Carrying assembly for test samples and electron microscope system

Abstract

The embodiment of the present disclosure discloses a bearing assembly for testing sample and an electron microscope system, the bearing assembly comprises: a main body; a contact part for supporting the testing sample and connected to the main body; the contact part comprises a plurality of recesses recessed towards the main body, the recesses are used for accommodating the testing sample; the recesses comprise a plurality of abutting surfaces; wherein at least two of the abutting surfaces are used for supporting the testing sample; and adjacent two of the abutting surfaces are connected and form an included angle.

Description

Technical Field

[0001] This disclosure relates to the field of testing, and more particularly to a sample carrier and an electron microscope system. Background Technology

[0002] To more intuitively and clearly observe the morphology of the failure site and analyze the cause of failure, FIB (Focused Ion Beam) is needed for preparing transmission samples, cross-sectional observation, and circuit repair. To transfer the sample from the FIB instrument to a scanning electron microscope (SEM) or transmission electron microscope (TEM) for imaging, observation, and measurement, a metal grid is required to support the sample. To ensure the stability and success rate of sample imaging, tungsten deposition is used to fix the sample to the metal pillars of the grid within the FIB instrument. Depending on the sample preparation method, the sample can be fixed on the sidewalls or top of the grid metal pillars. However, using only one side and tungsten deposition to fix the test sample results in only one side of the test sample being fixed, making it prone to detachment during rotational angle testing, thus reducing sample preparation yield. Furthermore, a longer FIB deposition time is required to increase the adhesion strength of the tungsten. Therefore, there is still room for improvement in how to better fix or support the test sample. Utility Model Content

[0003] According to some aspects of embodiments of this disclosure, a carrier component for a test sample is provided, comprising:

[0004] main body;

[0005] The contact portion is used to support the test sample and is connected to the main body;

[0006] The contact portion includes a plurality of recesses recessed toward the body, the recesses being used to receive the test sample;

[0007] The recess includes multiple abutment surfaces; wherein at least two of the abutment surfaces are used to support the test sample; adjacent abutment surfaces are connected and form an angle greater than or equal to 90°.

[0008] In some embodiments, the recess includes:

[0009] The groove has an opening direction opposite to the main body; the sidewalls and bottom of the groove serve as the abutment surface.

[0010] In some embodiments, the opening end of the groove has a dimension greater than or equal to the dimension of the bottom in a first direction, and the first direction is parallel to the contact surface between the body and the contact portion.

[0011] In some embodiments, the support component includes a plurality of the grooves, with two adjacent grooves sharing a sidewall.

[0012] In some embodiments, at least some of the opening ends of two adjacent grooves have different dimensions in the first direction.

[0013] In some embodiments, the recess includes:

[0014] The step structure includes a plurality of first abutting surfaces extending along a first direction and a plurality of second abutting surfaces extending along a second direction; the first abutting surfaces and the second abutting surfaces are connected to form a step;

[0015] The first direction is parallel to the contact surface between the main body and the contact portion, and the contact surface between the main body and the contact portion intersects with the second direction.

[0016] In some embodiments, the contact portion includes:

[0017] In the first direction, there are two stepped structures that are set away from each other.

[0018] In some embodiments, the body has a notch, and the contact portion is disposed on the bottom surface of the notch; the height of the contact portion is less than or equal to the depth of the notch.

[0019] In some embodiments, the carrier component includes:

[0020] A support rod, which is connected to the main body;

[0021] The support rod is used to connect to a motion component, which drives the support rod to rotate or tilt.

[0022] According to some aspects of embodiments of this disclosure, an electron microscope system is provided, comprising: a support assembly as described above; a sample stage connected to the support assembly, the sample stage driving the support assembly to rotate or tilt.

[0023] This disclosure provides a sample support assembly for electron microscope sample preparation. The support assembly includes a main body and a contact portion connected to the main body for supporting the sample. The contact portion includes multiple recesses facing the main body, which are used to accommodate the sample for rapid positioning and to restrict and support it. Each recess includes multiple abutment surfaces, at least two of which support the sample, supporting and bonding different surfaces on both sides of the sample to improve sample preparation yield. Adjacent abutment surfaces of the contact portion are connected and form an angle greater than or equal to 90°, providing a larger opening for easy insertion of the sample. Attached Figure Description

[0024] Figures 1 to 6This is a schematic diagram of a test sample support component provided according to an embodiment of the present disclosure;

[0025] Figure 7 This is a schematic diagram of a test sample preparation method provided according to an embodiment of the present disclosure. Detailed Implementation

[0026] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0027] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0028] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0029] It should be understood that the phrases "some embodiments" or "an embodiment" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this disclosure. Therefore, "some embodiments" or "an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure.

