A high-temperature-resistant power supply chip

Abstract

The utility model discloses a kind of high-temperature-resistant power supply chip, belong to power supply chip field.A kind of high-temperature-resistant power supply chip, including power supply chip body, the inside of mounting seat is provided with the convenient dismounting mechanism for facilitating the taking and placing of power supply chip body, the inside of heat dissipation frame and heat dissipation box is provided with high-temperature-resistant mechanism, the surface of power supply chip body is provided with corrosion-resistant mechanism.The utility model not only makes power supply chip when using can improve the convenience of user to power supply chip body dismounting and maintenance, reduces the working time when power supply chip body dismounting, so that power supply chip when using can ensure the stable work of power supply chip body under high temperature environment, reduces the problem that each component on the surface of power supply chip body appears ageing failure due to high temperature, and makes power supply chip when using can reduce the occurrence of electrical short-circuit risk, guarantee equipment and personnel safety, so that power supply chip can be used in relatively harsh environment.

Description

Technical Field

[0001] This utility model relates to the field of power chip technology, and in particular to a high-temperature resistant power chip. Background Technology

[0002] All electronic devices have power supplies, but different systems have different power requirements. To achieve the best performance of an electronic system, it is necessary to select the most suitable power management method, which requires the installation of power chips. Power chips are responsible for the conversion, distribution, detection, and other power management functions of electrical energy in electronic device systems. However, existing power chips are prone to damage due to high temperatures when used at high frequencies, and their heat dissipation function is not efficient enough. To meet market needs, a high-temperature resistant power chip is required.

[0003] A search revealed Chinese patent authorization number 202123147429.8, which discloses a high-temperature resistant power chip, including an explosion-proof shell. A chip is disposed in the middle of the inner cavity of the explosion-proof shell, and a heat-conducting component is disposed on the upper surface of the chip. A heat dissipation component extending to the top of the explosion-proof shell is disposed on the upper surface of the heat-conducting component. The high-temperature resistant power chip in the aforementioned patent has the following shortcomings: Existing power chips are inconvenient to disassemble and assemble, reducing the ease of use and maintenance for users, increasing the time spent on disassembly and assembly, and making them inefficient. Furthermore, the high-temperature resistance of existing power chips needs further improvement, which means that the power chip cannot guarantee stable operation in high-temperature environments, easily leading to aging and failure of components on the surface of the power chip due to high temperatures, thus shortening its lifespan. In addition, the corrosion resistance of existing power chips is insufficient, which makes them prone to electrical short circuits, failing to guarantee the safety of equipment and personnel, and making them unsuitable for use in harsh environments. Utility Model Content

[0004] The purpose of this invention is to solve the problems of inconvenient disassembly and assembly, insufficient high-temperature resistance, and inadequate corrosion resistance of existing power chips, and to propose a high-temperature resistant power chip.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-temperature resistant power chip includes a power chip body, a mounting base disposed on the outer side of the power chip body, the power chip body disposed inside the mounting base, a heat sink frame disposed on the top of the power chip body, pins disposed on the surfaces of both sides of the power chip body, a heat sink box disposed on the surface of the top center position of the heat sink frame, a perforated plate installed on the inner wall of the heat sink box, a perforated cover disposed on the surface of the top position of the heat sink box, a convenient disassembly and assembly mechanism disposed inside the mounting base for easy placement and removal of the power chip body, a high-temperature resistant mechanism disposed inside the heat sink frame and the heat sink box, and a corrosion resistant mechanism disposed on the surface of the power chip body.

[0007] As a preferred technical solution of this application, the inner wall of the mounting base is symmetrically provided with a plurality of support seats for supporting the power chip body, the two sides of the mounting base are provided with a plurality of heat dissipation through holes, the two sides of the mounting base are symmetrically provided with wire through holes, the center of the bottom of the mounting base is provided with heat dissipation fins for heat dissipation of the power chip body, the heat dissipation frame is connected to the mounting base by fastening studs, the inner wall of the heat dissipation frame is symmetrically provided with positioning blocks, and the surface of the heat dissipation frame is provided with conductive cloth.

