A high wear-resistant anti-deformation electronic component local reinforcement forming die

Abstract

This utility model discloses a high-wear-resistant and deformation-resistant electronic component local additive molding die, relating to the field of electronic component molding dies. It includes a bottom support base and a bottom molding die. A lifting and stabilizing frame is installed on the top of the bottom support base. Inside the lifting and stabilizing frame is a contact and docking mechanism for sliding a curved stabilizing plate. The contact and docking mechanism includes a downward docking die. During processing, the chip is directly placed inside the bottom molding die, and simultaneously, an extension and telescopic motor is activated. As the downward docking die moves, an integrated contact rod contacts the curved stabilizing plate, which presses the sides of the chip inward to maintain stability. This design prevents the chip from moving left or right during processing, resulting in a more stable final product without deformation.

Description

Technical Field

[0001] This utility model relates to the field of electronic component molding die technology, specifically a high wear-resistant and deformation-resistant electronic component local material feeding molding die. Background Technology

[0002] Electronic component molding dies are key process equipment in the electronics manufacturing industry. Their technical design directly affects product precision, production efficiency and cost control. Currently, the mainstream processes include two main categories: injection molding and thermoforming. Injection molding dies are characterized by multi-cavity and high precision and are widely used in small precision parts such as mobile phone accessories and remote control housings. Thermoforming dies are suitable for larger thin-walled structural parts such as lampshades and panels.

[0003] The existing design also has some shortcomings. First, the patent specification clearly states that electronic components are cut and shaped by moving a forming cutter, but the specification does not provide detailed technical features explaining how the forming cutter is moved. Second, the patent does not have a good material handling mechanism, making it difficult to handle the shaped electronic components.

[0004] To overcome the aforementioned defects, existing technology (Chinese Patent No. CN218693019U, Publication Date: 2023-03-24) discloses an electronic component cutting and forming mold, including a lower base, a guide sleeve fixedly connected to the lower base, a guide post slidably connected inside the guide sleeve, an upper base fixedly connected to the guide post, and a forming cutter fixedly connected to the upper base. This invention uses a cylinder to pull the upper base to move, thereby moving the forming cutter and cutting the electronic components inside the mold body. Pushing the support plate to slide causes the push plate to slide, pushing out the formed electronic components for easy handling. Pushing the sealing plate to rotate causes the rotating rod to rotate, causing the torsion spring to deform and ultimately opening the oil injection hole, facilitating the pouring of lubricating oil for cylinder lubrication. The elastic dust cover not only stores the lubricating oil but also prevents dust and other impurities from entering.

[0005] While the above design can solve the aforementioned problems, the processed chips may shift left and right during the mold docking process, resulting in poor final docking and forming effect. The chips cannot be stably clamped and will deviate. In addition, the finished products need to be manually removed after the processing is completed. Since the extrusion often generates a lot of heat, manual removal requires a long time to wait for cooling, thus reducing the efficiency of the equipment. Utility Model Content

[0006] The purpose of this invention is to provide a high-wear-resistant and deformation-resistant electronic component local additive molding die to solve the problems mentioned in the background art, such as the left and right position movement of the chip during the die docking process, resulting in poor final docking molding effect, chip misalignment due to unstable clamping, and the need for manual removal of the finished product after processing. Since extrusion often generates a lot of heat, manual removal requires a long time to cool down, thus reducing the efficiency of the equipment.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high wear-resistant and deformation-resistant electronic component local additive molding mold, comprising a bottom support base and a bottom molding mold, wherein a lifting and stabilizing frame is installed on the top of the bottom support base, and an abutting and docking mechanism for sliding a curved stabilizing plate is installed inside the lifting and stabilizing frame, the abutting and docking mechanism comprising a pressing and docking mold, and a limiting fitting rod is installed on the inner surface of the lifting and stabilizing frame, wherein a fixed rotating frame is installed on the outer surface of the bottom molding mold, and a reset docking mechanism for rotating an ejection fitting rod is installed inside the fixed rotating frame.

[0008] Furthermore, the reset docking mechanism includes a fixed lower pressure frame, which is fixedly installed on the upper surface of the bottom support base, and an extension support spring is installed inside the fixed lower pressure frame.