[0030] The support component provided in this disclosure can be used for sample preparation and support in electron microscopy. It is adaptable to the sample preparation stage or testing stage of an electron microscope, and can support and fix the test sample for extraction, thinning, and application in electron microscopy scanning tests. The electron microscope may include, but is not limited to, scanning electron microscopes, transmission electron microscopes, or scanning or transmission electron microscopes with an electron-ion dual-beam system, i.e., integrating FIB cutting (or etching) and deposition functions, as well as integrating electron scanning analysis functions. For example, a dual-beam electron microscope can achieve high-resolution imaging through the electron beam, including SEM or TEM modes, while simultaneously using a focused ion beam for precise etching or deposition (such as Pt materials). Combining the two allows for real-time observation of micro / nano fabrication and sample preparation and analysis, real-time measurement of the cutting thickness of the test sample, and accurate positioning and acquisition of the target structure to be analyzed, simplifying the testing process and improving the accuracy of testing and analysis. The sample preparation stage and testing stage of the dual-beam electron microscope can be the same device, or different components integrated on a single device.

[0031] In some embodiments, the electron microscope may include a single-beam electron microscope, in which case an additional FIB (Fiber Optic Injection) stage is required for sample preparation. The carrier assembly first prepares the sample in the chamber of the FIB stage, and then uses the carrier assembly to transfer the sample to the electron microscope for testing and analysis. The carrier assembly is adapted to the sample preparation stage fixture of the FIB stage, and also to the test stage fixture of the electron microscope.

[0032] In some embodiments, the target structure to be analyzed may include, but is not limited to, a schematic cross-section of a semiconductor structure or a region on a semiconductor die, including but not limited to various transistors (or transistor arrays), memory cells, memory arrays, metal interconnect layers, fan-out redistribution layers, PCB boards, packaging substrates, or silicon interposers, etc., without limitation.

[0033] In some embodiments, the carrier component may include a metal grid for carrying the test sample. The sample is adhered to the metal pillars of the grid by depositing tungsten. Adhesion of the test sample to one side can lead to problems such as warping and detachment, reducing testing efficiency.

[0034] In some embodiments, to fix the test sample, a groove is etched by bombarding the top of a metal pillar with an FIB (fiber ion beam), and the groove is then used to accommodate the test sample. Exemplarily, the FIB ion beam may include, but is not limited to, gallium ions, helium ions, neon ions, etc., for bombarding and etching the test sample. The FIB ion beam may also include, but is not limited to, palladium ions, gold ions, platinum ions, tungsten ions, carbon ions, etc., for depositing materials on the test sample, including conductive or non-conductive materials, for bonding the test sample to the grid, or bonding the test sample to the sampling needle, or protecting non-thinned sampling areas, or for reducing charge concentration and improving image contrast.

[0035] In some specific sample preparation practices, grooving is required for each sample preparation, which increases the overall sample preparation time, reduces the timeliness of sample preparation, and leads to excessive wear and tear on the grid. Simultaneously, bottom back etching increases the probability of sample contamination. When using sample preparation techniques such as beveling or undercutting, the sample size is usually large, requiring a larger groove at the top, which increases the etching amount in the FIB and further exacerbates the back etching phenomenon.

[0036] In view of this, the present disclosure provides a support component that may include the grid described above. The support component is pre-set with recesses of various sizes to accommodate and support test samples of different sizes. It does not require grooving the grid, which reduces the failure rate of sample preparation while reducing grid wear. After the test is completed, the sample can be separated so that the grid can be reused.