[0008] As a preferred technical solution of this application, the inner wall of the heat dissipation frame is symmetrically provided with heat-conducting plates for heat conduction, and the heat-conducting plates are connected to the heat dissipation frame by bolts. The surface of the top position of the heat dissipation frame is symmetrically provided with heat dissipation fins for heat dissipation. The inner wall of the heat dissipation frame is provided with a plurality of equally spaced heat dissipation holes. Mounting feet are installed at each corner position of the bottom of the mounting base. Mounting studs are threaded to the surface of the mounting feet. The heat dissipation box and the heat dissipation frame are connected by assembly studs. The hole cover and the heat dissipation box are connected by nails. The inner wall of the heat dissipation frame is provided with a plurality of equally spaced second heat dissipation holes.

[0009] As a preferred technical solution of this application, the easy disassembly and assembly mechanism consists of a clamping plate disposed inside the mounting base, a rubber pad disposed on the inner wall of the clamping plate, a guide block disposed at the bottom of the clamping plate, a holding groove disposed on the inner wall of the mounting base, and a telescopic elastic column disposed inside the holding groove.

[0010] As a preferred technical solution of this application, the high-temperature resistant mechanism comprises a temperature sensor disposed inside the heat dissipation frame, a motor disposed on the surface of the perforated plate, a rotating shaft disposed on the surface of the motor, a fan cover disposed inside the heat dissipation box, a cooling fan disposed inside the fan cover, a dustproof mesh disposed inside the heat dissipation box, and a stud body disposed on the surface of the dustproof mesh.

[0011] As a preferred technical solution of this application, the corrosion-resistant mechanism is composed of a polymer coating disposed on the surface of the power chip body, a transparent silicone coating disposed on the surface of the polymer coating, a nano-coating disposed on the surface of the transparent silicone coating, and a heat insulation layer disposed on the surface of the nano-coating.

[0012] Compared with the prior art, this utility model provides a high-temperature resistant power chip with the following characteristics:

[0013] Beneficial effects:

[0014] 1. This high-temperature resistant power chip, through its convenient disassembly and assembly mechanism, improves the ease of disassembly and maintenance for users, reduces the working time during disassembly and assembly, and achieves a more efficient function, solving the problem of inconvenient disassembly and assembly in existing technologies.

[0015] 2. This high-temperature resistant power chip, through its high-temperature resistant mechanism, ensures stable operation of the power chip body in high-temperature environments, avoids performance fluctuations, reduces the aging and failure of various components on the surface of the power chip body due to high temperatures, and extends the service life of the power chip. This solves the problem that the high-temperature resistance effect in the existing technology needs to be further improved.

[0016] 3. This high-temperature resistant power chip, through its corrosion-resistant mechanism, reduces the risk of electrical short circuits, ensuring the safety of equipment and personnel. It enables the power chip to be used in harsh environments, solving the problem of insufficient corrosion resistance in existing technologies. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0019] Figure 3 This is an enlarged side view sectional diagram of the present invention.

[0020] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0021] Figure 5 For the present utility model Figure 2 An enlarged structural diagram of the easy-to-assemble and disassemble mechanism;

[0022] Figure 6 For the present utility model Figure 2 Enlarged structural diagram of the high-temperature resistant mechanism;

[0023] Figure 7 For the present utility model Figure 3 Enlarged structural diagram of the corrosion-resistant mechanism.

[0024] In the picture:

[0025] 1. Power chip body; 11. Controller; 101. Mounting base; 102. Heat sink frame; 103. Heat sink fins; 104. Wiring hole; 105. Heat sink body; 106. Support base; 107. Pins; 108. Heat sink fins; 109. Heat-conducting plate; 110. Heat sink box; 111. Hole cover; 112. Mounting studs; 113. Mounting feet; 114. Conductive cloth; 115. Fastening studs; 116. Heat dissipation through hole; 117. Positioning block; 118. Bolt; 119. Mounting screw; 120. Second heat dissipation hole; 121. Assembly stud; 122. Hole plate; 123. Screw body; 2. Easy disassembly and assembly mechanism; 21. Guide block; 22. Clamping plate; 23. Rubber pad; 24. Telescopic elastic column; 25. Container slot; 3. High temperature resistant mechanism; 31. Temperature sensor; 32. Motor; 33. Fan cover; 34. Dustproof mesh; 35. Cooling fan; 36. Shaft; 37. Stud body; 4. Corrosion resistant mechanism; 41. Thermal insulation layer; 42. Nano coating; 43. Transparent silicone coating; 44. Polymer coating. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] Example:

