The detection shaft 19 provides mounting support for the transverse component and drives the transverse component to rotate a certain angle under the action of the detection motor 18. The transverse component provides sliding support for the mounting bracket 20. The mounting bracket 20 provides mounting support for the detection camera 21 and drives the detection camera 21 to move under the action of the transverse component.

[0025] The lateral movement assembly includes a lateral movement mounting plate 22, a lateral movement motor 23, and guide rods 24. The lateral movement mounting plate 22 is located at the lower end of the detection shaft 19 and is fixedly connected to the detection shaft 19. The lateral movement motor 23 is located at one end of the lateral movement mounting plate 22, passes through the lateral movement mounting plate 22, and is fixedly connected to the lateral movement mounting plate 22. Two sets of guide rods 24 are arranged side by side at intervals at the lower part of the lateral movement mounting plate 22 and are fixedly connected to the lateral movement mounting plate 22 through brackets. The mounting bracket 20 is located at the lower part of the guide rods 24 and is slidably connected to the guide rods 24 through linear bearings. The mounting bracket 20 is connected to the output end of the transverse motor 23 via a transmission pulley, transmission belt, and traction plate. The transverse assembly provides sliding support for the mounting bracket 20 through the cooperation of the transverse mounting plate 22, the transverse motor 23, and the guide rod 24. The transverse mounting plate 22 provides mounting support for the transverse motor 23. The transverse motor 23 drives the mounting bracket 20 to slide along the guide rod 24 via the transmission pulley, transmission belt, and traction plate, thereby adjusting the position of the detection camera 21. The guide rod 24 guides the movement of the mounting bracket 20.

[0026] It also includes a positioning assembly, which includes a positioning cylinder 25, a positioning spring 26, and a positioning block 27. The positioning cylinder 25 is located on the lower side of the mounting bracket 20 and is fixedly connected to the mounting bracket 20. The output end of the positioning cylinder 25 faces downward. The positioning spring 26 is located at the output end of the positioning cylinder 25 and its upper end is fixedly connected to the output end of the positioning cylinder 25. The positioning block 27 is located at the lower end of the positioning spring 26 and is fixedly connected to the positioning spring 26. The positioning block 27 is located above the positioning tray 8 and is made of silicone. The positioning assembly is connected via the positioning cylinder 25, the positioning spring 26, and... The alignment block 27, in conjunction with the mounting bracket 20, forms the alignment structure on the side of the mounting bracket to press and align the wafer disk during the labeling process. The alignment cylinder 25 provides mounting support for the alignment spring 26 and, through the extension and retraction of its output end, drives the alignment spring 26 to rise and fall. The alignment spring 26 provides elastic support for the alignment block 27 and, under the action of the alignment cylinder 25, drives the alignment block 27 to rise and fall. The alignment block 27, driven by the alignment spring 26, rises and falls to press and align the wafer disk during the labeling process, ensuring the stability of the wafer disk during labeling. A schematic diagram of the alignment component structure of this utility model is shown below. Figure 7 As shown.

[0027] It also includes an electrical control unit 28, which is located on one side of the upper part of the machine body 1 and is fixedly connected to the machine body 1. The electrical control unit 28 is electrically connected to the feeding robot 3, the moving motor 4, the vacuum pump, the printer 12, the rotary cylinder 13, the labeling cylinder 15, the suction pump, the detection motor 18, the detection camera 21, the traverse motor 23, and the positioning cylinder 25. The electrical connection diagram of this utility model is shown below. Figure 8 As shown.

[0028] It also includes a cover and casters. The cover is located on the upper part of the body 1 and is fixedly connected to the body 1. There are four sets of casters, which are respectively located at the four corners of the lower part of the body 1 and fixedly connected to the body 1. The body 1 is supported on the ground by the casters. The cover serves as a protective structure for the upper part of the body 1, and the casters serve as a moving structure for the lower part of the body 1, thereby providing moving support for the body 1. The casters are equipped with brake plates, which can be used to lock the casters.

[0029] In this technical solution, the electric lifting pallet, the loading robot 3, and each displacement component can be replaced by existing structures with the same functions. Their working principles and arrangements are all existing technologies, so they will not be described in detail here.

[0030] This technical solution also includes a position sensor and an audible and visual alarm. The working principle and arrangement of these sensors are the same as those in the prior art, so they will not be described in detail here.