[0009] Furthermore, the two sides of the ejector fitting rod are rotatably installed inside the fixed rotating frame, and the lower end of the extension support spring abuts against the upper surface of the end of the ejector fitting rod. Moreover, the inner surface of the bottom forming mold is provided with a mating plane groove.

[0010] Furthermore, the left and right ends of the pressing and docking mold slide along the outer surface of the limiting and bonding rod, and a bottom forming mold is installed on the upper surface of the bottom support base. The downward movement trajectory of the pressing and docking mold corresponds to the installation position of the bottom forming mold, and a bonding sliding frame is installed on the outer surface of the pressing and docking mold.

[0011] Furthermore, an integral abutment rod is installed on the outer surface of the pressing and docking mold, and a curved stabilizing plate is installed on the inner surface of the sliding frame. The curved stabilizing plate fits the interior of the sliding frame for limiting sliding, and the downward movement trajectory of the integral abutment rod corresponds to the top end of the curved stabilizing plate.

[0012] Furthermore, the front end rotation trajectory of the curved surface stabilizing plate will pass through the interior of the left and right sides of the pressing and docking mold, and two sets of integrated abutment rods, fitting sliding frames and curved surface stabilizing plates are symmetrically installed about the center point of the pressing and docking mold.

[0013] Furthermore, the front end of the ejector fitting rod is designed as a semi-circular shape, and the rotation trajectory of the front end of the ejector fitting rod corresponds to the opening position of the groove in the docking plane. Moreover, two sets of extension support springs, fixed rotating frames and ejector fitting rods are symmetrically installed about the center point of the bottom forming mold.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: When the high wear-resistant and deformation-resistant electronic component local feeding molding mold is being processed, the chip is directly placed inside the bottom molding mold and the extension and telescopic motor is started at the same time. As the pressing and docking mold moves, the integrated abutment rod will abut against the curved stabilizing plate during the movement. The curved stabilizing plate will squeeze the two sides of the chip inward to keep it stable. This design prevents the chip from moving left and right during the processing, so that the final processing effect will not be deformed and the use is more stable.

[0015] Furthermore, after the processing operation is completed, the pressing down docking mold disengages from the bottom forming mold. At this time, the ejector fitting rod rotates in the opposite direction synchronously with the downward pressure of the extension support spring. The finished product can then be lifted up due to the rotation of the ejector fitting rod. This design eliminates the need for manual removal of the finished product after the processing operation is completed, thus improving the efficiency and safety of the equipment.

[0016] Furthermore, after the chip is placed on the ejector locking rod, it will remain stably positioned at the bottom. At this time, the start of the extension telescopic motor will cause the ejector locking rod to press downward while the curved stabilizing plate moves inward along both sides. This design makes the use of the equipment more intelligent and efficient. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the bottom support base of this utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the limiting and fitting rod of this utility model;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of the sliding frame of this utility model;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the curved surface stabilizing plate of this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the fixed rotating frame of this utility model;

[0022] Figure 6 This is a schematic diagram of the three-dimensional structure of the inner groove of the docking plane of this utility model.

[0023] In the diagram: 1. Bottom support base; 2. Elevating and stabilizing frame; 3. Extension telescopic motor; 4. Downward pressing and docking mold; 5. Bottom forming mold; 6. Limiting and fitting rod; 7. Integrated abutting rod; 8. Fitting sliding frame; 9. Curved surface stabilizing plate; 10. Fixed downward pressing frame; 11. Extension support spring; 12. Fixed rotating frame; 13. Ejection fitting rod; 14. Dating plane inner groove. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1: Please refer to Figure 2 , Figure 3 and Figure 4 This utility model provides the following technical solution: a high wear-resistant and deformation-resistant electronic component local feeding molding mold, including a bottom support base 1 and a bottom molding mold 5, a lifting and stabilizing frame 2 is installed on the top of the bottom support base 1, and an abutment and docking mechanism for sliding a curved surface stabilizing plate 9 is installed inside the lifting and stabilizing frame 2. Figure 3 As shown, the contact docking mechanism includes a pressing docking mold 4, and a limiting fitting rod 6 is installed on the inner surface of the raising and stabilizing frame 2. A fixed rotating frame 12 is installed on the outer surface of the bottom forming mold 5, and a reset docking mechanism for rotating the ejecting fitting rod 13 is installed inside the fixed rotating frame 12.