[0028] Reference Figure 1-4A high-temperature resistant power chip includes a power chip body 1, a mounting base 101 on the outer side of the power chip body 1, the power chip body 1 being disposed inside the mounting base 101, a controller 11 mounted on the surface of the mounting base 101 (the controller 11 can be of the LA series), a plurality of support bases 106 symmetrically arranged on the inner wall of the mounting base 101 for supporting the power chip body 1 (eight in total), a plurality of heat dissipation holes 116 opened on both sides of the mounting base 101, the heat dissipation holes 116 communicating with the interior of the mounting base 101, wire through holes 104 symmetrically opened on both sides of the mounting base 101, and a wire through hole 104 at the center of the bottom of the mounting base 101 for power supply The heat sink 108 of the chip body 1 is connected to the mounting base 101 by mounting screws 119. The surface of the heat sink 108 is in contact with the surface at the bottom of the power chip body 1. A heat sink frame 102 is provided on the top of the power chip body 1. The heat sink frame 102 is connected to the mounting base 101 by fastening studs 115. Positioning blocks 117 are symmetrically installed on the inner wall of the heat sink frame 102. The positioning blocks 117 are engaged with the surface of the mounting base 101. The surface of the heat sink frame 102 is provided with conductive cloth 114. Heat-conducting plates 109 are symmetrically provided on the inner wall of the heat sink frame 102 for heat conduction. The heat-conducting plates 109 are connected to the heat sink frame 102 by bolts 118. The top surface of the heat sink 102 is symmetrically provided with heat dissipation fins 103 for heat dissipation. The heat dissipation fins 103 are connected to the surface of the heat sink 102 by screws. The inner wall of the heat sink 102 has multiple equally spaced heat dissipation holes 105. The heat conduction plate 109 is connected to the heat dissipation fins 103 through the heat dissipation holes 105. The surfaces of both sides of the power chip body 1 are provided with pins 107, which are arranged in an array. There are fourteen pins 107 on each side of the power chip body 1. The pins 107 are used to realize the electrical connection between the power chip body 1 and the external circuit. Mounting feet 113 are installed at each corner of the bottom of the mounting base 101. The surface of the mounting feet 113 is threaded with a mounting bracket. A stud 112 is installed, one end of which passes through the mounting foot 113 and extends to the bottom of the mounting foot 113. A heat sink 110 is provided on the surface of the top center position of the heat sink frame 102. A perforated plate 122 is installed on the inner wall of the heat sink 110. The heat sink 110 and the heat sink frame 102 are connected by an assembly stud 121. A hole cover 111 is provided on the surface of the top position of the heat sink 110. The hole cover 111 is connected to the heat sink 110 by a nail 123. The hole cover 111 and the heat sink 110 are detachably connected. A plurality of equally spaced second heat dissipation holes 120 are opened on the inner wall of the heat sink frame 102. The interior of the heat sink frame 102 and the heat sink 110 are connected through the second heat dissipation holes 120.

[0029] Reference Figure 2 and Figure 5Furthermore, the mounting base 101 also includes a convenient disassembly and assembly mechanism 2 for facilitating the placement and removal of the power chip body 1. The convenient disassembly and assembly mechanism 2 consists of a clamping plate 22 disposed inside the mounting base 101, a rubber pad 23 disposed on the inner wall of the clamping plate 22, a guide block 21 disposed at the bottom of the clamping plate 22, a holding groove 25 disposed on the inner wall of the mounting base 101, and a telescopic elastic column 24 disposed inside the holding groove 25. The inner wall of the mounting base 101 has a holding groove 25, and two clamping plates 22 are symmetrically arranged inside the mounting base 101 to clamp... Plates 22 are located on both sides of the power chip body 1. Rubber pads 23 for surface protection of the power chip body 1 are installed on the inner wall of the clamping plate 22. The surface of the rubber pads 23 contacts the surface of the power chip body 1. A guide block 21 is installed on the bottom surface of the clamping plate 22, with its bottom end extending into the interior of the receiving groove 25. The guide block 21 slides against the mounting base 101 and the inner wall of the receiving groove 25. A telescopic elastic post 24 is installed on the inner wall of the receiving groove 25, with one end of the telescopic elastic post 24 fixed to the surface of the guide block 21. By providing a convenient disassembly and assembly mechanism, the ease of disassembly, assembly, and maintenance of the power chip body 1 is improved, reducing the working time during disassembly and assembly, and increasing efficiency.