[0037] According to some aspects of embodiments of this disclosure, Figures 1 to 6 Provide some test sample carrier components 10, Figures 2 to 5 for Figure 1 A schematic cross-sectional view of a portion of the support component 10 in a perspective view. The support component 10 includes:

[0038] Main body 100;

[0039] The contact portion 110 is used to support the test sample and is connected to the main body 100;

[0040] The contact portion 110 includes a plurality of recesses 111 recessed toward the body 100, the recesses 111 being used to receive test samples;

[0041] The recess 111 includes multiple abutment surfaces; at least two abutment surfaces are used to support the test sample; adjacent abutment surfaces are connected and form an angle greater than or equal to 90°. In the figures, the z-direction can be a vertical direction or a direction with a certain angle to the vertical direction; x and y can be horizontal directions; the x-direction can be referred to as the first direction, the z-direction as the second direction, and the y-direction as the third direction, and the x and y directions can be interchanged. The recess 111 may include a groove 112 located at the top of the contact 110 and a stepped structure 113. The abutment surfaces may include the sidewalls and bottom surface of the groove 112, and the abutment surfaces may include the stepped bottom surface and the stepped sidewalls of the stepped structure 113.

[0042] Figure 1 The support component 10 shown can be a grid structure, with the contact portion 110 being a metal post on the grid, and the main body 100 adaptable to a fixture (or fixing component) of a sample preparation stage or test stage for fixed clamping. Alternatively, the support component 10 may also include... Figure 1 A support rod (not shown) is connected to the main body 100; the support rod is used to connect to a motion component, which drives the support rod to rotate or tilt so as to perform FIB etching and thinning on the test sample from different angles, and to facilitate scanning the sample from different angles to obtain the optimal resolution image of the target structure.

[0043] Figure 1 In this configuration, the contact part 110 and the main body 100 can be fixedly connected by welding or integral molding, or the contact part 110 can be detachably fixedly connected to the main body 100 by a threaded rod. When the contact part 110 is damaged or cannot be cleaned, the contact part 110 can be replaced. The support rod and the main body 100 can be fixedly connected by welding, integral molding, or by threads or other means.

[0044] Figure 1 In the middle, the contact portion 110 is located away from the end of the body 100, or the top of the contact portion 110 has a recess 111 that is recessed toward the body 100. The recess 111 may include at least a portion in a high horizontal position and a portion in a low horizontal position, thereby forming an accommodating space to accommodate the test sample. Figure 2 Show Figure 1 A schematic cross-section of the support component 10 in the xoz plane; the recess 111 may include a groove 112, a channel, an opening, and may also include a stepped structure 113. The groove 112 has at least two sidewalls in the horizontal direction, and the stepped structure 113 has one sidewall in the horizontal direction, with the other side being an open structure. The bottom surface and sidewalls of the groove 112 or the stepped structure 113 serve as abutment surfaces for supporting and contacting the test sample.

[0045] The support in this embodiment may include a support in the z-direction or a support in the x / y direction; when the test sample is rotated, the support in the x / y direction becomes a support in the z-direction. The support may include direct contact with the test sample, or the support may include indirect contact with the test sample by bonding with conductive material deposited via FIB. Conductive material, including but not limited to tungsten, platinum, palladium, gold, or carbon, may be used at the contact seams between the test sample and the bottom surface, and between the test sample and the sidewall, to bond and fix the test sample. Alternatively, conductive material may be deposited between the test sample and the contact surface to bond the test sample. The test sample may be supported by one bottom surface and one sidewall as two contact surfaces, or by one bottom surface and two sidewalls as three contact surfaces.

[0046] In some embodiments, refer to Figure 2 As shown, the main body 100 has a notch 101, and a contact portion 110 is provided on the bottom surface of the notch 101; the height of the contact portion 110 is less than or equal to the depth of the notch 101. The main body 100 has a protrusion 103 protruding along the z-direction, which constitutes the sidewall of the notch 101. Figure 2 In the notch 101, the height D11 of the contact portion 110 in the z-direction is less than or equal to the depth D12 of the notch 101. The body 100 and the contact portion 110 can be made of the same material, such as a non-magnetic metal, like copper, titanium, stainless steel, or other metals. Figure 1 In this embodiment, the thickness D13 of the bearing component 10 in the y-direction can range from 30μm to 50μm, including the endpoint values. The contact portion 110 and the main body 100 have the same thickness in the y-direction, which is D13.

