Heating devices and their electronic equipment

Abstract

This application relates to a heating device and its electronic equipment. The heating device includes: a radiator; a heat-conducting element integrally formed with the radiator, the heat-conducting element and the radiator cooperating to form an installation space; a heating element disposed within the installation space and thermally connected to the heat-conducting element; and an electrode component, one end of the electrode component connected to the heating element and located within the installation space, and the other end of the electrode component located outside the installation space. The heating device provided by this application can directly and efficiently transfer the heat generated by the heating element from the heat-conducting element to the radiator, avoiding heat loss during the transfer process, thereby improving the overall heat conversion efficiency of the heating device.

Description

Technical Field

[0001] This application relates to the field of heater technology, and more particularly to a heating device and its electronic equipment. Background Technology

[0002] A typical PTC heater includes a PTC heating element, electrodes, an aluminum tube, a heat sink, and an insulating film. The PTC heating element and electrodes are encapsulated within the aluminum tube by the insulating film, and then the corrugated heat sink is bonded to the aluminum tube using silicone. In this way, the heat generated by the PTC heating element can be transferred through the aluminum tube, silicone, and then to the corrugated heat sink.

[0003] Since the heat sink is bonded to the aluminum tube with silicone, the heat generated by the PTC heating element needs to be transferred to the corrugated heat sink through the silicone. However, silicone is relatively inefficient as a thermal conductive material, resulting in some heat loss during the transfer process, which reduces the overall heat conversion efficiency. Utility Model Content

[0004] This application provides a heating device and its electronic equipment to solve the problem of low heat conversion efficiency caused by the use of silicone bonding between the radiator and the aluminum tube.

[0005] In a first aspect, this application provides a heating device, the heating device comprising:

[0006] heat sink;

[0007] A heat-conducting component, wherein the heat-conducting component and the heat sink are integrally formed, and the heat-conducting component and the heat sink cooperate to form an installation space;

[0008] A heating element, wherein the heating element is disposed within the mounting space and is thermally connected to the heat-conducting element; and

[0009] An electrode component, one end of which is connected to the heating element and located within the mounting space, and the other end of which is located outside the mounting space.

[0010] In some possible implementations, the heat sink includes a first heat dissipation structure and a second heat dissipation structure connected to each other, the first heat dissipation structure and the second heat dissipation structure being disposed opposite each other, and the heat-conducting element being disposed between the first heat dissipation structure and the second heat dissipation structure.

[0011] In some possible implementations, the heat-conducting component includes a first heat-conducting part and a second heat-conducting part that are disposed opposite to and spaced apart from each other. The first heat-conducting part and the second heat-conducting part are both disposed between the first heat dissipation structure and the second heat dissipation structure. The first heat-conducting part, the second heat-conducting part, the first heat dissipation structure and the second heat dissipation structure cooperate to form the installation space. The cross-section of the first heat-conducting part and / or the cross-section of the second heat-conducting part are arc-shaped.

[0012] In some possible implementations, the concave surfaces of both the first and second heat-conducting portions are oriented towards the mounting space; or

[0013] The convex surfaces of both the first and second heat-conducting parts are oriented toward the mounting space.

[0014] In some possible implementations, the first heat dissipation structure includes a plurality of first heat dissipation plates and a plurality of second heat dissipation plates, wherein the plurality of first heat dissipation plates are arranged at intervals along a first direction, and the plurality of second heat dissipation plates are arranged at intervals along a second direction, and the plurality of first heat dissipation plates are connected to each other by at least one second heat dissipation plate.

[0015] The second heat dissipation structure includes a plurality of third heat dissipation plates and a plurality of fourth heat dissipation plates. The plurality of third heat dissipation plates are arranged in sequence at intervals along a first direction, and the plurality of fourth heat dissipation plates are arranged in sequence at intervals along a second direction. The plurality of third heat dissipation plates are connected to each other by at least one fourth heat dissipation plate. The first direction and the second direction are perpendicular to each other.