[0030] Reference Figure 2 and Figure 6Furthermore, the heat sink 102 and the heat sink 110 are equipped with a high-temperature resistant mechanism 3. The high-temperature resistant mechanism 3 includes a temperature sensor 31 installed inside the heat sink 102, a motor 32 installed on the surface of the perforated plate 122, a rotating shaft 36 installed on the surface of the motor 32, a fan shroud 33 installed inside the heat sink 110, a cooling fan 35 installed inside the fan shroud 33, a dustproof mesh 34 installed inside the heat sink 110, and a stud body 37 installed on the surface of the dustproof mesh 34. The motor 32 is mounted on the surface at the top center of the perforated plate 122. The motor 32 can be a YE series model. The input end of the motor 32 is connected to the control... The output of controller 11 is electrically connected. The output of motor 32 is connected to a rotating shaft 36 via a coupling. A fan shroud 33 is installed inside the heat sink 110. The top of the rotating shaft 36 extends into the inside of the fan shroud 33 and is fitted with a cooling fan 35. The cooling fan 35 rotates and engages with the inner wall of the fan shroud 33. A dust filter 34 for air filtration is installed inside the heat sink 110. The dust filter 34 is connected to the heat sink 110 via a stud body 37. A temperature sensor 31 is installed on the inner wall of the heat sink frame 102. The temperature sensor 31 can be a PT series sensor. The output of the temperature sensor 31 is electrically connected to the input of controller 11. By setting a high-temperature resistant mechanism, the stable operation of the power chip body 1 in high-temperature environments can be ensured, avoiding performance fluctuations. At the same time, it reduces the problem of aging and failure of various components on the surface of the power chip body 1 due to high temperatures, thus extending the service life of the power chip.

[0031] Reference Figure 3 and Figure 7 Furthermore, the power chip body 1 is provided with a corrosion-resistant mechanism 4 on its surface. The corrosion-resistant mechanism 4 consists of a polymer coating 44, a transparent silicone coating 43, a nano-coating 42, and a heat-insulating layer 41 on the surface of the nano-coating 42. The surface of the power chip body 1 is coated with a polymer coating 44 for corrosion resistance. A transparent silicone coating 43 is applied to the side of the polymer coating 44 away from the power chip body 1. A nano-coating 42 is applied to the side of the transparent silicone coating 43 away from the polymer coating 44. A heat-insulating layer 41 is fixedly connected to the side of the nano-coating 42 away from the transparent silicone coating 43. The heat-insulating layer 41 is used to insulate the power chip body 1 from external high temperatures. By providing the corrosion-resistant mechanism, the risk of electrical short circuits can be reduced, ensuring the safety of equipment and personnel, and enabling the power chip to be used in harsh environments.

[0032] Specifically, when using this high-temperature resistant power chip: First, place the mounting base 101 in the designated position. The user then installs the heat sink 108 onto the surface of the mounting base 101 by tightening the mounting screws 119 on the surface of the heat sink 108. Next, the user places the power chip body 1 inside the mounting base 101. The support base 106 supports the bottom of the power chip body 1, at which point the bottom of the power chip body 1 contacts the surface of the heat sink 108. Under the action of the heat sink 108, the surface of the power chip body 1 is cooled. Heat is dissipated through the heat dissipation holes 116, allowing heat to escape from the mounting base 101. Wiring is then performed through the wiring holes 104 to connect the power chip body 1. At this point, the pins 107 move to the outside of the mounting base 101. The user then tightens the screws on the surface of the heat dissipation fins 103 to mount them onto the surface of the heat sink frame 102. The heat-conducting plates 109 are then mounted on the inner wall of the heat sink frame 102 using bolts 118. Finally, the user places the heat sink frame 102 on the top surface of the mounting base 101. The heat sink 102 drives the positioning block 117 to snap onto the surface of the mounting base 101. The positioning block 117 positions the assembly between the mounting base 101 and the heat sink 102. Then, the user tightens the fastening studs 115 on the surface of the heat sink 102, assembling the heat sink 102 onto the surface of the mounting base 101. The conductive cloth 114 effectively absorbs and reflects electromagnetic interference, thereby effectively reducing the impact of electromagnetic radiation on the power chip body 1. When the power chip body 1 has been used... During the process, the temperature inside the mounting base 101 and the heat sink 102 will rise. Under the action of the heat conduction plate 109, the heat will be conducted to the surface of the heat sink fins 103 through the heat dissipation hole 105. Under the action of the heat dissipation fins 103, the heat inside the mounting base 101 and the heat sink 102 will be dissipated. After the mounting base 101 and the heat sink 102 are assembled, the user can tighten the mounting studs 112 on the surface of the mounting feet 113 to install the mounting base 101, the power chip body 1 and the heat sink 102 in the designated position for use.