[0047] In some embodiments, refer to Figure 2 The four contact portions 110 shown and their arrangement are merely examples; more contact portions 110 may be included. This is just an example. Figure 2 In the notch 101, the width D1 in the x direction can be 2000 μm, multiple contact portions 110 are centrally distributed within the notch 101, the spacing D2 between adjacent contact portions 110 can be 230 μm, the width D3 of the contact portion 110 in the x direction can be 70-150 μm, and the recess 111 at the top of the contact portion 110 includes a groove 112 or a stepped structure 113. Figure 1 and Figure 2 The dimensions of each part of the load-bearing component 10 are only examples and can be adapted according to the size of the fixture, the size of the test sample, or the electron microscope sample preparation standard. The specific dimensions of each part of the load-bearing component 10 are subject to limitations.

[0048] In some embodiments, refer to Figure 3 As shown, the recess 111 includes a groove 112, the opening direction of which is away from the main body 100; the sidewalls and bottom of the groove 112 serve as abutment surfaces.

[0049] The groove 112 may include four sidewalls extending in the z-direction. The test sample can be placed in the groove 112 and surrounded by the four sidewalls of the groove 112. The bottom surface of the groove 112 and at least two of the four sidewalls can be used as abutment surfaces to contact or support the test sample. It is possible to have one bottom surface and one sidewall as two abutment surfaces to support the test sample, or one bottom surface and two sidewalls as three abutment surfaces to support the test sample. A suitable groove 112 is selected based on the width of the test sample.

[0050] In some embodiments, Figure 1 As shown, the groove 112 includes two sidewalls and a bottom surface connected to the two sidewalls. The groove 112 is not closed at both ends in the y direction; the groove 112 is a groove structure with open ends in the y direction. Figure 2 The width of the opening end of the groove 112 in the x-direction is greater than or equal to the width of the bottom. The bottom surface of the groove 112 and at least one of the two sidewalls can be used as abutment surfaces to support the test sample. For example, a groove 112 with a width slightly larger than the width of the test sample can be selected. One side of the test sample is mounted against one sidewall of the groove 112 until it contacts the bottom surface. At this time, there is a gap between the other end surface of the test sample and the other sidewall of the groove 112. The test structure on both sides of the gap and the sidewall of the groove 112 can be reinforced and bonded by pre-cutting a portion of the structure from the test sample. Alternatively, conductive material can be deposited in the gap using FIB to connect the test sample and the sidewall of the groove 112.

[0051] In some embodiments, refer to Figure 3 As shown, the opening end of the groove 112 has a dimension in the first direction (x direction) that is greater than or equal to the dimension of the bottom, and the x direction is parallel to the contact surface between the body 100 and the contact portion 110.

[0052] In some embodiments, refer to Figure 3 As shown, the support component 10 includes a plurality of grooves 112, and two adjacent grooves 112 share a sidewall.

[0053] In some embodiments, refer to Figure 3 As shown, at least some of the opening ends of two adjacent grooves 112 have different dimensions in the x-direction.

[0054] One or more grooves 112 may be provided on a contact portion 110, for example, one groove 112 may be provided. Figure 3The diagram shows multiple grooves 112 with different opening widths. The number of grooves 112 on a single contact portion 110 can be 2 to 5. The width distribution range of the grooves 112 on each contact portion 110 can be different, thereby providing grooves 112 with different width ranges to accommodate test samples of various widths. For a single contact portion 110, adjacent grooves 112 share a sidewall. For example, opening two grooves 112 can form three sidewalls, with the middle sidewall shared by the two grooves 112.

[0055] Reference Figure 3 As exemplified, the width D6 of the top opening of a groove 112 in the x direction can be 30-50 μm, and the bottom width D7 of the groove 112 can be 20-30 μm; the opening width D6 of the groove 112 can be greater than its bottom width D7, so that the groove 112 is a wedge-shaped structure that is larger at the top and smaller at the bottom, so as to facilitate the placement of the test sample.

[0056] Figure 3 In the other groove 112, the width D8 of the top opening can be 10-25 μm, and the width D9 of its bottom can be 5-15 μm. The width D8 can be greater than the bottom width D9. The depth of the grooves 112 can be the same or different. For example, they can be the same depth D10, and D10 can be 10-25 μm.

[0057] Reference Figure 4 As shown, a groove 112 of appropriate width is selected for the width of the test sample 200, and only the test sample 200 is placed within the groove 112 of appropriate width. The test sample 200 can contact the two side walls of the groove 112 without contacting the bottom surface of the groove 112. There is a gap between the test sample 200 and the bottom surface of the groove 112 to facilitate the thinning of the test sample 200. Alternatively, the width of the top opening of the groove 112 is equal to the width of the bottom opening, allowing the test sample 200 to contact the bottom surface of the groove 112.

