A data acquisition module and liquid cooling system integrated packaging structure

Abstract

The utility model provides a kind of data acquisition module and liquid cooling system integration packaging structure, belong to the technical field of electronic equipment assembly and packaging, including processing mechanism, including casing, the liquid cooling assembly of being arranged in the inner chamber of the casing, fixedly installed in the ventilation baffle of the inner chamber of the casing.The utility model can immediately absorb the liquid of initial leakage of sealing ring by directly setting up hygroscopic torus in the key connection of liquid cooling pipe, prevent diffusion along pipe wall, active moisture absorption mechanism forms directional adsorption passage by modular design moisture absorption cotton column and through-hole, can accurately capture cooling liquid that seeps into cavity gap, avoid accumulation around electronic component, the elastic compression structure of positioning mechanism avoids mechanical stress concentration when maintaining sealing pressure, both prevent negative pressure to expand microcrack, and compensate sealing ring deformation by uniform pressure, this point surface combination's leakage prevention system keeps compact structure while completely blocking the diffusion path and electrochemical corrosion risk of seepage liquid.

Description

Technical Field

[0001] This utility model belongs to the technical field of electronic equipment assembly and packaging, specifically relating to an integrated packaging structure of a data acquisition module and a liquid cooling system. Background Technology

[0002] The integrated packaging structure of the data acquisition module and liquid cooling system integrates data acquisition components such as sensors and signal processing circuits with the liquid cooling heat dissipation mechanism in the same sealed housing. The internal flow channel design allows the coolant to flow directly through the heat-generating element area. At the same time, sensor signal acquisition and preliminary processing are completed inside the packaging structure. Its mechanical connection adopts a modular quick-release interface and meets IP protection level requirements.

[0003] Currently, when a sealing ring experiences chronic leakage due to long-term thermal deformation or mechanical stress, the leaked coolant tends to slowly diffuse within the internal cavity or flow channel gaps due to the compact layout of the integrated packaging structure. This liquid accumulation can cause localized short circuits or accelerate the aging of the sealing material. Furthermore, if the leakage occurs in the interlayer area between the liquid cooling pipeline and electronic components, forced adsorption may even widen existing micro-cracks due to negative pressure, further deteriorating the sealing performance. Utility Model Content

[0004] The purpose of this invention is to provide an integrated packaging structure for a data acquisition module and a liquid cooling system, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An integrated packaging structure for a data acquisition module and a liquid cooling system, comprising:

[0007] The processing mechanism includes a housing, a liquid cooling assembly disposed in the inner cavity of the housing, a ventilation baffle fixedly installed in the inner cavity of the housing, and a moisture-absorbing ring attached to the outer side of the ventilation baffle.

[0008] The active moisture-absorbing mechanism includes a box body that is movably engaged in the inner cavity of the housing, a groove formed in the inner cavity of the box body, a retaining plate fixedly installed on the outside of the box body, a moisture-absorbing cotton column that is movably engaged in the inner cavity of the groove, and a through hole formed on the outside of the box body.

[0009] And a positioning mechanism that limits the movement of the active moisture absorption mechanism after installation.

[0010] In a preferred embodiment of this utility model, the card plate is movably engaged at the opening on the outside of the housing, and the diameter of the card plate is larger than the diameter of the opening.

[0011] As a preferred embodiment of the present invention, the processing mechanism further includes a limiting plate fixedly installed in the inner cavity of the housing, a guide groove formed at the bottom of the limiting plate, a hole formed on the outer side of the housing, and an insertion port formed on the outer side of the housing.

[0012] As a preferred embodiment of this utility model, the positioning mechanism includes a sealing sheet that is movably engaged on the outside of the housing, a protrusion fixedly installed on one side of the sealing sheet for hand-holding, and a connecting rod fixedly installed on the other side of the sealing sheet, wherein the connecting rod is movably sleeved in the inner cavity of the hole.