[0033] Subsequently, when the user places the power chip body 1 inside the mounting base 101, the user pulls the clamping plate 22 inside the mounting base 101, causing the clamping plate 22 to slide along the inner walls of the mounting base 101 and the holding slot 25, allowing the power chip body 1 to be smoothly placed inside the mounting base 101. After placement, the user releases the clamping plate 22, and the guide block 21 moves under the elastic force of the telescopic elastic column 24 on the inner wall of the holding slot 25. This causes the guide block 21 to move along the clamping plate 22 and the rubber pad 23. At this time, the rubber pad 23 moves to contact the surface of the power chip body 1, and the telescopic elastic column 24 uses its own elasticity to clamp and limit the power chip body 1 inside the mounting base 101. The telescopic elastic column 24 can automatically adjust its elasticity according to the size of the power chip body 1, enabling it to limit and clamp power chip bodies 1 of different sizes. Simultaneously, the telescopic elastic column 24 reduces direct pressure on the surface of the power chip body 1, lowering the risk of damage. When it is necessary to remove the power chip body 1 from the mounting base 101, simply pull the clamping plate 22 away from the power chip body 1 to remove it from the mounting base 101. This facilitates easy installation and removal of the power chip, improving the convenience for users during installation, removal, and maintenance, reducing working time, and increasing efficiency. The specific structure of the telescopic elastic column 24 is existing technology and will not be described further. It should be noted that when the power chip body 1 is used in environments with high vibration or high impact, the user needs to add an additional fixing mechanism inside the mounting base 101 to ensure the accuracy and stability of the power chip body 1 during use.

[0034] Subsequently, when the power chip body 1 is used for a long time, the temperature of the power chip body 1 itself, as well as the inside of the mounting base 101 and the heat sink 102, will continuously rise. Under the action of the temperature sensor 31, the temperature inside the mounting base 101 and the heat sink 102 is monitored in real time. When the temperature sensor 31 senses that the temperature inside the mounting base 101 and the heat sink 102 has reached the set value, the temperature sensor 31 sends a signal to the controller 11. After receiving the signal from the temperature sensor 31, the controller 11 automatically controls the motor 32 inside the heat sink 110 to work. Under the action of the motor 32, the rotating shaft 36 is driven to rotate. When the rotating shaft 36 rotates, the rotating shaft 36 drives the cooling fan 35 inside the fan cover 33 to rotate. Under the action of the cooling fan 35, the heat inside the mounting base 101 and the heat sink 102 is introduced into the interior of the heat sink 110 through the second heat dissipation hole 120. Since the surface of the perforated plate 122 has several through holes, the heat can be dissipated from the interior of the heat sink 110 through the dustproof mesh 34 and the hole cover 111. Heat is rapidly dissipated through the through holes on the surface of the cover 111. The dust filter 34 helps to block dust and other impurities from entering the heat sink 110 through the cover 111. To clean the surface of the dust filter 34, loosen the screws 123 on the surface of the cover 111, then pull the cover 111 upwards to remove it from the surface of the heat sink 110. Next, loosen the studs 37 on the surface of the dust filter 34, and then pull the dust filter 34 upwards. 4. The dustproof mesh 34 can be pulled out from the inside of the heat sink 110 and its surface can be cleaned to ensure the heat dissipation efficiency of the mounting base 101 and the heat sink frame 102, so as to realize the high temperature resistance function of the power chip. This ensures that the power chip body 1 can work stably in high temperature environment, avoids performance fluctuations, and reduces the problem of aging and failure of various components on the surface of the power chip body 1 due to high temperature, thus extending the service life of the power chip.