[0058] In some embodiments, refer to Figure 3 As described above, when the width D6 of the opening at the top of the groove 112 is greater than its bottom width D7, the angle between the sidewall and the bottom surface is greater than 90° but less than 180°, meaning that the connection between two adjacent abutting surfaces forms an angle greater than 90°. In some other embodiments, when the width D6 of the opening at the top of the groove 112 is equal to its bottom width D7, the connection between two adjacent abutting surfaces forms an angle of 90°.

[0059] In some embodiments, refer to Figure 5As shown, the recess 111 includes a step structure 113, including a plurality of first abutting surfaces (step bottom surfaces) extending along the x-direction and a plurality of second abutting surfaces (step side surfaces) extending along the second direction (z-direction); the first abutting surfaces and the second abutting surfaces are connected to form a step; the x-direction is parallel to the contact surface between the main body 100 and the contact portion 110, and the contact surface between the main body 100 and the contact portion 110 intersects with the z-direction.

[0060] In some embodiments, refer to Figure 5 As shown, the contact portion 110 includes two stepped structures 113 that are disposed opposite to each other in the x-direction.

[0061] The top of the contact portion 110 may be provided with a stepped structure 113 on one side, or a step structure 113 may be provided. Figure 5 The two sides of the step structure 113 are arranged back to back. The step structure 113 includes multiple first abutment surfaces extending along the x direction and multiple second abutment surfaces extending along the z direction. Adjacent first abutment surfaces and second abutment surfaces are connected to each other to form steps. Figure 5 In this example, for a step, the angle between the first abutment surface (bottom surface of the step) and the second abutment surface (side surface of the step) is 90°; in other examples, the angle between the first abutment surface (bottom surface of the step) and the second abutment surface (side surface of the step) may be greater than 90° but less than 180°.

[0062] In some embodiments, refer to Figure 5 As shown, the number of steps can be 2 to 7, the width D4 of the step surface in the x-direction can be 10-15 μm, and the step height D5 can be 15-30 μm. Different steps can have different widths and different step heights. Steps of different widths and heights can be selected according to the thickness and width of different test samples.

[0063] Reference Figure 6 As shown, select a suitable step and place the test sample 200 on any suitable step, using the bottom and sides of the step to support the bottom and sidewalls of the test sample 200. A conductive layer can be deposited on the contact points of the bottom and sidewalls of the step using a material in place (FIB) to adhere and fix the test sample.

[0064] In some embodiments, Figure 7 Taking two grooves 112 as an example, a sampling needle is used to extract the test sample and place the two test samples in the grooves 112. With the help of the sample stage, the support assembly 10 is rotated or tilted. Using FIB (Film-In-line Blend), conductive material 131 is deposited along the y-direction at the contact points between the test sample and the sidewall of the groove 112, thus adhering the sidewall of the groove 112 to the test sample. Part of the conductive material 131 is located on the structure of the groove 112, and part of the conductive material 131 can extend along the contact seam between the test sample and the sidewall of the groove 112.

[0065] In some embodiments, refer to Figure 7 Using FIB Figure 6 Conductive material is deposited along the y-direction at the contact points between the test sample and the step surface and sidewall of the step, bonding the step structure 113 to the test sample. Part of the conductive material is located on the step structure 113, while some material extends along the contact seam between the test sample and the step structure 113. Subsequently, FIB (Film Injection Block) can be used to groove and thin the test sample 200 to meet the requirements of electron microscopy scanning.

[0066] In some embodiments, the support assembly 10 includes a support rod connected to the main body 100; the support rod is used to connect to a motion assembly, which drives the support rod to rotate or tilt.

[0067] A support rod (or tilting rod) is connected to the main body 100. The support rod is used to connect to a motion component, which drives the support rod to rotate or tilt, enabling FIB etching and thinning of the test sample from different angles, and facilitating scanning of the sample at different angles to obtain optimal resolution images of the target structure. The motion component can be a moving part of a sample preparation stage or a testing stage, which can be a sample stage assembly within the sample chamber of a dual-beam electron microscope system. The sample stage assembly can include a multi-axis motorized stage with electrically controlled multi-axis rotation, oscillation, and lifting to rotate or tilt the test sample. The support rod and the main body 100 can be connected by welding, integral molding, or detachably fixed via threads or other means.