[0013] As a preferred embodiment of this utility model, the positioning mechanism further includes a pressure block fixedly installed at the end of the connecting rod, a return spring fixedly installed on the outside of the pressure block, and a limiting ring fixedly installed at the end of the return spring. The limiting ring is movably sleeved on the outside of the connecting rod, and one side of the limiting ring is in contact with the inner wall of the housing.

[0014] As a preferred embodiment of this utility model, the liquid cooling assembly includes a mounting plate fixedly installed in the inner cavity of the housing, a cold plate fixedly installed on the outer side of the mounting plate, and a liquid cooling pipe fixedly connected to the cold plate.

[0015] In a preferred embodiment of this utility model, the liquid cooling pipe penetrates the ventilation partition and extends to the outside of the housing, and the moisture-absorbing ring is movably sleeved on the outside of the liquid cooling pipe.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: by directly fitting the moisture-absorbing ring onto the key connection of the liquid cooling pipe, it can immediately absorb the liquid that initially leaks from the sealing ring, preventing it from spreading along the pipe wall. The active moisture-absorbing mechanism forms a directional adsorption channel through the modularly designed moisture-absorbing cotton column and through holes, which can accurately capture the coolant that seeps into the cavity gaps, avoiding accumulation around electronic components. The elastic pressing structure of the positioning mechanism avoids mechanical stress concentration while maintaining the sealing pressure, preventing negative pressure from expanding micro-cracks and compensating for the deformation of the sealing ring through uniform pressure. This point-to-surface combined leak-proof system completely blocks the diffusion path of leaking liquid and the risk of electrochemical corrosion while maintaining structural compactness. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partial cross-sectional view of the overall structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the active moisture absorption mechanism of this utility model;

[0021] Figure 4 This is a schematic diagram of the positioning mechanism of this utility model.

[0022] In the picture:

[0023] 100. Processing mechanism; 110. Housing; 120. Liquid cooling assembly; 121. Mounting plate; 122. Cold plate; 123. Liquid cooling pipe; 130. Ventilation baffle; 140. Moisture-absorbing ring; 150. Limiting plate; 160. Guide groove; 170. Hole; 180. Insertion port;

[0024] 200. Active moisture-absorbing mechanism; 210. Box body; 220. Groove; 230. Plate; 240. Moisture-absorbing cotton column; 250. Through hole;

[0025] 300. Positioning mechanism; 310. Sealing plate; 320. Protrusion; 330. Connecting rod; 340. Pressure block; 350. Return spring; 360. Limiting ring. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0029] Example

[0030] Reference Figures 1-4 This embodiment of the present invention provides an integrated packaging structure for a data acquisition module and a liquid cooling system, comprising:

[0031] The processing mechanism 100 includes a housing 110, a liquid cooling assembly 120 disposed in the inner cavity of the housing 110, a ventilation baffle 130 fixedly installed in the inner cavity of the housing 110, and a moisture-absorbing ring 140 attached to the outside of the ventilation baffle 130.

[0032] The active moisture-absorbing mechanism 200 includes a box 210 that is movably locked in the inner cavity of the housing 110, a groove 220 that is opened in the inner cavity of the box 210, a retaining plate 230 that is fixedly installed on the outside of the box 210, a moisture-absorbing cotton column 240 that is movably locked in the inner cavity of the groove 220, and a through hole 250 that is opened on the outside of the box 210.

[0033] And a positioning mechanism 300 that limits the movement of the active moisture absorption mechanism 200 after installation.

[0034] The casing 110 provides structural support, the liquid cooling component 120 ensures heat dissipation, the ventilation baffle 130 optimizes airflow distribution, the moisture-absorbing ring 140 can absorb a small amount of leaked liquid, and the active moisture-absorbing mechanism 200 can further absorb residual moisture, thereby improving the overall sealing and reliability.

[0035] Specifically, the card plate 230 is movably mounted at the opening on the outside of the housing 110, and the diameter of the card plate 230 is larger than the diameter of its opening.

[0036] In this design, the diameter of the card plate 230 is larger than the diameter of the opening of the housing 110, which ensures that the box 210 is securely locked after installation, preventing loosening or falling off, while also facilitating disassembly and maintenance and improving the operability of the structure.