[0035] Subsequently, the thermal insulation layer 41 effectively isolates the power chip body 1 from external high temperatures, preventing corrosion of the internal electronic components. The transparent silicone coating 43 and the nano-coating 42 effectively resist the erosion of the power chip body 1 by acids, alkalis, salts, and other chemicals, protecting the internal copper foil and components. The polymer coating 44 isolates moisture, oxygen, contaminants, and sulfides, preventing corrosion, light decay, and failure of the power chip body 1's surface. This effectively increases the weather resistance and chemical corrosion resistance of the power chip body 1, achieving corrosion resistance and reducing the risk of electrical short circuits during use, ensuring equipment and personnel safety, and enabling the power chip to be used in harsh environments. It is important to note that the thickness and uniformity of the thermal insulation layer 41, nano-coating 42, transparent silicone coating 43, and polymer coating 44 must be strictly controlled to ensure they do not affect the heat dissipation and electrical performance of the power chip body 1, ultimately completing the power chip's operation.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-temperature-resistant power supply chip, comprising a power supply chip body (1), characterized in that: The power chip body (1) is provided with a mounting base (101) on its outer side. The power chip body (1) is located inside the mounting base (101). The top of the power chip body (1) is provided with a heat sink frame (102). The surfaces on both sides of the power chip body (1) are provided with pins (107). The surface at the center of the top of the heat sink frame (102) is provided with a heat sink box (110). The inner wall of the heat sink box (110) is provided with a perforated plate (122). The surface at the top of the heat sink box (110) is provided with a perforated cover (111). The mounting base (101) is provided with a convenient disassembly and assembly mechanism (2) for easy removal and placement of the power chip body (1). The heat sink frame (102) and the heat sink box (110) are provided with a high temperature resistant mechanism (3). The surface of the power chip body (1) is provided with a corrosion resistant mechanism (4).

2. The high-temperature-resistant power supply chip according to claim 1, characterized in that: The inner wall of the mounting base (101) is symmetrically provided with a plurality of support bases (106) for supporting the power chip body (1). The surfaces on both sides of the mounting base (101) are provided with a plurality of heat dissipation through holes (116). The surfaces on both sides of the mounting base (101) are symmetrically provided with wire through holes (104). The center of the bottom of the mounting base (101) is provided with heat dissipation fins (108) for dissipating heat from the power chip body (1). The heat dissipation frame (102) is connected to the mounting base (101) by fastening studs (115). The inner wall of the heat dissipation frame (102) is symmetrically provided with positioning blocks (117). The surface of the heat dissipation frame (102) is provided with conductive cloth (114).

3. The high temperature resistant power supply chip of claim 1, wherein: The inner wall of the heat dissipation frame (102) is symmetrically provided with heat-conducting plates (109) for heat conduction. The heat-conducting plates (109) are connected to the heat dissipation frame (102) by bolts (118). The surface of the top position of the heat dissipation frame (102) is symmetrically provided with heat dissipation fins (103) for heat dissipation. The inner wall of the heat dissipation frame (102) is provided with a plurality of equally spaced heat dissipation holes (105). The bottom corner of the mounting base (101) is provided with mounting feet (113). The surface of the mounting feet (113) is threaded with mounting studs (112). The heat dissipation box (110) is connected to the heat dissipation frame (102) by assembly studs (121). The hole cover (111) is connected to the heat dissipation box (110) by nails (123). The inner wall of the heat dissipation frame (102) is provided with a plurality of equally spaced second heat dissipation holes (120).

4. A high-temperature resistant power chip according to claim 1, characterized in that: The easy disassembly and assembly mechanism (2) consists of a clamping plate (22) disposed inside the mounting base (101), a rubber pad (23) disposed on the inner wall of the clamping plate (22), a guide block (21) disposed at the bottom of the clamping plate (22), a holding groove (25) disposed on the inner wall of the mounting base (101), and a telescopic elastic column (24) disposed inside the holding groove (25).

5. A high-temperature resistant power chip according to claim 1, characterized in that: The high-temperature resistant mechanism (3) comprises a temperature sensor (31) disposed inside the heat sink frame (102), a motor (32) disposed on the surface of the perforated plate (122), a rotating shaft (36) disposed on the surface of the motor (32), a fan cover (33) disposed inside the heat sink box (110), a cooling fan (35) disposed inside the fan cover (33), a dustproof mesh (34) disposed inside the heat sink box (110), and a stud body (37) disposed on the surface of the dustproof mesh (34).

6. A high-temperature resistant power chip according to claim 1, characterized in that: The corrosion-resistant mechanism (4) consists of a polymer coating (44) disposed on the surface of the power chip body (1), a transparent silicone coating (43) disposed on the surface of the polymer coating (44), a nano coating (42) disposed on the surface of the transparent silicone coating (43), and a heat insulation layer (41) disposed on the surface of the nano coating (42).

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