[0031] Working principle: When labeling wafer disks is required, several wafer disks to be labeled are placed side-by-side at intervals in the loading box 2 via a placement chute. The loading box 2 is placed on an electric lifting tray. The equipment is started, and the moving component moves the loading robot 3 to the loading box 2. The loading robot 3 grips the wafer disk and, under the action of the moving component, moves the wafer disk to the positioning tray 8. The vacuum nozzle 9 suctions the wafer disk. At the same time, the lateral moving component moves the detection camera 21 and the alignment component above the wafer disk. The alignment component presses and aligns the wafer disk. Simultaneously, the printer 12 prints labels, and the labels extend out of the printer 12 through the label outlet. The rotary cylinder 13 drives the rotary arm 14 to rotate so that the labeling cylinder 15 and the labeling nozzle 16 are kept horizontal relative to the printer 12. The output end of the labeling cylinder 15 extends, and the labeling nozzle 16 is pumped by the nozzle pump. Under the action of the labeling cylinder 15, the labeling paper is adsorbed. After adsorption, the output end of the labeling cylinder 15 retracts. Then, the rotary cylinder 13 drives the rotary arm 14 to rotate so that the labeling cylinder 15 and the labeling nozzle 16 are in a vertical position corresponding to the wafer disk. The output end of the labeling cylinder 15 extends, and the labeling nozzle 16 affixes the label to the wafer disk. The output end of the labeling cylinder 15 retracts, thus completing the labeling operation. During the labeling process, the detection camera 21 detects the labeling on the wafer disk. After the labeling is completed, the vacuum nozzle 9 stops working, and the loading robot 3 picks up the labeled wafer disk and moves it to the loading box 2 under the action of the moving component. The labeled wafer disk is placed back into the original placement groove to realize the unloading operation. Then, the electric lifting tray descends one level, and the loading robot 3 picks up the upper wafer disk of the labeled wafer disk to perform the next loading and labeling operation.

[0032] The beneficial effects of this utility model are that it is equipped with a feeding mechanism and a labeling mechanism, which can automatically feed and label wafer disks. It can also perform positioning and labeling operations on wafer disks of different specifications, with high labeling flexibility. It is equipped with a detection mechanism, which can perform alignment and positioning detection on the wafer disks to ensure accurate positioning. The equipment adopts fully automatic control, with a high degree of automation and integration, which ensures product quality, improves work efficiency, and has a low loss rate.

[0033] The above description details one embodiment of the present utility model, but it is merely a preferred embodiment and should not be construed as limiting the scope of the present utility model. All equivalent variations and improvements made within the scope of the present utility model application should still fall within the patent coverage of the present utility model.

Claims

1. An automatic labeling machine for semiconductor wafers, comprising a body (1), said body (1) being mounted on the ground, characterized in that, It also includes a feeding mechanism for forming an automatic feeding structure, a labeling mechanism for forming a combined labeling structure, and a detection mechanism for forming an adjustable positioning and detection structure. The feeding mechanism is arranged on the upper inner side of the machine body (1), the labeling mechanism is assembled on the upper part of the machine body (1) corresponding to the feeding mechanism, and the detection mechanism is arranged on one side of the machine body (1) corresponding to the labeling mechanism.

2. The automatic labeling machine for semiconductor wafers as described in claim 1, characterized in that, The feeding mechanism includes a feeding box (2), a moving component, and a feeding robot (3). The feeding box (2) is located on the upper side of the machine body (1) and is connected to the machine body (1) by an electric lifting tray. The inner wall of the feeding box (2) is provided with a placement groove corresponding to the wafer disk. The wafer disk is arranged in the feeding box (2) through the placement groove. The moving component is arranged on one side of the machine body (1). The feeding robot (3) is mounted on one end of the moving component corresponding to the feeding box (2) and is slidably connected to the machine body (1) through the moving component.

3. The automatic labeling machine for semiconductor wafers as described in claim 2, characterized in that, The moving assembly includes a moving motor (4), a moving screw (5), a guide rail (6), and a moving mounting plate (7). The moving motor (4) is located on one side of the machine body (1) and is fixedly connected to the machine body (1) via a bracket. The moving screw (5) is located at one end of the moving motor (4) and is rotatably connected to the machine body (1) via a bearing seat. One end of the moving screw (5) is connected to the output end of the moving motor (4) via a coupling. The guide rail (6) is located on one side of the machine body (1) corresponding to the moving screw (5) and is fixedly connected to the machine body (1) via a bracket. The moving mounting plate (7) is located on the upper part of the guide rail (6) and is slidably connected to the guide rail (6) via a slider. One end of the moving mounting plate (7) is connected to the moving screw (5) via a screw connector. The loading robot (3) is located at the lower part of the end of the moving mounting plate (7) away from the moving screw (5) and is fixedly connected to the moving mounting plate (7).

4. The automatic labeling machine for semiconductor wafers as described in claim 3, characterized in that, It also includes a positioning component, which includes a positioning tray (8) and a vacuum nozzle (9). The positioning tray (8) is composed of several annular tray structures with different diameters. The several annular trays with different diameters are arranged inside the upper inner side of the machine body (1) and are fixedly connected to the machine body (1). The positioning tray (8) is located below the loading robot (3). There are several vacuum nozzles (9). The several vacuum nozzles (9) are arranged at intervals in the lower part of the positioning tray (8) and penetrate the positioning tray (8). The vacuum nozzles (9) are connected to a vacuum pump.