[0037] Furthermore, the processing mechanism 100 also includes a limiting plate 150 fixedly installed in the inner cavity of the housing 110, a guide groove 160 opened at the bottom of the limiting plate 150, a hole 170 opened on the outer side of the housing 110, and an insertion port 180 opened on the outer side of the housing 110.

[0038] The combination of the limiting plate 150 and the guide groove 160 makes the installation of the active moisture absorption mechanism 200 more precise. The hole 170 and the socket 180 provide a fixed channel for components such as the connecting rod 330, optimize the internal space layout, and enhance the compactness and stability of the overall structure.

[0039] Preferably, the positioning mechanism 300 includes a sealing plate 310 movably mounted on the outside of the housing 110, a protrusion 320 fixedly mounted on one side of the sealing plate 310 for hand gripping, and a connecting rod 330 fixedly mounted on the other side of the sealing plate 310. The connecting rod 330 is movably sleeved in the inner cavity of the hole 170. The positioning mechanism 300 also includes a pressure block 340 fixedly mounted on the end of the connecting rod 330, a return spring 350 fixedly mounted on the outside of the pressure block 340, and a limiting ring 360 fixedly mounted on the end of the return spring 350. The limiting ring 360 is movably sleeved on the outside of the connecting rod 330, and one side of the limiting ring 360 is in contact with the inner wall of the housing 110.

[0040] The design of the sealing plate 310 and the protrusion 320 facilitates manual operation. The connecting rod 330 is precisely positioned through the hole 170, ensuring that the positioning mechanism 300 can effectively fix the active moisture absorption mechanism 200, prevent its displacement, and improve the sealing reliability. The cooperation of the pressure block 340 and the return spring 350 enables the limiting ring 360 to elastically press against the inner wall of the housing 110, ensuring that the positioning mechanism 300 can remain stable when there is vibration or temperature change, and avoiding sealing failure due to loosening.

[0041] Furthermore, the liquid cooling assembly 120 includes a mounting plate 121 fixedly installed in the inner cavity of the housing 110, a cold plate 122 fixedly installed on the outside of the mounting plate 121, and a liquid cooling pipe 123 fixedly connected to the cold plate 122.

[0042] The combination of mounting plate 121 and cold plate 122 optimizes the heat dissipation path. Liquid cooling pipe 123 is directly connected to cold plate 122, which improves heat exchange efficiency and ensures that the data acquisition module can still operate stably in high-temperature environments.

[0043] Furthermore, the liquid cooling pipe 123 penetrates the ventilation baffle 130 and extends to the outside of the housing 110, and the moisture-absorbing ring 140 is movably sleeved on the outside of the liquid cooling pipe 123.

[0044] The liquid cooling pipe 123 passes through the ventilation baffle 130 and extends to the outside of the housing 110, which facilitates connection with the external cooling system. The moisture-absorbing ring 140 is fitted on the outside of the liquid cooling pipe 123, which can specifically absorb liquid that may seep out of the pipe wall to prevent it from affecting electronic components and further improve the leak-proof performance.

[0045] In use, firstly, the heat generated by the data acquisition module is conducted to the cold plate 122 through the mounting plate 121, and the heat is carried away by the coolant circulating in the liquid cooling pipe 123;

[0046] Meanwhile, the ventilation baffle 130 guides the airflow inside the housing 110 to assist in heat dissipation. When a small amount of leakage occurs in the liquid cooling system, the moisture-absorbing ring 140 immediately absorbs the seepage liquid on the outer wall of the liquid cooling pipe 123, while the active moisture-absorbing mechanism 200 further adsorbs the moisture diffused into the groove 220 through the moisture-absorbing cotton column 240 and promotes the evaporation of moisture through the through hole 250.

[0047] The reset spring 350 of the positioning mechanism 300 continuously applies pressure to the limit ring 360, so that the pressure block 340 firmly presses the box body 210, ensuring that the moisture absorption component remains tightly fitted under vibration.