[0068] This disclosure provides a support component with grooves or stepped structures of different widths on the contact portion for accommodating, supporting, and fixing test samples of different sizes. This eliminates the need for etching and slotting the support component during the FIB sample preparation stage, thereby improving the stability of fixing the test sample, reducing wear on the support component, increasing sample preparation efficiency, and enabling the reusability of the support component.

[0069] According to some aspects of embodiments of this disclosure, an electron microscope system is provided, comprising: as shown in the figure. Figures 1 to 6 The carrier component 10 exemplified in any one of the embodiments also includes a sample stage connected to the carrier component 10, the sample stage driving the carrier component 10 to rotate or tilt.

[0070] In some embodiments, the electron microscope may include a dual-beam electron microscope, including SEM mode or TEM mode, which simultaneously utilizes a focused ion beam for precise etching or deposition (such as of tungsten materials). Combining both allows for real-time observation of micro / nano fabrication, sample preparation, and analysis. It enables real-time measurement of the cutting thickness of the test sample, accurate positioning and acquisition of the target structure to be analyzed, simplifies the testing process, and improves the accuracy of testing and analysis. The sample preparation stage and testing stage of the dual-beam electron microscope may be sample stages located within the sample chamber (or testing chamber). The sample stage supports FIB etching, deposition, and testing of the test sample. Different components may also be integrated on the sample stage to support FIB sample preparation and testing respectively. The sample stage may include a multi-axis motorized stage with electrically controlled multi-axis rotation, oscillation, and lifting to rotate or tilt the test sample. The sample stage can be fixed to the support assembly 10 by clamping the support rod of the support assembly 10.

[0071] In some embodiments, the electron microscope may include a single-beam electron microscope, in which case an additional FIB instrument is required for sample preparation. The carrier assembly 10 first prepares the sample in the chamber of the FIB instrument, and then uses the carrier assembly 10 to transfer the sample to the electron microscope for testing and analysis. The carrier assembly 10 is adapted to the sample stage fixture of the FIB instrument for sample preparation, and also to the sample stage fixture in the test chamber of the electron microscope for testing.

[0072] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A sample carrier component for testing, characterized in that, include: main body; The contact portion is used to support the test sample and is connected to the main body; The contact portion includes a plurality of recesses recessed toward the body, the recesses being used to receive the test sample; The recess includes multiple abutment surfaces; wherein at least two of the abutment surfaces are used to support the test sample; adjacent abutment surfaces are connected and form an angle greater than or equal to 90°.

2. The load-bearing component according to claim 1, characterized in that, The recess includes: The groove has an opening direction opposite to the main body; the sidewalls and bottom of the groove serve as the abutment surface.

3. The load-bearing component according to claim 2, characterized in that, The opening end of the groove has a dimension greater than or equal to the dimension of the bottom in a first direction, and the first direction is parallel to the contact surface between the body and the contact portion.

4. The load-bearing component according to claim 3, characterized in that, The support component includes a plurality of the grooves, and two adjacent grooves share a sidewall.

5. The load-bearing component according to claim 4, characterized in that, At least some of the opening ends of two adjacent grooves have different dimensions in the first direction.

6. The load-bearing component according to claim 1, characterized in that, The recess includes: The step structure includes a plurality of first abutting surfaces extending along a first direction and a plurality of second abutting surfaces extending along a second direction; the first abutting surfaces and the second abutting surfaces are connected to form a step; The first direction is parallel to the contact surface between the main body and the contact portion, and the contact surface between the main body and the contact portion intersects with the second direction.

7. The load-bearing component according to claim 6, characterized in that, The contact portion includes: In the first direction, there are two stepped structures that are set away from each other.

8. The load-bearing component according to claim 1, characterized in that, The main body has a notch, and the contact portion is disposed on the bottom surface of the notch; the height of the contact portion is less than or equal to the depth of the notch.

9. The load-bearing component according to claim 1, characterized in that, The carrier component includes: A support rod, which is connected to the main body; The support rod is used to connect to a motion component, which drives the support rod to rotate or tilt.

10. An electron microscope system, characterized in that, include: The carrier component as described in any one of claims 1 to 9; The sample stage is connected to the support assembly, and the sample stage drives the support assembly to rotate or tilt.

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