Fuse assembly for flexible circuit board
CN224696737UActive Publication Date: 2026-08-28深圳市至臻精密股份有限公司
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202521907118.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-04
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-04
AI Technical Summary
Technical Problem
[0003]在现有技术中，现有的柔性电路板的保险丝组件包括柔性电路板和保险丝，保险丝连接于柔性电路板，但是，覆盖膜全封闭压合时残留空气无法排出，以形成气泡，阻碍热量传递，导致现有的柔性电路板的保险丝组件的散热效果较差，同时，气泡影响柔性电路板的保险丝组件的外观
Benefits of technology
[0020]本实用新型提供一种柔性电路板的保险丝组件，柔性电路板设有电路区域；保险丝集成于柔性电路板，并与柔性电路板中形成对应的保险丝区域；电路区域延伸至保险丝区域；该保险丝呈蛇形布置；保险丝具有多个，多个保险丝相对布置，并与电路区域围合形成保险丝区域；柔性电路板开设有多个透窗部，各个透窗部沿着柔性电路板的厚度方向贯穿柔性电路板；多个透窗部分布于保险丝区域，并处于保险丝区域的不同位置；多个透窗部沿着保险丝区域的长度方向依次布置，多个透窗部处于保险丝区域的中部位置，且处于相邻的两个保险丝之间，多个透窗部用于排出覆盖膜与基材之间的残留空气，并通过模具对柔性电路板钻孔形成，以便于覆盖膜与基材之间的残留空气通过多个透窗部向外排出，避免了气泡形成，多个透窗部直接暴露保险丝区域，使得热量能快速散发到外部环境中，提高了柔性电路板的保险丝组件的散热效果。同时，避免了气泡影响柔性电路板的保险丝组件的外观，防止气泡膨胀会引发覆盖膜与基材分层，提高了柔性电路板的保险丝组件的美观性。
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224696737U_ABST
Abstract
The application provides a fuse assembly of a flexible circuit board, which comprises a flexible circuit board and fuses. A plurality of fuses and a circuit region form a fuse region. The flexible circuit board is provided with a plurality of window parts. The plurality of window parts are distributed in the fuse region. The plurality of window parts are located in the middle part of the fuse region. The plurality of window parts are used for discharging the residual air between the cover film and the base material. The plurality of window parts are formed by drilling the flexible circuit board through a mold, so that the residual air between the cover film and the base material is discharged outward through the plurality of window parts, and bubble formation is avoided. The plurality of window parts are directly exposed to the fuse region, so that heat can be quickly dissipated to the external environment, and the heat dissipation effect of the fuse assembly of the flexible circuit board is improved. At the same time, the appearance of the fuse assembly of the flexible circuit board is not affected by bubbles. Bubble expansion will not cause the cover film and the base material to delaminate, and the appearance of the fuse assembly of the flexible circuit board is improved.
Need to check novelty before this filing date? Find Prior Art