[0016] In some possible implementations, at least one of the two adjacent first heat sinks forms a heat dissipation airflow channel with one of the second heat sinks;

[0017] And / or, at least one of the adjacent third heat sinks forms a heat dissipation duct with one of the fourth heat sinks.

[0018] In some possible implementations, the radiator further includes a plurality of fifth heat dissipation plates, which are disposed between the first heat dissipation structure and the second heat dissipation structure. The plurality of fifth heat dissipation plates are arranged sequentially at intervals along the first direction, and each fifth heat dissipation plate is connected to the first heat dissipation structure and / or the second heat dissipation structure.

[0019] In some possible implementations, the extension direction of the heat dissipation duct is consistent with the extension direction of the installation space.

[0020] In some possible implementations, there are multiple thermal conductive elements, multiple heating elements, and multiple electrode components. Multiple thermal conductive elements cooperate with the heat sink to form multiple mounting spaces, and each mounting space corresponds to one heating element and one electrode component.

[0021] Secondly, this application provides an electronic device, which includes a housing and the aforementioned heating device. The housing has an air inlet, an air outlet, and a receiving space. The receiving space is connected to the air inlet and the air outlet, and the heating device is disposed within the receiving space.

[0022] The technical solutions provided in this application have the following advantages compared with the prior art:

[0023] The heating device provided in this application embodiment has the heat-conducting component and the heat sink integrally formed. Therefore, the heat generated by the heating element can be directly and efficiently transferred from the heat-conducting component to the heat sink, avoiding heat loss during the transfer process, thereby improving the overall heat conversion efficiency of the heating device.

[0024] Furthermore, since there is no need to use silicone to bond the aluminum tubes and the heat sink, the assembly process for the aluminum tubes and the heat sink can be reduced, thereby improving production efficiency. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0028] Figure 1 This is a schematic diagram of the structure of a first embodiment of a heating device provided in this application.

[0029] Figure 2 This is a schematic diagram of a second embodiment of a heating device provided in this application.

[0030] Figure 3This is a schematic diagram of a third embodiment of a heating device provided in this application.

[0031] Figure 4 This is a schematic diagram of a fourth embodiment of a heating device provided in this application.

[0032] Figure 5 A schematic diagram of the structure of the heating device provided in the embodiments of this application, which has two heat-conducting elements;

[0033] Figure 6 This is a schematic diagram of the structure of the radiator in the heating device provided in the embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] Heating device 10, radiator 100, first heat dissipation structure 110, first heat dissipation plate 111, second heat dissipation plate 112, second heat dissipation structure 120, third heat dissipation plate 121, fourth heat dissipation plate 122, heat dissipation duct 130, fifth heat dissipation plate 140, heat conduction component 200, first heat conduction part 210, second heat conduction part 220, installation space 300, heating element 400, electrode component 500. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0038] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0039] A typical PTC heater includes a PTC heating element, electrodes, an aluminum tube, a heat sink, and an insulating film. The PTC heating element and electrodes are encapsulated within the aluminum tube by the insulating film, and then the corrugated heat sink is bonded to the aluminum tube using silicone. In this way, the heat generated by the PTC heating element can be transferred through the aluminum tube, silicone, and then to the corrugated heat sink.

[0040] Since the heat sink is bonded to the aluminum tube with silicone, the heat generated by the PTC heating element needs to be transferred to the corrugated heat sink through the silicone. However, silicone is relatively inefficient as a thermal conductive material, resulting in some heat loss during the transfer process, which reduces the overall heat conversion efficiency.

[0041] To address the issue of low heat conversion efficiency caused by the silicone bonding method used to connect the radiator and the aluminum tube, this application provides a heating device and its electronic equipment that can directly and efficiently transfer the heat generated by the heating element from the heat-conducting element to the radiator, avoiding heat loss during the transfer process and thus improving the overall heat conversion efficiency of the heating device.

[0042] See Figures 1-6 This application provides a heating device 10, which includes a radiator 100, a heat-conducting element 200, and an electrode component 500.