[0026] like Figure 2 , Figure 3 and Figure 4 The technical solution shown addresses the problem of lateral movement of the processed chip during mold docking, leading to poor final docking and chip misalignment due to unstable clamping. It discloses that the left and right ends of the pressing docking mold 4 slide along the outer surface of the limiting bonding rod 6, and a bottom forming mold 5 is mounted on the upper surface of the bottom support base 1. Figure 4As shown, the downward movement trajectory of the pressing and docking mold 4 corresponds to the installation position of the bottom forming mold 5. The outer surface of the pressing and docking mold 4 is equipped with a sliding frame 8 and an integral abutment rod 7. The inner surface of the sliding frame 8 is equipped with a curved stabilizing plate 9. The curved stabilizing plate 9 slides in contact with the interior of the sliding frame 8. The downward movement trajectory of the integral abutment rod 7 corresponds to the top end of the curved stabilizing plate 9. The rotation trajectory of the front end of the curved stabilizing plate 9 passes through the interior of the left and right sides of the pressing and docking mold 4. The integral abutment rod 7, the sliding frame 8, and the curved stabilizing plate 9 are symmetrically installed in two sets about the center point of the pressing and docking mold 4.

[0027] When chip docking is required, the chip is placed directly into the bottom forming mold 5 fixedly installed on the upper surface of the bottom support base 1. The extension and telescopic motor 3, fixedly installed inside the top of the bottom support base 1, is then activated. This motor 3 extends the downward docking mold 4, fixedly installed at its lower output end, vertically downwards until the lower end of the downward docking mold 4 initially overlaps with the interior of the bottom forming mold 5. During the downward movement of the downward docking mold 4, its two ends slide along the corresponding limiting and fitting rods 6 fixedly installed inside the lifting and stabilizing frame 2, ensuring the equipment's anti-deformation effect. Furthermore, as the downward movement of the downward docking mold 4... Figure 4 As shown, the integrated abutment rods 7 fixedly installed on the left and right sides of its lower surface will move down synchronously, and during the movement, they will abut the outer top of the curved surface stabilizing plate 9. At this time, the curved surface stabilizing plate 9 will slide inward along the inside of the bonding sliding frame 8 fixedly installed on the outer surface of the bottom forming mold 5 due to the abutment. At this time, the other end of the curved surface stabilizing plate 9 can rotate with the abutment and enter the interior of the bottom forming mold 5. During this process, the curved surface stabilizing plate 9 will stably clamp the two sides of the chip to prevent large left and right position deviations during processing. This design improves the efficiency and stability of the equipment.

[0028] Example 2: Figure 1 , Figure 5 and Figure 6 The technical solution shown addresses the problem that after processing, the finished product needs to be manually removed, which generates a lot of heat and requires a long cooling time, thus reducing equipment efficiency. The solution discloses a reset docking mechanism including a fixed lower pressure frame 10, which is fixedly mounted on the upper surface of the bottom support base 1. Figure 5As shown, an extension support spring 11 is installed inside the fixed lower pressure frame 10, and the two sides of the ejector fitting rod 13 are rotatably installed inside the fixed rotating frame 12. The lower end of the extension support spring 11 abuts against the upper surface of the end of the ejector fitting rod 13. The inner surface of the bottom forming mold 5 is provided with a mating plane groove 14. The front end of the ejector fitting rod 13 is semi-circular, and the rotation trajectory of the front end of the ejector fitting rod 13 corresponds to the opening position of the mating plane groove 14. The extension support spring 11, the fixed rotating frame 12, and the ejector fitting rod 13 are symmetrically installed in two sets about the center point of the bottom forming mold 5.

