Wafer multi-facet defect detection apparatus
CN224695739UActive Publication Date: 2026-08-28SUZHOU SUNA OPTOELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202521954656.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-11
AI Technical Summary
Technical Problem
[0004]本实用新型的目的在于提供一种芯片多面缺陷检测装置，以解决现有检测装置作业速度慢、上下料方式呆板等问题
Benefits of technology
[0015]本实用新型的有益效果是：本实用新型的芯片多面缺陷检测装置，通过设置转动吸附件和多个检测工位，通过两者的配合，从而能够在所述转动吸附件转动过程中实现芯片的多个面的检测，有效的提高了检测的效率，多个测试工位的配合能够提高对芯片的检测效果；此外，通过吸附头实现芯片的上料和下料，使得芯片的取放更加灵活。
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Smart Images
Figure CN224695739U_ABST
Abstract
The utility model provides a kind of chip multi-surface defect detection device to carry out detection to cubic chip, and the chip has two end faces and four side surfaces around two end faces, and the chip multi-surface defect detection device includes rotating suction accessory;Feeding station;Discharging station;First side surface detection station;Second side surface detection station;First end face detection station.The chip multi-surface defect detection device of the utility model, by setting rotating suction accessory, to realize the detection of multiple surfaces of chip in the rotating process of rotating suction accessory, and detection efficiency is high, and detection effect is good;Chip feeding and discharging are realized by suction head, and chip picking and placing are more flexible.
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