[0043] The heat-conducting component 200 and the heat sink 100 are integrally formed, and the heat-conducting component 200 and the heat sink 100 cooperate to form an installation space 300; the heating component 400 is disposed in the installation space 300 and is thermally connected to the heat-conducting component 200; one end of the electrode component 500 is connected to the heating component 400 and is located in the installation space 300, and the other end of the electrode component 500 is located outside the installation space 300.

[0044] The heating device 10 provided in this embodiment has the following characteristics: since the heat-conducting element 200 and the radiator 100 are integrally formed, the heat generated by the heating element 400 can be directly and efficiently transferred from the heat-conducting element 200 to the radiator 100, avoiding heat loss during the transfer process, thereby improving the overall heat conversion efficiency of the heating device 10.

[0045] In addition, since there is no need to use silicone to bond the aluminum tube and the heat sink 100, the assembly process of the aluminum tube and the heat sink 100 can be reduced, thereby improving production efficiency.

[0046] In some possible implementations, the radiator 100 includes a first heat dissipation structure 110 and a second heat dissipation structure 120 connected to each other, the first heat dissipation structure 110 and the second heat dissipation structure 120 being disposed opposite to each other, and the heat-conducting element 200 being disposed between the first heat dissipation structure 110 and the second heat dissipation structure 120.

[0047] In traditional PTC heaters, the radiator 100 and the aluminum tube are two independent components. The aluminum tube needs to be bonded between the two corrugated radiators 100 using silicone. As a result, the overall structure of traditional PTC heaters requires a large amount of space in the longitudinal direction.

[0048] In this embodiment, the heat-conducting component 200 is directly disposed inside the heat sink 100, that is, between the first heat dissipation structure 110 and the second heat dissipation structure 120, and is integrally formed with the heat sink 100 without the need for a silicone adhesive structure in the middle. Therefore, the volume of the heating device 10 in the longitudinal direction is reduced, thereby reducing the space occupied by the heating device 10 in the longitudinal direction, so that the heating device 10 provided in this application is suitable for scenarios where the longitudinal space is relatively limited.

[0049] Furthermore, the radiator 100 can be manufactured in a single piece for long dimensions, such as continuously forming 2 meters, 3 meters, or even 4 meters in length. In practical applications, the formed radiator 100 can be cut to fit different length requirements according to the user's installation space 300, making it particularly suitable for applications with ample space in the length direction.

[0050] In some possible implementations, the heat-conducting component 200 includes a first heat-conducting portion 210 and a second heat-conducting portion 220 that are disposed opposite to and spaced apart. The first heat-conducting portion 210 and the second heat-conducting portion 220 are both disposed between the first heat dissipation structure 110 and the second heat dissipation structure 120. The first heat-conducting portion 210, the second heat-conducting portion 220, the first heat dissipation structure 110 and the second heat dissipation structure 120 cooperate to form the installation space 300. The cross-section of the first heat-conducting portion 210 and / or the cross-section of the second heat-conducting portion 220 are arc-shaped.

[0051] like Figure 1 , Figure 2 , Figure 4 , Figure 5 As shown, in some possible embodiments, the concave surfaces of the first heat-conducting part 210 and the second heat-conducting part 220 are both disposed facing the mounting space 300.

[0052] like Figure 3 and Figure 6 As shown, in some possible embodiments, the convex surfaces of the first heat-conducting part 210 and the second heat-conducting part 220 are both disposed facing the mounting space 300.

[0053] In some possible implementations, the first heat dissipation structure 110 includes a plurality of first heat dissipation plates 111 and a plurality of second heat dissipation plates 112. The plurality of first heat dissipation plates 111 are arranged at intervals along a first direction, and the plurality of second heat dissipation plates 112 are arranged at intervals along a second direction. The plurality of first heat dissipation plates 111 are connected to each other by at least one second heat dissipation plate 112.