[0029] After the chip is placed inside the bottom molding mold 5, the lower surface of the chip first adheres to the front end of the ejector fitting rod 13. Then, as the lowering mating mold 4 presses down, the chip and the front end of the ejector fitting rod 13 move downwards synchronously until the front end of the ejector fitting rod 13 and the corresponding mating plane groove 14 inside the bottom molding mold 5 are nested together. At this time, the chip will remain horizontally and stably placed. Simultaneously, while the ejector fitting rod 13 rotates along the fixed rotating frame 12 fixed at the top of the bottom support 1, the other end of the ejector fitting rod 13 rotates synchronously in the opposite direction. The rotation of the ejector fitting rod 13 will lift the lower end of the extension support spring 11 upwards. Figure 6 As shown, since the top of the extension support spring 11 is fixedly installed inside the fixed pressure frame 10 fixed on the upper surface of the bottom support base 1, the extension support spring 11 will retract upward until the pressure docking mold 4 and the bottom forming mold 5 are disengaged. At this time, the front end of the ejector fitting rod 13 is no longer under force, and the front end of the ejector fitting rod 13 can rotate synchronously due to the downward reset of the extension support spring 11. During this process, the front end of the ejector fitting rod 13 will push the chip placed inside the bottom forming mold 5 upward. This design makes the use of the equipment safer and more convenient.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high wear-resistant and deformation-resistant electronic component local feeding molding die, comprising a bottom support base (1) and a bottom forming die (5), wherein a lifting and stabilizing frame (2) is installed on the top of the bottom support base (1), characterized in that: The inside of the lifting stabilizer (2) is equipped with an abutment docking mechanism for sliding the curved surface stabilizer plate (9); The contact docking mechanism includes a pressing docking mold (4), and a limiting fitting rod (6) is installed on the inner surface of the raising stabilizing frame (2). A fixed rotating frame (12) is installed on the outer surface of the bottom forming mold (5), and a reset docking mechanism for rotating the ejection fitting rod (13) is installed inside the fixed rotating frame (12).

2. A high-wear-resistant anti-deformation local reinforced forming mold for electronic components according to claim 1, characterized in that: The reset docking mechanism includes a fixed lower pressure frame (10), which is fixedly installed on the upper surface of the bottom support base (1), and an extension support spring (11) is installed inside the fixed lower pressure frame (10).

3. The high wear-resistant and deformation-resistant electronic component local additive molding die according to claim 2, characterized in that: The two sides of the ejector fitting rod (13) are rotatably installed inside the fixed rotating frame (12), and the lower end of the extension support spring (11) abuts against the upper surface of the end of the ejector fitting rod (13). Moreover, the inner surface of the bottom forming mold (5) is provided with a mating plane groove (14).

4. A high-wear-resistant anti-deformation local material forming mold for electronic components according to claim 1, characterized in that: The left and right ends of the pressing docking mold (4) slide along the outer surface of the limiting bonding rod (6), and the bottom forming mold (5) is installed on the upper surface of the bottom support base (1). The downward movement trajectory of the pressing docking mold (4) corresponds to the installation position of the bottom forming mold (5), and the bonding sliding frame (8) is installed on the outer surface of the pressing docking mold (4).

5. A high-wear-resistant anti-deformation local reinforced forming mold for electronic components according to claim 4, characterized in that: The outer surface of the pressing and docking mold (4) is equipped with an integral abutment rod (7), and the inner surface of the sliding frame (8) is equipped with a curved surface stabilizing plate (9). The curved surface stabilizing plate (9) slides in contact with the interior of the sliding frame (8) and the downward movement trajectory of the integral abutment rod (7) corresponds to the top end of the curved surface stabilizing plate (9).

6. The high wear-resistant and deformation-resistant electronic component local additive molding die according to claim 5, characterized in that: The front end rotation trajectory of the curved surface stabilizing plate (9) will pass through the interior of the left and right sides of the pressing docking mold (4), and the integrated abutment rod (7), the fitting sliding frame (8) and the curved surface stabilizing plate (9) are symmetrically installed on the left and right sides about the center point of the pressing docking mold (4).

7. A high-wear-resistant anti-deformation local material forming mold for electronic components according to claim 3, characterized in that: The front end of the ejector fitting rod (13) is semi-circular, and the rotation trajectory of the front end of the ejector fitting rod (13) corresponds to the opening position of the groove (14) in the docking plane. Moreover, the extension support spring (11), the fixed rotating frame (12) and the ejector fitting rod (13) are symmetrically installed on the left and right sides of the center point of the bottom forming mold (5).

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