5. The automatic labeling machine for semiconductor wafers as described in claim 4, characterized in that, The labeling mechanism includes a labeling bracket (10), a labeling tray (11), a printer (12), and a rotating assembly. The labeling bracket (10) is located on the upper inner side of the machine body (1) and is fixedly connected to the machine body (1). There are two sets of labeling trays (11). The two sets of labeling trays (11) are arranged side by side at intervals on one side of the labeling bracket (10) and are rotatably connected to the labeling bracket (10) through a rotating shaft. The printer (12) is located on the upper part of the machine body (1) corresponding to the labeling tray (11) and is fixedly connected to the machine body (1) through a bracket. The rotating assembly is arranged between the printer (12) and the positioning tray (8).

6. The automatic labeling machine for semiconductor wafers as described in claim 5, characterized in that, The rotating assembly includes a rotary cylinder (13), a rotary arm (14), a labeling cylinder (15), and a labeling nozzle (16). The rotary cylinder (13) is located between the printer (12) and the positioning tray (8) and is fixedly connected to the machine body (1) via a bracket. The rotary arm (14) is located at the output end of the rotary cylinder (13) and one end is fixedly connected to the rotary cylinder (13). The labeling cylinder (15) is located at the end of the rotary arm (14) away from the rotary cylinder (13) and is fixedly connected to the rotary arm (14). The labeling nozzle (16) is located at the output end of the labeling cylinder (15) and is fixedly connected to the output end of the labeling cylinder (15). The labeling nozzle (16) is connected to a nozzle pump.

7. The automatic labeling machine for semiconductor wafers as described in claim 6, characterized in that, The detection mechanism includes a detection bracket (17), a detection motor (18), a detection shaft (19), a mounting bracket (20), and a detection camera (21). The detection bracket (17) is located on the upper part of the machine body (1) and is fixedly connected to the machine body (1). The detection motor (18) is located on the upper end of the detection bracket (17) and is fixedly connected to the detection bracket (17). The detection shaft (19) is located on the upper part of the detection bracket (17) and is assembled and connected to the detection bracket (17) through a bearing seat. The upper end of the detection shaft (19) is connected to the detection motor (18) through a transmission belt and a transmission pulley. The mounting bracket (20) is located on the lower end of the detection shaft (19) and is connected to the detection shaft (19) through a transverse component. The detection camera (21) is located on the inner side of the mounting bracket (20) and is fixedly connected to the mounting bracket (20). The detection end of the detection camera (21) is set downward.

8. The automatic labeling machine for semiconductor wafers as described in claim 7, characterized in that, The transverse assembly includes a transverse mounting plate (22), a transverse motor (23), and guide rods (24). The transverse mounting plate (22) is located at the lower end of the detection shaft (19) and is fixedly connected to the detection shaft (19). The transverse motor (23) is located at one end of the transverse mounting plate (22) and passes through the transverse mounting plate (22) and is fixedly connected to the transverse mounting plate (22). There are two sets of guide rods (24). The two sets of guide rods (24) are arranged side by side at intervals at the lower part of the transverse mounting plate (22) and are fixedly connected to the transverse mounting plate (22) through brackets. The mounting bracket (20) is located at the lower part of the guide rods (24) and is slidably connected to the guide rods (24) through linear bearings. The mounting bracket (20) is connected to the output end of the transverse motor (23) through a transmission pulley, a transmission belt, and a traction plate.

9. The automatic labeling machine for semiconductor wafers as described in claim 8, characterized in that, It also includes a positioning assembly, which includes a positioning cylinder (25), a positioning spring (26), and a positioning block (27). The positioning cylinder (25) is located on the lower side of the mounting bracket (20) and is fixedly connected to the mounting bracket (20). The output end of the positioning cylinder (25) is set downwards. The positioning spring (26) is located on the output end of the positioning cylinder (25) and its upper end is fixedly connected to the output end of the positioning cylinder (25). The positioning block (27) is located at the lower end of the positioning spring (26) and is fixedly connected to the positioning spring (26). The positioning block (27) is located above the positioning tray (8).

10. The automatic labeling machine for semiconductor wafers as described in claim 9, characterized in that, It also includes an electrical control unit (28), which is located on the upper side of the machine body (1) and fixedly connected to the machine body (1). The electrical control unit (28) is electrically connected to the loading robot (3), the moving motor (4), the vacuum pump, the printer (12), the rotary cylinder (13), the labeling cylinder (15), the suction pump, the detection motor (18), the detection camera (21), the transverse motor (23), and the positioning cylinder (25).

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