[0054] The second heat dissipation structure 120 includes a plurality of third heat dissipation plates 121 and a plurality of fourth heat dissipation plates 122. The plurality of third heat dissipation plates 121 are arranged in sequence at intervals along a first direction, and the plurality of fourth heat dissipation plates 122 are arranged in sequence at intervals along a second direction. The plurality of third heat dissipation plates 121 are connected to each other by at least one fourth heat dissipation plate 122. The first direction and the second direction are perpendicular to each other.

[0055] The first direction is Figure 3 The X direction, the second direction is Figure 3 Y direction.

[0056] In some possible implementations, at least one of the two adjacent first heat sinks 111 forms a heat dissipation duct 130 with one of the second heat sinks 112;

[0057] And / or, at least one of the adjacent third heat sinks 121 forms a heat dissipation duct 130 with one of the fourth heat sinks 122.

[0058] See Figures 2-5 In some possible implementations, the radiator 100 further includes a plurality of fifth heat dissipation plates 140, which are disposed between the first heat dissipation structure 110 and the second heat dissipation structure 120. The plurality of fifth heat dissipation plates 140 are arranged sequentially at intervals along the first direction, and each fifth heat dissipation plate 140 is connected to the first heat dissipation structure 110 and / or the second heat dissipation structure 120.

[0059] By providing multiple fifth heat dissipation plates 140 between the first heat dissipation structure 110 and the second heat dissipation structure 120, heat dissipation air ducts 130 for air circulation can be formed between adjacent fifth heat dissipation plates 140. In this way, the effective heat dissipation area of ​​the radiator 100 can be increased, and airflow can be guided through in an orderly manner, thereby further improving the overall heat dissipation efficiency and heat exchange efficiency.

[0060] In some possible implementations, the extension direction of the heat dissipation duct 130 is consistent with the extension direction of the mounting space 300.

[0061] The extension direction of the heat dissipation duct 130 and the extension direction of the installation space 300 can be parallel to each other or approximately parallel, thus ensuring that the air outlet direction of the heat dissipation duct 130 is parallel to the arrangement direction of the electrode components 500.

[0062] When the air duct is perpendicular to or intersects the electrode direction, the airflow is prone to forming vortices or local high-pressure areas near the electrode, increasing wind resistance and causing noise.

[0063] Based on this, in this application, the extension direction of the heat dissipation duct 130 is consistent with the extension direction of the installation space 300, so that the airflow direction is parallel to the electrode arrangement direction. The airflow will not frequently change direction when passing through the heat sink 100, avoiding turbulence caused by turning, collision, etc., thereby reducing wind resistance and noise.

[0064] In some possible implementations, there are multiple thermal conductive elements 200, multiple heating elements 400, and multiple electrode components 500. Multiple thermal conductive elements 200 cooperate with the heat sink 100 to form multiple mounting spaces 300, and each mounting space 300 corresponds to one heating element 400 and one electrode component 500.

[0065] In some embodiments, the heating device 10 further includes an insulating film that covers the outer surfaces of the heating element 400 and the electrode component 500 for electrical isolation and safety protection.

[0066] By setting the insulating film, short circuits or leakage can be effectively prevented between the heating element 400 and the electrical components inside the heating device 10, thereby improving the safety and reliability of the overall equipment.

[0067] Meanwhile, the insulating film also has good high temperature resistance and can maintain a stable insulation effect during the long-term operation of the heating device 10.

[0068] This application also provides an electronic device, which includes a housing and a heating device 10 mentioned in the above embodiments. The housing is provided with an air inlet, an air outlet and a receiving space. The receiving space is connected to the air inlet and the air outlet to form a complete air flow path. The heating device 10 is disposed in the receiving space and is used to heat the air flowing through the receiving space.

[0069] For example, when the electronic device is running, outside air enters the containment space through the air inlet, is heated when passing through the heating device 10, and is then discharged from the air outlet, thereby achieving the function of heating the target environment or object.

[0070] Among them, electronic devices can be small electronic devices such as 3D printers, sweeping robots, and heaters.

[0071] For example, when the heating device 10 is installed in a 3D printer, it can be used to heat the printing platform (heated bed) or nozzle area to prevent the printing material from cooling too quickly and causing warping, thereby improving the printing quality.