[0048] In summary, the housing 110 and the liquid cooling component 120 form a compact heat dissipation system, and the cold plate 122 and the liquid cooling pipe 123 are directly connected to improve heat exchange efficiency; the moisture-absorbing ring 140 and the active moisture-absorbing mechanism 200 work together to achieve a dual leak-proof mechanism that can handle small amounts of leakage in stages, and the ventilation baffle 130 optimizes airflow while working with moisture-absorbing materials to prevent moisture accumulation.

[0049] The positioning mechanism 300 and the spring-preloaded limiting ring 360 ensure the stability of the components under vibration and temperature difference. The modular design of the card plate 230 and the guide groove 160 ensures both assembly accuracy and ease of maintenance. The overall structure has significant advantages in terms of space utilization, heat dissipation performance, leak-proof reliability and maintainability, ensuring the long-term stable operation of high-density electronic equipment.

[0050] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0051] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0052] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An integrated packaging structure for a data acquisition module and a liquid cooling system, characterized in that: include, The processing mechanism (100) includes a housing (110), a liquid cooling assembly (120) disposed in the inner cavity of the housing (110), a ventilation baffle (130) fixedly installed in the inner cavity of the housing (110), and a moisture-absorbing ring (140) attached to the outside of the ventilation baffle (130). The active moisture-absorbing mechanism (200) includes a box body (210) movably mounted in the inner cavity of the housing (110), a groove (220) opened in the inner cavity of the box body (210), a retaining plate (230) fixedly installed on the outside of the box body (210), a moisture-absorbing cotton column (240) movably mounted in the inner cavity of the groove (220), and a through hole (250) opened on the outside of the box body (210); And a positioning mechanism (300) that limits the movement of the active moisture absorption mechanism (200) after installation.

2. The data acquisition module integrated packaging structure with liquid cooling system according to claim 1, characterized in that: The card plate (230) is movably engaged at the opening on the outside of the housing (110), and the diameter of the card plate (230) is larger than the diameter of its opening.

3. The integrated packaging structure of data acquisition module and liquid cooling system according to claim 2, characterized in that: The processing mechanism (100) further includes a limiting plate (150) fixedly installed in the inner cavity of the housing (110), a guide groove (160) opened at the bottom of the limiting plate (150), a hole (170) opened on the outer side of the housing (110), and an insertion port (180) opened on the outer side of the housing (110).

4. The data acquisition module integrated packaging structure with liquid cooling system according to claim 3, characterized in that: The positioning mechanism (300) includes a sealing plate (310) movably mounted on the outside of the housing (110), a protrusion (320) fixedly mounted on one side of the sealing plate (310) for hand gripping, and a connecting rod (330) fixedly mounted on the other side of the sealing plate (310), the connecting rod (330) being movably sleeved in the inner cavity of the hole (170).

5. The data acquisition module integrated packaging structure with liquid cooling system according to claim 4, characterized in that: The positioning mechanism (300) further includes a pressure block (340) fixedly installed at the end of the connecting rod (330), a return spring (350) fixedly installed on the outside of the pressure block (340), and a limiting ring (360) fixedly installed at the end of the return spring (350). The limiting ring (360) is movably sleeved on the outside of the connecting rod (330), and one side of the limiting ring (360) is in contact with the inner wall of the housing (110).

6. The integrated packaging structure of data acquisition module and liquid cooling system according to claim 5, characterized in that: The liquid cooling assembly (120) includes a mounting plate (121) fixedly installed in the inner cavity of the housing (110), a cold plate (122) fixedly installed on the outside of the mounting plate (121), and a liquid cooling pipe (123) fixedly connected to the cold plate (122).

7. The data acquisition module integrated packaging structure with liquid cooling system according to claim 6, characterized in that: The liquid cooling pipe (123) passes through the ventilation baffle (130) and extends to the outside of the housing (110), and the moisture-absorbing ring (140) is movably sleeved on the outside of the liquid cooling pipe (123).

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