Wafer thickness measurement system
CN224695220UActive Publication Date: 2026-08-28ZHEJIANG SHUANGYUAN TECH CO LTD
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Patent Information
- Application Number
- CN202621143050.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-27
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2036-07-27
AI Technical Summary
Technical Problem
当待测晶圆存在位置偏移，或者晶圆表面图形结构与预设坐标之间存在偏差时，难以准确判断实际测量位置是否落在适于测量的平坦区域，进而影响膜厚测量的可靠性
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Smart Images
Figure CN224695220U_ABST
Abstract
The utility model discloses a kind of wafer thickness measurement systems, including pedestal, motion module, microscopic imaging module, white light interference thickness measurement module and industrial control linkage control unit. Microscopic imaging module includes microscopic illumination light source, Kohler illumination component, first light splitting module, microscopic objective lens, barrel lens, second light splitting module and imaging module;White light interference thickness measurement module includes white light source, fiber coupler, spectrometer and fiber receiving end. Imaging module and fiber receiving end are connected with shared microscopic objective lens, barrel lens via second light splitting module, and fiber receiving end is equipped with Z direction adjusting mechanism and XY adjusting mechanism;Control unit controls two light sources time-sharing work. The system can realize the visualization positioning and film thickness measurement of sample measurement area.
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