[0072] When the heating device 10 is installed in the sweeper, it can be used to dry the internal electronic components of the sweeper and prevent condensation from damaging the circuits in a humid environment.

[0073] When the heating device 10 is installed in a small fan heater or air purifier, it can serve as a highly efficient and safe heating source, improving the air treatment effect.

[0074] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0075] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0077] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0078] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0079] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0080] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0081] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heating device, characterized in that, The heating device includes: heat sink; A heat-conducting component, wherein the heat-conducting component and the heat sink are integrally formed, and the heat-conducting component and the heat sink cooperate to form an installation space; A heating element, wherein the heating element is disposed within the mounting space and is thermally connected to the heat-conducting element; and An electrode component, one end of which is connected to the heating element and located within the mounting space, and the other end of which is located outside the mounting space.

2. The heating device according to claim 1, characterized in that, The radiator includes a first heat dissipation structure and a second heat dissipation structure connected to each other. The first heat dissipation structure and the second heat dissipation structure are disposed opposite to each other, and the heat-conducting element is disposed between the first heat dissipation structure and the second heat dissipation structure.

3. The heating device according to claim 2, characterized in that, The heat-conducting component includes a first heat-conducting part and a second heat-conducting part that are opposite to and spaced apart. The first heat-conducting part and the second heat-conducting part are both disposed between the first heat dissipation structure and the second heat dissipation structure. The first heat-conducting part, the second heat-conducting part, the first heat dissipation structure and the second heat dissipation structure cooperate to form the installation space. The cross-section of the first heat-conducting part and / or the cross-section of the second heat-conducting part are arc-shaped.

4. The heating device according to claim 3, characterized in that, The concave surfaces of both the first and second heat-conducting parts are oriented towards the mounting space; or The convex surfaces of both the first and second heat-conducting parts are oriented toward the mounting space.

5. The heating device according to claim 2, characterized in that, The first heat dissipation structure includes a plurality of first heat dissipation plates and a plurality of second heat dissipation plates. The plurality of first heat dissipation plates are arranged at intervals along a first direction, and the plurality of second heat dissipation plates are arranged at intervals along a second direction. The plurality of first heat dissipation plates are connected to each other by at least one second heat dissipation plate. The second heat dissipation structure includes a plurality of third heat dissipation plates and a plurality of fourth heat dissipation plates. The plurality of third heat dissipation plates are arranged in sequence at intervals along a first direction, and the plurality of fourth heat dissipation plates are arranged in sequence at intervals along a second direction. The plurality of third heat dissipation plates are connected to each other by at least one fourth heat dissipation plate. The first direction and the second direction are perpendicular to each other.

6. The heating device according to claim 5, characterized in that, At least one of the two adjacent first heat sinks forms a heat dissipation airflow with one of the second heat sinks; And / or, at least one of the adjacent third heat sinks forms a heat dissipation duct with one of the fourth heat sinks.

7. The heating device according to claim 5, characterized in that, The radiator further includes a plurality of fifth heat dissipation plates, which are disposed between the first heat dissipation structure and the second heat dissipation structure. The plurality of fifth heat dissipation plates are arranged at intervals along the first direction, and each fifth heat dissipation plate is connected to the first heat dissipation structure and / or the second heat dissipation structure.

8. The heating device according to claim 6, characterized in that, The extension direction of the heat dissipation duct is consistent with the extension direction of the installation space.

9. The heating device according to any one of claims 1 to 7, characterized in that, The number of the heat-conducting components, the number of the heating components, and the number of the electrode components are all multiple. The multiple heat-conducting components cooperate with the heat sink to form multiple installation spaces, and each installation space corresponds to one heating component and one electrode component.

10. An electronic device, characterized in that, The electronic device includes a housing and a heating device according to any one of claims 1-9. The housing has an air inlet, an air outlet, and a receiving space. The receiving space is connected to the air inlet and the air outlet. The heating device is disposed within the receiving space.

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